JP2008072038A - 電気部品の接続方法 - Google Patents

電気部品の接続方法 Download PDF

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Publication number
JP2008072038A
JP2008072038A JP2006251069A JP2006251069A JP2008072038A JP 2008072038 A JP2008072038 A JP 2008072038A JP 2006251069 A JP2006251069 A JP 2006251069A JP 2006251069 A JP2006251069 A JP 2006251069A JP 2008072038 A JP2008072038 A JP 2008072038A
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Japan
Prior art keywords
terminal row
electrical component
anisotropic conductive
conductive adhesive
connection
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Granted
Application number
JP2006251069A
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English (en)
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JP4432949B2 (ja
Inventor
Tadahiko Sakai
忠彦 境
Hideki Nagafuku
秀喜 永福
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2006251069A priority Critical patent/JP4432949B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to PCT/JP2007/068321 priority patent/WO2008032867A1/en
Priority to US12/159,832 priority patent/US7886432B2/en
Priority to EP07807672A priority patent/EP2062469A1/en
Priority to KR1020087015316A priority patent/KR20090051721A/ko
Priority to CN2007800018446A priority patent/CN101366326B/zh
Priority to TW96134541A priority patent/TW200818357A/zh
Publication of JP2008072038A publication Critical patent/JP2008072038A/ja
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Publication of JP4432949B2 publication Critical patent/JP4432949B2/ja
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

【課題】ＡＣＰを用いた場合であっても高いスループットで接続できる電気部品の接続方法を提供する。
【解決手段】第１の電気部品の接続部５に設けられた第１の端子列６と第２の電気部品の接続部７に設けられた第２の端子列８とを導電可能に接続する方法として、半田粒子３と導電性粒子４を熱硬化性樹脂２内に散在させたペースト状の異方性導電接着剤１を用い、両端子列６、８が位置合わせされた両接続部５、７を半田粒子３により半田付けして仮固定する工程と、熱硬化した熱硬化性樹脂２により両接続部５、７を本固定する工程の２段階の工程を経ることで、仮固定を行う装置から本固定を行う装置に移送される際に両端子列６、８に位置ずれが生じないようにした。
【選択図】図１

