TW200818357A - Electric components connecting method - Google Patents

Electric components connecting method Download PDF

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Publication number
TW200818357A
TW200818357A TW96134541A TW96134541A TW200818357A TW 200818357 A TW200818357 A TW 200818357A TW 96134541 A TW96134541 A TW 96134541A TW 96134541 A TW96134541 A TW 96134541A TW 200818357 A TW200818357 A TW 200818357A
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TW
Taiwan
Prior art keywords
terminal
terminal array
array
electrical
electrical component
Prior art date
Application number
TW96134541A
Other languages
English (en)
Inventor
Tadahiko Sakai
Hideki Eifuku
Original Assignee
Matsushita Electric Ind Co Ltd
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Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200818357A publication Critical patent/TW200818357A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

200818357 九、發明說明： 【發明所屬之技術領域】 本發明係、關於一種使用膏狀各向# 氣組件之連接方法。 ” ^电黏著劑之電 【先前技術】 具有反映針腳數目之；益增加且在：：分中之端子陣列 前趨勢。各向異性導電物丨…間距之曰益減小的當 、 ¥電黏者劑經組態成諸如由銀或、r袓制 成之金屬顆粒或藉由用金來電鑛塑膠樹脂顆粒 顆粒之導電顆粒係經分散 、/、衣成的 樹脂黏著劑中。㈣力及熱 险 =於彼此疋位的兩個連接部分之間的狀態下施加，藉此 h顆粒被炫焊至兩個連接部分之相對之端子 時該樹脂被熱固化。以此方式，該相對之端子陣列可彼此 電連接且兩個連接部分可彼此實體連接（參考專利文獻 1。）。在許多狀況下’電氣組件之連接過程被劃分為兩個過 程’亦即’暫行固定過程及最終固定過程。產量藉由使用 用於暫订固定之暫行壓力結合褒置與用於最終固定之最 終壓力結合裝置彼此鏈接的組裝線來並行（亦即，同時） 執行兩個過程而增加（參考專利文獻2)。暫行壓力結合裝 置將在兩個各別連接部分中成對設置之端子陣列相對於 彼此定位且執行暫行固定。最終壓力結合裝置執行將壓力 及熱施加至暫行固定之連接部分且藉此使樹脂黏著劑熱 312XP/發明說明書(補件)/96-10/96134541 6 200818357 固化之最終固定。 :當將暫行固定之電氣組件自暫行壓力結合裝置輸送至 取終壓力結合裝置時’暫行固定之電氣組件可接收諸如振 ，力之外力。因此’應採取特定措施以防止在相對於彼此 定位之兩個端子陣列之間發生位置偏移。為此，帶狀各向 異性導電薄膜（ACF，anisotropic conductive fiim)被廣 泛用=各向異性導電黏著劑。ACF具有如下優勢：相對於 彼此定位之兩個端子陣列之間的位置關係較不易於發生 改變，因為ACF之表面具黏性且高結合強度可由相對^之 壓力產生。