JPH09234831A - 積層板 - Google Patents
積層板Info
- Publication number
- JPH09234831A JPH09234831A JP8043446A JP4344696A JPH09234831A JP H09234831 A JPH09234831 A JP H09234831A JP 8043446 A JP8043446 A JP 8043446A JP 4344696 A JP4344696 A JP 4344696A JP H09234831 A JPH09234831 A JP H09234831A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- intermediate layer
- thermosetting resin
- glass
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/02—Layered products comprising a layer of synthetic resin in the form of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/02—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising combinations of reinforcements, e.g. non-specified reinforcements, fibrous reinforcing inserts and fillers, e.g. particulate fillers, incorporated in matrix material, forming one or more layers and with or without non-reinforced or non-filled layers
- B29C70/021—Combinations of fibrous reinforcement and non-fibrous material
- B29C70/025—Combinations of fibrous reinforcement and non-fibrous material with particular filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/10—Fibres of continuous length
- B32B2305/20—Fibres of continuous length in the form of a non-woven mat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
なく、スルーホール間の絶縁性、打抜き加工性、寸法変
化、反りのレベルを向上させ、かつ低コストである印刷
回路用積層板を提供すること。 【解決手段】 中間層が熱硬化性樹脂に無機充填材を1
0〜300重量%混合した組成物を含浸した繊維基材か
らなり、その両面に該熱硬化性樹脂に無機充填材を10
〜300重量%混合した組成物樹脂層を介して、表面層
が熱硬化性樹脂含浸繊維基材からなる積層板。
Description
子機器、通信機器等に使用される印刷回路用として好適
な積層板に関するものである。
み、それに用いられる印刷回路基板として、ガラス不織
布を中間層基材とし、ガラス織布を表面層基材とし、こ
れらの基材にた構成で、エポキシ樹脂を含浸させ加熱加
圧成形した積層板(以下、コンポジット積層板という)
が使用されている。最近かかるコンポジット積層板に対
し、従来この分野で使用されている紙基材フェノール樹
脂積層板と同等の打抜き加工性、低コスト化が要求され
るようになってきた。また産業用電子機器分野において
も、低コスト化の必要性からガラス織布を使用しないか
又はその使用量を減らしたコンポジット積層板が使用さ
れるようになってきたが、性能上ガラス織布基材積層板
より種々の点で劣り、これと同等の寸法変化、反りが小
さいことが要求されるようになってきた。
な問題点を解決するため種々検討の結果なされたもの
で、その目的とするところは、電気的特性及び他の諸特
性を低下させることなく、スルーホール間の絶縁性、打
抜き加工性、寸法変化、反りのレベルを向上させ、かつ
低コストである印刷回路用に好適な積層板を提供するこ
とにある。
部が熱硬化性樹脂に無機充填材を10〜300重量%混
合した組成物を配合した繊維基材からなり、その両外面
が該熱硬化性樹脂に無機充填材を10〜300重量%配
合した組成物樹脂層からなり、表面層が熱硬化性樹脂含
浸繊維基材からなることを特徴とする積層板であり、好
ましくは中間層の繊維基材がガラス繊維不織布であり、
表面層の繊維基材がガラス繊維織布である積層板であ
る。
性樹脂に無機充填材を加えることにより、打抜き加工性
や寸法安定性を向上させるとともに、Z方向の熱膨張を
小さくするのでスルホール信頼性を向上させることも可
能である。また、従来では、繊維基材を中間層全体に構
成していたが、中間層の中央部にのみ繊維基材を配し、
繊維基材の使用量を減らすことにより、中間層に残存す
るボイドを減らすことが可能となる。
ガラス繊維織布、ガラス繊維不織布、合成繊維織布又は
不織布、クラフト紙、リンター紙など特に限定されない
が、耐熱性、含浸性及び打抜き加工性の点からはガラス
繊維不織布が好ましい。不織布としては25〜150g
/m2▲▼を1〜2枚使用することが好ましい。
ウム、炭酸カルシウム、クレー、タルク、シリカ等であ
り、熱硬化性樹脂に対する混合割合は10〜300重量
%が好ましい。更に好ましくは70〜250重量%であ
る。10重量%未満では、打抜き加工性、寸法安定性、
及びスルーホール信頼性の向上効果が小さく、300重
量%を越えると無機充填材の混合及び成形が困難とな
る。
シ樹脂、ポリイミド樹脂、ポリエステル樹脂、フェノー
ル樹脂などであるが、特にエポキシ樹脂が好ましい。エ
ポキシ樹脂としては、ビスフェノールA型エポキシ樹
脂、ノボラック型エポキシ樹脂が挙げられる。
繊維織布、ガラス繊維不織布、合成繊維織布又は不織
布、クラフト紙、リンター紙など特に限定されないが、
耐熱性及び強度の点からはガラス繊維織布が好ましい。
