CA1212180A - Shape retaining flexible electric circuit and method of manufacture thereof - Google Patents
Shape retaining flexible electric circuit and method of manufacture thereofInfo
- Publication number
- CA1212180A CA1212180A CA000450650A CA450650A CA1212180A CA 1212180 A CA1212180 A CA 1212180A CA 000450650 A CA000450650 A CA 000450650A CA 450650 A CA450650 A CA 450650A CA 1212180 A CA1212180 A CA 1212180A
- Authority
- CA
- Canada
- Prior art keywords
- printed circuit
- electrically conductive
- inches
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000009738 saturating Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 13
- 238000005530 etching Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 239000011111 cardboard Substances 0.000 description 15
- 230000014759 maintenance of location Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
SHAPE RETAINING FLEXIBLE ELECTRIC CIRCUIT
AND METHOD OF MANUFACTURE THEREOF
Abstract of the Invention:
A printed circuit board composed of a polymer impregnated nonwoven web substrate laminated to electrically conductive sheets which can be manufactured in a process similar to that used for rigid or hardboard printed circuit boards is presented. The printed circuit boards are flexible in the sense that they can be bent to any desired multiplanar shape and will retain that shape after installation.
AND METHOD OF MANUFACTURE THEREOF
Abstract of the Invention:
A printed circuit board composed of a polymer impregnated nonwoven web substrate laminated to electrically conductive sheets which can be manufactured in a process similar to that used for rigid or hardboard printed circuit boards is presented. The printed circuit boards are flexible in the sense that they can be bent to any desired multiplanar shape and will retain that shape after installation.
Description
I
SHAPE RETAINING FLEXIBLE ELECTRIC CIRCUIT
.
AND METHOD OF MANUFACTURE THEREOF
Background of the Invention:
This invention relates to the field of flexible printed circuit boards. More particularly, this invention relates to flexible printed circuit boards having a fiber reinforced substrate which can be conventionally manufactured or processed like rigid printed circuit board or cardboard but thereafter is bendable to retain any desired multi planar shape.
The process for manufacturing rigid printed circuit board or cardboard is well known in the art.
The cardboard is produced in a panel form with the particular circuitry being etched, plated, screened or stamped thereon. Rigid printed circuit board of this type must necessarily only be used for single-plane cardboard applications since any bending would result in cracking and/or breaking.
In order to connect single-plane hard hoards to other cardboards within the electronic device, expensive multi board interconnections must be utilized. These interconnectors add both to parts costs and labor costs as well as increasing the complexity of a given installation.
:' I, I
Conventional flexible printed circuits (e.g.
plastic substrates with circuit patterns thereon) do not solve the above problems associated with cardboard use. Flexible printed circuits which are used effectively as wiring harnesses or in other applications are not suitable for fixed, multi planar application. This is due, to the fact that such flexible printed circuits do not assume and retain permanent shaped or molded configurations. Also because although a flexible printed circuit board may take on a multi planar shape, its lack of plasticity and the inherent "memory" property of its flexible plastic components may cause the flexible circuit - board to revert to its original configuration. This movement can interior with other internal parts of the electronic device. Further, when flexible printed circuits are connected to electronic systems, expensive connectors are needed which are especially adapted for flexible circuit board interconnections.
Jo Finally, unlike cardboard devices, when used as a fixed wiring part, flexible circuits require the use of extra stiffness in order to support the mounting of heavy components.
Summary of the Invention:
The above-discussed and other deficiencies of the prior art are overcome or significantly reduced by the present invention. In accordance with the present invention, flexible printed circuit boards with fiber reinforced substrates are made utilizing conventional cardboard processes. The printed circuit board is produced in sheet form and can be etched and/or stamped out to any desired shape using conventional cardboard processing techniques.
~2~2~
Thereafter, the unique properties of the present invention allow the printed circuit board to be formed into a predetermined three dimensional shape and thereafter mounted into electronic equipment.
The formed printed circuit board will neither bend nor crack and has sufficient stiffness to retain its shape after installation.
The manufacturing process of the present invention includes forming a non woven web substrate lo of polyester and glass fibers, impregnating and saturating the web with an epoxy solution and thereafter drying the web to drive off any solvent.
