JPWO2013157197A1 - 電子部品実装方法および電子部品実装ライン - Google Patents
電子部品実装方法および電子部品実装ライン Download PDFInfo
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- JPWO2013157197A1 JPWO2013157197A1 JP2014511087A JP2014511087A JPWO2013157197A1 JP WO2013157197 A1 JPWO2013157197 A1 JP WO2013157197A1 JP 2014511087 A JP2014511087 A JP 2014511087A JP 2014511087 A JP2014511087 A JP 2014511087A JP WO2013157197 A1 JPWO2013157197 A1 JP WO2013157197A1
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- electronic component
- electrode
- solder
- circuit member
- component mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
Description
すなわち、本発明の一局面は、(i)第1電極が形成された主面を有する電子部品を、
前記第1電極に対応する第2電極が形成された主面を有する回路部材に、前記第1電極と前記第2電極との間に熱硬化性樹脂を含む接合材およびはんだを介在させて搭載する工程と、(ii)前記電子部品を前記回路部材に対して押圧しながら、前記はんだの融点よりも低い温度で前記熱硬化性樹脂を第1加熱して硬化させ、その後、前記押圧の圧力を解除する工程、(iii)前記押圧の圧力が解除された状態で、前記第1電極と前記第2電極との間に介在する前記はんだを第2加熱して溶融させて、前記第1電極と前記第2電極とを電気的に接続する工程と、を有する、電子部品実装方法に関する。
(実施形態1)
工程(i)
ここでは、第1電極が形成された主面を有する電子部品2として、第1電極12にはんだバンプ13が備えられたベアチップを用い、第2電極が形成された主面を有する回路部材として、ランド電極11を有する回路基板1を用いる、フリップチップ実装について説明する。
次に、図1(c)に示すように、電子部品2を回路基板1に対して押圧し、荷重をかけながら、電子部品2を介して接合材3を第1加熱する。このような押圧と第1加熱は、電子部品2の背面(主面の反対側の面)に当接する当接面を有するとともに当接面を加熱するヒータ機能を具備するボンディングツール5を用いて行われる。ボンディングツール5の当接面は、電子部品2に均等に圧力を印加できるように平坦であり、電子部品2の背面の大きさよりも大きな面積を有することが望ましい。十分な荷重をかけて電子部品2を押圧することにより、はんだバンプ13は、回路基板1のランド電極11と電子部品2との間で少し押し潰され、変形する。このとき、各電極とはんだバンプ13との間に面接触が達成される。一方、接合材に含まれる熱硬化性樹脂の硬化反応が進行する。
次に、電子部品2に対する押圧の圧力が解除された状態で、ランド電極11と電子部品2との間に介在するはんだバンプ13を第2加熱して溶融させる。これにより、溶融はんだは、ランド電極11および電子部品2の第1電極12に濡れ広がる。その後、はんだの温度が低下すると、はんだが凝固し、はんだ接合部13aが形成される。第2加熱の方法は、電子部品2から回路基板1に対する荷重が印加されない方法であれば、特に限定されない。例えば、図1(d)に示すように、電子部品2を搭載した回路基板1をオーブン6に入れて、はんだバンプ13の融点以上の温度に加熱すればよい。
次に、複数の電子部品2を同時に1つの回路基板1に搭載する場合について説明する。なお、回路基板1の数は、1つに限られず、例えば、10個の電子部品2を2つの回路基板1に5つずつ実装するような場合(すなわち複数の電子部品を少なくとも2つの回路基板に分配して実装する場合)も、本実施形態に含まれる。
まず、図2(a)に示すように、複数の電子部品2の搭載位置を有する回路基板1Aを、その主面に形成されたランド電極(図示せず)を鉛直上方に向けるようにして所定のステージ上に配置する。次に、回路基板1Aのランド電極を覆うように、各電子部品の搭載位置に、熱硬化性樹脂を含む接合材3が塗布される。接合材3の形態や回路基板1Aへの供給方法は、特に限定されず、実施形態1と同様である。その後、はんだバンプ13を有する複数の電子部品2が、回路基板1Aの主面に、順次、搭載される。なお、図2では、電子部品2が1個ずつ回路基板1Aの搭載位置に搭載される場合を示しているが、使用する電子部品搭載装置の仕様により、複数個の電子部品2を同時に、複数の対応する搭載位置に搭載することも可能である。