Description

本発明は、ペースト状の異方性導電接着剤を用いた電気部品の接続方法に関するものである。
近年の多ピン化、狭ピッチ化する端子列を接続部に備えた電気部品の接続に異方性導電接着剤を用いる方法が実用化されている。異方性導電接着剤は、エポキシ樹脂等の絶縁性と熱硬化性を備えた樹脂接着剤に銀や半田からなる金属粒子やプラスチック樹脂に金メッキを施した粒子等の導電性粒子を散在させた状態で構成されている。異方性導電接着剤を位置合わせされた両接続部の間に介在させた状態で圧力と熱を加えると、導電性粒子が両接続部の対向する端子列と融着すると同時に樹脂の熱硬化が進展し、対向する端子列同士を電気的に接続するとともに両接続部を物理的に接続することができる（特許文献１参照）。電気部品の接続工程は、仮固定工程と本固定工程の２段階の工程に分割されることが多く、仮固定を行う仮圧着装置と本固定を行う本圧着装置を連結した組立ラインで両工程を同時並行的に行うことでスループットの向上を図っている（特許文献２参照）。仮圧着装置では、両接続部に対をなして備えられた端子列同士の位置合わせをして仮固定を行う。本圧着装置では、仮固定された両接続部を加圧および加熱して樹脂接着剤を完全に硬化させる本固定を行う。
仮固定された電子部品には、仮圧着装置から本圧着装置に移送される際に振動等の外力が加わることがあるので、位置合わせされた両端子列が位置ずれを起こすことがないようにしなければならない。そのため、異方性導電接着剤には、テープ状に加工したＡＣＦ（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）が広く用いられている。ＡＣＦは、表面がベタつき、比較的軽い圧力で被着面に接着する力（タック力）が高いので、位置合わせされた両端子列の位置関係がずれにくいという利点がある。このＡＣＦの表層にさらに粘着材を施してタック力を強化する場合もある（特許文献３参照）。
特開平１１−１８６３３４号公報 特開平９−２８３８９６号公報 特開平８−２４９９３０号公報
しかしながら、ＡＣＦは、ペースト状の異方性導電接着剤であるＡＣＰ（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｐａｓｔｅ）に比べタック力に勝るが、テープ状に成型加工しているため、比較的安価なＡＣＰに比べコスト面で劣っている。また、ＡＣＦを被着対象となる電気部品の接続部に対応する形状に加工したり、接続部に貼着したりするための専用の装置を設置する費用やスペースが必要となるなど施工性の面でもＡＣＰに比べ劣っている。
一方、ＡＣＰは、上述の点でＡＣＦに勝るものの接続部を仮固定するほどのタック力を持たないので一回の圧着で本固定まで完了させる必要があり、仮固定工程と本固定工程を同時平行的に行うＡＣＦで接続方法に比べスループットで劣っていた。
そこで本発明は、ＡＣＰを用いた場合であっても高いスループットで接続できる電気部品の接続方法を提供することを目的とする。
請求項１に記載の発明は、熱硬化性樹脂内に半田粒子を散在させたペースト状の異方性導電接着剤を用いて第１の電気部品の接続部に設けられた第１の端子列と第２の電気部品の接続部に設けられた第２の端子列とを導電可能に接続する電気部品の接続方法であって、前記第１の電気部品の接続部と前記第２の電気部品の接続部との間に前記異方性導電接着剤を介在させた状態で前記第１の端子列と前記第２の端子列とを相対させる位置合わせ工程と、前記異方性導電接着剤に含まれる前記半田粒子を溶融させて前記第１の端子列と前記第２の端子列とを半田付けすることで前記第１の電気部品の接続部と前記第２の電気部品の接続部とを仮固定する半田付け工程と、仮固定後の前記第１の電気部品と前記第２の電気部品を移送する工程と、前記異方性導電接着剤を熱硬化させることで前記第１の電気部品の接続部と前記第２の電気部品の接続部とを本固定する接続工程と、を含む。
請求項２に記載の発明は、請求項１に記載の発明であって、前記半田付け工程が、前記第１の端子列に対して前記第２の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、加圧と加熱を同時に解除する工程と、を含む。
請求項３に記載の発明は、請求項１に記載の発明であって、前記半田付け工程が、前記第１の端子列に対して前記第１の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、加熱を解除する工程と、加熱を解除した後に加圧を解除する工程と、を含む。
請求項４に記載の発明は、請求項１または２に記載の発明であって、前記半田付け工程が、前記第１の端子列に対して前記第２の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、前記半田粒子に加熱された熱を前記第１の端子列側から放熱する工程と、を含む。
請求項５に記載の発明は、請求項１乃至４の何れかに記載の発明であって、前記接続工程が、前記第２の電気部品の接続部側から前記異方性導電接着剤に加熱する工程を含む。
請求項６に記載の発明は、請求項１乃至４の何れかに記載の発明であって、前記接続工程が、第１の電気部品の接続部に対して前記第２の電気部品の接続部側から加圧する工程と、前記第２の電気部品の接続部側から前記異方性導電接着剤に加熱する工程と、を含む。
本発明によれば、半田粒子を熱硬化性樹脂内に散在させたペースト状の異方性導電接着剤を用い、両端子列が位置ずれを生じないように溶融した半田粒子により両接続部を仮固定する工程と、熱硬化した熱硬化性樹脂により両接続部を本固定する工程の２段階の工程を経ることで、タック力に劣るペースト状の異方性導電接着剤を用いた場合であっても高いスループットで接続が実現できる。
本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の異方性導電接着剤の組成を示す断面図であり、図２は本発明の実施の形態の異方性導電接着剤を用いて仮固定された第１の電気部品の接続部と前記第２の電気部品の接続部を示す断面図であり、図３は本発明の実施の形態の異方性導電接着剤を用いて本固定された第１の電気部品の接続部と前記第２の電気部品の接続部を示す断面図である。
最初に、本発明の実施の形態の異方性導電接着剤の組成について、図１を参照して説明する。異方性導電接着剤１は、熱硬化性樹脂２内に半田粒子３と導電性粒子４を散在させて組成されている。熱硬化性樹脂２は、エポキシ樹脂等の絶縁性と熱硬化性を備えたペー
