KR101196722B1 - 전자부품 실장방법 - Google Patents

전자부품 실장방법 Download PDF

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KR101196722B1
KR101196722B1 KR1020077017344A KR20077017344A KR101196722B1 KR 101196722 B1 KR101196722 B1 KR 101196722B1 KR 1020077017344 A KR1020077017344 A KR 1020077017344A KR 20077017344 A KR20077017344 A KR 20077017344A KR 101196722 B1 KR101196722 B1 KR 101196722B1
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South Korea
Prior art keywords
electronic component
solder
thermosetting resin
gold
substrate
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KR1020077017344A
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English (en)
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KR20080048440A (ko
Inventor
타다히코 사카이
히데키 에이후쿠
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파나소닉 주식회사
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Publication of KR20080048440A publication Critical patent/KR20080048440A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
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    • Y10T29/49117—Conductor or circuit manufacturing
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    • Y10T29/49117—Conductor or circuit manufacturing
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

전자부품에 마련된 금 범프를 기판에 형성된 접합단자에 주석 또는 주석계의 땜납을 이용하여 접합하고, 전자부품과 기판을 열경화성 수지에 의해 접착하여 전자부품을 기판에 실장하기 위한 전자부품 실장방법이 개시된다. 열경화성 수지를 전자부품의 하면에 의해 외측으로 향하여 유동시켜 땜납 입자를 땜납의 융점보다도 고온으로 가열된 금 범프의 측면에 접촉시키고 또한 땜납 입자의 일부를 금 범프와 전극의 사이에 끼워 넣은 상태로 용융시킨다. 이것에 의해, 금 범프중으로의 외부로부터의 Sn의 확산을 촉진시켜 금 범프중의 Sn 농도를 상승시켜 땜납 접합부에서 금 범프로 Sn이 확산하는 것에 의한 카켄달 보이드를 억제할 수 있다.
전자부품, 범프, 기판

Description

전자부품 실장방법{METHOD OF MOUNTING ELECTRONIC COMPONENTS}
본 발명은 금 범프가 마련된 전자부품을 기판에 실장하는 전자부품 실장방법에 관한 것이다.
전자부품을 기판에 실장하는 방법으로서, 전자부품에 마련된 범프를 기판에 형성된 접합단자에 접합하는 형태가 널리 이용되고 있으며, 범프의 재질로서는 도전성이 우수하고 산화에 의한 표면 열화가 없는 금이 다용되고 있다. 금을 재질로 하는 범프를 접합단자에 접합하는 방법으로서는 종래부터 열경화성 수지중에 도전 입자를 혼입한 이방성 도전제가 알려져 있다. 이 방법에서는 전자부품의 탑재에 앞서 접합단자를 피복하기 위해 미리 이방성 도전제를 도포하고, 전자부품 실장 동작시에 범프를 접합단자에 압압하면서 가열한다. 이것에 의해, 범프와 접합 단자를 도전 입자를 통하여 전기적으로 도통시키고 또한, 경화된 이방성 도전제에 의해 전자부품 본체와 기판을 접착한다.
이 이방성 도전제를 이용하는 방법은 전기적인 도통과 전자부품 본체의 기판에의 접착을 동시에 행할 수 있는 이점을 갖지만, 양호한 도통을 확보하여 저 접속저항을 실현하기 위해서는 범프와 접합단자의 접촉상태를 모든 범프에 대하여 균일하게 유지하는 것이 요구된다. 이 때문에 이방성 도전제를 이용한 부품 실장 방법 에서는 고도의 탑재 정밀도를 구비한 실장 설비를 필요로 하므로 간편한 방법으로 금의 범프가 설치된 전자부품을 고품질로 실장가능한 방법이 요구되었다.