The dry, tacky web is then laminated on one or both sides with sheets of copper to form a sheet of printed circuit board material. As in cardboard material, the sheet can be etched, punched, drilled or blanked out to form any desired circuits and configurations and finally, the stamped configurations can be formed or bent for multi planar configurations Accordingly, one object of the present invention is to provide a novel and improved flexible printed circuit and material which will have sufficient rigidity so that it can be manufactured by conventional cardboard processes and which is flexible enough to be easily formed or bent into multi planar shapes which will be retained.
Another object of the present invention is to provide a novel and improved flexible printed circuit 3Q element having sufficient plasticity to allow retention of its formed shape.
Still another object of the present invention is to provide a flexible printed circuit board wherein the mounting of heavy components is possible without the use of extra stiffeners.
Other objects and advantages of the present invention will be apparent to and understood by those skilled in the art from the following detailed description and drawings.
Brief Description of the Drawings:
Referring now to the drawings, wherein like - elements are numbered alike in thy several FIGURES.
FIGURE 1 is a partial exploded perspective view of a flexible printed circuit board in accordance with the present invention;
FIGURE 2 is a side elevation view of the flexible printed circuit board of FIGURE l;
FIGURE 3 is a top plan view of the flexible printed circuit board of FIGURE l;
FIGURE 4 is a side view of the flexible printed circuit board of FIGURE 1 bent into a "S" shape;
FIGURE 5 is a perspective view of the flexible printed circuit board of FIGURE 4;
FIGURE 6 is a flow diagram representing the manufacturing steps employed in the practice of the present invention;
FIGURE 7 is a top plan view of the printed circuit board of FIGURE 1 etched to desired circuit shapes on a production sheet;
FIGURE 8 is a top plan view of the printed circuit boards of FIGURE 7 punched from the production sheet; and FIGURE 9 is a perspective view of the printed circuit boards of FIGURE 8 shaped to a multi planar configuration.
Description of the Preferred Embodiment:
Referring first to FIGURES 1 and 2, the flexible printed circuit board 10 of the present invention is shown. The printed circuit board 10 includes a fiber reinforced substrate 12 laminated between electrically conductive sheets 14. In the preferred embodiment, the substrate 12 is made of a non woven blend of polyester and glass fibers forming a Deb.
This non woven web is thereafter saturated with a polymer such as epoxy resin thus forming a polymer impregnated non woven web. The substrate thickness may generally be in the range of .010 inches to .062 inches but preferably is .015 inches to .030 inches.
The substrate is preferably laminated between sheets of copper ranging in thickness from .0006 to 0.003, preferably .0014 inch icons (one ounce copper).
Although one ounce copper (.0014 inch) may be preferred, 2 ounce copper (.0028 inch) and 1/2 ounce copper (.0007 inch) may be utilized for some applications. The construction could also be one sheet of copper 14 laminated to one side of substrate 12.
Although the materials in the above described laminates are not new in the art, in the sense that composites of non woven substrate laminated to one or two sheets of copper are known, the particular dimensioning detailed above is new and is critical to the present invention and constitutes the flexible printed circuit board of the present invention as a new product having new and novel features for certain desired and needed applications.
Laminates of non woven substrate ranging in thickness from 0.004 to .010 inch bonded to 1 or
SHAPE RETAINING FLEXIBLE ELECTRIC CIRCUIT
.
AND METHOD OF MANUFACTURE THEREOF
Background of the Invention:
This invention relates to the field of flexible printed circuit boards. More particularly, this invention relates to flexible printed circuit boards having a fiber reinforced substrate which can be conventionally manufactured or processed like rigid printed circuit board or cardboard but thereafter is bendable to retain any desired multi planar shape.
The process for manufacturing rigid printed circuit board or cardboard is well known in the art.
The cardboard is produced in a panel form with the particular circuitry being etched, plated, screened or stamped thereon. Rigid printed circuit board of this type must necessarily only be used for single-plane cardboard applications since any bending would result in cracking and/or breaking.
