CN104221480A - 电子零件安装方法及电子零件安装线 - Google Patents

电子零件安装方法及电子零件安装线 Download PDF

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Publication number
CN104221480A
CN104221480A CN201380019898.0A CN201380019898A CN104221480A CN 104221480 A CN104221480 A CN 104221480A CN 201380019898 A CN201380019898 A CN 201380019898A CN 104221480 A CN104221480 A CN 104221480A
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mentioned
electronic component
electrode
solder
heating
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CN201380019898.0A
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CN104221480B (zh
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永福秀喜
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/341—Surface mounted components
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Abstract

一种电子零件安装方法，具有：将具有形成第1电极(12)后的主面的电子零件(2)搭载在具有形成与第1电极(12)对应的第2电极(11)后的主面的电路部件(1)上，使含有热固化性树脂的接合件(3)及焊料(13)介于第1电极和第2电极之间的工序；一边将电子零件(2)向电路部件(1)按压，一边以比焊料的熔点更低的温度对热固化性树脂进行第1加热，使之固化，其后，解除按压的压力的工序；以及在按压的压力被解除的状态下，对介于第1电极(12)和第2电极(11)之间的焊料进行第2加热，使之熔融，将第1电极(12)和第2电极(11)电连接的工序。

Description

电子零件安装方法及电子零件安装线
技术领域
本发明涉及使用含有热固化性树脂的接合件和焊料，将电子零件安装于电路部件上的安装方法及安装线。
背景技术
在印刷基板等的电路部件上安装倒装芯片等的电子零件的情况下，在使含有热固化性树脂的接合件和焊料介于印刷基板的电极和电子零件的电极之间后，将接合件和焊料加热，使热固化性树脂固化，并且使焊料熔融的回流焊接方式，已被广泛采用。熔融后的焊料在电极间浸润并扩散，随后，被冷却，在电极间形成焊料接合部。由此，实现电极间的电连接。另一方面，热固化性树脂的固化物成为保护焊料接合部的树脂加固部。
作为利用回流焊接方式的安装方法之一，提出了一种使用在比焊料的熔点低的温度下固化的热固化性树脂，最开始以低温使热固化性树脂固化，随后，把焊料加热到熔点以上的温度，将电极间用焊料接合的方法(参见专利文献1)。采用这种方法，热固化性树脂的固化及焊料的熔融要一边将电子零件向电路部件按压一边进行。其原因为，通常在电路部件的电极和电子零件的电极之间的距离上存在偏差，是为了防止因热固化性树脂介于电极间而导致的电连接不佳或熔融焊料和电极之间的接触不良。
另外，还提出了在电路部件的电极上预先涂敷焊料，当隔着热固化性树脂将具有焊料凸点的电子零件安装于电路部件上时，使焊料凸点的下端部切入所预涂的焊料里的方法。而且，还提出了在不把电子零件向电路部件按压的状况下，实施热固化性树脂的固化及焊料的熔融的方法(参见专利文献2)。
在先技术文献
专利文献
专利文献1：日本特开2000-58597号公报
专利文献2：日本特开平10-322011号公报
发明内容
发明要解决的课题
如同专利文献1那样，在一边从电子零件施加对电路部件的载重一边安装电子零件的情况下，使用与电子零件的背面抵接，一边按压电子零件一边加热的焊接工具。而且，对于按压电子零件时焊接工具的温度，设定了温度曲线，以从使热固化性树脂固化所需的低温，变化为使焊料熔融所需的高温。从而，每1次电子零件的安装结束，都需要将焊接工具的温度从焊料熔点以上的温度冷却到熔点以下的温度。从而，存在安装的节拍时间变长，生产性变低这样的问题。
