WO2008091119A1 - Surface protective film - Google Patents
Surface protective film Download PDFInfo
- Publication number
- WO2008091119A1 WO2008091119A1 PCT/KR2008/000452 KR2008000452W WO2008091119A1 WO 2008091119 A1 WO2008091119 A1 WO 2008091119A1 KR 2008000452 W KR2008000452 W KR 2008000452W WO 2008091119 A1 WO2008091119 A1 WO 2008091119A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- surface protective
- weight
- parts
- protective film
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000012790 adhesive layer Substances 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 230000006835 compression Effects 0.000 claims abstract description 22
- 238000007906 compression Methods 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 17
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 17
- 239000004593 Epoxy Substances 0.000 claims abstract description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 16
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920005990 polystyrene resin Polymers 0.000 claims description 2
- 229920002799 BoPET Polymers 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 16
- 239000003522 acrylic cement Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- 150000002513 isocyanates Chemical class 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Definitions
- the present invention relates to an adhesive composition for a surface protective film and a surface protective film using the same, more particularly to an adhesive composition for a surface protective film and a surface protective film using the same wherein a film in which an adhesive is coated on a heat-resistant substrate is attached on a side of fexible products such as copper foil or flexible copper clad laminate (FCCL) polyimide film, thereby protecting the surface from being damaged during manufacturing processes such as pattern printing, light exposure, peeling, etching, development, washing, drying, compression at high temperature, and the like.
- FCCL flexible copper clad laminate
- FCCL hard print circuit boards
- FPCB flexible print circuit boards
- a surface protective film comprising an intermediate for enhancing adhesion between a heat-resistant substrate and an adhesive layer constituted of an acrylic resin and an isocyanate-based curing agent is known (Lintec Corporation; Japanese Patent Laid-Open No. 2000-44896).
- an adhesive composition comprising an acrylic resin having hydroxyl functional groups and an isocyanate-based curing agent is known (Toyo Ink; Japanese Patent Laid-Open No. 2006-22313).
- the intermediate formed between the adhesive layer and the base film in the aforesaid techniques provides no special advantages other than enhancing adhesion. Further, it requires additional process and increases the total film thickness.
- the isocyanate-based curing agent results in the increase of adhesion during the compression of the acrylic resin at high temperature.
- the adhesive may migrate when the protective film is removed after the compression at high temperature and the curling of the FPCB may occur.
- An object of the present invention is to provide an adhesive composition for a surface protective film and a surface protective film using the same, wherein the surface protective film has higher initial adhesion than that of conventional films before compression at high temperature so as to maintain sufficient adhesion to an adherend, and its adhesion increase after the compression at high temperature is controlled particularly within 3 times of the initial adhesion so as to prevent the migration of the adhesive during the removal of the film and prevent the damage of the adherend.
- Another object of the present invention is to provide an adhesive composition for a surface protective film having superior heat resistance, chemical resistance and re- leasablity, and a surface protective film using the same.
- the present invention provides a surface protective film comprising a base film; and an adhesive layer formed on the inner side of the base film, wherein the adhesive composition of the adhesive layer comprises 1 to 4 parts by weight of an epoxy -based curing agent based on 100 parts by weight of an acrylic resin having carboxyl functional groups so as to reduce the difference between adhesion after the compression at high temperature and initial adhesion at a lamination of the film.
- the surface protective film in accordance with the present invention provides effective protection of the surface of FCCL or copper foil since it has good chemical resistance and shows less change of adhesion even at high temperature and high pressure.
- the surface protective film in accordance with the present invention can provide effective protection of the product surface.
- FIG. 1 schematically illustrates the construction of a surface protective film according to an embodiment of the present invention.
- FIG. 1 schematically illustrates the construction of a surface protective film according to an embodiment of the present invention.
- the surface protective film according to an embodiment of the present invention comprises a base film 10; an adhesive layer 20 formed on the inner side of the base film; and a release film 30 formed on the adhesive layer 20.