コンポジット積層板に使用されていたガラス不織布を使
用を減らし、熱硬化性樹脂に無機充填材を10〜300
重量%混合した樹脂組成物を含浸した繊維基材の層とな
る。そして該中間層の繊維基材に樹脂組成物を含浸する
際、該熱硬化性樹脂に無機充填材を10〜300重量%
混合した樹脂組成物を多量に塗布することにより中間層
の表面に樹脂組成物の層が形成される。そのため、従来
不織布の存在のために不織布の繊維間に残存していたボ
イドの発生が少なくなり、スルーホール間絶縁性、耐熱
性を向上することができる。更に、ガラス不織布は製造
工程上コスト高になるが、本発明の積層板はガラス不織
布を使用量を減らしているので、コストダウンを達成す
ることもできる。
「部」及び「%」はそれぞれ「重量部」及び「重量%」
を示す。
組成は次の通りである。 (1)臭素化エポキシ樹脂(油化シェル製 Ep−1046) 100部 (2)ジシアンジアミド 4 (3)2−エチル−4−メチルイミダゾール 0.15 (4)メチルセロソルブ 30 (5)アセトン 60 上記材料を混合して均一なワニスを調製した。このワニ
スをガラス織布(日東紡績製 WE−18K RB−8
4)に樹脂含有量が40重量%程度になるように含浸し
乾燥してガラス織布プリプレグ〔A〕を得た。
固形分100部に対して、次の配合の無機充填材を添加
し、攪拌混合し無機充填材含有ワニスを作製した。 (1)シリカ(龍森製 クリスタライト VX−3) 25部 (2)ギブサイト型水酸化アルミニウム (昭和電工製,ハイジライトH−42) 70 (3)超微粉末シリカ(シオノギ製薬製 カープレックス) 5 このワニスを上記ガラス織布プリプレグ〔A〕の片面に
乾燥後の膜厚が0.6mmになるようにナイフコーター
で塗工し、その上面に75g/m2 ガラス不織布(日本
バイリーン製 EP−4075)を重ね合わせ乾燥して
プリプレグ〔B〕を得た。次にこのプリプレグ〔B〕2
枚をガラスペーパー面を内側にして重ね合わせ、さらに
その両面に18μm厚の銅箔を重ね、成形温度165
℃、圧力60kg/cm2 で90分間積層成形して、厚
さ1.6mmの銅張積層板を得た。
機充填材含有ワニスをガラス不織布(日本バイリーン製
EP4075)に、樹脂及び無機充填材の合計の含有
量が中間層全体に対して90%になるように含浸乾燥し
て、ガラス不織布プリプレグ〔C〕を得た。次にこのガ
ラス不織布プリプレグ〔C〕を3枚重ね合わせ中間層と
し、上下表面層に実施例1で得たガラス織布プリプレグ
〔A〕各1枚を配置し、さらにその両面に18μm厚の
銅箔を重ね、実施例1と同様に加熱加圧成形して厚さ
1.6mmの銅張積層板を得た。
樹脂配合ワニスをガラス不織布(日本バイリーン製 E
P4075)に、樹脂の含有量が中間層全体に対して9
0%になるように含浸乾燥して、ガラス不織布プリプレ
グ〔D〕を得た。次にこのガラス不織布プリプレグ
〔D〕を3枚重ね合わせ中間層とし、上下表面層に実施
例1で得たガラス織布プリプレグ〔A〕を配置し、さら
にその両面に18μm厚の銅箔を重ね、実施例1と同様
に加熱加圧成形して厚さ1.6mmの銅張積層板を得
た。
銅張積層板について、スルーホール間絶縁性、打抜き加
工性、寸法変化率、曲げ強さ等を測定した。その結果を
表1に示す。
m、60℃・90%RHの条件で1000時間処理後の
絶縁抵抗を測定した。 2.打ち抜き加工性:ASTM法による、○:良好、
△:やや不良。 3.反り:一片が300mmの銅張積層板のテストピー
スを170℃、30分間加熱した後の反りの最大量を測
定した。 4.寸法変化率:穴間隔が250mmの銅張積層板のテ
ストピースを170℃、30分間加熱した後の穴間隔の
寸法変化率を測定した。 5.曲げ強さ:JIS C 6481による(常態) 6.Z方向熱膨張率:銅張積層板を全面エッチングし、
常温から200℃まで10℃/分で昇温し、Z方向の熱
膨張率を求めた。
得られた積層板は、製造工程からコストの高いガラス繊
維不織布を使用量を減らし、無機充填材を熱硬化性樹脂
と混合して中間層としているので、比較例1及び2で得
られたものに比べそれぞれ10〜20%程度低コスト化
することができる。
なく、スルーホール間絶縁性、打抜き加工性、反り、寸
法安定性に優れており、低コスト化も達成できる。
Claims (2)
- 【請求項1】 中間層の中央部が熱硬化性樹脂に無機充
填材を10〜300重量%配合した樹脂組成物を含浸し
た繊維基材からなり、その両外面が該熱硬化性樹脂に無
機充填材を10〜300重量%配合した樹脂組成物層か
らなり、表面層が熱硬化性樹脂含浸繊維基材からなるこ
とを特徴とする積層板。 - 【請求項2】 中間層の繊維基材がガラス繊維不織布で
あり、表面層の繊維基材がガラス繊維織布である請求項
1記載の積層板。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08043446A JP3119577B2 (ja) | 1996-02-29 | 1996-02-29 | 積層板 |
US08/714,264 US6124220A (en) | 1995-03-28 | 1996-09-17 | Laminated board and process for production thereof |
TW85111363A TW440528B (en) | 1995-03-28 | 1996-09-17 | Laminated board and process for production thereof |
KR1019960041737A KR100403649B1 (ko) | 1996-02-29 | 1996-09-23 | 적층판및그의제조방법 |
SG9700327A SG94696A1 (en) | 1996-02-29 | 1997-02-14 | Laminated board and process for production thereof |
DE69713532T DE69713532T2 (de) | 1996-02-29 | 1997-02-19 | Verfahren zum Herstellen einer Schichtstoffplatte |
EP97102705A EP0792737B1 (en) | 1996-02-29 | 1997-02-19 | Process for producing a laminated board |