結合強度可藉由在ACF之表面上形成黏著劑層 而增加（參考專利文獻3)。 曰 [專利文獻 1] JP-A-1 1-1 86334 [專利文獻 2] JP-A-9-283896 [專利文獻 3] JP-A-8-249930 【發明内容】 然而’雖然ACF較作為膏狀各向異性導電黏著劑之各向 異性導電貧（ACP, anisotropic conductive paste)給予 更高結合強度，但成形為膠帶形式之ACF的成本係高於相 對低廉之ACP。ACF在工作之容易性方面亦較ACP差：用 於使ACF成為符合ACF待被黏結至之電氣組件之連接部分 的形狀且用於將ACF黏結至連接部分之專用裝置需要被 安裝’此舉需要成本及安裝空間。 雖然ACP在上述方面優於ACF，但其不可提供用於連接 部分之暫行固定的充足結合強度，其使得有必要藉由單個 312XP/發明說明書(補件)/96-10/96134541 7 200818357 壓力結合操作來完成連接過程（於最終固定）。因而，使用 ACP之連接方法之產量低於使用暫行固定過程及最終固定 過程被並行（亦即，同時）執行之Acf之產量。 因此，本發明之目的在於提供一種即使在使用Acp之狀 況下亦能夠以高產量來連接電氣組件的電氣組件之連接 方法。 根據本發明…種用於將設置於第—電氣組件之連 =中ΐ第—端子陣列與設置於第二電氣組件之連接部分 =弟二端子陣列以使用經分散嬋料顆粒㈣固性樹脂 中？：：各向異性導電黏著劑而將電氣連續性建立於第 二端子:列與第二端子陣列之間的方式而彼㈣接」 第二端子陣列在各向里性導電^^I吏弟一端子陣列與 件之連接部分盥第-雷_弟屯乳組 彼此相對；-焊接;=牛之連接部分之間的狀態下 劑中所含有之焊料顆粒熔 電黏者 早陳列姑曰枪+ 弟 ^子陣列與第二端 車J彼此知接來將第一電氣組件 — = :Γ::第一電氣組件及第二電氣組件;及-運接步驟，該步驟藉由 丁汉 第-電氣組件之連接部分：第電黏：劑熱固化而將 此最終固定。 刀/、弟一電軋組件之連接部分彼 此外，焊接步驟包含以下子 側施加壓力至第—端 1.自弟二端子陣列之一 而子陣列及自第二端子陣列之—侧加 312ΧΡ/發明說明書(補件)/96-1 〇/% 11 200818357 熱=焊=粒，及同時完成壓力施加及加熱。 >接步‘驟包含以下子步驟：自 側施加壓力至宽t 弟一鈿子陣列之一 財等自第二端子陣列之一側加 施：完成加熱，及在完成加熱之後完成厪力 料’烊接步驟包含以下子步驟：自第二端子之一 側施加愿力至第—端子陣一山 熱該㈣&子陣狀一側加 焊料顆粒的熱。 ^子陣列之-侧耗散已供應至 =’連接步驟包含以下子步驟：自第二電氣組件之連 接邛/刀之側加熱各向異性導電黏著劑。 此外，連接步驟包含以下子步驟：自第二電氣組件之連 接^之側施加壓力i第一電氣組件之連接部分，及自第 电氣、、且件之連接σρ分之側加熱各向異性導電黏著劑。 本發明使用兩個步驟，亦即，使料料顆粒被分散於 》固性樹脂中之膏狀各向異性導電黏著劑來使㈣化之& 料顆粒將兩個連接部分彼此暫行岐以防止在兩個端子 陣列之間的位置偏移的步驟，及使用已被熱固化之熱固性 樹脂來將兩個連接部分彼此最終固定之步驟。兩個連接部 分可以高產量彼此連接，儘管結合強度低之膏狀各向里性 導電黏著劑被使用。 【實施方式】 下文將參看圖式描述本發明之具體例。 首先，將參考圖1描述本發明具體例之各向異性導電黏 312ΧΡ/發明說明書(補件)/96-10/96134541 9 200818357 者劑之組合物。各向異性導電黏著劑丨經組態成焊料顆粒 及導電顆粒4分散於熱固性樹脂2中之方式。熱固性樹 脂2為諸如環氧樹脂之膏狀絕緣熱固性樹脂黏著劑。焊料 ::粒二由9〇%或更多(重量百分比)之含有咖(炫 ‘; .、、，勺140 C)之低熔點金屬製成’且在低於熱 開=固化之溫度的溫度下熔化。將焊料顆粒3之平均直 從设定為5至15㈣。導電顆粒4為由諸如銀或全之 :::成的金屬顆粒或藉由用金來電鑛 =顆：當將導電顆粒4之直捏設定為小於焊料顆粒3 直住。¥電顆粒4並非不可缺少，亦即，1可 接著，將參相丨至圖3描隸據本、 組件之連接方法。