スト状の樹脂接着剤である。半田粒子３は、重量比で９０％以上がＳｎＢｉ（融点約１４０℃）で組成された低融点金属であり、熱硬化性樹脂２が熱硬化を始める温度より低い温度で溶融する。半田粒子３は平均粒径が５μｍ〜１５μｍが使用される。導電性粒子４は、銀や金などの貴金属からなる金属粒子やプラスチック樹脂に金メッキを施した粒子であり、その粒子径は半田粒子３の粒子径より小さく形成されている。なお導電性粒子４は必須ではなく省略してもよい。
次に、本発明の実施の形態の電子部品の接続方法について、図１乃至図３を参照して説明する。図１において、第１の電気部品の接続部５には、複数の電極パッドを配列した第１の端子列６が形成されている。また、第１の電気部品と接続される第２の電気部品の接続部７にも同様の第２の端子列８が形成されている。第１の電気部品の接続部５には、ディスペンサ等により異方性導電接着剤１が塗布されており、第１の電気部品の接続部５と第２の電気部品の接続部７との間に異方性導電接着剤１を介在させた状態で第１の端子列６と第２の端子列８とを相対させている（位置合わせ工程）。
図２において、第１の端子列６と第２の端子列８との間に介在する異方性導電接着剤１に含まれる半田粒子３を溶融させて第１の端子列６と第２の端子列８とを半田付けする（半田付け工程）。半田粒子３は外部から加えられる熱によって溶融した状態で第１の端子列６と第２の端子列８に接触し、その後固化して第１の端子列６と第２の端子列８とを半田付けする。半田付け工程では、第１の端子列６と第２の端子列８とを半田付けすることにより、第１の電気部品の接続部５と第２の電気部品の接続部７とを仮固定することを目的としており、熱硬化性樹脂２の熱硬化を目的としていないので、加熱温度（熱圧着ツールの温度）Ｔ１は半田粒子３の融点Ｔより高く（望ましくは１０℃以上高く）、圧着時間（加熱時間）は半田粒子３の溶融に最低限必要な長さ（０．５秒から３秒の範囲）に設定される。
位置合わせと半田付けを行う装置として、ステージ１０に対して相対的に移動が可能な熱圧着ツール１１を有する仮圧着装置を使用することができる。ステージ上に固定された第１の端子列６に対し、熱圧着ツール１１に吸着された第２の端子列８を位置合わせした後に、第２の端子列８側から加熱温度Ｔ１で加熱するとともに荷重Ｆ１で加圧することで、第１の端子列６と第２の端子列８の間の半田粒子３を押し潰しながら溶融させる。溶融した半田粒子３を固化させるためには、半田粒子３を融点Ｔ以下まで冷却する必要があるので、所定時間加熱および加圧を行った後に熱圧着ツール１１を第２の端子列８側から離間させると、加圧と加熱が同時に解除されて半田粒子３が融点Ｔ以下まで自然冷却される。このとき、加熱を加圧に先立って解除させると、半田粒子３が第１の端子列６と第２の端子列８の間で押し潰された状態で固化するので、より良好な半田付けが実現できる。また、第１の端子列６が固定されるステージ１０をステンレスやアルミニウム等の伝熱性の高い材質のものにすることで、第２の端子列８側から加えられる熱が半田粒子３を加熱した後に第１の端子列６からステージ側に放熱されて冷却されるという現象を利用した半田付けを行うこともできる。具体的には、融点Ｔよりも高い加熱温度Ｔ１（融点Ｔ＋１０℃以上融点Ｔ＋３０℃以下）に加熱した熱圧着ツール１１を第２の端子列８側に加圧する。すると半田粒子３は融点Ｔ以上に加熱されて溶融するがその後上記放熱により一時的に融点以下まで冷却されて固化する。そして固化したタイミングで熱圧着ツール１１を上昇させれば半田付け工程は完了する。図３において、第１の電気部品の接続部５と第２の電気部品の接続部７との間に介在する異方性導電接着剤１を熱硬化させることで第１の電気部品の接続部５と第２の電気部品の接続部７とを接続する（接続工程）。異方性導電接着剤１のベースとなる熱硬化性樹脂２は、外部から加えられる熱によって硬化し、第１の電気部品の接続部５と第２の電気部品の接続部７とを不可逆的に本固定する。そのため、接続工程における加熱温度は、熱硬化性樹脂２が熱硬化する温度よりも高い温度Ｔ２となっており、加熱時間も熱硬化樹脂２の熱硬化に必要な長さ（４秒以上）に設定する。
接続を行う装置として、ステージ１２に対して相対的に移動が可能な熱圧着ツール１３を有する熱圧着装置を使用することができる。ステージ１２上に移送された仮固定後の第１の電気部品の接続部５と第２の電気部品の接続部７に対し、第２の電気部品の接続部７側から温度Ｔ２で加熱することで、第１の電気部品の接続部５と第２の電気部品の接続部７との間に介在する異方性導電接着剤１を熱硬化させる。このとき、ステージ上に固定された第１の電気部品の接続部５に対して第２の電気部品の接続部７側から荷重Ｆ２で加圧すると、第１の端子列６と第２の端子列８の間の半田粒子３と導電性粒子４とを押し潰し、両端子列との接触面積を増大させるので、より良好な電気的導通が実現できる。
このように、本実施の形態の電気部品の接続方法は、半田粒子３を熱硬化性樹脂２内に散在させたペースト状の異方性導電接着剤１を用い、溶融した半田粒子３により両接続部５、７を仮固定する工程と、熱硬化した熱硬化性樹脂２により両接続部５、７を本固定する工程の２段階の工程を経ることで両電気部品の接続を行う。溶融半田により仮固定された両接続部５、７は、熱硬化性樹脂２の熱硬化による接合力には及ばないが、本圧着装置に移送する際に加わる振動や衝撃程度では第１の端子列６と第２の端子列８が位置ずれを起こさない程度の接合力で仮固定される。これにより、高い位置精度を維持した状態での本固定が可能となり、高スループットでの生産が可能となる。
本発明によれば、タック力に劣るペースト状の異方性導電接着剤を用いた場合であっても高いスループットの接続が実現できるという利点を有し、大量生産される電子機器向けの電気部品を接続する際に有用である。
本発明の実施の形態の異方性導電接着剤の組成を示す断面図 本発明の実施の形態の異方性導電接着剤を用いて仮固定された第１の電気部品の接続部と前記第２の電気部品の接続部を示す断面図 本発明の実施の形態の異方性導電接着剤を用いて本固定された第１の電気部品の接続部と前記第２の電気部品の接続部を示す断面図
符号の説明
１ 異方性導電接着剤
２ 熱硬化性樹脂
３ 半田粒子
４ 導電性粒子
５ 第１の電気部品の接続部
６ 第２の電気部品の接続部
７ 第１の端子列
８ 第２の端子列

