JPS59184587A - フレキシブル回路基板及びその製造法 - Google Patents

フレキシブル回路基板及びその製造法

Info

Publication number
JPS59184587A
JPS59184587A JP59065065A JP6506584A JPS59184587A JP S59184587 A JPS59184587 A JP S59184587A JP 59065065 A JP59065065 A JP 59065065A JP 6506584 A JP6506584 A JP 6506584A JP S59184587 A JPS59184587 A JP S59184587A
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
board according
sheet
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59065065A
Other languages
English (en)
Japanese (ja)
Inventor
フランシス・エス・ガ−レイ
リチヤ−ド・テイ・トラスコス
ポ−ル・エル・アンダ−ソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of JPS59184587A publication Critical patent/JPS59184587A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP59065065A 1983-03-31 1984-03-31 フレキシブル回路基板及びその製造法 Pending JPS59184587A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48091483A 1983-03-31 1983-03-31
US480914 1995-06-07

Publications (1)

Publication Number Publication Date
JPS59184587A true JPS59184587A (ja) 1984-10-19

Family

ID=23909869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59065065A Pending JPS59184587A (ja) 1983-03-31 1984-03-31 フレキシブル回路基板及びその製造法

Country Status (6)

Country Link
JP (1) JPS59184587A (fr)
CA (1) CA1212180A (fr)
DE (1) DE3411973A1 (fr)
FR (1) FR2543780B1 (fr)
GB (1) GB2137425B (fr)
IT (1) IT1196065B (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641342A1 (de) * 1986-12-03 1988-06-09 Huels Troisdorf Schichtpressstoff aus faserverstaerktem, vernetztem polypropylen
US4974121A (en) * 1987-05-29 1990-11-27 Fuji Xerox Co., Ltd. Wiring module
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate
DE4337960A1 (de) * 1993-11-06 1995-05-11 Philips Patentverwaltung Leiterplatte
DE4423893C2 (de) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flachdichtung mit flexibler Leiterplatte
DE19650154C2 (de) * 1996-12-04 1999-06-10 Lemfoerder Metallwaren Ag Schaltvorrichtung für ein Getriebe eines KFZ mit einer mit Sensoren, Leuchtdioden, Prozessen und anderen elektronischen Bauelementen bestückten Leiterplatte und Verfahren zur Herstellung einer gekrümmten Leiterplatte zur Verwendung in einer solchen Schaltvorrichtung
DE29922560U1 (de) 1999-12-22 2000-03-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80636 München Vorrichtung zur flächigen Messung von Betriebszustandsgrößen bei Maschinenkomponenten
CN101883470B (zh) * 2004-06-23 2012-09-05 日立化成工业株式会社 印制电路板用预浸料片以及贴有金属箔的叠层板
US8634204B2 (en) 2010-08-19 2014-01-21 Apple Inc. Compact folded configuration for integrated circuit packaging
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US9602914B2 (en) 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
US8477492B2 (en) 2010-08-19 2013-07-02 Apple Inc. Formed PCB
US8515113B2 (en) 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
US8427379B2 (en) 2010-08-19 2013-04-23 Apple Inc. Modular material antenna assembly
KR101494555B1 (ko) * 2010-08-19 2015-02-17 애플 인크. 휴대용 전자 장치
US9287627B2 (en) 2011-08-31 2016-03-15 Apple Inc. Customizable antenna feed structure
US9406999B2 (en) 2011-09-23 2016-08-02 Apple Inc. Methods for manufacturing customized antenna structures
US20240057250A1 (en) * 2020-12-14 2024-02-15 Koninklijke Philips N.V. Method and systems for cold forming features on flex circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board
JPS5599789A (en) * 1979-01-26 1980-07-30 Matsushita Electric Works Ltd Material for printed circuit and method of fabricating same
JPS5649473A (en) * 1979-09-28 1981-05-06 Iwai Kikai Kogyo Kk Double sealed valve

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665852A1 (de) * 1967-01-20 1971-01-28 Siemens Ag Verfahren zur Herstellung gekruemmter elektrischer Leiterplatten
GB1191909A (en) * 1967-10-16 1970-05-13 Westinghouse Electric Corp Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture
GB1200387A (en) * 1967-11-06 1970-07-29 Cincinnati Milling Machine Co Copper clad plastic panel
DE2003982A1 (de) * 1969-02-03 1970-08-06 Cincinnati Milling Machine Co Kupferkaschierte Kunststoffplatte und Verfahren zur Herstellung derselben
GB1361242A (en) * 1970-07-08 1974-07-24 Minnesota Mining & Mfg Laminate comprising non-woven fibrous backing
SE415318B (sv) * 1974-01-07 1980-09-22 Minnesota Mining & Mfg Mrtallbelagt dielektriskt arkmaterial, metallskikt pa icke vevd bana
GB1475031A (en) * 1975-01-18 1977-06-01 Marconi Co Ltd Curved rigid printed circuit boards
US4103102A (en) * 1976-07-01 1978-07-25 Bell Telephone Laboratories, Incorporated Reinforced flexible printed wiring board
GB2061989B (en) * 1979-10-26 1984-01-11 Castall Inc Insulating boards for printed circuits
GB2109166A (en) * 1981-11-06 1983-05-25 Tba Industrial Products Ltd Printed circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board
JPS5599789A (en) * 1979-01-26 1980-07-30 Matsushita Electric Works Ltd Material for printed circuit and method of fabricating same
JPS5649473A (en) * 1979-09-28 1981-05-06 Iwai Kikai Kogyo Kk Double sealed valve

Also Published As

Publication number Publication date
FR2543780B1 (fr) 1990-02-23
FR2543780A1 (fr) 1984-10-05
IT8420307A0 (it) 1984-03-29
GB2137425A (en) 1984-10-03
DE3411973A1 (de) 1984-10-11
GB2137425B (en) 1987-06-17
IT1196065B (it) 1988-11-10
CA1212180A (fr) 1986-09-30
GB8408263D0 (en) 1984-05-10

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