CN107452706B - 电路部件的连接构造以及连接方法 - Google Patents

电路部件的连接构造以及连接方法 Download PDF

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CN107452706B
CN107452706B CN201710361409.XA CN201710361409A CN107452706B CN 107452706 B CN107452706 B CN 107452706B CN 201710361409 A CN201710361409 A CN 201710361409A CN 107452706 B CN107452706 B CN 107452706B
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electrode
solder
main surface
bismuth
circuit
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CN107452706A (zh
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岸新
圆尾弘树
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

本发明提供一种电路部件的连接构造以及连接方法。电路部件的连接构造具备：具有配备了第1电极的第1主面的第1电路部件、具有配备了第2电极的第2主面的第2电路部件、以及介于第1主面与所述第2主面之间的接合部，接合部具有将第1电极与第2电极电连接的焊料部，焊料部包含铋‑铟合金，在铋‑铟合金中，所述铋‑铟合金中包含的铋的量超过20质量％且为80质量％以下。

Description

电路部件的连接构造以及连接方法
技术领域
本公开涉及电路部件的连接构造以及连接方法。
背景技术
在将具有配备了第1电极的第1主面的第1电路部件、与具有配备了具有凸块的第2电极的第2主面的第2电路部件进行连接的方法中，首先，以第1电极与第2电极隔着焊料而对置的方式配置第1电路部件和第2电路部件。接下来，一边将第2电路部件向第1电路部件按压，一边进行加热，从而使焊料熔融之后，停止加热，使得熔融的焊料固化，由此形成将第1电极与第2电极电连接的焊料部。
在上述连接方法中，由焊料构成凸块(参考日本特开2014-130956号公报)、或者在第1电极的表面形成有包含焊料的覆盖层。
发明内容
本公开涉及电路部件的连接构造，具备：第1电路部件，具有配备了第1电极的第1主面；第2电路部件，具有配备了第2电极的第2主面；和接合部，介于所述第1主面与所述第2主面之间，所述接合部具有将所述第1电极与所述第2电极电连接的焊料部，所述焊料部含有铋-铟合金，在所述铋-铟合金中，所述铋-铟合金中包含的铋的量超过20质量％且为80质量％以下。
此外，本公开涉及电路部件的连接方法，将第1电路部件与第2电路部件进行连接，所述第1电路部件具有配备了第1电极的第1主面，所述第2电路部件具有配备了第2电极的第2主面，所述电路部件的连接方法包括：配置工序，以所述第1电极与所述第2电极隔着含有铋-铟合金的焊料而对置的方式配置所述第1电路部件和所述第2电路部件；和焊料部形成工序，一边将所述第2电路部件向所述第1电路部件按压，一边进行加热，使所述焊料熔融之后，通过使所述熔融的焊料固化来形成将所述第1电极与所述第2电极电连接的焊料部，所述铋-铟合金中包含的铋的量超过20质量％且为80质量％以下。
根据本公开所涉及的电路部件的连接构造，能够提高第1电路部件所具有的第1电极与第2电路部件所具有的第2电极的电连接的可靠性。
