CN101366326B - 电子部件连接方法 - Google Patents

电子部件连接方法 Download PDF

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Publication number
CN101366326B
CN101366326B CN2007800018446A CN200780001844A CN101366326B CN 101366326 B CN101366326 B CN 101366326B CN 2007800018446 A CN2007800018446 A CN 2007800018446A CN 200780001844 A CN200780001844 A CN 200780001844A CN 101366326 B CN101366326 B CN 101366326B
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array
electronic unit
connecting portion
terminals
semiconductor particles
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CN101366326A (zh
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境忠彦
永福秀喜
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

一种电子部件连接方法，用于将设置于第一电子部件的连接部(5)内的第一端子阵列(6)和设置在第二电子部件的连接部(7)内的第二端子阵列(8)相互连接，使得在第一端子阵列和第二端子阵列之间建立电连接，该方法包括两个步骤：使用焊料粒子(3)和导电粒子(4)分散于热固性树脂(2)内的膏状各向异性导电粘合剂(1)，通过熔化焊料粒子(3)，暂时相互固定端子阵列(6，8)相互对准的两个连接部(5，7)的步骤；以及通过已经热固化的热固性树脂(2)，最终相互固定两个连接部(5，7)的步骤。这防止在从暂时固定设备移送到最终固定设备期间在两个端子阵列(6，8)之间发生位置偏差。

Description

电子部件连接方法
技术领域
本发明涉及使用膏状各向异性导电粘合剂的电子部件连接方法。
背景技术
使用各向异性导电粘合剂连接在连接部分别具有端子阵列的电子部件的方法已经实用化，其中该端子阵列反应了引脚数目增加且引脚节距减小的最近趋势。各向异性导电粘合剂按照下述方式配置，即，诸如由银或焊料制成的金属粒子或者使用金电镀塑性树脂粒子而制作的粒子的导电粒子分散在诸如环氧树脂的绝缘热固性树脂粘合剂内。在各向异性导电粘合剂夹置于相互对准的两个连接部之间的状态下，施加压力和热量，由此将导电粒子熔焊到两个连接部的对向端子阵列，且同时热固化该树脂。如此，对向的端子阵列可以相互电连接且两个连接部可以相互物理连接(见专利文献1)。在许多情形中，电子部件连接工艺划分为两个工艺，即，暂时固定工艺和最终固定工艺。采用用于暂时固定的暂时压力结合设备和用于最终固定的最终压力结合设备相互连接的组装线，并行地(即，同时)执行这两个工艺，由此提高生产量(见专利文献2)。暂时压力结合设备将成对设置的端子阵列在两个相应连接部内彼此对准并执行暂时固定。最终压力结合设备执行最终固定，其中压力和热量施加到暂时固定的连接部且树脂粘合剂由此完全固化。
当从暂时压力结合设备移送到最终压力结合设备时，暂时固定的电子部件会受到诸如振动力的外部力。因此，应采取特定措施来防止彼此对准的两个端子阵列之间发生位置偏差。为此，带状ACF(各向异性导电膜)广泛地用作各向异性粘合剂。ACF具有的优点为，彼此对准的两个端子阵列之间的位置关系较少趋于改变，因为其表面是粘性的且可以由较低压力产生高的结合强度。通过在ACF表面上形成粘合剂层可以提高结合强度(见阵列文献3)。
[专利文献1]JP-A-11-186334
[专利文献2]JP-A-9-283896
[专利文献3]JP-A-8-249930
发明内容
然而，虽然ACF在结合强度方面强于膏状各向异性导电粘合剂ACP(各向异性导电膏)，成形为带状的ACF在成本上高于较为廉价的ACP。ACF在加工容易性方面也劣于ACP：需要安装专用设备，该专用设备用于将ACF加工成与将贴着到ACF的电子部件的连接部适形的形状，且该专用设备并用于将ACF贴着到该连接部，这需要成本以及安装空间。
ACP在上述方面优于ACF，不过ACP无法提供足够的结合强度用于暂时固定连接部，这使得需要通过单一压力结合操作以完成连接工艺(至最终固定)。由此，使用ACP的连接方法在生产量上低于使用ACF的连接方法，其中使用ACF的连接方法并行地(即，同时)执行暂时固定工艺和最终固定工艺。
本发明的目的因此是提供一种电子部件连接方法，即使在使用ACP的情形下也能够高生产量地连接电子部件。
根据本发明，一种电子部件连接方法，用于将设置于第一电子部件的连接部内的第一端子阵列和设置在第二电子部件的连接部内的第二端子阵列相互连接，使得通过焊料粒子分散于热固性树脂内的膏状各向异性导电粘合剂在第一端子阵列和第二端子阵列之间建立电连接，该方法包括：定位步骤，在该各向异性导电粘合剂夹置于该第一电子部件的连接部和该第二电子部件的连接部之间的状态下，致使该第一端子阵列和该第二端子阵列彼此相对；焊接步骤，通过熔化包含在该各向异性导电粘合剂内的该焊料粒子将该第一端子阵列和该第二端子阵列相互焊接，使该第一电子部件的连接部和该第二电子部件的连接部彼此暂时固定；移送步骤，移送彼此暂时固定的该第一电子部件和该第二电子部件；以及连接步骤，通过热固化该各向异性导电粘合剂，使该第一电子部件的连接部和该第二电子部件的连接部彼此最终固定。
此外，该焊接步骤包括如下子步骤：从该第二端子阵列侧对该第一端子阵列加压和从该第二端子阵列侧加热该焊料粒子；以及同时结束该加压和该加热。
此外，该焊接步骤包括如下子步骤：从该第二端子阵列侧对该第一端子阵列加压和从该第二端子阵列侧加热该焊料粒子；结束该加热；以及在该加热结束之后结束该加压。
再者，该焊接步骤包括如下子步骤：从该第二端子阵列侧对该第一端子阵列加压和从该第二端子阵列侧加热该焊料粒子；以及从该第一端子阵列侧散逸已经供应到该焊料粒子的热量。
再者，该连接步骤包括如下子步骤：从该第二电子部件的连接部侧加热该各向异性导电粘合剂。
再者，该连接步骤包括如下子步骤：从该第二电子部件的连接部侧对该第一电子部件的连接部加压；以及从该第二电子部件的连接部侧加热该各向异性导电粘合剂。
本发明采用两个步骤，即，使用焊料粒子分散于热固性树脂内的膏状各向异性导电粘合剂，通过熔化焊料粒子来暂时固定两个连接部的步骤，以及通过已经热固化的热固性树脂来最终相互固定两个连接部的步骤。尽管结合强度低的膏状各向异性导电粘合剂被使用，两个连接部可以高生产量地相互连接。
附图说明
图1为示出根据本发明实施例的各向异性导电粘合剂的组成的断面图。
图2为示出使用根据本发明实施例的各向异性导电粘合剂来相互暂时固定的第一和第二电子部件的连接部的断面图。
图3为示出使用根据本发明实施例的各向异性导电粘合剂来相互最终固定的第一和第二电子部件的连接部的断面图。
具体实施方式
下面参考附图描述本发明的实施例。
首先，参考图1描述根据本发明实施例的各向异性导电粘合剂的组成。各向异性导电粘合剂1按照焊料粒子3和导电粒子4分散于热固性树脂2内的方式来构成。热固性树脂2为膏状的绝缘热固性树脂粘合剂，例如环氧树脂。焊料粒子3是由低熔点金属制成，该低熔点金属包含SnBi(熔点约为140℃)90％以上(重量百分比)且在比热固性树脂2开始热固化的温度低的温度下熔化。焊料粒子3的平均直径设置为5至15μm。导电粒子4是由诸如银或金的贵金属制成的金属粒子或者通过使用金电镀塑性树脂粒子得到的粒子。导电粒子4的直径设置为小于焊料粒子3的直径。导电粒子4不是必需的，即可以省略。
接着，参考图1至3描述根据本发明实施例的电子部件连接方法。如图1所示，布置有多个电极焊垫的第一端子阵列6形成于第一电子部件的连接部5。与第一端子阵列6类似的第二端子阵列8形成于第二电子部件的连接部7，该第二电子部件将连接到第一电子部件。各向异性导电粘合剂1已经使用配给器等涂布到第一电子部件的连接部5。在各向异性导电粘合剂1夹置于第一电子部件的连接部5和第二电子部件的连接部7之间的状态下，第一端子阵列6和第二端子阵列8彼此对置(定位步骤)。
随后，如图2所示，各向异性导电粘合剂1的夹置于第一端子阵列6和第二端子阵列8之间的部分所包含的焊料粒子3熔化，由此第一端子阵列6和第二端子阵列8被相互焊接(焊接步骤)。焊料粒子3在被外部供应的热量熔化的状态下接触第一端子阵列6和第二端子阵列8。焊料粒子3随后凝固，由此第一端子阵列6和第二端子阵列8被相互焊接。焊接步骤旨在通过将第一端子阵列6和第二端子阵列8相互焊接而将第一电子部件的连接部5和第二电子部件的连接部7相互暂时固定。由于并非旨在热固化热固性树脂2，加热温度T1(即，热压结合工具的温度)设置为高于焊料粒子的熔点T(优选地高10℃以上)，且压力结合时间(加热时间)设置为长于熔化焊料粒子3所需的最少时间(0.5至3秒)。
定位和焊接设备可以是暂时压力结合设备，该设备具有可以相对于工作台10移动的热压结合工具11。在吸着于热压结合工具11上的第二端子阵列8对准固定到工作台10的第一端子阵列6时，加热是从第二端子阵列8侧在加热温度T1下执行，且第二电子部件的连接部7以力F1压抵第一电子部件的连接部5，由此第一端子阵列6和第二端子阵列8之间的焊料粒子3被压碎的同时熔化。为了使熔化的焊料粒子3凝固，需要将其冷却到比熔点T低的温度。因此，在加热和加压预定时间之后，热压结合工具11从第二电子部件的连接部7分离。结果，加热和加压同时结束，且焊料粒子3自然冷却到比熔点T低的温度。此时，在结束加压之前结束加热可以实现更好的焊接，因为焊料粒子3在第一端子阵列6和第二端子阵列8之间被压碎的状态下凝固。
第一端子阵列6固定到的工作台10可由具有高热导性的材料诸如不锈钢或铝制成，这使得可以利用下述现象进行焊接：从第二端子阵列8侧供应的热量用于加热焊料粒子3且随后通过第一端子阵列6散逸到工作台10侧，致使焊料粒子3冷却。更具体而言，通过已经加热到比熔点T高的加热温度T1(T+10℃至T+30℃)的热压结合工具11从第二端子阵列8侧施加压力。焊料粒子3被加热到比熔点T高的温度而熔化。由于上述热散逸，焊料粒子3随后冷却到比熔点T低的温度而临时凝固。在焊料粒子3已经凝固时，通过上升热压结合工具11而完成该焊接步骤。
随后，如图3所示，夹置于第一电子部件的连接部5和第二电子部件的连接部7之间的各向异性导电粘合剂1热固化，第一电子部件的连接部5和第二电子部件的连接部7由此相互连接(连接步骤)。为各向异性导电粘合剂1的基底(base)的热固性树脂2通过外部施加的热量而固化，且由此最终以不可逆方式固定第一电子部件的连接部5和第二电子部件的连接部7。为此，连接步骤中的加热温度设置在温度T2，该温度T2高于热固性树脂2的热固化温度；而且加热时间设置为长于热固化该热固性树脂2所需的时间(4秒以上)。
连接设备可以是具有可相对于工作台12移动的热压结合工具13的热压结合设备。已经暂时相互固定并移送在工作台12上的第一电子部件的连接部5和第二电子部件的连接部7从第二电子部件的连接部7侧在温度T2被加热，夹置于第一电子部件的连接部5和第二电子部件的连接部7之间的各向异性导电粘合剂1由此热固化。此时，第二电子部件的连接部7通过力F2压抵第一电子部件的连接部5，由此位于第一端子阵列6和第二端子阵列8之间的焊料粒子3和导电粒子4被压碎且其与端子阵列6和8的接触面积增大。由此可以达成更好的电连接。
如上所述，在根据本实施例的电子部件连接方法中，两个电子部件通过两个步骤而相互连接，即，使用焊料粒子3分散于热固性树脂2内的膏状各向异性导电粘合剂1，通过熔化焊料粒子3来暂时固定两个连接部5和7的步骤，以及通过已经热固化的热固性树脂2来最终固定两个连接部5和7的步骤。通过熔化焊料粒子3而暂时相互固定的两个连接部5和7的结合强度低于热固性树脂2热固化时得到的结合强度。然而，两个连接部5和7暂时相互固定具有足够结合强度，以防止在移送到最终压力结合设备期间施加的振动或冲击引起的在第一端子阵列6和第二端子阵列8之间发生位置偏差。这使得可以在维持高的位置精度的状态下进行最终固定，且由此实现高生产量的生产。
工业应用性
本发明提供了这样的优点，即使采用结合强度低的膏状各向异性导电粘合剂，也可以实现高生产量的生产。因此，当应用于量产电子设备的电子部件连接工艺时，本发明是有用的。
本发明是基于在2006年9月15提交的日本专利申请No.2006-251069并主张其优先权利益，其全部内容引用结合于此。

Claims (6)

1.一种电子部件连接方法，用于将设置于第一电子部件的连接部内的第一端子阵列和设置在第二电子部件的连接部内的第二端子阵列相互连接，使得通过焊料粒子分散于热固性树脂内的膏状各向异性导电粘合剂在第一端子阵列和第二端子阵列之间建立电连接，所述电子部件连接方法包括：
定位步骤，在所述各向异性导电粘合剂夹置于所述第一电子部件的连接部和所述第二电子部件的连接部之间的状态下，致使所述第一端子阵列和所述第二端子阵列彼此相对；
焊接步骤，通过以高于焊料粒子熔点T的温度T1进行加热来熔化包含在所述各向异性导电粘合剂内的所述焊料粒子将所述第一端子阵列和所述第二端子阵列相互焊接，利用第一热压结合工具使所述第一电子部件的连接部和所述第二电子部件的连接部彼此暂时固定；
冷却步骤，将焊料粒子冷却到熔点T以下；
移送步骤，移送彼此暂时固定的所述第一电子部件和所述第二电子部件；以及
连接步骤，通过以高于热固化性树脂的热固化温度的温度T2来热固化所述各向异性导电粘合剂，利用第二热压结合工具使所述第一电子部件的连接部和所述第二电子部件的连接部彼此最终固定。
2.如权利要求1所述的电子部件连接方法，其中所述焊接步骤包括如下子步骤：从所述第二端子阵列侧对所述第一端子阵列加压和从所述第二端子阵列侧加热所述焊料粒子；以及同时结束所述加压和所述加热。
3.如权利要求1所述的电子部件连接方法，其中所述焊接步骤包括如下子步骤：从所述第二端子阵列侧对所述第一端子阵列加压和从所述第二端子阵列侧加热所述焊料粒子；结束所述加热；以及在所述加热结束之后结束所述加压。
4.如权利要求1所述的电子部件连接方法，其中所述焊接步骤包括如下子步骤：从所述第二端子阵列侧对所述第一端子阵列加压和从所述第二端子阵列侧加热所述焊料粒子；以及从所述第一端子阵列侧散逸已经供应到所述焊料粒子的热量。
5.如权利要求1至4任意一项所述的电子部件连接方法，其中所述连接步骤包括如下子步骤：从所述第二电子部件的连接部侧加热所述各向异性导电粘合剂。
6.如权利要求1至4任意一项所述的电子部件连接方法，其中所述连接步骤包括如下子步骤：从所述第二电子部件的连接部侧对所述第一电子部件的连接部加压；以及从所述第二电子部件的连接部侧加热所述各向异性导电粘合剂。
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