CN97102697A CN1080642C (zh) | 1996-02-29 | 1997-02-27 | 生产叠层板的工艺 |
IDP970615A ID15992A (id) | 1996-02-29 | 1997-02-28 | Papan lamina dan proses pembuatannya |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08043446A JP3119577B2 (ja) | 1996-02-29 | 1996-02-29 | 積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09234831A true JPH09234831A (ja) | 1997-09-09 |
JP3119577B2 JP3119577B2 (ja) | 2000-12-25 |
Family
ID=12663938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP08043446A Expired - Lifetime JP3119577B2 (ja) | 1995-03-28 | 1996-02-29 | 積層板 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0792737B1 (ja) |
JP (1) | JP3119577B2 (ja) |
KR (1) | KR100403649B1 (ja) |
CN (1) | CN1080642C (ja) |
DE (1) | DE69713532T2 (ja) |
ID (1) | ID15992A (ja) |
SG (1) | SG94696A1 (ja) |
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CN1121318C (zh) * | 1998-04-07 | 2003-09-17 | 陈进郎 | 纤维浪板之制造方法 |
US6258203B1 (en) * | 1999-09-21 | 2001-07-10 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and acrylic fibers |
KR100492253B1 (ko) * | 2002-01-29 | 2005-05-31 | 서성오 | 천연석수지섬유복합판재 및 그 제조방법 |
KR100509161B1 (ko) * | 2002-07-11 | 2005-08-23 | 주식회사 성진케미칼 | 도전성 고무패드층 및 폴리이미드층을 구비한 유리섬유 패드 |
US20060035548A1 (en) | 2002-07-18 | 2006-02-16 | Mitsubishi Rayon Co., Ltd. | Prepreg, intermediate material for forming frp, and method for production thereof and method for production of fiber-reinforced composite material |
JP4177041B2 (ja) * | 2002-07-18 | 2008-11-05 | 三菱レイヨン株式会社 | 繊維強化複合材料の製造方法 |
DE102004004407A1 (de) * | 2004-01-29 | 2005-08-18 | Gunter Prediger | Vorrichtung und Verfahren zur Herstellung von Harzbeschichtungen |
DE102004039751A1 (de) * | 2004-07-30 | 2006-01-12 | Daimlerchrysler Ag | Verfahren zur Herstellung von Bauteilen aus einem Kunststoffmaterial |
EP1876199A4 (en) * | 2005-04-27 | 2009-09-02 | Hitachi Chemical Co Ltd | LAMINATED, PREIMPREGNATED PLATE, COMPOSITE COATED WITH METAL SHEET, CIRCUIT BOARD CONNECTION MATERIAL, MULTILAYER PRINTED CONNECTION CARD, AND METHODS OF MAKING THE SAME |
KR100777686B1 (ko) * | 2006-03-07 | 2007-11-28 | 이승부 | 무석면 슬레이트 및 그의 제조방법 |
JP5120267B2 (ja) * | 2007-02-08 | 2013-01-16 | 住友ベークライト株式会社 | 積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法 |
CN101277591B (zh) * | 2007-03-29 | 2010-09-22 | 欣兴电子股份有限公司 | 内嵌式电路板及其制造方法 |
KR100934622B1 (ko) | 2007-12-21 | 2009-12-31 | 류철주 | 콘크리트 보수 보강용 페놀수지와 유리섬유를 이용한불연패널과 이의 제조방법 및 이를 이용한 구조물 보수보강공법 |
CN102019656B (zh) * | 2009-09-11 | 2015-03-25 | 固瑞特模具(太仓)有限公司 | 复合模具叠层板和复合模具 |
CN101664733B (zh) * | 2009-09-15 | 2012-09-05 | 广东生益科技股份有限公司 | 用于厚铜多层印刷电路板的半固化片的制作方法及该半固化片 |
CN101961941A (zh) * | 2010-08-19 | 2011-02-02 | 广东生益科技股份有限公司 | 低流胶半固化片的制作方法及该低流胶半固化片 |
WO2013042749A1 (ja) * | 2011-09-22 | 2013-03-28 | 日立化成株式会社 | 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 |