- the adhesive layer 20 is formed by adding 1.0 to 4.0 parts by weight of an epoxy -based curing agent to 100 parts by weight of an acrylic resin (base resin) having carboxyl functional groups.
- the base resin and the curing agent are added with the above-mentioned proportion and then mixed for 10 minutes.
- the coating of the adhesive is formed in a clean room environment.
- the adhesive coating is performed with an apparatus wherein the coater head and the drying chamber have a cleanness class 100 to 1,000 so as to block the inclusion of dusts and foreign matters (impurities) inside the coating film.
- the number of foreign matters larger than 100 D is maintained below 3 per m .
- a comma coater is used as coater head and the viscosity of a coating solution is maintained at 500 to 2,000 cps at 25 0 C during the coating. Further, the surface roughness after coating is controlled to satisfy R of 0.3+0.1 or less, R of 2.5+0.3 or a z less, and R of 4.0+0.3 or less. max
- a solvent is used to maintain the viscosity of the coating solution.
- the solvent may be any one if it can dissolve an adhesive composition comprising an adhesive and a curing agent, and is not particularly limited.
- toluene, methyl ethyl ketone, isopropyl alcohol, cyclohexanone, ethyl acetate or a mixture thereof may be used.
- the base film 10 is prepared from a heat-resistant material, preferably a heat- resistant resin film having a thickness in the range from 10 to 200 D.
- Preferred examples of the heat-resistant resin include a polyester resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc., a polyimide resin, a polycarbonate resin, a polystyrene resin, a polyamide resin, a polyester imide resin, a polyester ether resin, and so forth.
- a polyester resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc.
- a polyimide resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc.
- a polyimide resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc.
- a polyimide resin such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, etc.
- a polyimide resin such as poly
- the adhesive compositions of the adhesive layer 20 was prepared using an acrylic resin having carboxyl or hydroxyl functional groups, and an isocyanate-based curing agent or an epoxy-based curing agent, and varying the coating thickness. Initial adhesion and increase of the adhesion after compression at high temperature were measured.
- Base film 10 / adhesive layer 20-1 1 to 2 parts by weight of epoxy-based curing agent based on 100 parts by weight of acrylic adhesive having carboxyl groups / release film 30
- Base film 10 / adhesive layer 20-2 2 to 3 parts by weight of epoxy-based curing agent based on 100 parts by weight of acrylic adhesive having carboxyl groups / release film 30
- Base film 10 / adhesive layer 20-3 3 to 4 parts by weight of epoxy-based curing agent based on 100 parts by weight of acrylic adhesive having carboxyl groups / release film 30
- Base film 10 / adhesive layer 20-4 1 to 2 parts by weight of isocyanate-based curing agent based on 100 parts by weight of acrylic adhesive having hydroxyl groups
- Base film 10 / adhesive layer 20-5 2 to 4 parts by weight of isocyanate-based curing agent based on 100 parts by weight of acrylic adhesive having hydroxyl groups
- Base film 10 / adhesive layer 20-6 4 to 5 parts by weight of isocyanate-based curing agent based on 100 parts by weight of acrylic adhesive having hydroxyl groups
- Base film 10 / adhesive layer 20-7 0.9 part by weight of epoxy-based curing agent based on 100 parts by weight of acrylic adhesive having carboxyl groups / release film
- Base film 10 / adhesive layer 20-8 4.1 parts by weight of epoxy-based curing agent based on 100 parts by weight of acrylic adhesive having carboxyl groups / release film
- the adhesive compositions 20- 1 to 20-3 used in Examples 1 to 3 were prepared by mixing 100 parts by weight of an acrylic resin having carboxyl groups with 1 to 4 parts by weight of an epoxy-based resin.
- the adhesive compositions 20-4 to 20-6 used in Comparative Examples 1 to 3 were prepared by mixing 100 parts by weight of an acrylic resin having hydroxyl groups with 1 to 5 parts by weight of an isocyanate-based resin.