另一方面，若从热固化性树脂固化之前焊接工具的温度就是熔点以上的温度，则按压电子零件时压力的控制较为困难，在焊接工具触碰到电子零件的背面时，存在熔融焊料从电子零件和电路部件之间溢出、飞散的可能性。
另外，在一边从电子零件施加对电路部件的载重一边安装电子零件的情况下，基本上需要1个1个地安装电子零件。假使同时安装多个电子零件，则在电子零件间按压的压力大小不匀，造成在一部分电子零件上焊料飞散，在另一部分电子零件上发生连接不佳这样的状况，确保焊料接合部的可靠性变得困难。
接下来，如同专利文献2那样，在不从电子零件施加对电路部件的载重，实施热固化性树脂的固化及焊料的熔融的情况下，需要在电路部件的电极上预先涂敷焊料的人工和时间，在此基础上，需要使焊料凸点的下端部可靠地切入所预先涂敷的焊料里。在无法确保这种切入的情况下，热固化性树脂介于电极间，发生接合不佳。特别是，在热固化性树脂中作为填料分散着二氧化硅等的无机粒子的情况下，接合不佳的发生率增高。
解决课题的手段
鉴于上面，本发明的目的之一为，在确保焊料接合部的可靠性的同时，缩短安装的节拍时间。
也就是说，本发明的一个方式涉及电子零件安装方法，其特征为，具有：工序(i)，将具有形成第1电极后的主面的电子零件搭载在具有形成与上述第1电极对应的第2电极后的主面的电路部件上，使含有热固化性树脂的接合件及焊料介于上述第1电极和上述第2电极之间；工序(ii)，一边将上述电子零件向上述电路部件按压，一边以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热，使之固化，其后，解除上述按压的压力；工序(iii)，在上述按压的压力被解除的状态下，对介于上述第1电极和上述第2电极之间的上述焊料进行第2加热，使之熔融，将上述第1电极和上述第2电极电连接。
本发明的另一方式涉及电子零件安装线，用来将具有形成第1电极后的主面的电子零件，安装于具有形成与上述第1电极对应的第2电极后的主面的电路部件上，其特征为，具备：电路部件搬送装置，搬送上述电路部件；供给装置，给上述电路部件搬送装置供给上述电路部件；电子零件搭载装置，配置于上述供给装置的下游侧，在上述电路部件上搭载上述电子零件，以使含有热固化性树脂的接合件及焊料介于上述第1电极和上述第2电极之间；第1加热装置，配置于上述电子零件搭载装置的下游侧，具备焊接工具，该焊接工具与和上述电子零件的上述主面相反侧的面抵接，一边将上述电子零件向上述电路部件按压，一边隔着上述电子零件，以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热，使之固化；以及第2加热装置，配置于上述第1加热装置的下游侧，在上述按压的压力被解除的状态下，使介于上述第1电极和上述第2电极之间的上述焊料熔融。
发明效果
根据本发明，当使用热固化性树脂和焊料，通过形成焊料接合部和树脂加固部将电子零件安装于电路部件上时，可以缩短安装的节拍时间，且能够以低成本形成可靠性高的焊料接合部。
虽然将本发明的新特征记述于所附权利要求中，但是本发明涉及结构及内容的双方，连同本发明的其他目的及特征，通过比照附图的下面的详细说明，会进一步充分理解。
附图说明
图1是表示本发明的一个实施方式所涉及的电子零件安装方法一系列工序的附图。
图2是表示本发明的另一实施方式所涉及的电子零件安装方法一系列工序的附图。
图3是表示本发明的一个实施方式所涉及的电子零件安装线概略结构的框图。
图4是概念表示第2加热前的焊料凸点和各电极的状态及第2加热后的焊料接合部的状态的纵向剖面图。
图5是表示具有预先涂敷了焊料的焊盘电极的电路基板一例的附图。
图6是表示在具有焊料凸点的主面上具备接合件的电子零件一例的纵向剖面图。
图7是表示使用使焊料粒子分散后的接合件将电子零件安装于电路基板上时搭载电子零件的工序的附图。
具体实施方式
本发明涉及一种将具有形成第1电极后的主面的电子零件，安装于具有形成与第1电极对应的第2电极后的主面的电路部件上的方法。这样的安装一般作为使含有热固化性树脂的接合件及焊料介于第1电极和第2电极之间，将电子零件和电路部件同时加热的工序，来实施。安装的结果为，电子零件通过焊料接合部接合于电路基板上。热固化性树脂为固化物，成为保护焊料接合部的树脂加固部。