CN102756533A (zh) * | 2012-08-10 | 2012-10-31 | 常州市天润木业有限公司 | 一种弯曲康贝特的制作方法 |
US11001011B2 (en) * | 2016-02-23 | 2021-05-11 | Toray Industries, Inc. | Method of producing fiber reinforced composite material |
CN105620007A (zh) * | 2016-04-06 | 2016-06-01 | 江苏奇一科技有限公司 | 高强超厚型连续纤维热塑性浸渍材料设备及制备方法 |
DE102016007156A1 (de) * | 2016-06-10 | 2017-05-11 | Diehl Aircabin Gmbh | Faserverbundmaterial, Prepregmaterial und Herstellungsverfahren |
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DE2203672A1 (de) * | 1972-01-25 | 1973-08-09 | Elektro Isolier Ind Wahn Wilhe | Oberflaechenkaschierte schichtstoffe mit deckschichten aus mit glasfasern besonderer art verstaerkten und gefuellten epoxyd-glasfaser-vliesen auf der basis modifizierter auftragsmassen |
FR2224293A1 (en) * | 1973-04-05 | 1974-10-31 | Drouet Diamond | Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats |
JPS63205230A (ja) * | 1987-02-23 | 1988-08-24 | 日立化成工業株式会社 | 積層板の製造方法 |
JPH01152138A (ja) * | 1987-12-09 | 1989-06-14 | Sumitomo Bakelite Co Ltd | 印刷回路用積層板の製造方法 |
JPH0767693B2 (ja) * | 1988-03-08 | 1995-07-26 | 大日本インキ化学工業株式会社 | シートモールディングコンパウンドとその製造方法およびその成形品 |
JPH04215492A (ja) * | 1990-12-13 | 1992-08-06 | Sumitomo Bakelite Co Ltd | 印刷回路用積層板の製造方法 |
EP0499219A3 (en) * | 1991-02-14 | 1993-01-13 | Takeda Chemical Industries, Ltd. | Molding materials and molded products therefrom |
JPH05154960A (ja) * | 1991-12-05 | 1993-06-22 | Sumitomo Bakelite Co Ltd | 印刷回路用積層板の製造方法 |
JPH05162246A (ja) * | 1991-12-12 | 1993-06-29 | Sumitomo Bakelite Co Ltd | 印刷回路用積層板 |
JP2659490B2 (ja) * | 1992-03-23 | 1997-09-30 | 住友ベークライト株式会社 | 印刷回路用積層板 |
JPH07176843A (ja) * | 1993-12-21 | 1995-07-14 | Sumitomo Bakelite Co Ltd | 印刷回路用積層板 |
-
1996
- 1996-02-29 JP JP08043446A patent/JP3119577B2/ja not_active Expired - Lifetime
- 1996-09-23 KR KR1019960041737A patent/KR100403649B1/ko not_active IP Right Cessation
-
1997
- 1997-02-14 SG SG9700327A patent/SG94696A1/en unknown
- 1997-02-19 DE DE69713532T patent/DE69713532T2/de not_active Expired - Fee Related
- 1997-02-19 EP EP97102705A patent/EP0792737B1/en not_active Expired - Lifetime
- 1997-02-27 CN CN97102697A patent/CN1080642C/zh not_active Expired - Fee Related
- 1997-02-28 ID IDP970615A patent/ID15992A/id unknown
Also Published As
Publication number | Publication date |
---|---|
EP0792737B1 (en) | 2002-06-26 |
EP0792737A2 (en) | 1997-09-03 |
CN1080642C (zh) | 2002-03-13 |
KR970061511A (ko) | 1997-09-12 |
JP3119577B2 (ja) | 2000-12-25 |
ID15992A (id) | 1997-08-21 |
DE69713532D1 (de) | 2002-08-01 |
KR100403649B1 (ko) | 2004-03-20 |
CN1162526A (zh) | 1997-10-22 |
SG94696A1 (en) | 2003-03-18 |
EP0792737A3 (en) | 1998-07-22 |
DE69713532T2 (de) | 2003-02-27 |
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