附图说明
图1A是表示在实施方式所涉及的电路部件的连接方法中在第1电路部件搭载了第2电路部件的状态下的主要部分的一例的示意剖视图。
图1B是表示在实施方式所涉及的电路部件的连接方法中通过焊料的固化所形成的焊料部的一例的示意剖视图。
图2是表示实施方式所涉及的实施例以及比较例中的连接构造的连接强度与焊料的合金组成之间的关系的图。
具体实施方式
在说明实施方式之前，先简单说明现有技术中的问题。
一般，通过蒸镀等所形成的表面比较粗糙的电极(特别是透明电极这种包含金属氧化物的电极)难以被熔融的焊料浸润，因此难以实现良好的连接状态。由此，对于这种电极，也谋求在熔融时充分地追随电极的表面从而能够形成与电极牢固地紧贴的焊料部的焊料。
[电路部件的连接方法]
首先，说明将第1电路部件与第2电路部件进行连接的电路部件的连接方法，其中，第1电路部件具有配备了第1电极的第1主面，第2电路部件具有配备了具有凸块的第2电极的第2主面。焊料被赋予或者涂敷在第1电极的表面，或者包含在凸块的至少前端部。
(配置工序(i)以及焊料部形成工序(ii))
电路部件的连接方法包括：(i)配置工序，以第1电极与第2电极隔着焊料而对置的方式来配置第1电路部件与第2电路部件；(ii)焊料部形成工序，一边将第2电路部件向第1电路部件按压，一边进行加热，在使焊料熔融之后，使熔融的焊料固化，由此形成将第1电极与第2电极电连接的焊料部。
上述连接方法中使用的焊料包含铋-铟合金。由于焊料中包含的铋是从熔融状态固化时体积发生膨胀的异常液体，因此在焊料部形成工序(ii)中，在熔融的焊料固化的过程中，焊料膨胀，焊料与第1电极以及第2电极的界面处的压力提高。由此，焊料容易追随电极的表面，通过焊料的固化所形成的焊料部能够与第1电极以及第2电极牢固地紧贴。
另一方面，由于焊料中包含的铟的延展性优异，因此，能够增大焊料与第1电极以及第2电极的浸润面积。
为了充分且平衡良好地获得基于上述铋以及铟的效果，铋-铟合金中包含的铋的量需要超过20质量％且为80质量％以下。若铋-铟合金中包含的铋的量超过20质量％，则能够充分地获得上述由铋所带来的效果，从而能够使焊料部与电极(特别是透明电极)牢固地紧贴并接合。若铋-铟合金中包含的铋的量为80质量％以下，则能够充分地获得上述由铟所带来的效果。若铋-铟合金中包含的铋的量超过80质量％，则焊料的熔点变高，电极间的连接所需的加热温度变高，从而有可能产生电路部件的弯曲等不良情况。
从由铋的异常液体所带来的电极间的接合性提高的观点出发，铋-铟合金中包含的铋的量优选为25质量％～80质量％，更优选为40质量％～80质量％，进一步优选为55质量％～80质量％。
在此，图1A以及图1B中示意地表示焊料部形成工序(ii)中的电路部件的连接状态的主要部分。图1A表示在第1电路部件搭载了第2电路部件的状态下的主要部分。图1B表示经由通过焊料固化所形成的焊料部而将第1电极与第2电极连接的状态下的主要部分。
在配置工序(i)中，在具有第1电极1的第1电路部件2之上，搭载具有第2电极4的第2电路部件5。第2电极4在其表面具有由焊料3构成的焊料凸块。焊料3包含铋含有量超过20质量％且为80质量％以下的铋-铟合金。这样，以第1电极1与第2电极4隔着焊料3(焊料凸块)而对置的方式配置第1电路部件2与第2电路部件5。
接下来，在焊料部形成工序(ii)中，一边将第2电路部件5向第1电路部件2按压，一边进行加热，在使焊料3熔融之后，停止加热，从而熔融的焊料3固化。在停止加热而焊料3从熔融状态固化的过程中，由于焊料3含有铋因此膨胀，从而充分地追随第1电极的表面。此外，由于熔融的焊料3含有铟，因此在第1电极1以及第2电极4适度地浸润扩散。其结果，如图1B所示那样，与图1A的状态相比，焊料3的体积膨胀，通过焊料3的固化所形成的焊料部6与第1电极1以及第2电极4牢固地连接。在图1B中，焊料部6介于第1电路部件2的第1主面与第2电路部件5的第2主面之间，形成本公开所涉及的接合部。