Claims (6)

  1. 熱硬化性樹脂内に半田粒子を散在させたペースト状の異方性導電接着剤を用いて第１の電気部品の接続部に設けられた第１の端子列と第２の電気部品の接続部に設けられた第２の端子列とを導電可能に接続する電気部品の接続方法であって、
    前記第１の電気部品の接続部と前記第２の電気部品の接続部との間に前記異方性導電接着剤を介在させた状態で前記第１の端子列と前記第２の端子列とを相対させる位置合わせ工程と、
    前記異方性導電接着剤に含まれる前記半田粒子を溶融させて前記第１の端子列と前記第２の端子列とを半田付けすることで前記第１の電気部品の接続部と前記第２の電気部品の接続部とを仮固定する半田付け工程と、
    仮固定後の前記第１の電気部品と前記第２の電気部品を移送する工程と、
    前記異方性導電接着剤を熱硬化させることで前記第１の電気部品の接続部と前記第２の電気部品の接続部とを本固定する接続工程と、
    を含む電気部品の接続方法。
  2. 前記半田付け工程が、前記第１の端子列に対して前記第２の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、加圧と加熱を同時に解除する工程と、を含む請求項１に記載の電気部品の接続方法。
  3. 前記半田付け工程が、前記第１の端子列に対して前記第１の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、加熱を解除する工程と、加熱を解除した後に加圧を解除する工程と、を含む請求項１に記載の電気部品の接続方法。
  4. 前記半田付け工程が、前記第１の端子列に対して前記第２の端子列側から加圧するとともに前記第２の端子列側から前記半田粒子に加熱する工程と、前記半田粒子に加熱された熱を前記第１の端子列側から放熱する工程と、を含む請求項１または２に記載の電気部品の接続方法。
  5. 前記接続工程が、前記第２の電気部品の接続部側から前記異方性導電接着剤に加熱する工程を含む請求項１乃至４の何れかに記載の電気部品の接続方法。
  6. 前記接続工程が、第１の電気部品の接続部に対して前記第２の電気部品の接続部側から加圧する工程と、前記第２の電気部品の接続部側から前記異方性導電接着剤に加熱する工程と、を含む請求項１乃至４の何れかに記載の電気部品の接続方法。
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