In order to connect single-plane hard hoards to other cardboards within the electronic device, expensive multi board interconnections must be utilized. These interconnectors add both to parts costs and labor costs as well as increasing the complexity of a given installation.
:' I, I
Conventional flexible printed circuits (e.g.
plastic substrates with circuit patterns thereon) do not solve the above problems associated with cardboard use. Flexible printed circuits which are used effectively as wiring harnesses or in other applications are not suitable for fixed, multi planar application. This is due, to the fact that such flexible printed circuits do not assume and retain permanent shaped or molded configurations. Also because although a flexible printed circuit board may take on a multi planar shape, its lack of plasticity and the inherent "memory" property of its flexible plastic components may cause the flexible circuit - board to revert to its original configuration. This movement can interior with other internal parts of the electronic device. Further, when flexible printed circuits are connected to electronic systems, expensive connectors are needed which are especially adapted for flexible circuit board interconnections.
Jo Finally, unlike cardboard devices, when used as a fixed wiring part, flexible circuits require the use of extra stiffness in order to support the mounting of heavy components.
Summary of the Invention:
The above-discussed and other deficiencies of the prior art are overcome or significantly reduced by the present invention. In accordance with the present invention, flexible printed circuit boards with fiber reinforced substrates are made utilizing conventional cardboard processes. The printed circuit board is produced in sheet form and can be etched and/or stamped out to any desired shape using conventional cardboard processing techniques.
~2~2~
Thereafter, the unique properties of the present invention allow the printed circuit board to be formed into a predetermined three dimensional shape and thereafter mounted into electronic equipment.
The formed printed circuit board will neither bend nor crack and has sufficient stiffness to retain its shape after installation.
The manufacturing process of the present invention includes forming a non woven web substrate lo of polyester and glass fibers, impregnating and saturating the web with an epoxy solution and thereafter drying the web to drive off any solvent.
The dry, tacky web is then laminated on one or both sides with sheets of copper to form a sheet of printed circuit board material. As in cardboard material, the sheet can be etched, punched, drilled or blanked out to form any desired circuits and configurations and finally, the stamped configurations can be formed or bent for multi planar configurations Accordingly, one object of the present invention is to provide a novel and improved flexible printed circuit and material which will have sufficient rigidity so that it can be manufactured by conventional cardboard processes and which is flexible enough to be easily formed or bent into multi planar shapes which will be retained.
Another object of the present invention is to provide a novel and improved flexible printed circuit 3Q element having sufficient plasticity to allow retention of its formed shape.
Still another object of the present invention is to provide a flexible printed circuit board wherein the mounting of heavy components is possible without the use of extra stiffeners.
Other objects and advantages of the present invention will be apparent to and understood by those skilled in the art from the following detailed description and drawings.
Brief Description of the Drawings:
Referring now to the drawings, wherein like - elements are numbered alike in thy several FIGURES.
FIGURE 1 is a partial exploded perspective view of a flexible printed circuit board in accordance with the present invention;
FIGURE 2 is a side elevation view of the flexible printed circuit board of FIGURE l;
FIGURE 3 is a top plan view of the flexible printed circuit board of FIGURE l;
FIGURE 4 is a side view of the flexible printed circuit board of FIGURE 1 bent into a "S" shape;
FIGURE 5 is a perspective view of the flexible printed circuit board of FIGURE 4;
FIGURE 6 is a flow diagram representing the manufacturing steps employed in the practice of the present invention;
FIGURE 7 is a top plan view of the printed circuit board of FIGURE 1 etched to desired circuit shapes on a production sheet;
FIGURE 8 is a top plan view of the printed circuit boards of FIGURE 7 punched from the production sheet; and FIGURE 9 is a perspective view of the printed circuit boards of FIGURE 8 shaped to a multi planar configuration.
Description of the Preferred Embodiment:
Referring first to FIGURES 1 and 2, the flexible printed circuit board 10 of the present invention is shown. The printed circuit board 10 includes a fiber reinforced substrate 12 laminated between electrically conductive sheets 14. In the preferred embodiment, the substrate 12 is made of a non woven blend of polyester and glass fibers forming a Deb.