上述含有铋-铟合金的焊料对于通过蒸镀等所形成的表面比较粗糙的电极(特别是透明电极这种含有金属氧化物的电极)的连接是有效的。一般而言，由于这种电极难以被熔融焊料浸润，因此难以实现良好的连接状态。此外，存在含有金属氧化物的电极在高温下与焊料进行反应而部分消失的情况。另一方面，由于上述含有铋-铟合金的焊料也能够充分地追随这种电极的表面而浸润扩散，因此能够实现良好的连接状态。此外，由于含有铋-铟合金的焊料在低温下熔融，因此几乎不会损伤含有金属氧化物的电极。
透明电极优选算术平均粗糙度Ra为5nm～10nm，优选最大高度Rz为70nm以下。即便在利用通过蒸镀等所形成的上述范围的表面比较粗糙的透明电极的情况下，通过利用上述铋-铟合金，也能够实现良好的连接状态。再有，算术平均粗糙度Ra以及最大高度Rz通过基于JIS B 0601-2001的测量方法来求出。
为了在低温(例如130℃以下)进行焊料部形成工序(ii)的加热，优选铋-铟合金中包含的铋的量为27质量％～68质量％。在铋-铟合金中包含的铋的量为27质量％～68质量％的情况下，铋-铟合金的熔点为72℃～109℃。由于能够在低温下进行焊料部形成工序(ii)的加热，因此能够减少施加于电路部件的热应力，即便在连接玻璃基板这种耐热应力较弱的电路部件的情况下，也能够充分地抑制电路部件的弯曲等不良情况的发生。
为了在更低温(例如110℃以下)下进行焊料部形成工序(ii)的加热，优选铋-铟合金中包含的铋的量为27质量％～55质量％。该情况下，铋-铟合金的熔点为100℃以下。
为了在进一步低温(例如100℃以下)下进行焊料部形成工序(ii)的加热，优选铋-铟合金中包含的铋的量为35质量％～55质量％。该情况下，铋-铟合金的熔点为90℃以下。
作为熔点72℃～109℃的铋-铟合金，可列举例如35Bi-65In(熔点：72℃)、51Bi-49In(熔点：85℃)、55Bi-45In(熔点：89℃)、27Bi-73In(熔点：100℃)、68Bi-32In(熔点：109℃)等。其中，XBi-YIn意味着含有X质量％的铋和Y质量％的铟的合金。
优选铋-铟合金中的铋以外的剩余部分几乎(例如剩余部分的99质量％以上)都是铟。这种铋-铟合金的电极间的连接可靠性高且为低熔点。铋-铟合金包含例如从由BiIn2、Bi3In5以及BiIn构成的群组中选择的至少1种。
铋-铟合金也可以少量含有铋以及铟以外的第3成分。铋-铟合金中包含的第3成分的量为例如0.01质量％以下。作为第3成分，可列举例如镍、钴。由于这种第3成分的存在，例如能够提高通过焊料固化所形成的焊料部的机械强度。
此外，从提高焊料对电极的浸润性以及电极间的电连接的可靠性的观点出发，优选焊料中包含的铋-铟合金中，铋-铟合金中包含的铟的量为20质量％以上且低于80质量％，更优选为20质量％～75质量％，进一步优选为20质量％～60质量％，特别优选为20质量％～45质量％。
为了改善焊料对电极的浸润性，可以在焊料的表面涂敷助焊剂。助焊剂使用公知的材料即可。不过，在使用上述含有铋-铟合金的焊料的情况下，即便不使用助焊剂，也能够将电极间牢固地连接，能够提高针对第1电极与第2电极的电连接的可靠性。也就是说，在配置工序(i)中，也可以在第1电极与焊料之间不设置助焊剂。该情况下，不需要涂敷助焊剂的工序、以及除去形成了焊料部之后的助焊剂的残渣的工序，能够减少工序数量。
由于经由焊料来进行电极间的连接，因此施加于电路部件的压力可以较低。由此，即便在连接较薄且强度低的电路部件的情况下，也不易发生不良情况，能够确保针对第1电极与第2电极的电连接的较高的可靠性。
(第1电路部件)