作为安装对象的电子零件的种类虽然没有特别限定，但是例如裸芯片或具备插入板的封装零件成为对象。本发明特别适于倒装芯片安装等的表面安装。电子零件既可以是在具有第1电极的主面上具备焊料凸点的BGA(Ball grid Array:球栅阵列封装)型，也可以是不具备焊料的电子零件。
电路部件没有特别限定，而包括在主面上具有焊盘电极的电路基板(纸酚醛基板、玻璃环氧基板、树脂制的柔性基板及陶瓷基板等)或叠层芯片(COC)构造中作为基础的电子零件。电路部件的第2电极也可以是预先涂敷了焊料的电极。
本发明的电子零件安装方法具有使含有热固化性树脂的接合件及焊料介于电子零件的第1电极和电路部件的第2电极之间而进行搭载的工序。例如，将电路部件载置于安装台上，以使第2电极朝着垂直上方，在电路部件的上表面涂敷含有热固化性树脂的接合件，使之覆盖第2电极。
在第1电极及第2电极的至少一个具备焊料的情况下，在电路部件的上表面，只要仅仅供给热固化性树脂就足够。另一方面，在第1电极及第2电极全都不具备焊料的情况下，只要使粒状物的焊料(焊料粒子)分散于含有热固化性树脂的接合件中，对电子零件和电路部件之间供给，就可以。还有，热固化性树脂及焊料不是必须对电路部件供给，也可以供给热固化性树脂或焊料，使之覆盖电子零件的第1电极。例如，也可以预先将含有热固化性树脂的接合件涂敷在电子零件的主面上，使之覆盖BGA型电子零件的焊料凸点的至少一部分。这种情况下，因为仅仅通过将电子零件载置于电路部件上，以使第1电极和第2电极对置，就可以将接合件和焊料对电极间供给，所以能够使制造工序简单化。
接着，一边将电子零件对电路部件按压，一边以比焊料的熔点更低的温度，对热固化性树脂进行第1加热，使之固化，其后，解除按压的压力。此时，若一边以焊料的熔点以上的温度加热一边将电子零件对电路部件按压，则压力的控制变得极其困难。若压力过大，则存在熔融焊料从电子零件和电路部件之间溢出或飞散的可能性。另一方面，在焊料的熔点以下的温度下使热固化性树脂的固化反应进行的情况下，按压的压力控制比较容易。其原因为，焊料成为电子零件的主面和电路部件的主面之间的间隔物，抵抗按压的压力。为了在防止焊料的熔融的同时，使热固化性树脂充分固化，优选的是，将焊料的熔点和热固化性树脂的固化反应进行的温度之差设为10℃以上。另外，从以较低温形成焊料接合部的观点出发，优选的是，将温度差设为100℃以下。
第1加热的温度虽然根据焊料的熔点或电子零件的种类而不同，但是例如，优选的是130～200℃。若是过于低温，则在热固化性树脂的固化反应进行中需要比较长的时间，若过于高温，则防止焊料的熔融较为困难。
将电子零件对电路部件按压的压力虽然没有特别限定，但是只要考虑电路部件的变形或焊料凸点的高度等，进行适当设定就可以。例如，只要施加介于第1电极和第2电极之间的焊料排除热固化性树脂的介入，和第1电极及第2电极至少进行点接触，优选的是进行面接触的程度的载重，就可以。但是，在接合件含有无机材料的粉末作为填料的情况下，因为焊料和各电极之间的接触易于因填料而受阻，所以优选的是，施加足够的载重。
在按压时，优选的是，使介于第1电极和第2电极之间的焊料的至少一部分产生变形。通过使焊料变形，可以更加可靠地形成可靠性高的焊料接合部。因焊料发生变形，而在焊料的内部蓄积应力，因此认为，在焊料的熔融时促进和电极之间的浸润。
接着，在按压的压力被解除的状态下，对介于第1电极和第2电极之间的焊料进行第2加热，使之熔融，让熔融焊料和第1电极及第2电极接触。该工序要在电子零件不受到来自外部的压力的状态下进行。从而，只要在普通的回流焊接炉或焊炉中，和电子零件及电路部件一起，将介于它们之间的焊料加热，就可以。从而，可以使安装系统的结构简单化，以低成本实施电子零件安装。
对于使含有热固化性树脂的接合件及焊料介于电子零件的第1电极和电路部件的第2电极之间而进行搭载的工序来说，也可以将多个电子零件对至少1个电路部件进行搭载。这种情况下，可以一边对至少1个电路部件，同时按压多个电子零件，一边以比焊料的熔点更低的温度将热固化性树脂加热。因为如果是小于焊料的熔点的温度，则能够以比较大的压力将电池零件对电路部件按压，所以可以减小电子零件间施加载重的不匀。从而，即便同时按压多个电子零件，也可以使全部电子零件的第1电极及与之对应的第2电极，和焊料进行点接触或者面接触。
另一方面，当使介于多个电子零件的第1电极和至少1个电路部件的第2电极之间的焊料熔融时，只要对于全部的电子零件，解除按压的压力就可以。而且，只要将全部的电子零件，和电路部件一起在回流焊接炉或焊炉中同时进行第2加热，就可以。根据这种安装方法，不需要每个电子零件都重复往电路部件的搭载、第1加热及第2加热，可以高效地进行安装。从而，可以减低电子零件安装的成本。
在接合件中使用的热固化性树脂虽然没有特别限定，但是可以使用环氧树脂、苯酚树脂、三聚氰胺树脂、聚氨酯树脂、丙烯酸树脂及双马来酰亚胺树脂等。热固化性树脂也可以含有固化剂、固化促进剂及反应性稀释剂等。例如，作为环氧树脂的固化剂，最好使用酸酐、脂肪族或芳香族胺、咪唑或其衍生物等。作为固化促进剂，可以示例双氰胺等。接合件也可以还含有炭黑、无机材料的粉末(二氧化硅等的陶瓷粒子)等。
在接合件中，也可以使之含有助焊剂或活性剂等的成分。借此，更加可靠地确保熔融焊料和电极的浸润性。作为活性剂，可以使用例如从有机酸、胺类及由它们的卤化物组成的群选择的至少1种。作为卤化物中含有的卤素，可举出溴或氯。
在接合件中，也可以使之分散焊料粒子。焊料粒子的含有量虽然没有特别限定，但是只要相对于焊料粒子和热固化性树脂的总计，例如设为20～60质量％，就可以。使之分散焊料粒子后的接合件在电子零件及电路部件的各电极全都不具备焊料凸点或所预涂的焊料的情况下，较为方便。
焊料的种类虽然没有特别限定，但是可以使用例如以Sn为基础的焊料或金焊料。作为以Sn为基础的焊料，可举出Sn-Ag合金、Sn-Bi合金、Sn-Ag-Cu合金、Sn-Bi-Ag合金、Sn-Cu合金、Sn-Sb合金、Sn-Ag-Cu-Bi合金、Sn-Ag-Bi-In合金、Sn-Ag-Cu-Sb合金、Sn-Zn合金及Sn-Zn-Bi合金等。
下面，一边参照附图，一边说明本发明的一个实施方式所涉及的电子零件安装方法。
(实施方式1)
工序(i)
在此，对于倒装芯片安装进行说明，该倒装芯片安装使用在第1电极12上具备焊料凸点13的裸芯片作为具有形成第1电极后的主面的电子零件2，使用具有焊盘电极11的电路基板1作为具有形成第2电极后的主面的电路部件。
首先，如图1(a)所示，电路基板1被配置于指定的载物台上，使之将其主面上所形成的焊盘电极11朝向垂直上方。
接着，如图1(b)所示，涂敷含有热固化性树脂的接合件3，使之覆盖电路基板1的焊盘电极11。接合件的形态没有特别限定，既可以是膏状物，也可以是薄膜等的固体。膏状的接合件可以使用市场上销售的接合件涂敷装置的点涂机，进行涂敷使之覆盖焊盘电极11。薄膜等固体的接合件可以利用市场上销售的零件搭载装置等，配置于电路基板2之上，使之覆盖焊盘电极11。
随后，具有焊料凸点13的电子零件2被搭载于电路基板1的主面上。当搭载电子零件2时，首先隔着接合件3，进行电子零件2和电路基板1的对位，以便多个焊料凸点13触碰到各自对应的焊盘电极11。电子零件2往电路基板1的搭载只要能使用例如具备吸引嘴4的市场上销售的电子零件搭载装置来进行，就可以。
工序(ii)
接着，如图1(c)所示，一边将电子零件2对电路基板1按压，施加载重，一边隔着电子零件2对接合件3进行第1加热。这种按压和第1加热使用下述焊接工具5来进行，该焊接工具5具有与电子零件2的背面(主面的相反方的面)进行抵接的抵接面，并且具备将抵接面加热的加热功能。优选的是，焊接工具5的抵接面是平坦的，以便可以对电子零件2均匀地施加压力，并且具有比电子零件2的背面的大小更大的面积。通过施加足够的载重来按压电子零件2，焊料凸点13在电路基板1的焊盘电极11和电子零件2之间被稍微压塌，发生变形。此时，在各电极和焊料凸点13之间形成面接触。另一方面，接合件中含有的热固化性树脂的固化反应得以进行。
按压电子零件2的过程中焊接工具5的抵接面的温度通过与加热功能合一设置的温度调节功能，被调整为小于焊料凸点13的熔点，且适于热固化性树脂的固化的温度。在热固化性树脂的固化充分进行，形成了由固化物而产生的树脂加固部3a的时候，由焊接工具5做出的电子零件2的按压被解除。树脂加固部3a填充于焊料凸点13周边的间隙内，具有保护将在后面的工序中形成的焊料接合部的功能。
然后，焊接工具5可以在将抵接面的温度维持成小于焊料凸点13的熔点且适于热固化性树脂的固化的温度的原状下，向下次应按压的其他电子零件2的上方移动，重复电子零件2的按压。从而，不需要使焊接工具5的温度发生变化，即便在连续安装多个电子零件2的场合，仍可以大幅缩短节拍时间。
虽然还能够紧接着树脂加固部3a的形成之后，利用焊接工具5使焊料凸点13熔融，但是采用那种方法，需要将焊接工具5的抵接面的温度暂时升温到焊料凸点13熔融的温度。而且，在连续安装多个电子零件2的场合，需要将焊接工具5的抵接面的温度降温到小于焊料凸点13的熔点。从而，在焊接工具5的抵接面的温度调整中花费时间，缩短安装的节拍时间较为困难。