- the adhesive compositions 20-7 and 20-8 used in Comparative Examples 4 and 5 were prepared by mixing 100 parts by weight of an acrylic resin having carboxyl groups with 0.9 part by weight and 4.1 parts by weight of an epoxy-based resin, respectively.
- toluene was used as solvent and viscosity was maintained appropriately.
- the mixed composition was coated on a PET (polyethylene terephthalate) film to have a dry film thickness of 6 D or less, 6-15 D, 15-18 D, and 18 D or more, using a comma coater, so as to form an adhesive layer.
- a release film was laminated to the adhesive layer so as to obtain a surface protective film having a configuration of base film / adhesive layer / release film.
- the surface protective film was aged at 23 0 C and 50% RH for 7 days.
- Adhesion was measured while peeling at 180°at a rate of 300 mm/min.
- each of the films prepared in Examples and Comparative Examples was cut to a size of 25 mmxl20 mm in the MD direction, and each resulting sample was attached on a polyimide film (Apical 25NPI) and laminated by pressing with a pressure of 4 kgf/cm.
- Adhesion was measured while peeling at 180°at a rate of 300 mm/min.
- each of the films prepared in Examples and Comparative Examples was cut to a size of 20 mmxl20 mm in the TD direction, and each resulting sample was attached on an FCCL and laminated by pressing with a pressure of 4 kgf/cm. After subjected to be for 30 minutes, the sample was heated in an oven of 18O 0 C for 1 hour.
- the adhesive composition for a surface protective film and a surface protective film using the same according to the present invention are effective in protecting the surface of flexible products such as FCCL and copper foil.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009547174A JP2010516856A (ja) | 2007-01-24 | 2008-01-24 | 表面保護フィルム |
| CN2008800029619A CN101594993B (zh) | 2007-01-24 | 2008-01-24 | 表面保护膜 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070007622A KR100838461B1 (ko) | 2007-01-24 | 2007-01-24 | 표면 보호 필름 |
| KR10-2007-0007622 | 2007-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008091119A1 true WO2008091119A1 (en) | 2008-07-31 |
Family
ID=39644662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2008/000452 WO2008091119A1 (en) | 2007-01-24 | 2008-01-24 | Surface protective film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010516856A (zh) |
| KR (1) | KR100838461B1 (zh) |
| CN (1) | CN101594993B (zh) |
| WO (1) | WO2008091119A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555348A (zh) * | 2011-12-28 | 2012-07-11 | 广东生益科技股份有限公司 | 无胶双面挠性覆铜板生产用保护膜及其制造方法 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101142198B1 (ko) * | 2009-12-21 | 2012-05-07 | 도레이첨단소재 주식회사 | 연성인쇄회로기판용 점착보호필름 |
| KR101188170B1 (ko) | 2011-01-21 | 2012-10-05 | 도레이첨단소재 주식회사 | 연성회로기판 보호필름용 점착제 및 이를 이용한 연성회로기판용 보호필름 |
| JP5855465B2 (ja) | 2012-01-10 | 2016-02-09 | 藤森工業株式会社 | 表面保護フィルム、及びそれが貼着された光学部品、工業製品 |
| CN102975460A (zh) * | 2012-11-23 | 2013-03-20 | 安文娟 | 一种透明耐磨型显示屏贴膜的制备方法 |
| CN104097370A (zh) * | 2013-04-11 | 2014-10-15 | 汉达精密电子(昆山)有限公司 | 防拉伸变形橡胶贴片 |
| CN103561546B (zh) * | 2013-11-10 | 2016-05-18 | 大连吉星电子有限公司 | 柔性电路板与金属片热压式贴附工艺 |
| KR101628551B1 (ko) * | 2014-12-02 | 2016-06-08 | 현대자동차주식회사 | 표면 보호 필름 |
| CN105647411B (zh) * | 2015-11-27 | 2018-09-07 | 东莞市航达电子有限公司 | 耐高温保护膜 |
| CN105898988B (zh) * | 2016-06-01 | 2018-10-02 | 深圳市汇晨电子股份有限公司 | 背光源fpc整版胶膜及其整体贴胶工艺 |
| KR102117873B1 (ko) * | 2018-07-02 | 2020-06-02 | 도레이첨단소재 주식회사 | 노광 공정용 점착보호필름 |
| KR102334954B1 (ko) | 2018-10-11 | 2021-12-02 | 주식회사 엘지화학 | 폴더블 디스플레이용 보호 필름 및 이를 포함하는 폴더블 디스플레이 장치 |
| KR102521063B1 (ko) | 2021-03-25 | 2023-04-13 | 율촌화학 주식회사 | 내용제성이 우수한 다이싱 테이프 |
| KR102627768B1 (ko) | 2022-03-08 | 2024-01-19 | 도레이첨단소재 주식회사 | 보호필름용 저수축 점착시트 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0951164A (ja) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | フレキシブル印刷配線基板およびカバーレイフィルム |
| JP2002080810A (ja) * | 2000-01-20 | 2002-03-22 | Shin Etsu Chem Co Ltd | 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム |
| KR20060051762A (ko) * | 2004-09-29 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061957A (ja) * | 1992-06-18 | 1994-01-11 | Mitsui Toatsu Chem Inc | 表面保護用粘着テープの製造方法 |
| EP1409601A2 (en) * | 2001-07-16 | 2004-04-21 | Denki Kagaku Kogyo Kabushiki Kaisha | Surface protection film |
| JP4191945B2 (ja) * | 2002-03-29 | 2008-12-03 | ソマール株式会社 | 粘着体、それを用いた粘着シート並びにフレキシブル回路基板用積層材料 |
| JP4437638B2 (ja) * | 2002-08-09 | 2010-03-24 | 日本カーバイド工業株式会社 | 再剥離型表面保護シート用粘着剤組成物及び再剥離型表面保護シート |
| JP4682299B2 (ja) * | 2003-11-17 | 2011-05-11 | 綜研化学株式会社 | 保護シート用感圧接着剤 |
| JP4880877B2 (ja) * | 2004-01-16 | 2012-02-22 | リンテック株式会社 | フレキシブルプリント配線基板の製造方法及び該製造方法に用いる再剥離性剥離材付き工程フィルム |
| JP4581061B2 (ja) * | 2004-06-25 | 2010-11-17 | 綜研化学株式会社 | 光学フィルム保護シート用粘着剤組成物及び光学フィルム保護シート |
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2007
- 2007-01-24 KR KR1020070007622A patent/KR100838461B1/ko active IP Right Grant
-
2008
- 2008-01-24 CN CN2008800029619A patent/CN101594993B/zh active Active
- 2008-01-24 WO PCT/KR2008/000452 patent/WO2008091119A1/en active Application Filing
- 2008-01-24 JP JP2009547174A patent/JP2010516856A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0951164A (ja) * | 1995-08-08 | 1997-02-18 | Nitsukan Kogyo Kk | フレキシブル印刷配線基板およびカバーレイフィルム |
| JP2002080810A (ja) * | 2000-01-20 | 2002-03-22 | Shin Etsu Chem Co Ltd | 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム |
| KR20060051762A (ko) * | 2004-09-29 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555348A (zh) * | 2011-12-28 | 2012-07-11 | 广东生益科技股份有限公司 | 无胶双面挠性覆铜板生产用保护膜及其制造方法 |
| CN102555348B (zh) * | 2011-12-28 | 2014-08-13 | 广东生益科技股份有限公司 | 无胶双面挠性覆铜板生产用保护膜及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010516856A (ja) | 2010-05-20 |
| CN101594993A (zh) | 2009-12-02 |
| KR100838461B1 (ko) | 2008-06-16 |
| CN101594993B (zh) | 2012-12-26 |
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