JPH0240228B2 - - Google Patents
Info
- Publication number
- JPH0240228B2 JPH0240228B2 JP59162366A JP16236684A JPH0240228B2 JP H0240228 B2 JPH0240228 B2 JP H0240228B2 JP 59162366 A JP59162366 A JP 59162366A JP 16236684 A JP16236684 A JP 16236684A JP H0240228 B2 JPH0240228 B2 JP H0240228B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- nonwoven fabric
- parts
- weight
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 38
- 239000004745 nonwoven fabric Substances 0.000 claims description 21
- 239000004744 fabric Substances 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 239000011256 inorganic filler Substances 0.000 claims description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000004080 punching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16236684A JPS6140094A (ja) | 1984-07-31 | 1984-07-31 | 多層積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16236684A JPS6140094A (ja) | 1984-07-31 | 1984-07-31 | 多層積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6140094A JPS6140094A (ja) | 1986-02-26 |
| JPH0240228B2 true JPH0240228B2 (fr) | 1990-09-10 |
Family
ID=15753195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16236684A Granted JPS6140094A (ja) | 1984-07-31 | 1984-07-31 | 多層積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6140094A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2557325B2 (ja) * | 1988-01-29 | 1996-11-27 | 東芝ケミカル株式会社 | 多層銅張積層板 |
| JPH02177498A (ja) * | 1988-12-28 | 1990-07-10 | Shin Kobe Electric Mach Co Ltd | 多層印刷配線板 |
| JPH02197190A (ja) * | 1989-01-26 | 1990-08-03 | Shin Kobe Electric Mach Co Ltd | 多層印刷配線板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516479A (en) * | 1978-07-21 | 1980-02-05 | Sumitomo Electric Ind Ltd | Heterojunction light receiving diode |
| JPS5516478A (en) * | 1978-07-21 | 1980-02-05 | Atsushi Okazaki | Internal stop ball sealing structure |
| JPS563978U (fr) * | 1979-06-25 | 1981-01-14 | ||
| JPS5751998A (en) * | 1980-07-08 | 1982-03-27 | Mannesmann Ag | Apparatus for regulating axial compressor |
-
1984
- 1984-07-31 JP JP16236684A patent/JPS6140094A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516479A (en) * | 1978-07-21 | 1980-02-05 | Sumitomo Electric Ind Ltd | Heterojunction light receiving diode |
| JPS5516478A (en) * | 1978-07-21 | 1980-02-05 | Atsushi Okazaki | Internal stop ball sealing structure |
| JPS563978U (fr) * | 1979-06-25 | 1981-01-14 | ||
| JPS5751998A (en) * | 1980-07-08 | 1982-03-27 | Mannesmann Ag | Apparatus for regulating axial compressor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6140094A (ja) | 1986-02-26 |
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