GB1200387A - Copper clad plastic panel - Google Patents
Copper clad plastic panelInfo
- Publication number
- GB1200387A GB1200387A GB5043867A GB5043867A GB1200387A GB 1200387 A GB1200387 A GB 1200387A GB 5043867 A GB5043867 A GB 5043867A GB 5043867 A GB5043867 A GB 5043867A GB 1200387 A GB1200387 A GB 1200387A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- mat
- border
- copper clad
- plastic panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
1,200,387. Copper-fibreglass laminates. CINCINNATI MILLING MACHINE CO. 6 Nov., 1967, No. 50438/67. Heading B5N. [Also in Divisions G1 and H1] Laminated panels comprise copper foil bonded by heat and pressure to a thermosetting resin base, reinforced with a mat formed by laying down a plurality of glass fibre strands so that each has a lateral swirl pattern. In making the panel the mat is impregnated with and encased in the resin either before or after placing on the foil and the resulting assembly is pressed in a platen press. A yarn border may be stapled around the mat border to confine the resin during pressing. The resin may be methacrylate resin with cross-linking agents (as in the example), or polyester, phenol-formaldehyde, melamine or epoxy resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5043867A GB1200387A (en) | 1967-11-06 | 1967-11-06 | Copper clad plastic panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5043867A GB1200387A (en) | 1967-11-06 | 1967-11-06 | Copper clad plastic panel |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1200387A true GB1200387A (en) | 1970-07-29 |
Family
ID=10455887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5043867A Expired GB1200387A (en) | 1967-11-06 | 1967-11-06 | Copper clad plastic panel |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1200387A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2137425A (en) * | 1983-03-31 | 1984-10-03 | Rogers Corp | Shape retaining flexible electric circuit board and method of manufacture thereof |
GB2179750A (en) * | 1984-11-13 | 1987-03-11 | Commw Of Australia | Method of and an apparatus for applying a load to a material |
JP2017224758A (en) * | 2016-06-16 | 2017-12-21 | 日本化薬株式会社 | Substrate for double-sided circuit suitable for high-frequency circuit |
-
1967
- 1967-11-06 GB GB5043867A patent/GB1200387A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2137425A (en) * | 1983-03-31 | 1984-10-03 | Rogers Corp | Shape retaining flexible electric circuit board and method of manufacture thereof |
GB2179750A (en) * | 1984-11-13 | 1987-03-11 | Commw Of Australia | Method of and an apparatus for applying a load to a material |
JP2017224758A (en) * | 2016-06-16 | 2017-12-21 | 日本化薬株式会社 | Substrate for double-sided circuit suitable for high-frequency circuit |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |