KR100838461B1 - 표면 보호 필름 - Google Patents

표면 보호 필름 Download PDF

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Publication number
KR100838461B1
KR100838461B1 KR1020070007622A KR20070007622A KR100838461B1 KR 100838461 B1 KR100838461 B1 KR 100838461B1 KR 1020070007622 A KR1020070007622 A KR 1020070007622A KR 20070007622 A KR20070007622 A KR 20070007622A KR 100838461 B1 KR100838461 B1 KR 100838461B1
Authority
KR
South Korea
Prior art keywords
film
weight
surface protection
adhesive composition
base film
Prior art date
Application number
KR1020070007622A
Other languages
English (en)
Korean (ko)
Inventor
김영희
김성환
박종복
김원
김윤희
Original Assignee
율촌화학 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 율촌화학 주식회사 filed Critical 율촌화학 주식회사
Priority to KR1020070007622A priority Critical patent/KR100838461B1/ko
Priority to JP2009547174A priority patent/JP2010516856A/ja
Priority to CN2008800029619A priority patent/CN101594993B/zh
Priority to PCT/KR2008/000452 priority patent/WO2008091119A1/en
Application granted granted Critical
Publication of KR100838461B1 publication Critical patent/KR100838461B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020070007622A 2007-01-24 2007-01-24 표면 보호 필름 KR100838461B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020070007622A KR100838461B1 (ko) 2007-01-24 2007-01-24 표면 보호 필름
JP2009547174A JP2010516856A (ja) 2007-01-24 2008-01-24 表面保護フィルム
CN2008800029619A CN101594993B (zh) 2007-01-24 2008-01-24 表面保护膜
PCT/KR2008/000452 WO2008091119A1 (en) 2007-01-24 2008-01-24 Surface protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070007622A KR100838461B1 (ko) 2007-01-24 2007-01-24 표면 보호 필름

Publications (1)

Publication Number Publication Date
KR100838461B1 true KR100838461B1 (ko) 2008-06-16

Family

ID=39644662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070007622A KR100838461B1 (ko) 2007-01-24 2007-01-24 표면 보호 필름

Country Status (4)