第1电路部件例如具有具备以规定的间距排列的多个第1电极的第1主面。第1电路部件没有特别限定，可以是例如电视机、平板电脑、智能手机、可穿戴设备等所具备的显示面板中使用的透明基板。透明基板也可以是半透明。作为透明基板，可列举玻璃基板以及薄膜状基板。薄膜状基板由具有透明性的树脂薄膜形成。作为具有透明性的树脂薄膜，可以是聚对苯二甲酸乙二醇酯(PET)、聚碳酸酯(PC)、聚萘二甲酸乙二醇酯(PEN)等的薄膜。第1主面可以是第1电路部件的任意的主面。
在第1电路部件是透明基板的情况下，对第1电极使用透明电极。透明电极只要是包含铟和锡的氧化物即可，也可以包含铟及锡以外的微量的第三金属元素。透明电极的代表例是所谓的氧化铟锡或者掺杂锡的氧化铟(Indium Tin Oxide(ITO))电极。
第1电极可以是焊盘电极。在焊盘电极的表面具有焊料的情况下，焊料只要存在于焊盘电极的表面的至少按压时凸块接触的部分即可。也可以在焊盘电极的表面形成含有焊料的覆盖层。作为对第1电极的表面赋予焊料的方法，利用公知的手法即可。
(第2电路部件)
第2电路部件例如具有具备以规定的间距排列的多个第2电极的第2主面。第2电路部件没有特别限定，可以是例如半导体芯片、电子部件封装件、薄膜基板、连接器等。第2主面可以是第2电路部件的任意主面。
第2电极没有特别限定，可以是包含例如金、铂、铜、镍、钯、各种焊料等的金属电极。形成金属电极的焊料可以是含有例如锡、银、铋、铟、镍、铜等的焊料。
(凸块)
存在于第2电极的表面的凸块是为了将第1电极和第2电极以短距离可靠地进行连接而设置的。相比于引线键合，使用了凸块的电极间的电连接能够减小安装面积，有利于电子部件的小型化。此外，由于能够缩短电极间的连接距离，因此对于被要求优异的电特性的电子部件的连接是有利的。
在由焊料构成凸块的情况下，只要凸块的至少前端部含有焊料即可。凸块的前端部是在按压时与第1电极接触的部分。也可以是凸块整体由焊料构成。此外，在凸块包含由焊料以外的金属材料构成的部分的情况下，该部分也可以兼用作第2电极的一部分。作为由焊料形成凸块的方法，采用公知的手法即可。
从充分地获得基于铋的异常液体的焊料膨胀效果的观点出发，优选凸块的最大直径为20μm以上。
优选凸块之中由焊料构成的部分所占的体积比例为30体积％以上。由此，能够充分地获得基于铋的异常液体的焊料膨胀效果。
在焊料部形成工序(ii)中，在将第2电路部件向第1电路部件按压时，第1电路部件也向第2电路部件被按压。也就是说，向哪个电路部件抵按用于按压的工具都可以。例如使用用于加热的工具对第1电路部件以及/或者第2电路部件进行加热来进行焊料的加热。用于按压的工具也可以兼用作用于加热的工具。
(粘合剂设置工序(iii)以及树脂部形成工序(iv))
进而，优选上述的连接方法包括：(iii)粘合剂设置工序，在第1主面与第2主面之间设置粘合剂；以及(iv)树脂部形成工序，形成由粘合剂将第1主面与第2主面粘合的树脂部。由此，电路部件的连接强度得以提高。
优选树脂部覆盖焊料部的至少一部分。由此，焊料部被加固，连接构造的强度进一步提高。此外，在电路部件具有以规定的间距排列的多个电极的情况下，即便电极间的间距较窄，也容易确保相邻的电极间的绝缘。例如，期望树脂部形成为填埋将多个第1电极与多个第2电极连接的多个焊料部的间隙。
粘合剂设置工序(iii)在焊料部形成工序(ii)之后实施即可。在焊料部形成工序(ii)之后实施粘合剂设置工序(iii)的情况下，例如，只要在第1主面与第2主面之间填充粘合剂(底部填料)即可。
或者，在配置工序(i)中，也可以使粘合剂介于第1主面与第2主面之间。在配置工序(i)中，在使粘合剂介于第1主面与第2主面之间的情况下，例如只要在第1主面与第2主面涂敷粘合剂即可。
(粘合剂)