工序(iii)
接着，在对电子零件2的按压的压力被解除的状态下，对介于焊盘电极11和电子零件2之间的焊料凸点13进行第2加热，使之熔融。由此，熔融焊料在焊盘电极11及电子零件2的第1电极12上浸润并扩散。随后，若焊料的温度下降，则焊料凝固，形成焊料接合部13a。第2加热的方法只要是不从电子零件2施加对电路基板1的载重的方法，就没有特别限定。例如图1(d)所示，只要将搭载电子零件2后的电路基板1放入焊炉6中，加热到焊料凸点13的熔点以上的温度，就可以。
(实施方式2)
下面，说明将多个电子零件2同时搭载于1块电路基板1上的情形。还有，电路基板1的数量不限于1个，例如将10个电子零件2以各5个的形式安装于2块电路基板1上的情形(也就是将多个电子零件分配安装于至少2块电路基板上的情形)也包含于本实施方式中。
工序(i)
首先，如图2(a)所示，把具有多个电子零件2的搭载位置的电路基板1A，以将其主面上所形成的焊盘电极(未图示)朝向垂直上方的形式，配置于指定的载物台上。接着，在各电子零件的搭载位置上涂敷含有热固化性树脂的接合件3，使之覆盖电路基板1A的焊盘电极。接合件3的形态及对电路基板1A的供给方法没有特别限定，和实施方式1相同。随后，具有焊料凸点13的多个电子零件2被依次搭载于电路基板1A的主面上。还有，虽然在图2中表示出，电子零件2以各1个的形式搭载于电路基板1A的搭载位置上的情形，但是也可以根据使用的电子零件搭载装置的规格，将多个电子零件2同时搭载于多个对应的搭载位置上。
工序(ii)
接着，如图2(c)所示，一边将多个电子零件2同时对电路基板1A按压，施加载重，一边隔着电子零件2对接合件3进行第1加热。这种按压和第1加热可以使用下述焊接工具5A来进行，该焊接工具5A具有能与多个电子零件2全部的背面抵接的较大的抵接面，并且具备将抵接面加热的加热功能。由于这样同时进行多个电子零件2的按压及第1加热，因而与实施方式1的情形相比，能够更进一步缩短安装的节拍时间。
在此，优选的也是，焊接工具5A的抵接面是平坦的，以便可以对全部的电子零件2均匀地施加压力，并且具有比搭载着全部电子零件2的区域的面积更大的面积。另外，优选的是，按压的压力设为焊料凸点13被稍稍压塌而产生变形的程度。按压电子零件2的过程中焊接工具5A的抵接面的温度被调整为小于焊料凸点13的熔点，且适于热固化性树脂的固化的温度。然后，只要在全部的电子零件2和电路基板1A之间的热固化性树脂的固化充分进行，形成了树脂加固部3a的时候，同时解除由焊接工具5A做出的电子零件2的加热和按压，就可以。
还有，因为第1加热以小于焊料凸点13的熔点的温度进行，所以焊料凸点13成为电子零件2和电路基板1A之间的间隔物。从而，能够以比较大的压力按压多个电子零件2。因而，可以防止在一部分的电子零件中，未形成焊料凸点13和焊盘电极之间的接触之类的不佳状况的发生。
工序(iii)
接着，如图2(d)所示，在对全部电子零件2的按压的压力被解除的状态下，将由热固化性树脂的固化物(树脂加固部3a)接合了多个电子零件2后的电路基板1A，放入焊炉6中，进行第2加热。借此，可以使多个电子零件2的焊料凸点13同时熔融。从而，可以针对多个电子零件2，同时形成焊料接合部13a。
下面，对于实施本发明的电子零件安装方法所用的安装线，进行说明。
在图3中，用简单化后的框图，表示本发明的一个实施方式所涉及的在电路基板1A上安装多个电子零件所用的电子零件安装线(下面也只称为安装线)。安装线100包括供给电路基板1A的供给装置101、电子零件搭载装置102、第1加热装置103、第2加热装置104及回收安装完成后的电路基板1A的回收装置105。再者，安装线100还包括搬送装置(搬送机)106，用来将电路基板1A，从供给装置101经过电子零件搭载装置102、第1加热装置103及第2加热装置104，搬送到回收装置105。在搬送装置106上，安装有保持电路基板1A的载物台。搬送装置106通过使保持电路基板1A的载物台，从安装线的上游侧向下游侧移动，来搬送电路基板1A。
下面，举出在图2所示的那种电路基板1A上安装图1、2所示的那种BGA型的多个电子零件2的情形为例，进行说明。
