WO2006001305A1 - 印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法 - Google Patents
印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法 Download PDFInfo
- Publication number
- WO2006001305A1 WO2006001305A1 PCT/JP2005/011449 JP2005011449W WO2006001305A1 WO 2006001305 A1 WO2006001305 A1 WO 2006001305A1 JP 2005011449 W JP2005011449 W JP 2005011449W WO 2006001305 A1 WO2006001305 A1 WO 2006001305A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed wiring
- wiring board
- metal foil
- clad laminate
- producing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/14—Making preforms characterised by structure or composition
- B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/0872—Prepregs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53796—Puller or pusher means, contained force multiplying operator
- Y10T29/53848—Puller or pusher means, contained force multiplying operator having screw operator
- Y10T29/53857—Central screw, work-engagers around screw
- Y10T29/53878—Tubular or tube segment forms work-engager
- Y10T29/53883—Screw threaded work-engager
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05765134.1A EP1768471B1 (en) | 2004-06-23 | 2005-06-22 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
US11/630,651 US7947332B2 (en) | 2004-06-23 | 2005-06-22 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
JP2006528562A JPWO2006001305A1 (ja) | 2004-06-23 | 2005-06-22 | 印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004184857 | 2004-06-23 | ||
JP2004-184856 | 2004-06-23 | ||
JP2004184858 | 2004-06-23 | ||
JP2004-184858 | 2004-06-23 | ||
JP2004-184857 | 2004-06-23 | ||
JP2004184856 | 2004-06-23 | ||
JP2004189607 | 2004-06-28 | ||
JP2004-189607 | 2004-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006001305A1 true WO2006001305A1 (ja) | 2006-01-05 |
Family
ID=35781768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/011449 WO2006001305A1 (ja) | 2004-06-23 | 2005-06-22 | 印刷配線板用プリプレグ、金属箔張積層板、及び印刷配線板、並びに、多層印刷配線板の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7947332B2 (ja) |
EP (1) | EP1768471B1 (ja) |
JP (4) | JPWO2006001305A1 (ja) |
KR (4) | KR100971865B1 (ja) |
CN (3) | CN101883470B (ja) |
TW (2) | TW200606194A (ja) |
WO (1) | WO2006001305A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008141182A (ja) * | 2006-11-02 | 2008-06-19 | Hitachi Chem Co Ltd | 金属箔張積層板及び多層印刷配線板 |
JP2018532676A (ja) * | 2015-09-30 | 2018-11-08 | コーニング インコーポレイテッド | ハロゲン化ポリイミドシロキサン化学組成物およびハロゲン化ポリイミドシロキサン低摩擦コーティングを有するガラス物品 |
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CN101374383B (zh) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | 绝缘基膜、电路板基板及电路板 |
TWI548320B (zh) * | 2007-09-11 | 2016-09-01 | Ajinomoto Kk | Manufacturing method of multilayer printed circuit board |
JP5018840B2 (ja) * | 2009-07-27 | 2012-09-05 | 富士通株式会社 | クーポン基板 |
JP5803248B2 (ja) | 2011-05-06 | 2015-11-04 | ソニー株式会社 | 情報処理装置、情報処理方法、及びプログラム |
WO2012165439A1 (ja) * | 2011-05-31 | 2012-12-06 | 日立化成工業株式会社 | めっきプロセス用プライマー層、配線板用積層板及びその製造方法、多層配線板及びその製造方法 |
CN109524806B (zh) * | 2011-10-17 | 2020-07-17 | 日产自动车株式会社 | 端子座 |
JP5941847B2 (ja) * | 2013-01-17 | 2016-06-29 | 信越化学工業株式会社 | シリコーン・有機樹脂複合積層板及びその製造方法、並びにこれを使用した発光半導体装置 |
TWI610606B (zh) * | 2013-02-21 | 2018-01-01 | 味之素股份有限公司 | 零件內建配線基板之製造方法及半導體裝置 |
US9472480B2 (en) | 2014-05-28 | 2016-10-18 | Cree, Inc. | Over-mold packaging for wide band-gap semiconductor devices |
US9641163B2 (en) | 2014-05-28 | 2017-05-02 | Cree, Inc. | Bandwidth limiting methods for GaN power transistors |
US9515011B2 (en) * | 2014-05-28 | 2016-12-06 | Cree, Inc. | Over-mold plastic packaged wide band-gap power transistors and MMICS |
JP6880723B2 (ja) * | 2016-12-27 | 2021-06-02 | 住友金属鉱山株式会社 | 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法 |
CN109591325B (zh) * | 2018-10-12 | 2021-02-02 | 江西昌河航空工业有限公司 | 一种防止复合材料桨叶与金属件过渡区表面漆裂的方法 |
CN116968362B (zh) * | 2023-09-22 | 2024-01-02 | 玩出梦想(上海)科技有限公司 | 头戴式显示设备前盖的制备方法 |
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JPS63158217A (ja) | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | 積層板の製造法 |
JPH05347461A (ja) | 1992-06-12 | 1993-12-27 | Sumitomo Bakelite Co Ltd | ポリアミック酸フィルムおよびその製造方法 |
JPH06334B2 (ja) | 1985-03-15 | 1994-01-05 | 日立化成工業株式会社 | プリプレグの製造方法 |