따라서, 이러한 요망을 만족시키는 것을 목적으로 하여 이방성 도전제에 함유된 도전 입자를 땜납 입자로 치환한 구성의 것을 이용하는 방법이 각종 제안되고 있다(예를 들면, 특허문헌 1 내지 4 참조). 이러한 특허문헌예에서는 수지에 땜납 입자를 혼입한 시트형 이방성 도전제를 이용하여 전자부품 실장동작에 있어서 범프와 접속 단자와의 사이에 개재한 땜납 수지를 용융시킴으로써 양호한 도전성을 확보하도록 하고 있다.
[특허문헌 1] 특개평8-186156호 공보
[특허문헌 2] 특개평10-112473호 공보
[특허문헌 3] 특개평11-4064호 공보
[특허문헌 4] 특개평11-176879호 공보
하지만, 상술한 각 예에 나타낸 방법에서, 땜납 입자를 구성하는 땜납 재질로서 최근 다용되고 있는 주석(Sn)계의 땜납을 이용하는 경우에는 이하에 설명하는 바와 같은 카켄달 보이드(Kirkendall voids)에 기인하는 강도 열화가 생기는 문제가 있다. 즉, 금(Au)을 재질로 하는 범프와 접합단자를 땜납을 개재시켜 접합하는 접합 경계면 근방에서는 시간 경과와 함께 Au중으로의 Sn의 확산이 진행된다. 이 때, 이방성 도전제를 이용하는 땜납 접합에서는 함유되는 땜납 입자의 양은 통상의 땜납 접합과 비교하여 적기 때문에, 땜납 접합와 범프중의 Sn의 농도차는 커지기 쉬워 결과로서 땜납 접합부로부터 범프중으로의 Sn의 확산이 촉진된다. 이 결과, 땜납 접합부에서 Sn이 확산한 부분에 미소한 보이드가 발생하여 접합강도를 크게 저하시키는 요인이 되었다.
따라서, 본 발명은 금의 범프를 땜납 접합하는 전자부품 실장에 있어서 카켄달 보이드에 기인하는 강도 열화를 방지할 수 있는 전자부품 실장방법을 제공하는 것을 목적으로 한다.
본 발명의 전자부품 실장방법은 전자부품에 마련된 금 범프를 기판에 형성된 접합단자에 주석 또는 주석계의 땜납을 이용하여 접합하고 또한, 상기 전자부품과 기판을 열경화성 수지에 의해 접착함으로써 상기 전자부품을 기판에 실장하는 전자부품 실장방법으로서,
상기 땜납을 입자상으로 한 땜납 입자를 포함하는 열경화성 수지를 상기 기판의 표면의 상기 접합단자를 포함하는 범위에 도포하는 수지 도포 공정;
가열 기능을 가지는 유지헤드에 의해 상기 전자부품을 유지한 상태로 상기 금 범프와 상기 접합 단자의 위치 맞춤을 행하는 위치 맞춤 공정;
상기 유지 헤드에 의한 상기 전자부품의 가열을 행하면서 상기 유지 헤드를 하강시켜 상기 금 범프를 상기 접합단자에 접합하는 범프 접합 공정; 및
상기 열경화성 수지를 열경화시켜 상기 전자부품을 상기 기판에 접착하는 수지 경화 공정을 포함하고,
상기 범프 접합 공정에 있어서, 상기 도포된 열경화성 수지를 전자부품의 하면에 의해 외측으로 향하여 유동시켜 상기 열경화성 수지중에 함유된 상기 땜납 입자를 상기 유지헤드에 의해 상기 땜납의 융점보다도 고온으로 가열된 상기 금 범프의 측면에 접촉시키고 또한, 상기 땜납 입자의 일부를 상기 금 범프와 상기 접합단자의 사이에 끼워 넣은 상태로 용융시킨다.