粘合剂是含有环氧树脂等热固化性树脂的树脂组成物即可。树脂组成物可以进一步包含热固化性树脂的固化剂。作为固化剂，可列举胺、酚醛树脂、酸酐等。树脂组成物可以进一步包含各种添加剂。作为添加剂，可列举除去焊料、电极表面的氧化覆膜的活性剂、填料、固化促进剂等。
树脂部包含通过热固化性树脂的固化反应而得到的固化物。优选焊料部形成工序(ii)的加热温度高于热固化性树脂的固化反应进展的温度。在配置工序中，在使粘合剂介于第1主面与第2主面之间的情况下，能够与焊料部的形成一起来进行树脂部的形成。
优选热固化性树脂的固化反应进展的温度高于焊料的熔点。由此，热固化性树脂的固化反应几乎是在焊料熔融而第1电极以及第2电极被焊料浸润之后进展的。由此，能够提高针对第1电极与第2电极的电连接的可靠性。
[电路部件的连接构造]
本公开所涉及的电路部件的连接构造通过上述连接方法而得到。该连接构造具备：具有配备了第1电极的第1主面的第1电路部件；具有配备了第2电极的第2主面的第2电路部件；以及介于第1主面与第2主面之间的接合部。接合部具有通过上述连接方法所形成的焊料部。接合部也可以还具有通过上述连接方法形成的树脂部。
焊料部至少在第1电极的附近包含铋含有量超过20质量％且为80质量％以下的铋-铟合金。所谓第1电极的附近，是指焊料部中的在该焊料部与第1电极之间形成合金层的情况下比该合金层靠内侧(焊料部侧)的部分。合金层包含第1电极中包含的金属和焊料中包含的金属。
在上述连接方法中，在凸块由焊料构成的情况下，通过焊料的固化所形成的焊料部至少在第1电极与第2电极之间包含铋-铟合金。在上述连接方法中，在第1电极的表面形成含有焊料的覆盖层的情况下，通过焊料的固化所形成的焊料部至少在第1电极与凸块之间包含铋-铟合金。
[实施例]
接下来，基于实施例对本公开进行更为具体的说明。不过，本公开并不限于以下的实施例。
(第1电路部件的制作)
在厚度为0.3mm且为矩形(30mm×30mm尺寸)的玻璃基板的一个表面(第1主面)，作为透明电极，条纹状地形成宽度为50μm的多个ITO电极(厚度为
Figure BDA0001299411630000091
)。ITO电极的间距设为0.1mm。
再有，ITO电极的形成中采用了蒸镀法。关于ITO电极的表面状态，算术平均粗糙度Ra为7.8nm，最大高度Rz为66.6nm。算术平均粗糙度Ra以及最大高度Rz通过基于JIS B0601-2001的测量方法来求出。
(评价板状部件的制作)
为了评价电极间的连接状态，取代具有配备了第2电极的第2主面的第2电路部件，为了方便而采用厚度为1.6mm且为矩形(3.2mm×1.6mm尺寸)的、表面被Au镀覆的Cu制板状部件(Au镀覆层的厚度为0.1～0.5μm)。
通过电解镀覆法，作为凸块的替代物，在板状部件的一个表面(3.2mm×1.6mm尺寸)形成了含有焊料的覆盖层(厚度为3～10μm)。
(电路部件的连接)
将具有包含焊料的覆盖层的板状部件搭载于具有透明电极的玻璃基板之上。这样，以透明电极与Au镀覆层隔着焊料而对置的方式配置玻璃基板与板状部件(配置工序(i))。
利用评价用板状部件自身的重量，一边将板状部件向玻璃基板按压，一边从玻璃基板的下方利用加热板进行加热，从而使焊料熔融。此时，以比焊料的熔点高出约10℃的温度对焊料加热10秒钟。之后，停止加热，使得熔融的焊料固化，由此形成将透明电极与Au镀覆层连接的焊料部(焊料部形成工序(ii))。由此获得电路部件的连接构造(评价用连接构造体)。
在上述评价用连接构造体的制作中，焊料中采用In单体(熔点：约156℃)、10Bi-90In(熔点：140℃)、20Bi-80In(熔点：110℃)、40Bi-60In(熔点：80℃)、55Bi-45In(熔点：89℃)、80Bi-20In(熔点：180℃)、Bi单体(熔点：约271℃)。再有，XBi-YIn意味着包含X质量％的铋和Y质量％的铟的合金。
利用各种焊料分别得到评价用连接构造体。
[评价]
利用键合检测器(株式会社レスカ制、PTR-1102)，测定了评价用连接构造体的透明电极与Au镀覆层的连接强度。具体而言，在固定了评价用连接构造体之后，利用安装有负荷传感器的工具对评价用板状部件的侧面(1.6mm×1.6mm尺寸)进行按压，测量透明电极与Au镀覆层的连接被破坏时的负荷。测量时，使工具从玻璃基板面下降至0.3mm的高度。工具的移送速度设为0.5mm/秒。
图2表示该评价结果。其中，图2中的100In、10Bi、20Bi、40Bi、55Bi、80Bi以及100Bi分别表示In单体(比较例)、10Bi-90In(比较例)、20Bi-80In(比较例)、40Bi-60In、55Bi-45In、80Bi-20In以及Bi单体(比较例)。
在焊料中使用了40Bi-60In、55Bi-45In、80Bi-20In的情况下(实施例)，能够得到较高的连接强度。
在焊料中使用了20Bi-80In、10Bi-90In、In单体的情况下(比较例)，连接强度下降。在焊料中使用了Bi单体的情况下(比较例)，连接强度较高，但由于焊料的熔点非常高，因此无法在低温下进行透明电极与Au镀覆层的连接。
本公开所涉及的电路部件的连接构造以及连接方法，对于如液晶等中使用的具有透明电极的玻璃基板那样具备焊料难以浸润的电极的电路部件特别有用。

Claims (11)

1.一种电路部件的连接构造，具备：
第1电路部件，具有配备了第1电极的第1主面；
第2电路部件，具有配备了第2电极的第2主面；和
接合部，介于所述第1主面与所述第2主面之间，
所述接合部具有将所述第1电极与所述第2电极电连接的焊料部，
所述焊料部含有铋-铟合金，
在所述铋-铟合金中，所述铋-铟合金中包含的铋的量为55质量％～80质量％。
2.根据权利要求1所述的电路部件的连接构造，其中，
所述接合部还具有将所述第1主面与所述第2主面粘合的树脂部。
3.根据权利要求1所述的电路部件的连接构造，其中，
所述第1电极是透明电极。
4.根据权利要求1所述的电路部件的连接构造，其中，
所述铋-铟合金的熔点为72℃～109℃。
5.一种电路部件的连接方法，将第1电路部件与第2电路部件进行连接，所述第1电路部件具有配备了第1电极的第1主面，所述第2电路部件具有配备了第2电极的第2主面，
所述电路部件的连接方法包括：
配置工序，以所述第1电极与所述第2电极隔着含有铋-铟合金的焊料而对置的方式配置所述第1电路部件和所述第2电路部件；和
焊料部形成工序，一边将所述第2电路部件向所述第1电路部件按压，一边进行加热，使所述焊料熔融，通过使熔融的所述焊料固化来形成将所述第1电极与所述第2电极电连接的焊料部，
所述铋-铟合金中包含的铋的量为55质量％～80质量％。
6.根据权利要求5所述的电路部件的连接方法，其中，还包括：
粘合剂设置工序，使粘合剂介于所述第1主面与所述第2主面之间；和
树脂部形成工序，由所述粘合剂形成将所述第1主面与所述第2主面粘合的树脂部。
7.根据权利要求6所述的电路部件的连接方法，其中，
所述粘合剂设置工序在所述焊料部形成工序之后实施。
8.根据权利要求5所述的电路部件的连接方法，其中，
在所述配置工序中，使粘合剂介于所述第1主面与所述第2主面之间。
9.根据权利要求5所述的电路部件的连接方法，其中，
所述第1电极是透明电极。
10.根据权利要求5所述的电路部件的连接方法，其中，
所述铋-铟合金的熔点为72℃～109℃。
11.根据权利要求5所述的电路部件的连接方法，其中，
在所述配置工序中，在所述第1电极与所述焊料之间不设置助焊剂。
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