This non woven web is thereafter saturated with a polymer such as epoxy resin thus forming a polymer impregnated non woven web. The substrate thickness may generally be in the range of .010 inches to .062 inches but preferably is .015 inches to .030 inches.
The substrate is preferably laminated between sheets of copper ranging in thickness from .0006 to 0.003, preferably .0014 inch icons (one ounce copper).
Although one ounce copper (.0014 inch) may be preferred, 2 ounce copper (.0028 inch) and 1/2 ounce copper (.0007 inch) may be utilized for some applications. The construction could also be one sheet of copper 14 laminated to one side of substrate 12.
Although the materials in the above described laminates are not new in the art, in the sense that composites of non woven substrate laminated to one or two sheets of copper are known, the particular dimensioning detailed above is new and is critical to the present invention and constitutes the flexible printed circuit board of the present invention as a new product having new and novel features for certain desired and needed applications.
Laminates of non woven substrate ranging in thickness from 0.004 to .010 inch bonded to 1 or
2 oz. copper have been used for conventional flexible printed circuit boards. However, in accordance with
3~2~
the present invention, the unique combination of the palmer impregnated web and copper together with the dimensioning and composition as described above, provides a printed circuit board which can be bent and formed into permanent multi planar shape without cracking or creasing of the substrate or of the copper. The multi planar bent circuit board will then retain its bent or formed shape when the forming forces are removed therefrom. The bends should be curved (forming distinct radii) since sharp creases may break the copper and/or craze the substrate.
When thicker 2 ounce ~.0028 inch) copper is used, the bends should have a larger radius to guard against damage to both the substrate and the copper. The radius should be about I inch for a laminate of 0.015 substrate and 1 oz. copper, and should increase for thicket laminates. The bending or forming can be done at room temperature although there may be some advantages in precise shape retention in forming at elevated temperatures.
Referring now to FIGURES 4 and 5; a flexible printed circuit board 10 of the present invention is shown after it has been bent into an "S" shape and is ready to be mounted into electronic equipment Thus what would have taken a multiplicity of parts with the use of conventional cardboard devices and corresponding interconnectors requires only one part with the utilization of the present invention. Note that although only a one piece conventional flexible circuit board could have been substituted for the "S"
shaped configuration shown in FIGURES 4 and 5, the enumerated problems discussed earlier would nonetheless be present.
~Z~2~
The process for manufacture along with an illustrated example of a practical, relatively complicated application of the flexible circuit boar of the present invention is shown in FIGURES 6 through 9. Referring to FIGURE 6, the flow diagram representing the manufacturing steps is shown. As already discussed, the substrate 12 of a non woven blend of polyester and glass fibers is formed in a conventional manner in step A. Thereafter this web is saturated with a polymer (usually an epoxy resin) in step B followed by a drying step C whereby any excess solvent from the saturation step is removed.
The substrate 12 is then laminated to conductive sheets usually copper) in step D forming flat sheets of circuit board 20. Referring now both to step E
and to FIGURE 7, the circuit board sheets 20 are then etched in the usual manner to form any desired shape and electrical circuit configuration 22. These shapes 22 are then punched, drilled or blanked out as shown in FIGURE 8 in step F to form a geometrically shaped flat planar printed circuit board elements 24.
Steps A through F in FIGURE 6 comprise the well known, inexpensive and conventional manufacturing process for producing rigid or cardboard printed circuit boards. The further processing of the present invention and the novel and improved element of the present invention is shown in FIGURE 9 and step G wherein the punched printed circuit boards of FIGURE 8 are bent or formed into multi planar or other shapes. These shaped circuit boards are then easily placed into the desired equipment without the use of expensive multi board interconnections or fear of non retention of the installation shape. The present invention is especially well suited for those applications involving automatic insertion of components.
~2~Z~B~
The forming or bending may be at room temperature or at elevated temperature, and it may be done manually or by machine. Once the circuit element is formed, it retains its shape, which is lo crucial importance in the present invention. It has been determined that the shape retention is the result of the interaction and relationship between the thickness of copper 14 and substrate 12, and the combined characteristics of these laminated materials.
Thus, the printed circuit board of the present invention is a formable or bendable circuit element which essentially combines some of the advantages of both rigid and flexible printed circuit board materials including:
(1) the ability to process in sheet form, which is useful to cardboard manufacturers who conventionally process in this manner;
(2) heavy components may be mounted on the relatively rigid structure without the use of extra stiffeners as are required with conventional flexible printed circuit boards;
(3) the present invention can be terminated and connected into the rest of an electronic system using conventional printed circuit board connectors, and does not require the expensive connectors associated with flexible boards;
the present invention, the unique combination of the palmer impregnated web and copper together with the dimensioning and composition as described above, provides a printed circuit board which can be bent and formed into permanent multi planar shape without cracking or creasing of the substrate or of the copper. The multi planar bent circuit board will then retain its bent or formed shape when the forming forces are removed therefrom. The bends should be curved (forming distinct radii) since sharp creases may break the copper and/or craze the substrate.
When thicker 2 ounce ~.0028 inch) copper is used, the bends should have a larger radius to guard against damage to both the substrate and the copper. The radius should be about I inch for a laminate of 0.015 substrate and 1 oz. copper, and should increase for thicket laminates. The bending or forming can be done at room temperature although there may be some advantages in precise shape retention in forming at elevated temperatures.
Referring now to FIGURES 4 and 5; a flexible printed circuit board 10 of the present invention is shown after it has been bent into an "S" shape and is ready to be mounted into electronic equipment Thus what would have taken a multiplicity of parts with the use of conventional cardboard devices and corresponding interconnectors requires only one part with the utilization of the present invention. Note that although only a one piece conventional flexible circuit board could have been substituted for the "S"
shaped configuration shown in FIGURES 4 and 5, the enumerated problems discussed earlier would nonetheless be present.
~Z~2~
The process for manufacture along with an illustrated example of a practical, relatively complicated application of the flexible circuit boar of the present invention is shown in FIGURES 6 through 9. Referring to FIGURE 6, the flow diagram representing the manufacturing steps is shown. As already discussed, the substrate 12 of a non woven blend of polyester and glass fibers is formed in a conventional manner in step A. Thereafter this web is saturated with a polymer (usually an epoxy resin) in step B followed by a drying step C whereby any excess solvent from the saturation step is removed.
The substrate 12 is then laminated to conductive sheets usually copper) in step D forming flat sheets of circuit board 20. Referring now both to step E
and to FIGURE 7, the circuit board sheets 20 are then etched in the usual manner to form any desired shape and electrical circuit configuration 22. These shapes 22 are then punched, drilled or blanked out as shown in FIGURE 8 in step F to form a geometrically shaped flat planar printed circuit board elements 24.
Steps A through F in FIGURE 6 comprise the well known, inexpensive and conventional manufacturing process for producing rigid or cardboard printed circuit boards. The further processing of the present invention and the novel and improved element of the present invention is shown in FIGURE 9 and step G wherein the punched printed circuit boards of FIGURE 8 are bent or formed into multi planar or other shapes. These shaped circuit boards are then easily placed into the desired equipment without the use of expensive multi board interconnections or fear of non retention of the installation shape. The present invention is especially well suited for those applications involving automatic insertion of components.
~2~Z~B~
The forming or bending may be at room temperature or at elevated temperature, and it may be done manually or by machine. Once the circuit element is formed, it retains its shape, which is lo crucial importance in the present invention. It has been determined that the shape retention is the result of the interaction and relationship between the thickness of copper 14 and substrate 12, and the combined characteristics of these laminated materials.
Thus, the printed circuit board of the present invention is a formable or bendable circuit element which essentially combines some of the advantages of both rigid and flexible printed circuit board materials including:
(1) the ability to process in sheet form, which is useful to cardboard manufacturers who conventionally process in this manner;
(2) heavy components may be mounted on the relatively rigid structure without the use of extra stiffeners as are required with conventional flexible printed circuit boards;
(3) the present invention can be terminated and connected into the rest of an electronic system using conventional printed circuit board connectors, and does not require the expensive connectors associated with flexible boards;
(4) like flexible printed circuit boards, the ability to conform to the shape of the space available and to bend circuitry around corners; and
(5) like cardboard, the ability to retain its shape after installation.
2~8~3 g While preferred embodiments have been shown and described, various modifications and substitutions may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is to be understood that the present invention has been described by way of illustrations and not limitation.
2~8~3 g While preferred embodiments have been shown and described, various modifications and substitutions may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is to be understood that the present invention has been described by way of illustrations and not limitation.
Claims (24)
1. A printed circuit material for forming semi-rigid multiplanar circuit boards comprising:
a substrate material made of a nonwoven web impregnated with a polymer;
at least one sheet of electrically conductive material laminated to at least one side of said sub-strate;
said electrically conductive sheet having a thickness of between .0006 inches and .003 inches; and said laminate of nonwoven substrate material and electrically conductive material being capable of being formed into shape retaining multiplanar shapes.
a substrate material made of a nonwoven web impregnated with a polymer;
at least one sheet of electrically conductive material laminated to at least one side of said sub-strate;
said electrically conductive sheet having a thickness of between .0006 inches and .003 inches; and said laminate of nonwoven substrate material and electrically conductive material being capable of being formed into shape retaining multiplanar shapes.
2. The printed circuit material of claim 1 wherein:
said substrate has a thickness of between 0.010 inches and 0.062 inches; and said nonwoven web is made of a combination of polyester fibers and glass fibers.
said substrate has a thickness of between 0.010 inches and 0.062 inches; and said nonwoven web is made of a combination of polyester fibers and glass fibers.
3. The printed circuit material of claim 1 wherein:
said polymer is an epoxy resin.
said polymer is an epoxy resin.
4. The printed circuit material of claim 2 wherein:
said substrate has a thickness of between 0.015 inches to 0.030 inches.
said substrate has a thickness of between 0.015 inches to 0.030 inches.
5. The printed circuit material of claim 1 wherein:
said sheet of electrically conductive material has a thickness of 0.0014 inches.
said sheet of electrically conductive material has a thickness of 0.0014 inches.
CLAIM 6. The printed circuit material of claim 1 wherein:
said sheet of electrically conductive material is copper.
said sheet of electrically conductive material is copper.
CLAIM 7. The printed circuit material of claim 1 including:
two sheets of electrically conductive material laminated to opposite sides of said substrate.
two sheets of electrically conductive material laminated to opposite sides of said substrate.
CLAIM 8. The printed circuit material of claim 7 wherein:
said nonwoven web is made of a combination of polyester fibers and glass fibers.
said nonwoven web is made of a combination of polyester fibers and glass fibers.
CLAIM 9. The printed circuit material of claim 7 wherein:
said polymer is an epoxy resin.
said polymer is an epoxy resin.
CLAIM 10. The printed circuit material of claim 7 wherein:
said substrate has a thickness of between 0.015 inches to 0.030 inches.
said substrate has a thickness of between 0.015 inches to 0.030 inches.
CLAIM 11. The printed circuit material of claim 7 wherein:
said sheet of electrically conductive material has a thickness of 0.0014 inches.
said sheet of electrically conductive material has a thickness of 0.0014 inches.
CLAIM 12. The printed circuit material of claim 7 wherein:
said sheet of electrically conductive material is copper.
said sheet of electrically conductive material is copper.
13. The process of forming a semi-rigid and multiplanar printed circuit board including the steps of:
forming a sheet of nonwoven web substrate material;
saturating and thereby impregnating said nonwoven web with a polymeric solution;
drying off any extra solvent left by said polymeric solution from said nonwoven web;
laminating one or both sides of said nonwoven web with electrically conductive sheets;
etching said electrically conductive lamin-ated sheets to form a plurality of geometric patterns;
punching said electrically conductive lamin-ated sheets into desired shapes; and bonding said punched and said etched lamin-ated sheets into shape retaining multiplanar con-figuration.
forming a sheet of nonwoven web substrate material;
saturating and thereby impregnating said nonwoven web with a polymeric solution;
drying off any extra solvent left by said polymeric solution from said nonwoven web;
laminating one or both sides of said nonwoven web with electrically conductive sheets;
etching said electrically conductive lamin-ated sheets to form a plurality of geometric patterns;
punching said electrically conductive lamin-ated sheets into desired shapes; and bonding said punched and said etched lamin-ated sheets into shape retaining multiplanar con-figuration.
14. The method of forming a printed circuit board as in claim 13 wherein:
said nonwoven web is made of a combination of polyester and glass fibers.
said nonwoven web is made of a combination of polyester and glass fibers.
15. The method of forming a printed circuit board as in claim 13 wherein:
said polymer is an epoxy resin.
said polymer is an epoxy resin.
16. The method of forming a printed circuit board as in claim 13 wherein:
said substrate has a thickness of between 0.015 inches to 0.030 inches.
said substrate has a thickness of between 0.015 inches to 0.030 inches.
17. The method of forming a printed circuit board as in claim 13 wherein:
said sheet of electrically conductive material has a thickness of 0.0014 inches.
said sheet of electrically conductive material has a thickness of 0.0014 inches.
18. The method of forming a printed circuit board as in claim 13 wherein:
said sheet of electrically conductive material is copper.
said sheet of electrically conductive material is copper.
19. A printed circuit board for forming semi-rigid multiplanar circuit boards comprising:
a substrate material made of a nonwoven web impregnated with a polymer;
at least one circuit pattern of electrically conductive material laminated to at least one side of said substrate; and said laminate of substrate material and electrically conductive material being formed into a shape retaining multiplanar configuration.
a substrate material made of a nonwoven web impregnated with a polymer;
at least one circuit pattern of electrically conductive material laminated to at least one side of said substrate; and said laminate of substrate material and electrically conductive material being formed into a shape retaining multiplanar configuration.
20. The printed circuit board of claim 19 wherein:
said nonwoven web is made of a combination of polyester and glass fibers.
said nonwoven web is made of a combination of polyester and glass fibers.
21. The printed circuit board of claim 19 wherein:
said polymer is an epoxy resin.
said polymer is an epoxy resin.
22. The printed circuit board of claim 19 wherein:
said substrate has a thickness of between 0.015 inches to 0.030 inches.
said substrate has a thickness of between 0.015 inches to 0.030 inches.
CLAIM 23. The printed circuit board of claim 19 wherein:
said sheet of electrically conductive material has a thickness of 0.0014 inches
said sheet of electrically conductive material has a thickness of 0.0014 inches
CLAIM 24. The printed circuit board of claim 19 wherein:
said sheet of electrically conductive material is copper.
said sheet of electrically conductive material is copper.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48091483A | 1983-03-31 | 1983-03-31 | |
| US480,914 | 1983-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1212180A true CA1212180A (en) | 1986-09-30 |
Family
ID=23909869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000450650A Expired CA1212180A (en) | 1983-03-31 | 1984-03-28 | Shape retaining flexible electric circuit and method of manufacture thereof |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS59184587A (en) |
| CA (1) | CA1212180A (en) |
| DE (1) | DE3411973A1 (en) |
| FR (1) | FR2543780B1 (en) |
| GB (1) | GB2137425B (en) |
| IT (1) | IT1196065B (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3641342A1 (en) * | 1986-12-03 | 1988-06-09 | Huels Troisdorf | LAYER COMPRESSION MADE OF FIBER REINFORCED, CROSSLINKED POLYPROPYLENE |
| US4974121A (en) * | 1987-05-29 | 1990-11-27 | Fuji Xerox Co., Ltd. | Wiring module |
| US4913955A (en) * | 1987-06-05 | 1990-04-03 | Shin-Kobe Electric Machinery Co., Ltd. | Epoxy resin laminate |
| DE4337960A1 (en) * | 1993-11-06 | 1995-05-11 | Philips Patentverwaltung | Circuit board |
| DE4423893C2 (en) * | 1994-07-07 | 1996-09-05 | Freudenberg Carl Fa | Flat gasket with flexible circuit board |