본 발명에 따르면, 도포된 열경화성 수지를 전자부품의 하면에 의해 외측으로 향하여 유동시켜 열경화성 수지중에 함유된 땜납 입자를 땜납 입자의 융점보다도 고온으로 가열된 금 범프의 측면에 접촉시키고 또한, 땜납 입자의 일부를 금 범프와 접합단자와의 사이에 끼워 넣은 상태로 용융시킴으로써, 금 범프중에의 외부로부터의 Sn의 확산을 촉진시켜 금 범프중의 Sn 농도를 상승시킬 수 있고, 땜납 접합부에서 금 범프로의 Sn의 확산을 억제하여 카켄달 보이드의 발생을 억제할 수 있다.
도 1a 내지 1c는 본 발명의 일실시예에 따른 전자부품 실장방법의 공정 설명도.
도 2a 및 2b는 본 발명의 일실시예에 따른 전자부품 실장방법의 공정 설명도.
도 3a 및 3b는 본 발명의 일실시예에 따른 전자부품 실장방법의 공정 설명도.
다음, 본 발명의 실시예를 도면을 참조하여 설명한다. 이 전자부품 실장방법은 전자부품에 설치된 금 범프를 기판에 형성된 접합단자에 주석 또는 주석계 땜납 을 이용하여 접합하고 또한, 전자부품과 기판을 열경화성 수지에 의해 접착한다.
도 1a에서, 기판(1)의 표면에는 접합단자로서의 전극(2)이 형성되어 있다. 기판(1)의 표면에 있어서 전극(2)을 포함하는 범위에는 도 1b에 도시한 것과 같이 땜납을 입자상으로 한 땜납 입자(도 3a에 나타낸 땜납 입자(4) 참조)를 함유하는 열경화성 수지(3)가 도포된다(수지 도포 공정). 여기서, 땜납입자(4)에 이용되는 땜납은 주석(Sn) 및 은(Ag)을 함유하는 Sn-Ag계 땜납, 주석(Sn), 은(Ag), 및 동(Cu)을 함유하는 Sn-Ag-Cu계 땜납, 주석(Sn) 및 비스무트(Bi)를 함유하는 Sn-Bi계 땜납 중 어느 하나가 이용된다.
다음, 수지 도포후의 기판(1)에는 전자부품(6)이 탑재된다. 도 1c에 나타낸 것과 같이, 전자부품(6)의 하면에 형성된 전극(6a)에는 하부에 볼록부(5a)를 가지는 형상의 금 범프(5)가 설치되어 있다. 전자부품(6)은 가열기능을 가지는 유지 헤드(7)에 의해 흡착 유지되고, 기판(1)에의 탑재에 앞서 전자부품(6)의 가열이 개시된다. 그리고, 전자부품(6)을 유지한 유지 헤드(7)는 전자부품(6)의 가열을 행하면서 기판(1)의 상방으로 이동하고, 금 범프(5)와 전극(2)과의 위치 맞춤을 행한다(위치 맞춤 공정).
이 후, 전자부품(6)의 가열이 진행되어 금 범프(5)의 온도가 열경화성 수지(3)에 함유되는 땜납 입자(4)의 융점보다도 고온이 되면, 전자부품(6)의 착지 동작이 개시된다. 즉, 유지 헤드(7)에 의한 전자부품(6)의 가열을 행하면서 유지 헤드(7)를 하강시켜 금 범프(5)를 전극(2)에 접합한다(범프 접합 공정). 이 때, 전자부품(6)의 하강에 의해 먼저 도 2a에 도시한 바와 같이 기판(1)의 표면에 도포된 열경화성 수지(3)를 외측으로 향하여 넓히면서, 금 범프(5)의 볼록부(5a)를 전극(2)에 착지시킨다. 그리고, 이 후 유지 헤드(7)에 의한 전자부품(6)의 압압과 가열을 계속함으로써, 도 2b에 도시한 바와 같이 볼록부(5a)가 어느 정도 변형된 상태로 금 범프(5)가 전극(2)에 접합됨과 동시에, 열경화성 수지(3)를 열경화시켜 전자부품(6)을 기판(1)에 접착한다(수지 경화 공정).
도 3a 및 3b는 상술한 범프 접합 공정에서의 열경화성 수지(3)의 거동을 나타내고 있다. 전자부품(6)을 기판(1)에 대하여 하강시키는 과정에서는 먼저 금 범프(5)가 볼록부(5a)로부터 열경화성 수지(3)에 매립되고, 그 후 전자부품(6)의 하면이 열경화성 수지(3)를 밀어 내림으로써 열경화성 수지(3)는 내측에서 외측으로 밀어 넓히고, 이것에 의해 열경화성 수지(3)는 함유한 땜납 입자(4)와 함께 외측(화살표 a 방향)으로 향하여 유동한다.
그리고, 이 상태에서 더 전자부품(6)을 하강시키면, 도 2b에 도시한 바와 같이 열경화성 수지(3)중의 땜납 입자(4)는 일부가 금 범프(5)의 측면에 접촉하고 일부는 금 범프(5)의 하면과 전극(2)과의 사이에 끼워 넣어진다. 그리고, 이러한 땜납 입자(4)는 모두 미리 땜납입자(4)의 융점보다도 고온으로 가열된 금 범프(5)에 접촉함으로써 용융된다. 여기서, 금 범프(5)의 측면에 접촉하여 용융된 땜납 입자(4)로부터는 땜납입자(4)의 성분인 Sn이 금 범프(5)의 Au중으로 확산된다. 또한, 금 범프(5)와 전극(2)의 사이에서 용융된 땜납 입자(4)는 후에 냉각 고화함으로써 금 범프(5)를 전극(2)에 접합하는 역할을 한다.
즉, 본 실시예에 나타낸 전자부품 실장방법에서는 상술한 범프 접합 공정에 서 도포된 열경화성 수지(3)를 전자부품(6)의 하면에 의해 외측으로 향하여 유동시켜 열경화성 수지(3)중에 함유된 땜납 입자(4)를 유지헤드(7)에 의해 땜납의 융점보다도 고온으로 가열된 금 범프(5)의 측면에 접촉시킴과 동시에 땜납 입자(4)의 일부를 금 범프(5)와 전극(2)의 사이에 끼워 넣은 상태로 용융시키도록 하고 있다.
금 범프(5)를 주석(Sn)계의 땜납에 의해 전극(2)을 접합할 때 상술한 바와 같은 전자부품 실장방법을 채용함으로써 이하에 나타낸 우수한 효과를 얻는다. 즉, 전자부품(6)의 전극(2)에의 접합에 주석계의 땜납을 이용하는 경우에는 카켄달 보이드에 기인하는 강도 열화가 생기는 문제가 있다. 즉, 금(Au)을 재질로 하는 범프와 전극을 땜납을 개재시켜 접합하는 접합 경계면 근방에서는 땜납 접합부로부터 Au중으로 Sn이 확산됨으로써 미소한 보이드가 발생하기 쉬워 접합 강도를 저하시키는 요인이 되었다.
이에 대하여, 본 실시예에 나타낸 전자부품 실장방법에서는 열경화성 수지(3)중의 땜납 입자(4)를 유동시켜 가열된 금 범프(5)의 측면에 접촉시키고, 이들 땜납 입자(4)를 금 범프(5)의 표면에서 용융시키도록 하고 있다. 이것에 의해, 금 범프(5)에는 외부에서 내부로 향하여 땜납 입자(4)중의 Sn이 확산되어 금 범프(5)중의 Sn 농도가 상승한다. 이것은 금 범프(5) 내부의 Sn 농도와, 금 범프(5)와 전극(2)과의 접합 경계면 근방에서의 Sn 농도와의 농도차가 축소된다는 것을 의미하고 있다.