电子零件搭载装置102是一种具有下述功能的组合装置，该功能为，在从供给装置101供给的电路基板1A上涂敷含有热固化性树脂的接合件3之后，在电路基板1A上搭载电子零件2。也就是说，电子零件搭载装置102在装置内的上游侧，具有在电路基板1A上涂敷接合件3的涂敷单元，在装置内的下游侧，具有在电路基板1A上搭载电子零件2的搭载单元。因此，可以在同一装置的内部将接合件3供给到电路基板1A上之后，立刻对电路基板1A进行电子零件2的安装。
因而，能谋求安装的节拍时间的进一步缩短。
还有，在电子零件2或者电路基板1A预先于具有第1电极或者第2电极的主面上备有热固化性树脂的情况下，不需要涂敷接合件3的涂敷单元。另外，也可以取代使用组合装置，而在比电子零件搭载装置102更靠上游侧，另行配置涂敷接合件3所用的涂敷装置。
在电子零件搭载装置102内部的上游侧，首先由具备涂敷头(点涂机)的涂敷单元，在电路基板1A上涂敷含有热固化性树脂的接合件3。涂敷头能够通过3轴移动机构移动到任意的位置上，那种3轴移动机构的动作由指定的控制装置来控制。在此，要控制涂敷头的动作，以便由从涂敷头供给的接合件3覆盖电路基板1A的主面的焊盘电极11。从涂敷头涂敷接合件3的定时及要涂敷的接合件3的量由控制装置来控制。通常在电路基板1A的多个电子零件2的搭载位置上分别涂敷接合件3。
接下来，在电子零件搭载装置102内部的下游侧，由搭载单元，进行电子零件2往电路基板1A的搭载。搭载单元例如具备：供给台，供给多个电子零件2被配置成矩阵状的托盘；安装头；3轴移动机构，使安装头移动；控制装置，控制3轴移动机构的动作。安装头具备吸引嘴4，通过吸引来拾起电子零件2，并通过解除吸引，而使电子零件2在任意的位置上释放。在此，电子零件2在把焊料凸点13朝向垂直下方后的状态下，由吸引嘴4从托盘拾起，移动到电路基板1A的电子零件的搭载位置上方。然后，通过由3轴移动机构做出的安装头的升降动作，在使电子零件2触碰到电路基板1A的搭载位置之后，解除由吸引嘴做出的吸引。通过进行多次同样的操作，就可以在电路基板1A的多个零件搭载位置上，分别搭载多个电子零件2。
接着，搭载多个电子零件2后的电路基板1A被搬送至第1加热装置103，进行定位。第1加热装置103具备焊接工具5A，该焊接工具5A具有能与多个电子零件2的背面同时抵接的抵接面，可以借助来自上方的压力，将多个电子零件2对电路基板1A同时按压。焊接工具5A例如具有通过加压用促动器(例如液压缸、气缸)从上方施加向下方的压力的功能，以及将和电子零件2之间的抵接面加热的加热功能。
在第1加热装置103内，首先使定位后的电路基板1A上的多个电子零件2的背面同时接触焊接工具5A的抵接面，由加压用促动器将多个电子零件2朝向电路基板1A同时按压。其间，焊接工具5A的抵接面的温度被控制成可以通过隔着电子零件2的传热使热固化性树脂的固化反应进行，且不使焊料熔融的温度。还有，也可以通过使之在放置着电路基板1A的载物台上还包括加热装置，来促进热固化性树脂的固化反应。随后，在热固化性树脂的固化反应充分进行的时候，解除由焊接工具5A做出的按压。
接着，电路基板1A被搬送至第2加热装置104。第2加热装置104虽然没有特别限定，但只要是例如具有通道状加热空间的回流焊炉就可以。电路基板1A在通道状的炉内由搬送装置106搬送的期间，进行第2加热，达到焊料凸点13的熔点以上的温度。其间，不需要将电子零件2对电路基板1A按压那样的外力。经过回流焊炉后的电路基板1A既可以通过自然冷却进行冷却，也可以使用风扇等的吹风装置进行冷却。借此，多个电子零件2的焊料凸点13同时被焊接于电路基板1A的焊盘电极11上。
随后，电子零件2的安装完成后的电路基板1A(安装结构体)由回收装置105进行回收。回收装置105例如具备将安装电子零件2后的电路基板1A收纳于收集架等中所用的卸料机。
下面，对于焊料接合部的结构，进行说明。
图4(X)模式表示出以焊料的熔点以上的温度进行第2加热之前焊料凸点12的状态。焊料凸点13在电子零件的第1电极12和电路部件的第2电极11之间，成为被稍稍压塌的状态。其原因为，当进行使热固化性树脂固化所需的第1加热时，电子零件对电路部件进行按压。另一方面，被压塌的焊料凸点13的周围由热固化性树脂的固化物(未图示)包围。因此，认为给予焊料凸点13的上下方向的压力未释放，而作为应力残留在焊料凸点13的内部。
图4(Y)模式表示出，以焊料的熔点以上的温度进行第2加热之后焊料接合部13a的状态。因为若通过第2加热，焊料熔融，则被闭锁在焊料凸点13内部的应力得到释放，所以认为，熔融焊料迅速在第1电极12及第2电极11上浸润并扩散。此时，在焊料凸点的周围，虽然存在作为热固化性树脂之固化物的树脂加固部3a，但是要考虑，热固化性树脂的固化物通过第2加热已经变得比较柔软。从而，尽管焊料凸点的周围由树脂加固部3a包围，但是即便不从电子零件进行对电路部件的按压，各电极和熔融焊料的浸润仍进行，在焊料接合部13a上形成附图中所示的那种类似凸缘的形状的区域。因此，认为将形成可靠性高的焊料接合部13a。