| DE19650154C2 (en) * | 1996-12-04 | 1999-06-10 | Lemfoerder Metallwaren Ag | Switching device for a transmission of a motor vehicle with a printed circuit board equipped with sensors, light-emitting diodes, processes and other electronic components and method for producing a curved printed circuit board for use in such a switching device |
| DE29922560U1 (en) | 1999-12-22 | 2000-03-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80636 München | Device for the flat measurement of operating state variables in machine components |
| KR100971865B1 (en) | 2004-06-23 | 2010-07-22 | 히다치 가세고교 가부시끼가이샤 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
| US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| US8427379B2 (en) | 2010-08-19 | 2013-04-23 | Apple Inc. | Modular material antenna assembly |
| US9602914B2 (en) | 2010-08-27 | 2017-03-21 | Apple Inc. | Porting audio using a connector in a small form factor electronic device |
| US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
| US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
| WO2012024578A2 (en) * | 2010-08-19 | 2012-02-23 | Apple Inc. | Portable electronic device |
| US9287627B2 (en) | 2011-08-31 | 2016-03-15 | Apple Inc. | Customizable antenna feed structure |
| US9406999B2 (en) | 2011-09-23 | 2016-08-02 | Apple Inc. | Methods for manufacturing customized antenna structures |
| EP4260665A1 (en) * | 2020-12-14 | 2023-10-18 | Koninklijke Philips N.V. | Method and systems for cold forming features on flex circuits |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1665852A1 (en) * | 1967-01-20 | 1971-01-28 | Siemens Ag | Process for the production of curved electrical circuit boards |
| GB1191909A (en) * | 1967-10-16 | 1970-05-13 | Westinghouse Electric Corp | Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture |
| GB1200387A (en) * | 1967-11-06 | 1970-07-29 | Cincinnati Milling Machine Co | Copper clad plastic panel |
| DE2003982A1 (en) * | 1969-02-03 | 1970-08-06 | Cincinnati Milling Machine Co | Copper-clad plastic sheet and method for producing the same |
| CA970676A (en) * | 1970-07-08 | 1975-07-08 | Gaylord L. Groff | Laminate comprising non-woven fibrous backing |
| SE415318B (en) * | 1974-01-07 | 1980-09-22 | Minnesota Mining & Mfg | MRTALL COATED DIELECTRIC SHEET MATERIAL, METAL LAYER ON NON WOVEN COAT |
| GB1475031A (en) * | 1975-01-18 | 1977-06-01 | Marconi Co Ltd | Curved rigid printed circuit boards |
| JPS52149361A (en) * | 1976-06-08 | 1977-12-12 | Casio Computer Co Ltd | Method of producing flexible printed circuit board |
| US4103102A (en) * | 1976-07-01 | 1978-07-25 | Bell Telephone Laboratories, Incorporated | Reinforced flexible printed wiring board |
| JPS5599789A (en) * | 1979-01-26 | 1980-07-30 | Matsushita Electric Works Ltd | Material for printed circuit and method of fabricating same |
| JPS5649473A (en) * | 1979-09-28 | 1981-05-06 | Iwai Kikai Kogyo Kk | Double sealed valve |
| GB2061989B (en) * | 1979-10-26 | 1984-01-11 | Castall Inc | Insulating boards for printed circuits |
| GB2109166A (en) * | 1981-11-06 | 1983-05-25 | Tba Industrial Products Ltd | Printed circuit boards |
-
1984
- 1984-03-22 FR FR848404441A patent/FR2543780B1/en not_active Expired - Fee Related
- 1984-03-28 CA CA000450650A patent/CA1212180A/en not_active Expired
- 1984-03-29 IT IT20307/84A patent/IT1196065B/en active
- 1984-03-30 DE DE19843411973 patent/DE3411973A1/en not_active Ceased
- 1984-03-30 GB GB08408263A patent/GB2137425B/en not_active Expired
- 1984-03-31 JP JP59065065A patent/JPS59184587A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2137425B (en) | 1987-06-17 |
| GB8408263D0 (en) | 1984-05-10 |
| FR2543780A1 (en) | 1984-10-05 |
| IT1196065B (en) | 1988-11-10 |
| FR2543780B1 (en) | 1990-02-23 |
| DE3411973A1 (en) | 1984-10-11 |
| IT8420307A0 (en) | 1984-03-29 |
| JPS59184587A (en) | 1984-10-19 |
| GB2137425A (en) | 1984-10-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |