WO2008149678A1 - 電子部品の接続方法及び接合体 - Google Patents

電子部品の接続方法及び接合体 Download PDF

Info

Publication number
WO2008149678A1
WO2008149678A1 PCT/JP2008/059388 JP2008059388W WO2008149678A1 WO 2008149678 A1 WO2008149678 A1 WO 2008149678A1 JP 2008059388 W JP2008059388 W JP 2008059388W WO 2008149678 A1 WO2008149678 A1 WO 2008149678A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive particles
pressing
electronic component
force
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059388
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Tomoyuki Ishimatsu
Daisuke Sato
Hiroki Ozeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to HK10105568.9A priority Critical patent/HK1139785B/xx
Priority to KR1020097026916A priority patent/KR101130002B1/ko
Priority to CN2008800190225A priority patent/CN101681858B/zh
Publication of WO2008149678A1 publication Critical patent/WO2008149678A1/ja
Priority to US12/631,210 priority patent/US8273207B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
PCT/JP2008/059388 2007-06-06 2008-05-21 電子部品の接続方法及び接合体 Ceased WO2008149678A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
HK10105568.9A HK1139785B (en) 2007-06-06 2008-05-21 Method for connecting electronic part and jointed structure
KR1020097026916A KR101130002B1 (ko) 2007-06-06 2008-05-21 전자 부품의 접속 방법 및 접합체
CN2008800190225A CN101681858B (zh) 2007-06-06 2008-05-21 电子部件的连接方法及接合体
US12/631,210 US8273207B2 (en) 2007-06-06 2009-12-04 Method for connecting electronic part and joined structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-150180 2007-06-06
JP2007150180A JP5010990B2 (ja) 2007-06-06 2007-06-06 接続方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/631,210 Continuation US8273207B2 (en) 2007-06-06 2009-12-04 Method for connecting electronic part and joined structure

Publications (1)

Publication Number Publication Date
WO2008149678A1 true WO2008149678A1 (ja) 2008-12-11

Family

ID=40093503

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059388 Ceased WO2008149678A1 (ja) 2007-06-06 2008-05-21 電子部品の接続方法及び接合体

Country Status (6)

Country Link
US (1) US8273207B2 (cg-RX-API-DMAC7.html)
JP (1) JP5010990B2 (cg-RX-API-DMAC7.html)
KR (1) KR101130002B1 (cg-RX-API-DMAC7.html)
CN (2) CN102448255B (cg-RX-API-DMAC7.html)
TW (1) TWI394811B (cg-RX-API-DMAC7.html)
WO (1) WO2008149678A1 (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101853794A (zh) * 2009-03-24 2010-10-06 松下电器产业株式会社 电子元器件接合方法和凸点形成方法及其装置
WO2016204136A1 (ja) * 2015-06-16 2016-12-22 デクセリアルズ株式会社 接続体、接続体の製造方法、検査方法
JP2020053403A (ja) * 2014-03-31 2020-04-02 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