还有，在上述实施方式中，虽然说明了将具有焊料凸点的电子零件安装于电路基板上的情形，但是具有焊料凸点的电子零件只不过是能够实现根据本发明安装方法及安装线的安装的电子零件的一例。在使用没有焊料凸点的电子零件的情况下，例如图5所示，通过作为电路基板，使用焊盘电极11具备预涂后的焊料14的电路基板1B，也能够进行同样的安装。
另外，在上述实施方式中，虽然说明了涂敷含有热固化性树脂的接合件使之覆盖电路基板的焊盘电极的情形，但是接合件也可以预先具备在电子零件中。例如图6所示，也可以在电子零件2的具有第1电极12的主面上，事先涂敷含有热固化性树脂的固体的接合件3b。因为通过使用这种附带接合件3b的电子零件2，可以省去把接合件涂敷于电路基板上的工序，所以节拍时间的进一步缩短成为可能。另外，因为通过使焊料凸点13的前端部从接合件3b突出，可以可靠地确保焊料凸点13和电路部件的第2电极之间的接触，所以焊料接合部的可靠性变得更高。
再者，在电子零件的第1电极及电路部件的第2电极全都预先不具备焊料的情况下，如图7所示，通过将使焊料粒子15分散后的接合件3涂敷于电路基板1上，就能够进行同样的安装。这种情况下，接合件要作为各向异性导电粘接剂来发挥作用。
下面，对于本发明的电子零件安装方法，根据实施例进行具体说明。但是，下面的实施例并不用来限定本发明。
《实施例1》
作为接合件，使用了含有环氧树脂、固化剂、炭黑、二氧化硅及偶联剂的热固化性树脂组合物。该组合物调整了组成，以便固化反应在150℃下进行。
作为电路部件，使用了玻璃环氧基板(FR4)。
作为电子零件，使用了BGA型的半导体芯片(尺寸7×7mm，焊料凸点数700个)。
在焊料凸点的形成中，使用了Sn-Ag共晶焊料(熔点221℃)。
首先，在FR4基板上，采用Cu箔形成电子零件28个量的焊盘电极，准备好试验用基板。在试验用基板的各电子零件的搭载区域上，按1.5mm3分别涂敷接合件，接下来，将电子零件搭载到试验用基板上。此时，进行正确的对位，以便电子零件的焊料凸点和对应的焊盘电极对置。
<第1加热>
接着，准备好焊接工具，该焊接工具具有和FR4基板的面积相同的面积(72cm2)的平坦面。然后，使焊接工具的平坦面与全部电子零件的背面抵接，从电子零件的背面朝向试验用基板施加使焊料凸点稍稍产生变形的程度的力(2.8kN)。此时，将焊接工具的抵接面的温度，通过内置的加热器设定成150℃。其结果为，在300秒后，接合件的固化反应基本上完成。
<第2加热>
接着，解除由焊接工具做出的按压，将搭载电子零件后的试验用基板，放入预先设定成260℃的焊炉内，加热60秒，随后进行冷却。借此，在电子零件和试验用基板的焊盘电极之间形成焊料接合部。
随后，测量全部电子零件的焊料接合部的连接电阻值，结果全都是电阻非常小，电连接状态良好。第1加热和第2加热的总计时间是360秒。
《比较例1》
在第1加热之后，不解除由焊接工具做出的按压，将力减低为0.56kN，另一方面，把焊接工具的平坦面的温度升温至260℃，接下来，除了进行第2加热的工序之外，实施和实施例1相同的操作。随后，测量全部电子零件的焊料接合部的连接电阻值，结果全都是电阻非常小，电连接状态良好。另外，第1加热和第2加热的净总计时间是360秒。但是，为了把焊接工具的平坦面的温度升温至260℃，花费5分钟时间，进而，为了恢复为原来的温度，需要20分钟。另外，当进行第2加热时，为了对全部的电子零件施加均匀的压力，以便熔融焊料不从电子零件和试验用基板之间溢出，对于焊接工具的平坦面的角度及载重的大小，需要精密的控制。
《比较例2》
在将电子零件搭载到试验用基板上之后，不使用焊接工具，而将其放入预先设定成150℃的焊炉内，进行第1加热，使之进行热固化性树脂的固化反应。随后，将焊炉的温度升温至260℃，进行第2加热。其后，测量全部电子零件的焊料接合部的连接电阻值，结果在电阻上观察到较大的差异，判明焊料接合部的可靠性低。
根据上面的结果，至少判明，第1加热需要一边将电子零件对电路部件按压，一边进行。另外，还判明，在进行第2加热时，通过解除按压，能够实现安装的节拍时间的大幅缩短。
虽然有关目前优选的实施方式，说明了本发明，但是不应该限定性地解释那样的公示。各种的变通及改变通过阅读上述公示，对本发明所属的技术领域内的技术人员一定会变得明确。从而，所附的权利要求应当解释为，在不脱离本发明的真实精神及范围的状况下，包含全部的变通及改变。
产业上的可利用性
本发明在使用热固化性树脂和焊料，将电子零件安装于电路部件上的电子零件安装的领域，是有用的，能够缩短安装的节拍时间，并且以低成本形成可靠性高的接合部。
符号说明
1、1A、1B：电路基板，2：电子零件，3：接合件，3a：树脂加固部，4：吸引嘴，5、5A：焊接工具，6：焊炉，11：焊盘电极(第2电极)，12：第1电极，13：焊料凸点，13a：焊料接合部，14：焊料预涂层，15：焊料粒子，100：安装线，101：供给装置，102：电子零件搭载装置，103：第1加热装置，104：第2加热装置，105：回收装置

Claims (10)

1.一种电子零件安装方法，其特征为，
具有：
工序(i)，将具有形成第1电极后的主面的电子零件搭载在具有形成与上述第1电极对应的第2电极后的主面的电路部件上，使含有热固化性树脂的接合件及焊料介于上述第1电极和上述第2电极之间；
工序(ii)，一边将上述电子零件向上述电路部件按压，一边以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热，使之固化，其后，解除上述按压的压力；以及
工序(iii)，在上述按压的压力被解除的状态下，对介于上述第1电极和上述第2电极之间的上述焊料进行第2加热，使之熔融，将上述第1电极和上述第2电极电连接。
2.如权利要求1所述的电子零件安装方法，其特征为，
在上述工序(ii)中，一边将多个上述电子零件同时向至少1个上述电路部件按压，一边以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热。
3.如权利要求1或2所述的电子零件安装方法，其特征为，
在上述工序(iii)中，在上述按压的压力被解除的状态下，对介于多个上述电子零件的第1电极和至少1个上述电路部件的第2电极之间的上述焊料同时进行第2加热。
4.如权利要求1～3任1项所述的电子零件安装方法，其特征为，
在上述工序(ii)中，通过上述按压，使介于上述第1电极和上述第2电极之间的焊料的至少一部分产生变形。
5.如权利要求1～4任1项所述的电子零件安装方法，其特征为，
上述第1电极具备上述焊料的至少一部分，来作为凸点。
6.如权利要求1～5任1项所述的电子零件安装方法，其特征为，
在上述第2电极上，预涂了上述焊料的至少一部分。
7.如权利要求1～6任1项所述的电子零件安装方法，其特征为，
上述焊料的至少一部分是粒状物，分散在上述接合件中。
8.如权利要求1～7任1项所述的电子零件安装方法，其特征为，
上述接合件含有无机材料的粉末，来作为填料。
9.一种电子零件安装线，用来将具有形成第1电极后的主面的电子零件，安装于具有形成与上述第1电极对应的第2电极后的主面的电路部件上，其特征为，
具备：
电路部件搬送装置，搬送上述电路部件；
供给装置，给上述电路部件搬送装置供给上述电路部件；
电子零件搭载装置，配置于上述供给装置的下游侧，在上述电路部件上搭载上述电子零件，以使含有热固化性树脂的接合件及焊料介于上述第1电极和上述第2电极之间；
第1加热装置，配置于上述电子零件搭载装置的下游侧，具备焊接工具，该焊接工具与和上述电子零件的上述主面相反侧的面抵接，一边将上述电子零件向上述电路部件按压，一边隔着上述电子零件，以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热，使之固化；以及
第2加热装置，配置于上述第1加热装置的下游侧，在上述按压的压力被解除的状态下，使介于上述第1电极和上述第2电极之间的上述焊料熔融。
10.如权利要求9所述的电子零件安装线，其特征为，
在上述电子零件搭载装置将多个上述电子零件搭载到至少1个上述电路部件上之后，上述电路部件搬送装置将上述至少1个电路部件搬送至上述第1加热装置，
上述第1加热装置利用上述焊接工具，一边将多个上述电子零件同时向上述至少1个电路部件按压，一边以比上述焊料的熔点更低的温度对上述热固化性树脂进行第1加热，
上述第2加热装置在上述按压的压力被解除的状态下，对介于上述多个电子零件的第1电极和上述至少1个电路部件的第2电极之间的上述焊料同时进行第2加热。
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