GB8408263D0 - Electric circuit - Google Patents

Electric circuit

Info

Publication number
GB8408263D0
GB8408263D0 GB848408263A GB8408263A GB8408263D0 GB 8408263 D0 GB8408263 D0 GB 8408263D0 GB 848408263 A GB848408263 A GB 848408263A GB 8408263 A GB8408263 A GB 8408263A GB 8408263 D0 GB8408263 D0 GB 8408263D0
Authority
GB
United Kingdom
Prior art keywords
electric circuit
electric
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB848408263A
Other versions
GB2137425B (en
GB2137425A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of GB8408263D0 publication Critical patent/GB8408263D0/en
Publication of GB2137425A publication Critical patent/GB2137425A/en
Application granted granted Critical
Publication of GB2137425B publication Critical patent/GB2137425B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
GB08408263A 1983-03-31 1984-03-30 Shape retaining flexible electric circuit board and method of manufacture thereof Expired GB2137425B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48091483A 1983-03-31 1983-03-31

Publications (3)

Publication Number Publication Date
GB8408263D0 true GB8408263D0 (en) 1984-05-10
GB2137425A GB2137425A (en) 1984-10-03
GB2137425B GB2137425B (en) 1987-06-17

Family

ID=23909869

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08408263A Expired GB2137425B (en) 1983-03-31 1984-03-30 Shape retaining flexible electric circuit board and method of manufacture thereof

Country Status (6)

Country Link
JP (1) JPS59184587A (en)
CA (1) CA1212180A (en)
DE (1) DE3411973A1 (en)
FR (1) FR2543780B1 (en)
GB (1) GB2137425B (en)
IT (1) IT1196065B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641342A1 (en) * 1986-12-03 1988-06-09 Huels Troisdorf LAYER COMPRESSION MADE OF FIBER REINFORCED, CROSSLINKED POLYPROPYLENE
US4974121A (en) * 1987-05-29 1990-11-27 Fuji Xerox Co., Ltd. Wiring module
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate
DE4337960A1 (en) * 1993-11-06 1995-05-11 Philips Patentverwaltung Circuit board
DE4423893C2 (en) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flat gasket with flexible circuit board
DE19650154C2 (en) * 1996-12-04 1999-06-10 Lemfoerder Metallwaren Ag Switching device for a transmission of a motor vehicle with a printed circuit board equipped with sensors, light-emitting diodes, processes and other electronic components and method for producing a curved printed circuit board for use in such a switching device
DE29922560U1 (en) 1999-12-22 2000-03-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80636 München Device for the flat measurement of operating state variables in machine components
JPWO2006001305A1 (en) 2004-06-23 2008-04-17 日立化成工業株式会社 Prepreg for printed wiring board, metal foil-clad laminate, printed wiring board, and method for producing multilayer printed wiring board
EP2606407A2 (en) * 2010-08-19 2013-06-26 Apple Inc. Portable electronic device
US8477492B2 (en) 2010-08-19 2013-07-02 Apple Inc. Formed PCB
US8515113B2 (en) 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US8427379B2 (en) 2010-08-19 2013-04-23 Apple Inc. Modular material antenna assembly
US8634204B2 (en) 2010-08-19 2014-01-21 Apple Inc. Compact folded configuration for integrated circuit packaging
US9602914B2 (en) 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
US9287627B2 (en) 2011-08-31 2016-03-15 Apple Inc. Customizable antenna feed structure
US9406999B2 (en) 2011-09-23 2016-08-02 Apple Inc. Methods for manufacturing customized antenna structures
JP2023552542A (en) * 2020-12-14 2023-12-18 コーニンクレッカ フィリップス エヌ ヴェ Method and system for cold forming features in flex circuits

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665852A1 (en) * 1967-01-20 1971-01-28 Siemens Ag Process for the production of curved electrical circuit boards
GB1191909A (en) * 1967-10-16 1970-05-13 Westinghouse Electric Corp Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture
GB1200387A (en) * 1967-11-06 1970-07-29 Cincinnati Milling Machine Co Copper clad plastic panel
DE2003982A1 (en) * 1969-02-03 1970-08-06 Cincinnati Milling Machine Co Copper-clad plastic sheet and method for producing the same
JPS5227189B1 (en) * 1970-07-08 1977-07-19
SE415318B (en) * 1974-01-07 1980-09-22 Minnesota Mining & Mfg MRTALL COATED DIELECTRIC SHEET MATERIAL, METAL LAYER ON NON WOVEN COAT
GB1475031A (en) * 1975-01-18 1977-06-01 Marconi Co Ltd Curved rigid printed circuit boards
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board
US4103102A (en) * 1976-07-01 1978-07-25 Bell Telephone Laboratories, Incorporated Reinforced flexible printed wiring board
JPS5599789A (en) * 1979-01-26 1980-07-30 Matsushita Electric Works Ltd Material for printed circuit and method of fabricating same
JPS5649473A (en) * 1979-09-28 1981-05-06 Iwai Kikai Kogyo Kk Double sealed valve
GB2061989B (en) * 1979-10-26 1984-01-11 Castall Inc Insulating boards for printed circuits
GB2109166A (en) * 1981-11-06 1983-05-25 Tba Industrial Products Ltd Printed circuit boards

Also Published As

Publication number Publication date
GB2137425B (en) 1987-06-17
IT8420307A0 (en) 1984-03-29
FR2543780A1 (en) 1984-10-05
GB2137425A (en) 1984-10-03
JPS59184587A (en) 1984-10-19
CA1212180A (en) 1986-09-30
FR2543780B1 (en) 1990-02-23
IT1196065B (en) 1988-11-10
DE3411973A1 (en) 1984-10-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19970330