CN101120441A - 安装电子元件的方法 - Google Patents

安装电子元件的方法 Download PDF

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Publication number
CN101120441A
CN101120441A CNA200680005056XA CN200680005056A CN101120441A CN 101120441 A CN101120441 A CN 101120441A CN A200680005056X A CNA200680005056X A CN A200680005056XA CN 200680005056 A CN200680005056 A CN 200680005056A CN 101120441 A CN101120441 A CN 101120441A
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China
Prior art keywords
electronic component
projection
thermosetting resin
circuit board
scolder
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CNA200680005056XA
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English (en)
Inventor
境忠彦
永福秀喜
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN101120441A publication Critical patent/CN101120441A/zh
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Abstract

一种用于在电路板上安装电子元件的电子元件安装方法，其中通过使用Sn制成的焊料或包含Sn的焊料使设置在电子元件上的Au凸起与形成在电路板上的接合终端相接合，并且电子元件借助热固树脂粘合在电路板上进而将电子元件安装在电路板。所施加的热固树脂借助电子元件的下表面朝外面流出，随后使热固树脂内包含的部分焊料微粒与被加热至高于焊料熔点温度的Au凸起的侧表面相接触，而另一部分的焊料微粒在夹于Au凸起和电极之间的状态下被熔化。因此，促进Sn从外部到Au凸起内的扩散并由此增加Au凸起内的Sn密度。此外，抑制了Sn从焊料接合部分到Au凸起内的扩散并进而抑制Kirkendall空隙的产生。