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KR101075192B1 (ko) 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
US20130000964A1 (en) * 2010-04-22 2013-01-03 Hiroshi Kobayashi Anisotropic conductive material and connection structure
JP5533393B2 (ja) * 2010-07-26 2014-06-25 パナソニック株式会社 電子部品接着用の接着剤および電子部品接着方法。
KR20130096259A (ko) * 2010-08-05 2013-08-29 스미또모 베이크라이트 가부시키가이샤 기능성 입자, 기능성 입자군, 충전제, 전자 부품용 수지 조성물, 전자 부품 및 반도체 장치
DE102010055318B4 (de) * 2010-12-21 2025-06-12 Audi Ag Verfahren und Einrichtung zur Steuerung des Drucks im Inneren eines Kraftstofftanks
JP5672022B2 (ja) * 2011-01-25 2015-02-18 日立化成株式会社 絶縁被覆導電粒子、異方導電性材料及び接続構造体
JP6044195B2 (ja) * 2011-09-06 2016-12-14 日立化成株式会社 絶縁被覆用粒子、絶縁被覆導電粒子、異方導電材料及び接続構造体
CN103030728B (zh) * 2011-09-06 2017-09-26 日立化成株式会社 绝缘包覆用粒子、绝缘包覆导电粒子、各向异性导电材料及连接结构体
JP5768676B2 (ja) * 2011-11-18 2015-08-26 デクセリアルズ株式会社 異方性導電フィルム、その製造方法、接続構造体及びその製造方法
WO2013122055A1 (ja) * 2012-02-15 2013-08-22 コニカミノルタ株式会社 機能性フィルム、およびその製造方法、並びに前記機能性フィルムを含む電子デバイス
GB201212489D0 (en) * 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
TW201408754A (zh) * 2012-08-29 2014-03-01 Compal Electronics Inc 黏著材料及具有熱阻隔能力基板結構的製作方法
JP6057224B2 (ja) * 2012-08-31 2017-01-11 パナソニックＩｐマネジメント株式会社 部品実装構造体
JP6066643B2 (ja) * 2012-09-24 2017-01-25 デクセリアルズ株式会社 異方性導電接着剤
TWI578571B (zh) * 2012-12-24 2017-04-11 鴻海精密工業股份有限公司 發光晶片組合及其製造方法
JP6261386B2 (ja) * 2014-03-04 2018-01-17 デクセリアルズ株式会社 多層型熱伝導性シート、多層型熱伝導性シートの製造方法
WO2015190409A1 (ja) * 2014-06-12 2015-12-17 コニカミノルタ株式会社 インクジェットヘッド及びインクジェット記録装置
CN107210287B (zh) * 2015-01-13 2020-04-14 迪睿合株式会社 多层基板
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device
JP6610117B2 (ja) * 2015-09-18 2019-11-27 コニカミノルタ株式会社 接続構造体、インクジェットヘッド、インクジェットヘッドの製造方法及びインクジェット記録装置
US10570518B2 (en) * 2016-08-03 2020-02-25 Kabushiki Kaisha Toyota Chuo Kenkyusho Composite plating film
JP2019084703A (ja) * 2017-11-02 2019-06-06 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射記録装置
CN113271719B (zh) * 2021-06-23 2022-07-08 昆山丘钛生物识别科技有限公司 柔性电路板处理方法、装置及设备
CN113805388B (zh) * 2021-08-25 2023-05-30 Tcl华星光电技术有限公司 框胶材料、液晶显示面板和显示装置
KR20230134656A (ko) * 2022-03-14 2023-09-22 삼성디스플레이 주식회사 이방성 도전 필름 및 이를 포함하는 표시 장치

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JPH11203938A (ja) * 1998-01-07 1999-07-30 Nec Corp 樹脂フィルムおよびこれを用いた電子部品の接続方法
JP2002217239A (ja) * 2001-01-19 2002-08-02 Matsushita Electric Ind Co Ltd 異方性導電膜
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101853794A (zh) * 2009-03-24 2010-10-06 松下电器产业株式会社 电子元器件接合方法和凸点形成方法及其装置
CN101853794B (zh) * 2009-03-24 2014-04-16 松下电器产业株式会社 电子元器件接合方法和凸点形成方法及其装置
JP2020053403A (ja) * 2014-03-31 2020-04-02 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP7017158B2 (ja) 2014-03-31 2022-02-08 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2022068165A (ja) * 2014-03-31 2022-05-09 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP7368765B2 (ja) 2014-03-31 2023-10-25 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
WO2016204136A1 (ja) * 2015-06-16 2016-12-22 デクセリアルズ株式会社 接続体、接続体の製造方法、検査方法
JP2017005225A (ja) * 2015-06-16 2017-01-05 デクセリアルズ株式会社 接続体、接続体の製造方法、検査方法
US10368443B2 (en) 2015-06-16 2019-07-30 Dexerials Corporation Connection body, method for manufacturing connection body, and method for inspecting same

Also Published As

Publication number Publication date
TWI394811B (zh) 2013-05-01
US8273207B2 (en) 2012-09-25
CN102448255B (zh) 2015-04-22
CN101681858B (zh) 2012-01-11
JP2008305887A (ja) 2008-12-18
TW200848486A (en) 2008-12-16
HK1139785A1 (en) 2010-09-24
KR20100021485A (ko) 2010-02-24
JP5010990B2 (ja) 2012-08-29
CN102448255A (zh) 2012-05-09
CN101681858A (zh) 2010-03-24
KR101130002B1 (ko) 2012-03-28
US20100080995A1 (en) 2010-04-01

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