JPH10200258A (ja) * | 1997-01-08 | 1998-07-31 | Matsushita Electric Ind Co Ltd | 多層プリント配線板の製造方法 |
JP2001294675A (ja) * | 2000-04-14 | 2001-10-23 | Mitsubishi Gas Chem Co Inc | プリプレグ及び金属箔張り積層板 |
JP2002121303A (ja) * | 2000-10-19 | 2002-04-23 | Sumitomo Bakelite Co Ltd | プリプレグ及びこれを用いた積層板の製造方法 |
JP2002226680A (ja) * | 2001-02-02 | 2002-08-14 | Sumitomo Bakelite Co Ltd | 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板 |
JP2002292663A (ja) * | 2001-03-30 | 2002-10-09 | Matsushita Electric Works Ltd | 多層積層板の製造方法 |
EP1300444A1 (en) * | 2000-06-28 | 2003-04-09 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin composition and cured object obtained therefrom |
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-
2005
- 2005-06-22 KR KR1020097025696A patent/KR100971865B1/ko active IP Right Grant
- 2005-06-22 WO PCT/JP2005/011449 patent/WO2006001305A1/ja active Application Filing
- 2005-06-22 EP EP05765134.1A patent/EP1768471B1/en active Active
- 2005-06-22 KR KR1020097014942A patent/KR20090090396A/ko not_active Application Discontinuation
- 2005-06-22 CN CN2009102072696A patent/CN101883470B/zh active Active
- 2005-06-22 CN CN2009102072681A patent/CN101711099B/zh active Active
- 2005-06-22 CN CN2009102072709A patent/CN101711100B/zh active Active
- 2005-06-22 US US11/630,651 patent/US7947332B2/en not_active Expired - Fee Related
- 2005-06-22 JP JP2006528562A patent/JPWO2006001305A1/ja active Pending
- 2005-06-22 KR KR1020077001494A patent/KR100979860B1/ko active IP Right Grant
- 2005-06-22 KR KR1020087014435A patent/KR20080066882A/ko not_active Application Discontinuation
- 2005-06-23 TW TW094121034A patent/TW200606194A/zh unknown
- 2005-06-23 TW TW100144565A patent/TW201215257A/zh unknown
-
2011
- 2011-01-07 JP JP2011002265A patent/JP2011109122A/ja active Pending
- 2011-01-07 JP JP2011002262A patent/JP2011103480A/ja active Pending
-
2012
- 2012-10-02 JP JP2012220552A patent/JP2013012779A/ja active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334B2 (ja) | 1985-03-15 | 1994-01-05 | 日立化成工業株式会社 | プリプレグの製造方法 |
JPS63158217A (ja) | 1986-12-22 | 1988-07-01 | Hitachi Chem Co Ltd | 積層板の製造法 |
JPH05347461A (ja) | 1992-06-12 | 1993-12-27 | Sumitomo Bakelite Co Ltd | ポリアミック酸フィルムおよびその製造方法 |
JPH10200258A (ja) * | 1997-01-08 | 1998-07-31 | Matsushita Electric Ind Co Ltd | 多層プリント配線板の製造方法 |
JP2001294675A (ja) * | 2000-04-14 | 2001-10-23 | Mitsubishi Gas Chem Co Inc | プリプレグ及び金属箔張り積層板 |
EP1300444A1 (en) * | 2000-06-28 | 2003-04-09 | Nippon Kayaku Kabushiki Kaisha | Epoxy resin composition and cured object obtained therefrom |
JP2002121303A (ja) * | 2000-10-19 | 2002-04-23 | Sumitomo Bakelite Co Ltd | プリプレグ及びこれを用いた積層板の製造方法 |
JP2002226680A (ja) * | 2001-02-02 | 2002-08-14 | Sumitomo Bakelite Co Ltd | 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板 |
JP2002292663A (ja) * | 2001-03-30 | 2002-10-09 | Matsushita Electric Works Ltd | 多層積層板の製造方法 |
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Cited By (2)
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JP2008141182A (ja) * | 2006-11-02 | 2008-06-19 | Hitachi Chem Co Ltd | 金属箔張積層板及び多層印刷配線板 |
JP2018532676A (ja) * | 2015-09-30 | 2018-11-08 | コーニング インコーポレイテッド | ハロゲン化ポリイミドシロキサン化学組成物およびハロゲン化ポリイミドシロキサン低摩擦コーティングを有するガラス物品 |
Also Published As
Publication number | Publication date |
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KR100979860B1 (ko) | 2010-09-02 |
KR20090090396A (ko) | 2009-08-25 |
CN101883470B (zh) | 2012-09-05 |
EP1768471A4 (en) | 2007-08-08 |
JP2011103480A (ja) | 2011-05-26 |
KR20080066882A (ko) | 2008-07-16 |
US7947332B2 (en) | 2011-05-24 |
TWI365205B (ja) | 2012-06-01 |
KR20070027725A (ko) | 2007-03-09 |
TW200606194A (en) | 2006-02-16 |
US20070277375A1 (en) | 2007-12-06 |
CN101711100A (zh) | 2010-05-19 |
EP1768471A1 (en) | 2007-03-28 |
JP2013012779A (ja) | 2013-01-17 |
KR20090130348A (ko) | 2009-12-22 |
CN101711099B (zh) | 2012-03-21 |
EP1768471B1 (en) | 2013-05-29 |
KR100971865B1 (ko) | 2010-07-22 |
JP2011109122A (ja) | 2011-06-02 |
CN101883470A (zh) | 2010-11-10 |
CN101711099A (zh) | 2010-05-19 |
JPWO2006001305A1 (ja) | 2008-04-17 |
TW201215257A (en) | 2012-04-01 |
CN101711100B (zh) | 2012-03-28 |
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