Description

安装电子元件的方法
技术领域
本发明涉及一种将分别配有金(Au)凸起的电子元件安装在电路板(board)上的电子元件安装方法。
背景技术
对于将电子元件安装在电路板上的方法，已经广泛使用了一种模式，其中设置在电子元件上的凸起(bump)分别与形成在电路板上的接合终端相接合。Au，导电性良好且不会由于氧化作用而使表面恶化，被广泛用作凸起的材料。至于使Au制成的凸起与接合终端接合的方法，已知一种使用各向异性的导电材料的方法，通过在热固树脂内混入导电微粒形成所述导电材料。在此方法中，各向异性导电材料预先被施加在电路板上以便在电子元件安装之前覆盖接合终端，随后加热凸起并在安装电子元件的同时使凸起压靠接合终端。因此，通过导电微粒使凸起和接合终端电传导，并且电子元件的主体进一步通过硬化的各向异性导电材料与电路板接合。
利用各向异性导电材料的这种方法具有优势，即同时执行电子元件的主体与电路板的电传导和接合。可是，为了确保良好的导电性并实现低耦合电阻，这种方法需要保持凸起和接合终端之间的接触状态，对所有凸起一样。为此，利用各向异性导电材料的部件安装方法需要具备高安装精确度的安装设备。因此，需要能够以高质量很容易地安装分别配有Au凸起的电子元件。
因此，为了满足上述需求，已经提出了多种方法，每种方法中各向异性导电材料所包含的导电微粒由焊料微粒所替换(例如，参见专利文献1至4)。在这些专利文献的每个实例中，使用通过在树脂中混入焊料微粒所形成的片状各向异性导电材料，并在安装电子元件时，设置在凸起和接合终端之间的焊料树脂被熔化，进而确保了良好的导电性。
专利文献1：JP-A-8-186156
专利文献2：JP-A-10-112473
专利文献3：JP-A-11-4064
专利文献4：JP-A-11-176879
可是，在前述每个实例中所示的方法中，当使用近年来已经广泛用作构成焊料微粒的焊料材料的Su焊料时，引出了一个问题，即由于下文解释的Kirkendall空隙(void)而使得强度下降。也就是说，在接近接合边界的区域内，其中Au制成的凸起和接合终端通过焊料接合，Sn随时间的经过扩散导Au内。在此情况中，在用各向异性导电材料的焊料接合中，由于各向异性导电材料中包含的焊料微粒量比常规使用的焊料接合中用的要少，焊料接合部分和凸起之间的Sn密度差很可能变大。因此，促进了Sn从焊料接合部分到凸起内的扩散。进而，在Sn扩散到Au内的部分焊料接合部分处产生细小的空隙，这引起接合强度的大幅度下降。
发明内容
因此，本发明的目的是在利用焊料接合Au凸起的电子元件安装方法中提供一种电子元件安装方法，其能够防止由于Kirkendall空隙所引起的强度下降的发生。
根据本发明的电子元件安装方法以这样的方式安置，在电子元件安装方法中，设置在电子元件上的Au凸起通过使用Sn制成的焊料或包含Sn的焊料与接合终端接合，并且电子元件借助热固树脂粘合在电路板上，进而将电子元件安装在电路板上，所述方法包括：
在电路板表面上包含接合终端的区域上施加热固树脂的树脂施加工序，所述树脂包含通过粒化焊料形成的焊料微粒；
在电子元件由具有加热功能的保持头保持的状态下，执行Au凸起和接合终端之间定位的定位工序；
降低保持头并利用保持头加热电子元件进而使Au凸起与接合终端接合的凸起接合工序；以及
热固化热固树脂进而将电子元件粘合在电路板上的树脂硬化工序，其中
在凸起接合工序中，施加的热固树脂借助电子元件的下表面朝外部流动，热固树脂中包含的焊料微粒通过保持头与被加热至高于焊料熔点温度的Au凸起的下表面相接触，并且部分的焊料微粒在夹于Au凸起和接合终端之间的状态下被熔化。
根据本发明，施加的热固树脂借助电子元件的下表面朝外部流动，随后热固树脂中包含的部分焊料微粒与被加热至高于焊料熔点温度的Au凸起的下表面相接触，并且另一部分焊料在夹于Au凸起和电极之间的状态下被熔化。
因此，促进了Sn从外部到Au凸起内的扩散，并由此增加了Au凸起内的Sn密度。此外，抑制了Sn从焊料接合部分到Au凸起内的扩散并由此抑制了Kirkendall空隙的产生。
附图说明
图1(a)至1(c)为解释根据本发明实施例的电子元件安装方法的示意图。
图2(a)至2(b)为解释根据本发明实施例的电子元件安装方法的示意图。
图3(a)至3(b)为解释根据本发明实施例的电子元件安装方法的示意图。
具体实施方式
参照附图解释本发明的实施例。根据该电子元件安装方法，设置在电子元件上的Au凸起通过使用Sn焊料或包含Sn的焊料分别与形成在电路板上的接合终端相接合，并借助热固树脂将电子元件粘合在电路板上。
在图1(a)中，分别用作接合终端的电极2形成在电路板1的表面上。如图1(b)中所示，包含通过粒化焊料所形成的焊料微粒(参见图3(a)中所示的焊料微粒4)的热固树脂3被施加在电路板1表面上包含电极2的区域上(树脂施加工序)。适用于焊料微粒4的焊料为包含Sn和Ag的Sn-Ag基焊料，包含Sn、Ag和Cu的Sn-Ag-Cu基焊料或包含Sn和Bi的Sn-Bi基焊料。
接着，将电子元件6安装在已经施加有树脂的电路板上。如图1(c)所示，形成在电子元件6下表面上的每个电极6a配有Au凸起5，所述凸起在其下部具有凸出部分5a。电子元件6由具有加热功能的保持头7所吸附和保持。如此保持电子元件6的保持头7在电路板1上移动并加热电子元件6，分别执行Au凸起5和电极2之间的定位(定位工序)。
此后，进行电子元件6的加热并在Au凸起5的温度变得高于热固树脂3内包含的焊料微粒4的熔点时，开始电子元件6的放置操作。也就是说，保持头7降低，进而使Au凸起分别与电极2相接合，同时保持头7加热电子元件(凸起接合工序)。在此情况中，首先，如图2(a)所示，根据电子元件6的降低，Au凸起5的凸出部分5a分别被放置在电极2上，同时迫使施加在电路板1表面上的热固树脂3朝外部延伸。随后，保持头7连续压按并加热电子元件6，借此，如图2(b)所示，Au凸起5在凸出部分5a略微变形的情况下分别与电极相接合。同时，热固树脂3被热固进而将电子元件6固定在电路板1(树脂硬化工序)。
图3(a)和3(b)示出了前述凸起接合工序中热固树脂3的性能。在相对于电路板1相抵电子元件6的过程中，Au凸起5的凸出部分5a首先被埋在热固树脂3内，电子元件6的下表面随后向下推动热固树脂3。因此，热固树脂3被迫从内部向外延伸，热固树脂3借此与其中所包含的焊料微粒4一起流到外面(箭头a所示的方向)。
当电子元件6在此状态下进一步降低时，如图2(b)所示，热固树脂3内的部分焊料微粒4与Au凸起的侧面相接触，而另一部分焊料微粒被夹在Au凸起5的下表面和电极2之间。这部分和另一部分焊料微粒4由于与预先已经被加热到高于焊料微粒4熔点的温度的Au凸起5相接触而被熔化。在此情况中，构成焊料4的Sn从与Au凸起5的侧表面相接触的焊料微粒4扩散到Au凸起5的Au中并由此被熔化。Au凸起5和电极2之间熔化的焊料微粒4随后冷却并固化，以使Au凸起5分别与电极2相接合。
换句话说，根据该实施例的电子元件安装方法，所施加的热固树脂3借助电子元件6的下表面流到外面，随后热固树脂3内包含的部分焊料微粒4与被保持头7加热到高于焊料熔点的稳定的Au凸起5的侧面相接触，而另一部分焊料微粒4在夹于Au凸起5和电极2之间的状态下也被熔化。
在利用包含Sn的焊料接合Au凸起5和电极2时使用前述电子元件安装方法时，能够获得以下极好的技术效果。即，在使用包含Sn的焊料以接合电子元件6和电极2的情况中，存在由于Kirkendall空隙使得强度下降的问题。具体地，在接合边界附近的区域中，其中Au形成的凸起和电极通过焊料接合，Sn从焊料接合部分到Au中的扩散很可能产生细小的空隙，这引起接合强度的下降。
相反，根据本实施例的电子元件安装方法，热固树脂3内的焊料4流动并与已加热的Au凸起5的侧面相接触，进而在Au凸起5的表面上熔化这些焊料微粒4。因此，焊料微粒4内的Sn从凸起的外部朝内部扩散到Au凸起5内，由此增加了Au凸起5内的Sn密度。这意味着Au凸起5内的Sn密度和Au凸起5与电极2之间接合边界附近的Sn密度差降低了。
因此，抑制了Sn从存在于Au凸起5和电极2之间接合边界的焊料微粒4到Au凸起5内的扩散，由此抑制了由于Sn扩散引起的Kirkendall空隙产生所带来的接合强度的下降。在此情况下，由于在Au凸起5与热固树脂3接触之前，Au凸起5被加热到高于焊料微粒4熔点的温度，所以与Au凸起5相接触的焊料微粒4迅速熔化，并由此促进了Sn从凸起外部到Au凸起5内的扩散。
本申请基于并要求2005年9月30日递交的日本专利申请No.2005-288107的权益，其全部内容在此包含引作参考。
工业应用性
根据本发明的电子元件安装方法具有抑制Kirkendall空隙产生并且还抑制Sn从焊料接合部分到Au凸起内的扩散的作用，并由此可应用于通过利用Sn制成的焊料或包含Sn的焊料使Au凸起分别与电路板上形成的接合终端接合的应用。

Claims (4)

1.一种用于将电子元件安装在电路板上的电子元件安装方法，其中通过使用Sn制成的焊料或包含Sn的焊料使设置在电子元件上的Au凸起与接合终端接合，并且所述电子元件借助热固树脂粘合在电路板上，进而将所述电子元件安装在电路板上，所述方法包括：
在电路板表面上包含接合终端的区域上施加热固树脂的树脂施加工序，所述树脂包含通过粒化焊料形成的焊料微粒；
在所述电子元件由具有加热功能的保持头保持的状态下，执行Au凸起和接合终端之间定位的定位工序；
降低保持头并利用保持头加热所述电子元件进而使Au凸起与接合终端接合的凸起接合工序；以及
热固化热固树脂进而将所述电子元件粘合在电路板上的树脂硬化工序，
其中，在所述凸起接合工序中，施加的热固树脂借助电子元件的下表面朝外部流动，热固树脂中包含的焊料微粒通过保持头与被加热至高于焊料熔点温度的Au凸起的下表面相接触，并且部分的焊料微粒在夹于Au凸起和接合终端之间的状态下被熔化。
2.根据权利要求1所述的电子元件安装方法，其中所述焊料为包含Sn和Ag的Sn-Ag基焊料，包含Sn、Ag和Cu的Sn-Ag-Cu基焊料或包含Sn和Bi的Sn-Bi基焊料。
3.根据权利要求1所述的电子元件安装方法，其中在所述Au凸起与所述热固树脂接触之前，所述Au凸起被加热到高于焊料微粒熔点的温度。
4.根据权利要求2所述的电子元件安装方法，其中在所述Au凸起与所述热固树脂接触之前，所述Au凸起被加热到高于焊料微粒熔点的温度。
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