FR2543780B1 - Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit - Google Patents

Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit

Info

Publication number
FR2543780B1
FR2543780B1 FR848404441A FR8404441A FR2543780B1 FR 2543780 B1 FR2543780 B1 FR 2543780B1 FR 848404441 A FR848404441 A FR 848404441A FR 8404441 A FR8404441 A FR 8404441A FR 2543780 B1 FR2543780 B1 FR 2543780B1
Authority
FR
France
Prior art keywords
manufacturing
shape
electric circuit
flexible electric
circuit retaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR848404441A
Other languages
English (en)
Other versions
FR2543780A1 (fr
Inventor
Francis S Gurley
Richard T Traskos
Paul L Anderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of FR2543780A1 publication Critical patent/FR2543780A1/fr
Application granted granted Critical
Publication of FR2543780B1 publication Critical patent/FR2543780B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
FR848404441A 1983-03-31 1984-03-22 Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit Expired - Fee Related FR2543780B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48091483A 1983-03-31 1983-03-31

Publications (2)

Publication Number Publication Date
FR2543780A1 FR2543780A1 (fr) 1984-10-05
FR2543780B1 true FR2543780B1 (fr) 1990-02-23

Family

ID=23909869

Family Applications (1)

Application Number Title Priority Date Filing Date
FR848404441A Expired - Fee Related FR2543780B1 (fr) 1983-03-31 1984-03-22 Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit

Country Status (6)

Country Link
JP (1) JPS59184587A (fr)
CA (1) CA1212180A (fr)
DE (1) DE3411973A1 (fr)
FR (1) FR2543780B1 (fr)
GB (1) GB2137425B (fr)
IT (1) IT1196065B (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641342A1 (de) * 1986-12-03 1988-06-09 Huels Troisdorf Schichtpressstoff aus faserverstaerktem, vernetztem polypropylen
US4974121A (en) * 1987-05-29 1990-11-27 Fuji Xerox Co., Ltd. Wiring module
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate
DE4337960A1 (de) * 1993-11-06 1995-05-11 Philips Patentverwaltung Leiterplatte
DE4423893C2 (de) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flachdichtung mit flexibler Leiterplatte
DE19650154C2 (de) * 1996-12-04 1999-06-10 Lemfoerder Metallwaren Ag Schaltvorrichtung für ein Getriebe eines KFZ mit einer mit Sensoren, Leuchtdioden, Prozessen und anderen elektronischen Bauelementen bestückten Leiterplatte und Verfahren zur Herstellung einer gekrümmten Leiterplatte zur Verwendung in einer solchen Schaltvorrichtung
KR20090090396A (ko) * 2004-06-23 2009-08-25 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 프리프레그, 금속박장 적층판 및 인쇄 배선판, 및 다층 인쇄 배선판의 제조 방법
US9602914B2 (en) 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
US8477492B2 (en) 2010-08-19 2013-07-02 Apple Inc. Formed PCB
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US8634204B2 (en) 2010-08-19 2014-01-21 Apple Inc. Compact folded configuration for integrated circuit packaging
US8515113B2 (en) 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
CN103221896B (zh) * 2010-08-19 2017-06-09 苹果公司 便携式电子设备
US8427379B2 (en) 2010-08-19 2013-04-23 Apple Inc. Modular material antenna assembly
US9287627B2 (en) 2011-08-31 2016-03-15 Apple Inc. Customizable antenna feed structure
US9406999B2 (en) 2011-09-23 2016-08-02 Apple Inc. Methods for manufacturing customized antenna structures
EP4260665A1 (fr) * 2020-12-14 2023-10-18 Koninklijke Philips N.V. Procédé et systèmes de formage à froid de caractéristiques sur des circuits souples

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665852A1 (de) * 1967-01-20 1971-01-28 Siemens Ag Verfahren zur Herstellung gekruemmter elektrischer Leiterplatten
GB1191909A (en) * 1967-10-16 1970-05-13 Westinghouse Electric Corp Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture
GB1200387A (en) * 1967-11-06 1970-07-29 Cincinnati Milling Machine Co Copper clad plastic panel
DE2003982A1 (de) * 1969-02-03 1970-08-06 Cincinnati Milling Machine Co Kupferkaschierte Kunststoffplatte und Verfahren zur Herstellung derselben
JPS5227189B1 (fr) * 1970-07-08 1977-07-19
SE415318B (sv) * 1974-01-07 1980-09-22 Minnesota Mining & Mfg Mrtallbelagt dielektriskt arkmaterial, metallskikt pa icke vevd bana
GB1475031A (en) * 1975-01-18 1977-06-01 Marconi Co Ltd Curved rigid printed circuit boards
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board
US4103102A (en) * 1976-07-01 1978-07-25 Bell Telephone Laboratories, Incorporated Reinforced flexible printed wiring board
JPS5599789A (en) * 1979-01-26 1980-07-30 Matsushita Electric Works Ltd Material for printed circuit and method of fabricating same
JPS5649473A (en) * 1979-09-28 1981-05-06 Iwai Kikai Kogyo Kk Double sealed valve
GB2061989B (en) * 1979-10-26 1984-01-11 Castall Inc Insulating boards for printed circuits
GB2109166A (en) * 1981-11-06 1983-05-25 Tba Industrial Products Ltd Printed circuit boards

Also Published As

Publication number Publication date
GB2137425A (en) 1984-10-03
DE3411973A1 (de) 1984-10-11
IT1196065B (it) 1988-11-10
GB8408263D0 (en) 1984-05-10
GB2137425B (en) 1987-06-17
IT8420307A0 (it) 1984-03-29
FR2543780A1 (fr) 1984-10-05
CA1212180A (fr) 1986-09-30
JPS59184587A (ja) 1984-10-19

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Legal Events

Date Code Title Description
ST Notification of lapse