따라서, 금 범프(5)와 전극(2)과의 접합 경계면에 존재하는 땜납 입자(4)에서 금 범프(5)의 내부로의 Sn의 확산이 억제되어 Sn의 확산에 의해 카켄달 보이드 가 발생하는 것에 기인하는 접합강도의 저하를 억제할 수 있다. 이 때, 금 범프(5)를 열경화성 수지(3)에 접촉시키기 전에 금 범프(5)의 온도를 땜납 입자(4)의 융점보다도 고온으로 가열함으로써 금 범프(5)에 접촉한 땜납 입자(4)는 신속하게 용융되어 외부로부터의 금 범프(5)중으로의 Sn의 확산을 촉진시킬 수 있다.
본 발명은 2005년 9월 30일 출원한 일본특허출원 제2005-288107을 기초로 한 출원으로서, 그 내용은 여기에 참조로서 포함된다.
본 발명의 전자부품 실장방법은 땜납 접합부로부터 금 범프로의 Sn의 확산을 억제하여 카켄달 보이드의 발생을 억제할 수 있는 효과를 가지며, 금 범프를 기판에 형성된 접합 단자에 주석 또는 주석계의 땜납을 이용하여 접합하는 용도에 이용가능하다.

Claims (4)

  1. 전자부품에 마련된 금 범프를 기판에 형성된 접합단자에 주석 또는 주석계의 땜납을 이용하여 접합하고 상기 전자부품과 기판을 열경화성 수지에 의해 접착함으로써 상기 전자부품을 기판에 실장하는 전자부품 실장방법으로서,
    상기 땜납을 입자상으로 한 땜납 입자를 함유하는 열경화성 수지를 상기 기판의 표면의 상기 접합단자를 포함하는 범위에 도포하는 수지 도포 공정;
    가열 기능을 가지는 유지헤드에 의해 상기 전자부품을 유지한 상태로 상기 금 범프와 상기 접합단자의 위치 맞춤을 행하는 위치 맞춤 공정;
    상기 유지 헤드에 의한 상기 전자부품의 가열을 행하면서 상기 유지 헤드를 하강시켜 상기 금 범프를 상기 접합단자에 접합하는 범프 접합 공정; 및
    상기 열경화성 수지를 열경화시켜 상기 전자부품을 상기 기판에 접착하는 수지 경화 공정을 포함하고,
    상기 범프 접합 공정에 있어서, 상기 도포된 열경화성 수지를 전자부품의 하면에 의해 외측으로 향하여 유동시켜 상기 열경화성 수지중에 함유된 상기 땜납 입자를 상기 유지헤드에 의해 상기 땜납의 융점보다도 고온으로 가열된 상기 금 범프의 측면에 접촉시키고 상기 땜납 입자의 일부를 상기 금 범프와 상기 접합단자의 사이에 끼워 넣은 상태로 용융시키는 것을 특징으로 하는 전자부품 실장방법.
  2. 제1항에 있어서, 상기 땜납은 주석(Sn) 및 은(Ag)을 함유하는 Sn-Ag계 땜납, 주석(Sn), 은(Ag), 및 동(Cu)을 함유하는 Sn-Ag-Cu계 땜납, 주석(Sn) 및 비스무트(Bi)를 함유하는 Sn-Bi계 땜납 중 어느 하나인 것을 특징으로 하는 전자부품 실장방법.
  3. 제1항에 있어서, 상기 금 범프를 상기 열경화성 수지에 접촉시키기 전에 상기 금 범프의 온도를 상기 땜납의 융점보다도 고온으로 가열하는 것을 특징으로 하는 전자부품 실장방법.
  4. 제2항에 있어서, 상기 금 범프를 상기 열경화성 수지에 접촉시키기 전에 상기 금 범프의 온도를 상기 땜납의 융점보다도 고온으로 가열하는 것을 특징으로 하는 전자부품 실장방법.
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JP2007103449A (ja) 2007-04-19
KR20080048440A (ko) 2008-06-02

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