次に、図2(c)に示すように、複数の電子部品2を、同時に、回路基板1Aに対して押圧し、荷重をかけながら、電子部品2を介して接合材3を第1加熱する。このような押圧と第1加熱は、複数の電子部品2の全ての背面に当接可能な大きな当接面を有するとともに、当接面を加熱するヒータ機能を具備するボンディングツール5Aを用いて行うことができる。このように複数の電子部品2の押圧および第1加熱を同時に行うことにより、実施形態1の場合よりも、実装のタクト時間を更に短縮することが可能である。
次に、図2(d)に示すように、全ての電子部品2に対する押圧の圧力が解除された状態で、複数の電子部品2が熱硬化性樹脂の硬化物(樹脂補強部3a)により接合された回路基板1Aを、オーブン6に入れて第2加熱する。これにより、複数の電子部品2のはんだバンプ13を同時に溶融させることができる。従って、複数の電子部品2について、はんだ接合部13aを同時に形成することができる。
図3に、本発明の一実施形態に係る、回路基板1Aに複数の電子部品を実装するための電子部品実装ライン(以下、単に実装ラインともいう)を簡略化したブロック図で示す。実装ライン100は、回路基板1Aを供給する供給装置101、電子部品搭載装置102、第1加熱装置103、第2加熱装置104および実装が完了した回路基板1Aを回収する回収装置105を含む。さらに、実装ライン100は、回路基板1Aを、供給装置101から、電子部品搭載装置102、第1加熱装置103および第2加熱装置104を経て、回収装置105まで搬送するための搬送装置(コンベア)106を含む。搬送装置106には、回路基板1Aを保持するステージが取り付けられている。搬送装置106は、回路基板1Aを保持したステージを、実装ラインの上流側から下流側に移動させることで、回路基板1Aを搬送する。
電子部品搭載装置102は、供給装置101から供給される回路基板1Aに熱硬化性樹脂を含む接合材3を塗布した後、回路基板1Aに電子部品2を搭載する機能を有する複合装置である。すなわち、電子部品搭載装置102は、装置内の上流側に、回路基板1Aに接合材3を塗布する塗布ユニットを有し、装置内の下流側に、回路基板1Aに電子部品2を搭載する搭載ユニットを有する。これにより、同じ装置の内部で接合材3を回路基板1Aに供給した後、直ちに、回路基板1Aに対して電子部品2の実装を行うことができる。
よって、実装のタクト時間の更なる短縮が図れる。
図4(X)は、はんだの融点以上の温度で第2加熱される前のはんだバンプ12の状態を模式的に示している。はんだバンプ13は、電子部品の第1電極12と、回路部材の第2電極11との間で、やや押し潰された状態となっている。これは、熱硬化性樹脂を硬化させるための第1加熱の際、電子部品が回路部材に対して押圧されるためである。一方、押し潰されたはんだバンプ13の周囲は、熱硬化性樹脂の硬化物(図示せず)により囲まれている。そのため、はんだバンプ13に付与された上下方向の圧力は開放されず、応力としてはんだバンプ13の内部に残留していると考えられる。
接合材として、エポキシ樹脂、硬化剤、カーボンブラック、シリカおよびカップリング剤を含む熱硬化性樹脂組成物を使用した。この組成物は、硬化反応が150℃で進行するように配合を調整した。
回路部材として、ガラスエポキシ基板(FR4)を使用した。
電子部品として、BGA型の半導体チップ(サイズ7×7mmはんだバンプ数700個)を使用した。
はんだバンプの形成には、Sn−Ag共晶はんだ(融点221℃)を用いた。
次に、FR4基板の面積と同じ面積(72cm2)の平坦面を有するボンディングツールを準備した。そして、ボンディングツールの平坦面を全ての電子部品の背面に当接させて、はんだバンプが僅かに変形する程度の力(2.8kN)を、電子部品の背面から試験用基板に向かって印加した。その際、ボンディングツールの当接面の温度を内蔵のヒータにより150℃に設定した。その結果、300秒後に、接合材の硬化反応がほぼ完了した。
次に、ボンディングツールによる押圧を解除して、電子部品を搭載した試験用基板を、予め260℃に設定されたオーブンに入れ、60秒加熱し、その後、冷却した。これにより、電子部品と試験用基板のランド電極との間にはんだ接合部を形成した。
第1加熱の後、ボンディングツールによる押圧を解除することなく、力を0.56kNに低減し、一方、ボンディングツールの平坦面の温度を260℃に昇温して、引き続き、第2加熱を行ったこと以外、実施例1と同様の操作を行った。その後、全ての電子部品のはんだ接合部の接続抵抗値を測定したところ、いずれも抵抗が十分に小さく、電気的接続状態は良好であった。また、第1加熱と第2加熱との正味の合計時間は360秒であった。ただし、ボンディングツールの平坦面の温度を260℃に昇温するのに5分時間がかかり、更に、元の温度に戻すのに20分を要した。また、第2加熱の際、溶融はんだが電子部品と試験用基板との間からはみ出さないように、全ての電子部品に均等な圧力を印加するためには、ボンディングツールの平坦面の角度や荷重の大きさに関して、精密な制御が必要であった。
電子部品を試験用基板に搭載した後、ボンディングツールを用いずに、予め150℃に設定されたオーブンに入れて第1加熱を行い、熱硬化性樹脂の硬化反応を進行させた。その後、オーブンの温度を260℃に昇温し、第2加熱を行った。その後、全ての電子部品のはんだ接合部の接続抵抗値を測定したところ、抵抗に大きなばらつきが見られ、はんだ接合部の信頼性が低いことが判明した。
図4(X)は、はんだの融点以上の温度で第2加熱される前のはんだバンプ13の状態を模式的に示している。はんだバンプ13は、電子部品の第1電極12と、回路部材の第2電極11との間で、やや押し潰された状態となっている。これは、熱硬化性樹脂を硬化させるための第1加熱の際、電子部品が回路部材に対して押圧されるためである。一方、押し潰されたはんだバンプ13の周囲は、熱硬化性樹脂の硬化物(図示せず)により囲まれている。そのため、はんだバンプ13に付与された上下方向の圧力は開放されず、応力としてはんだバンプ13の内部に残留していると考えられる。
Claims (10)
- (i)第1電極が形成された主面を有する電子部品を、前記第1電極に対応する第2電極が形成された主面を有する回路部材に、前記第1電極と前記第2電極との間に熱硬化性樹脂を含む接合材およびはんだを介在させて搭載する工程と、
(ii)前記電子部品を前記回路部材に対して押圧しながら、前記はんだの融点よりも低い温度で前記熱硬化性樹脂を第1加熱して硬化させ、その後、前記押圧の圧力を解除する工程、
(iii)前記押圧の圧力が解除された状態で、前記第1電極と前記第2電極との間に介在する前記はんだを第2加熱して溶融させて、前記第1電極と前記第2電極とを電気的に接続する工程と、を有する、電子部品実装方法。 - 前記工程(ii)において、複数の前記電子部品を少なくとも1つの前記回路部材に対して、同時に押圧しながら、前記はんだの溶融よりも低い温度で前記熱硬化性樹脂を第1加熱する、請求項1記載の電子部品実装方法。
- 前記工程(iii)において、前記押圧の圧力が解除された状態で、複数の前記電子部品の第1電極と少なくとも1つの前記回路部材の第2電極との間に介在する前記はんだを、同時に第2加熱する、請求項1または2記載の電子部品実装方法。
- 前記工程(ii)において、前記押圧により、前記第1電極と前記第2電極との間に介在するはんだの少なくとも一部を変形させる、請求項1〜3のいずれか1項に記載の電子部品実装方法。
- 前記第1電極が、前記はんだの少なくとも一部をバンプとして備える、請求項1〜4のいずれか1項に記載の電子部品実装方法。
- 前記第2電極に、前記はんだの少なくとも一部がプリコートされている、請求項1〜5のいずれか1項に記載の電子部品実装方法。
- 前記はんだの少なくとも一部が粒状物であり、前記接合材中に分散している、請求項1〜6のいずれか1項に記載の電子部品実装方法。
- 前記接合材が、無機材料の粉末をフィラーとして含んでいる、請求項1〜7のいずれか1項に記載の電子部品実装方法。
- 第1電極が形成された主面を有する電子部品を、前記第1電極に対応する第2電極が形成された主面を有する回路部材に実装する電子部品実装ラインであって、
前記回路部材を搬送する回路部材搬送装置と、
前記回路部材搬送装置に前記回路部材を供給する供給装置と、
前記供給装置より下流側に配置され、前記回路部材に、前記電子部品を、前記第1電極と前記第2電極との間に熱硬化性樹脂を含む接合材およびはんだが介在するように搭載する電子部品搭載装置と、
前記電子部品搭載装置より下流側に配置され、前記電子部品の前記主面とは反対側の面に当接して、前記電子部品を前記回路部材に対して押圧しながら、前記電子部品を介して、前記はんだの融点よりも低い温度で前記熱硬化性樹脂を第1加熱して硬化させるボンディングツールを具備する第1加熱装置と、
前記第1加熱装置より下流側に配置され、前記押圧の圧力が解除された状態で、前記第1電極と前記第2電極との間に介在する前記はんだを溶融させる第2加熱装置と、を具備する電子部品実装ライン。 - 前記電子部品搭載装置が、複数の前記電子部品を少なくとも1つの前記回路部材に搭載した後、前記回路部材搬送装置が、前記少なくとも1つの回路部材を前記第1加熱装置に搬送し、
前記第1加熱装置が、前記ボンディングツールにより、複数の前記電子部品を前記少なくとも1つの回路部材に対して、同時に押圧しながら、前記はんだの溶融よりも低い温度で前記熱硬化性樹脂を第1加熱し、
前記第2加熱装置が、前記押圧の圧力が解除された状態で、前記複数の電子部品の第1電極と前記少なくとも1つの回路部材の第2電極との間に介在する前記はんだを、同時に第2加熱する、請求項9記載の電子部品実装ライン。
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CN104221480B (zh) | 2017-09-08 |
CN104221480A (zh) | 2014-12-17 |
JP6011887B2 (ja) | 2016-10-25 |
US10034389B2 (en) | 2018-07-24 |
WO2013157197A1 (ja) | 2013-10-24 |
US20150121692A1 (en) | 2015-05-07 |
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