Country Link
JP (1) JP2010516856A (zh)
KR (1) KR100838461B1 (zh)
CN (1) CN101594993B (zh)
WO (1) WO2008091119A1 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101142198B1 (ko) * 2009-12-21 2012-05-07 도레이첨단소재 주식회사 연성인쇄회로기판용 점착보호필름
KR101188170B1 (ko) 2011-01-21 2012-10-05 도레이첨단소재 주식회사 연성회로기판 보호필름용 점착제 및 이를 이용한 연성회로기판용 보호필름
KR101429959B1 (ko) 2012-01-10 2014-08-14 후지모리 고교 가부시키가이샤 표면 보호 필름 및 그것이 첩착된 광학 부품과 공업 제품
KR101628551B1 (ko) * 2014-12-02 2016-06-08 현대자동차주식회사 표면 보호 필름
KR20200003616A (ko) * 2018-07-02 2020-01-10 도레이첨단소재 주식회사 노광 공정용 점착보호필름
KR20220133709A (ko) 2021-03-25 2022-10-05 율촌화학 주식회사 내용제성이 우수한 다이싱 테이프
KR20230132266A (ko) 2022-03-08 2023-09-15 도레이첨단소재 주식회사 보호필름용 저수축 점착시트
US11796719B2 (en) 2018-10-11 2023-10-24 Lg Chem, Ltd. Protection film for foldable display and foldable display device comprising same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102555348B (zh) * 2011-12-28 2014-08-13 广东生益科技股份有限公司 无胶双面挠性覆铜板生产用保护膜及其制造方法
CN102975460A (zh) * 2012-11-23 2013-03-20 安文娟 一种透明耐磨型显示屏贴膜的制备方法
CN104097370A (zh) * 2013-04-11 2014-10-15 汉达精密电子(昆山)有限公司 防拉伸变形橡胶贴片
CN103561546B (zh) * 2013-11-10 2016-05-18 大连吉星电子有限公司 柔性电路板与金属片热压式贴附工艺
CN105647411B (zh) * 2015-11-27 2018-09-07 东莞市航达电子有限公司 耐高温保护膜
CN105898988B (zh) * 2016-06-01 2018-10-02 深圳市汇晨电子股份有限公司 背光源fpc整版胶膜及其整体贴胶工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951164A (ja) * 1995-08-08 1997-02-18 Nitsukan Kogyo Kk フレキシブル印刷配線基板およびカバーレイフィルム
JP2002080810A (ja) 2000-01-20 2002-03-22 Shin Etsu Chem Co Ltd 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム
KR20050075693A (ko) * 2004-01-16 2005-07-21 린텍 가부시키가이샤 재박리성 공정 필름
KR20060051762A (ko) * 2004-09-29 2006-05-19 신에쓰 가가꾸 고교 가부시끼가이샤 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH061957A (ja) * 1992-06-18 1994-01-11 Mitsui Toatsu Chem Inc 表面保護用粘着テープの製造方法
EP1409601A2 (en) * 2001-07-16 2004-04-21 Denki Kagaku Kogyo Kabushiki Kaisha Surface protection film
JP4191945B2 (ja) * 2002-03-29 2008-12-03 ソマール株式会社 粘着体、それを用いた粘着シート並びにフレキシブル回路基板用積層材料
JP4437638B2 (ja) * 2002-08-09 2010-03-24 日本カーバイド工業株式会社 再剥離型表面保護シート用粘着剤組成物及び再剥離型表面保護シート
JP4682299B2 (ja) * 2003-11-17 2011-05-11 綜研化学株式会社 保護シート用感圧接着剤
JP4581061B2 (ja) * 2004-06-25 2010-11-17 綜研化学株式会社 光学フィルム保護シート用粘着剤組成物及び光学フィルム保護シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951164A (ja) * 1995-08-08 1997-02-18 Nitsukan Kogyo Kk フレキシブル印刷配線基板およびカバーレイフィルム
JP2002080810A (ja) 2000-01-20 2002-03-22 Shin Etsu Chem Co Ltd 接着剤組成物、フレキシブル印刷配線用基板及びカバーレイフィルム
KR20050075693A (ko) * 2004-01-16 2005-07-21 린텍 가부시키가이샤 재박리성 공정 필름
KR20060051762A (ko) * 2004-09-29 2006-05-19 신에쓰 가가꾸 고교 가부시끼가이샤 아크릴계 난연성 접착제 조성물 및 아크릴계 난연성 접착제시트

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101142198B1 (ko) * 2009-12-21 2012-05-07 도레이첨단소재 주식회사 연성인쇄회로기판용 점착보호필름
KR101188170B1 (ko) 2011-01-21 2012-10-05 도레이첨단소재 주식회사 연성회로기판 보호필름용 점착제 및 이를 이용한 연성회로기판용 보호필름
KR101429959B1 (ko) 2012-01-10 2014-08-14 후지모리 고교 가부시키가이샤 표면 보호 필름 및 그것이 첩착된 광학 부품과 공업 제품
KR101628551B1 (ko) * 2014-12-02 2016-06-08 현대자동차주식회사 표면 보호 필름
KR20200003616A (ko) * 2018-07-02 2020-01-10 도레이첨단소재 주식회사 노광 공정용 점착보호필름
KR102117873B1 (ko) 2018-07-02 2020-06-02 도레이첨단소재 주식회사 노광 공정용 점착보호필름
US11796719B2 (en) 2018-10-11 2023-10-24 Lg Chem, Ltd. Protection film for foldable display and foldable display device comprising same
KR20220133709A (ko) 2021-03-25 2022-10-05 율촌화학 주식회사 내용제성이 우수한 다이싱 테이프
KR20230132266A (ko) 2022-03-08 2023-09-15 도레이첨단소재 주식회사 보호필름용 저수축 점착시트
KR102627768B1 (ko) * 2022-03-08 2024-01-19 도레이첨단소재 주식회사 보호필름용 저수축 점착시트

Also Published As

Publication number Publication date
JP2010516856A (ja) 2010-05-20
CN101594993A (zh) 2009-12-02
CN101594993B (zh) 2012-12-26
WO2008091119A1 (en) 2008-07-31

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