如圖1所示，將第-端子陣二= 二數個電極襯墊之配置)形成於第-電氣組件之連接；二 ，。已使用配量器或其類似二二件導之電=7 加=電氣組件之連接部分5。將第一端子；二 二知子陣列8在各向異性導電黏著齊"插入於第—雷二 件之連接部分5與第二電氣組 電乳、、且 下彼此相對（定位步驟）。f之連接州之間的狀態 ，著’如圖2所示，使插入於第一端子陣列6 山 子陣W之間的各向異性導電黏著劑】之彼等部 有之焊料顆粒3熔化，藉此第—刀斤各 列δ彼此焊接（焊接, /、第二端子陣 …接使烊料顆粒3在被外部施加之 312XP/發明說明書(補件)/96-1〇/9613454ι 1〇 200818357 熱溶化之狀態下與第—端子陣列6及第二端子陣列8接 觸。接著使焊料顆粒3凝固，藉此第一端子陣列6與第二 端子陣列8彼此焊接。焊接步驟欲藉由將第一端子陣列6 與第二端子陣列8彼此料而將第-電氣組件之連接部 分5與第二電氣組件之連接部分7彼此暫行固定。因為不 欲熱固化熱固性樹脂2 ’所以將加熱溫度τι(亦即，熱壓 結合工具之溫度）設定為高於焊料顆粒之熔點了（較佳高 ι〇°或以上）且將壓力結合時間（加熱時間）設定為長於2 焊料顆粒3熔化所必需的最少時間（〇5至3秒）。 (.， 定位及焊接裝置可為具有可相對於台1〇而移動之熱壓 s八11的暫行壓力結合裝置。在將吸附於熱壓結合 工具11上之第二端子陣列8相對於固定至台10之第二二 子陣列6而定位之後，在加熱溫度n下自第二端子陣列 8之一側執行加熱，且將第二電氣組件之連接部分7在力 F1下擠壓在第-電氣組件之連接部分5 i，藉此在第一 端子陣列6與第二端子陣列8之間的焊料顆粒3在被壓碎 的同時被熔化。為了凝固炫化之焊料顆粒3，有必要將1 冷卻至低於熔點τ之溫度。因此，在指定時間之加熱及壓 力施加之後’將熱壓結合工具n與第二電氣組件之連接 部分7分離。結果’加熱及壓力施加同時完成且焊料顆粒 3自然冷卻至低於炼點τ之溫度。此時，較佳谭接可藉由 在完成壓力施加之前完成加熱而實現，因為焊料顆粒3在 其於第-端子陣列6與第二端子陣列8之間被壓碎的狀態 下凝固。 312XP/發明說明書(補件)抓10/96134541 11 200818357 之：有：：2 6所固疋至之台10可由諸如不鏽鋼或鋁 ;二：材料製成’其使得能夠利用“下現象進 flfi ^ j 8之一側供應之熱用於加熱烊料 顆粒3且接著經由第一踹 側，進而導致焊料顆粒3之^1至纟1〇之一 被加熱至高於炫點τ::=二更具體言之，麼力藉由 她結合工且;;度:自力;熱溫㈣^ 加。焊料顆粒3在被:i:二 化。焊料顆粒3接著在因、==之溫度的情況下炫 為上述熱耗散而冷卻至低於熔點 了之》皿度的情況下暫時凝固。焊接步驟藉由在焊料顆粒3 已疑固時提昇熱壓結合工具11而完成。 Ο 7圖3所7F ’使插人於第—電氣組件之連接部分 it二電氣ί件之連接部分7之間的各向異性導電黏著 d ”、、固化，藉此第一電氣組件之連接部分5與第二電氣 組件之連接部分7彼此連接（連接步驟）。熱固性樹脂2(各 向異性導電黏著劑1之基底）藉由外部供應之熱固化且藉 此以不可逆方式將第—電氣組件之連接部分5及第二^ 亂組件之連接部分7最終固定。為此，將連接步驟中之加 熱溫度設定為高於熱固性樹脂2之熱固化溫度的溫度T2 且將加熱時間設定為長於使熱固性樹脂2熱 之時間（4秒或以上）。 吓而 :連接裝置可為具有可相對於台12而移動之熱壓結合工 具13的熱壓結合裝置。將已被彼此暫行固定且輸送至台 12之第-電氣組件之連接部分5及第二電氣組件之連^ 312ΧΡ/發明說明書(補件)/96-10/96134541 12 200818357 部分7在溫度T2下自繁一垂， 加熱，藉此使插入於第— ; = =部分7之—側 氣組件之連接部分7 接邛力5與第二電 化。此時，第二電氣部分 讀1熱固 -電氣組件之連接部分5上連接一刀7由力F2擠遷在第 丈牧口I刀5上，藉此將第_ 二端子陣列4之間的”顆粒3列6與第 顆蝴子陣列4及6之接觸面積增力心; 可藉此獲得。 早乂仏私乳連績性 如上所述，在該具體例之電氣組件之 雷裔έ日放雜丄1 / 逐接方法中’兩個 電巩、、且件錯由兩個步驟而彼此 3被分散於熱固性樹脂2中之二2 ·用焊料顆粒 而並山中之局狀各向異性導電黏著劑1 谷化之焊料顆粒3將兩個連接部分5及7暫行固定 驟’及藉由已被熱固化之熱固性樹脂2而將兩個連接 Ρ刀5及7最終固定之步驟。藉由溶化之焊料顆粒3而彼 此暫㈣定之兩個連接部分5及7之結合強度低於在熱固 ，樹脂2被熱固化時所獲得的結合強度。然而，兩個連接 Ρ刀5及7以充足結合強度而彼此暫行固定，以防止因在 輸至敢終壓力結合裝置期間所外加之振動或衝擊而在 第一端子陣列6與第二端子陣列8之間發生位置偏移。此 舉使得能夠在維持高位置準確性之狀態下進行最終固定 且藉此能夠進行高產量生產。 (產業利用性） 本發明提供如下優勢：即使在使用低結合強度之膏狀各 向異性導電黏著劑的情況下亦可實現高產量連接過程。因 312χρ/發明說明書(補件)/96·謂613454 i 13 200818357 而’本發明在應用至大量生產電子設備之電氣組件之連接 過程中係為有用的。 本申請案基於且主張申請於2006年9月15日之日本專 利申請案第2006-251069號之優先權，該申請案之内容以 引用方式全部併入本文中。 【圖式簡單說明】 電黏著劑之 圖1顯示根據本發明具體例之各向異性導 組合物的剖視圖。
圖2顯示使用根據本發明具體例之各向里 劑而彼此暫行固定之第一電氣組件及第二雷斤电站者 接部分的剖視圖。 电軋組件之連 便用根據本發 園 劑而彼此最終固定之第-電氣組件及“二f f導電黏著 接部分的剖視圖。 氣氧組件之連 【主要元件符號說明】 各向異性導電黏著劑 熱固性樹脂 焊料顆粒 導電顆粒 b 連接部分 6 第一端子陣列 7 連接部分 8 第二端子陣列 10 台 312xp/發明說明書(補件)/%-10/96134541 14 200818357 11 熱壓結合工具 12 台 13 熱壓結合工具 F1 力 F2 力 T1 溫度 T2 溫度 312XP/發明說明書(補件)/96-10/96134541

Claims (1)

  1. 200818357 十、申請專利範圍： 帝u 孔組件之連接方法，其係用於將設置於一第一 d之：連接部分中之-第-端子陣列與設置於一 二連接部分中之-第二端子陣列，以-具 法包含：電氣連續性的方式而彼此連接，該方 第：第-端子陣列與該第二端子陣列於該 之間插=久之連接部分與該第二電氣組件之連接部分 °Λ肖異性冑電黏著劑的狀態下;f皮此相對； 該等错由使該各向異性導電黏著劑中所含有之 列彼二!化而將該第一端子陣列與該第二端子陣 氣組件之連接件之連接部分與該第二電 一輸送㈣，輸送彼㈣行固定的 第二電氣組件；及 电孔、、且仵及5亥 驟’藉由使該各向異性導電黏著劑熱固化而將 分彼此最終固定。^…亥弟…組件之連接部 圍第1項之電氣組件之連接方法，其中 麼力下子步驟··自該第二端子陣列之側施加 等焊料顆&子陣列’及自該第二端子陣列之侧加熱該 、㈣顆粒’及同時完成該屢力施加及該加孰。 3.如申請專利範圍第1項之電氣組件之連接方法，其中 312XP/發明說明書軸抓動61卿 16 200818357 :包含以下子步驟:自該第二端子陣列之侧施加 等焊料顆粒，==及】：第二端子陣列之側加熱該 力施加。70 ^ σ，、、、及在疋成該加熱之後完成該壓 利範圍第1項之電氣組件之連接方法，其中 壓下子㈣：自該第二端子陣列之侧施加 等焊料=—端子陣列，及自該第二端子陣列之側加熱該 焊料顆=熱及自該第—端子陣列之側耗散已供應至該等 =申: 青專利範圍第…項中任一項之電氣組件之連 該連接步驟包含以下子㈣：自該第二電氣 、、牛之錢接部分之側加熱該各向異性導電黏著劑。 接m專利範圍第1至4項中任-項之電氣組件之連 二mi該連接步驟包含以下子步驟：自該第二電氣 接t連接部分之側施加壓力至該第—電氣組件之連 向二及電自:著第二電氣組件之㈣ 312ΧΡ/發明說明書(補件)/96-10/96134541
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