WO2005036571A1 - 電極ペースト、セラミック電子部品及びその製造方法 - Google Patents
電極ペースト、セラミック電子部品及びその製造方法 Download PDFInfo
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- WO2005036571A1 WO2005036571A1 PCT/JP2004/014755 JP2004014755W WO2005036571A1 WO 2005036571 A1 WO2005036571 A1 WO 2005036571A1 JP 2004014755 W JP2004014755 W JP 2004014755W WO 2005036571 A1 WO2005036571 A1 WO 2005036571A1
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- powder
- external electrode
- electrode paste
- electronic component
- ceramic
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- 239000002003 electrode paste Substances 0.000 title claims abstract description 59
- 239000000919 ceramic Substances 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 95
- 239000002245 particle Substances 0.000 claims abstract description 29
- 238000010304 firing Methods 0.000 claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 62
- 239000010949 copper Substances 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- -1 conoret Chemical compound 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 18
- 239000003985 ceramic capacitor Substances 0.000 abstract description 17
- 239000003990 capacitor Substances 0.000 abstract description 16
- 229910003322 NiCu Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 238000004880 explosion Methods 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 11
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- 239000002344 surface layer Substances 0.000 description 6
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- 229910000679 solder Inorganic materials 0.000 description 5
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
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- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
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- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Definitions
- the present invention relates to an electrode paste, a ceramic electronic component, and a method for manufacturing the same.
- ceramic electronic components such as multilayer ceramic capacitors have been manufactured by using a layer made of ceramic dielectric powder constituting a dielectric layer and a layer consisting of an internal electrode paste constituting an internal electrode layer.
- a method in which a laminated body in which a plurality of layers are alternately formed and an external electrode is provided after firing the laminated body is adopted.
- the dielectric layer is formed by mixing a ceramic dielectric powder, an organic binder, an organic solvent, and the like, forming a slurry into a dielectric paste, forming a sheet by a method such as a doctor blade method, and drying the paste as appropriate.
- a ceramic molded body manufactured by using the above method is used.
- the internal electrode paste used for forming the internal electrode layer is formed by dispersing a metal powder such as nickel in an organic binder, an organic solvent, or the like to form a paste.
- the internal electrode paste is screen-printed on the surface of the sheet-shaped ceramic molded body, and the organic solvent contained in the internal electrode paste is dried. It is manufactured by pressing.
- a ceramic element By forming the laminate into chips and firing the chips, a ceramic element is formed.
- An external electrode is provided on an end face of the ceramic element where the internal electrode layer is exposed.
- an external electrode paste obtained by dispersing a metal powder such as copper in a binder, a solvent, or the like to form a paste is used.
- the ceramic element to which the external electrode paste is applied is fired, and the metal powder in the external electrode paste is sintered to form a porous sintered body.
- An external electrode as a body is formed.
- Such an external electrode is disclosed in, for example, Patent Document 11 below and Patent Document 5 below.
- connection reliability or the wettability of the ceramic electronic component is poor.
- the surface of the external electrode is plated with copper, nickel, tin or the like.
- Patent Document 1 Japanese Patent Application Laid-Open No. 5-275272
- Patent Document 2 JP-A-8-306580
- Patent Document 3 JP 2002-198253
- Patent Document 4 JP-A-7-335477
- Patent Document 5 JP-A-10-144559
- the above-mentioned conventional ceramic electronic components have the following problems.
- the moisture in the plating may soak into the voids of the external electrodes, and this soaked moisture causes a problem of "explosion” when mounting the ceramic electronic component.
- This “bombing” is a phenomenon in which when the external electrode is heated during mounting, the moisture that soaks into the gap of the external electrode evaporates, and the vapor pressure causes the solder to fly off.
- the popped-out solder may adhere to ceramic electronic components, other mounted components, and printed wiring, resulting in short-circuit failure and the like.
- the present invention has been made to solve the above-described problems, and has as its object to provide an electrode paste, a ceramic electronic component, and a method of manufacturing the same, which can suppress the occurrence of explosion. .
- the method for manufacturing a ceramic electronic component according to the present invention includes a ceramic element in which dielectric layers and electrode layers are alternately stacked, and an external electrode formed on an end face where the electrode layer of the ceramic element is exposed.
- the external electrode paste includes Cu.
- the first powder contains a second powder composed of a metal that is less noble than Cu.
- the present inventors have applied a ceramic electrode with an external electrode paste containing a predetermined amount of a second powder having a predetermined range of particle size, which is made of a metal base lower than Cu, to obtain a ceramic electronic component. It has been newly found that when fabricated, the occurrence of explosion can be significantly suppressed while the external electrodes of the ceramic electronic component maintain sufficient strength.
- the metal constituting the second powder is at least one metal selected from the group consisting of nickel, cobalt and titanium.
- the ceramic electronic component according to the present invention is characterized in that a ceramic element in which dielectric layers and electrode layers are alternately laminated has a first powder composed of Cu and Cu on an end face where the electrode layer is exposed.
- a ceramic electronic component obtained by applying an external electrode paste containing a second powder composed of a base metal and firing the ceramic element to which the external electrode base has been applied, The weight ratio of the second powder to the powder is 0.5-10 wt%, and the average particle size of the second powder is 0.2-10 m.
- the external electrode paste used for producing the ceramic electronic component includes a second powder composed of a metal that is less noble than Cu, prepared by adding a first powder composed of Cu. Have been.
- the present inventors have made intensive studies and applied a ceramic electrode manufactured by applying an external electrode paste containing a predetermined amount of a second powder having a particle size in a predetermined range, which is made of a metal powder lower than Cu, to a ceramic element. It was newly discovered that the occurrence of explosion was significantly suppressed in the parts while the external electrodes maintained sufficient strength.
- the second powder be at least one metal of nickel, cobalt, and titanium, which is a metal force lower than Cu constituting the second powder.
- the electrode paste according to the present invention includes a binder, a first powder composed of Cu and having an average particle diameter of less than 20 ⁇ m, and a second powder composed of a metal lower than Cu,
- the weight ratio of the second powder to the first powder is 0.5-10 wt%, and the average particle size of the second powder is 0.2-10 m.
- This electrode paste contains, in addition to the first powder composed of Cu, a second powder composed of a metal that is more noble than Cu.
- a second powder composed of a metal that is more noble than Cu.
- the metal constituting the second powder is at least one metal selected from the group consisting of nickel, cobalt, and titanium.
- an electrode paste a ceramic electronic component, and a method for manufacturing the same, which can suppress the occurrence of explosion.
- FIG. 1 is a schematic sectional view of a ceramic capacitor according to an embodiment of the present invention.
- FIG. 2 is a partially enlarged view showing a print pattern of a green sheet.
- FIG. 3 is a view showing a procedure for manufacturing a ceramic capacitor.
- FIG. 4 (a) is a cross-sectional photograph of an external electrode obtained by firing an electrode paste to which nickel powder is not added
- FIG. 4 (b) is an electrode to which nickel powder is added
- 4 is a cross-sectional photograph of an external electrode obtained by firing a paste.
- FIG. 5 is a table showing experimental results according to an example of the present invention.
- FIG. 6 is a schematic plan view showing a substrate used for strength measurement according to an example.
- FIG. 7 is a diagram showing a method of measuring intensity in an example.
- FIG. 1 shows a schematic sectional view of a ceramic capacitor according to an embodiment of the present invention.
- a ceramic capacitor 10 which is a type of ceramic electronic component, has two outermost layers, a surface layer 11, and approximately 300 dielectric layers 12 sandwiched between the surface layers 11, which are arranged vertically.
- a hexahedral capacitor element body (ceramic element) 16 having an internal electrode layer 14 interposed between each of the formed dielectric layers 12 is provided. That is, the capacitor body 16 has a laminated structure of about 600 layers, and the dielectric layers 12 and the internal electrode layers 14 are alternately laminated.
- end faces of the capacitor body 16 a pair of end faces 16a, 16b extending in the thickness direction of the capacitor body 16 and facing each other are respectively provided so as to cover the entire area of the end faces 16a, 16b.
- the external electrodes 18 and 18 are provided.
- the internal electrode layers 14 arranged above and below are electrically insulated from each other by the dielectric layer 12 and are connected to one external electrode 18 different from each other. Therefore, when a predetermined voltage is applied between the pair of external electrodes 18, 18, electric charges are stored between the internal electrode layers 14 that are vertically opposed. Note that the capacitance of the ceramic capacitor 10 is proportional to the size of the facing area of the internal electrode layer 14 facing vertically.
- the surface layer 11 and the dielectric layer 12 are both layers mainly composed of BaTiO.
- each dielectric layer 12 is about 114 m.
- the surface layer 11 and the dielectric layer 12 are formed by firing a green sheet (ceramic molded body) described later.
- the internal electrode layer 14 is a metal layer containing Ni as a main component, and its thickness is about 1 ⁇ m.
- Each external electrode 18 is a porous body mainly composed of Cu, which has high conductivity among metals, and has an arithmetic average roughness of a surface 18a of about 1 ⁇ m.
- FIG. 2 is a partially enlarged view showing the printing pattern of the green sheet.
- FIG. 3 is a diagram showing a procedure for manufacturing a ceramic capacitor.
- This green sheet 20 is made of BaTiO powder and organic
- a dielectric paste slurried by mixing with a binder is formed into a sheet by a doctor blade method. Also, two green sheets 21 which are thicker than the green sheet 20 and are to be the surface layer 11 are prepared.
- a predetermined pattern of the internal electrode paste 22 is applied to the surface 20a of the green sheet 20 by a screen printing method and dried. That is, the internal electrode paste 22 is applied to a region of the green sheet surface 20a other than the three side edge regions of the rectangular region 24 corresponding to one capacitor (see FIG. 2).
- the internal electrode paste 22 is obtained by dispersing nickel powder in an organic binder and an organic solvent to form a paste.
- organic compounds can be used, and examples thereof include cellulosic resin, epoxy resin, aryl resin, acrylic resin, phenol-formaldehyde resin, unsaturated polyester resin, and polycarbonate resin.
- a binder such as polyamide resin, polyimide resin, alkyd resin, and rosin ester.
- organic solvent a known organic solvent can be used, and for example, a solvent such as butyl carbitol, butyl carbitol acetate, turpentine oil, ⁇ -tvneol, ethyl ethyl solvent, butyl phthalate and the like can be used.
- a solvent such as butyl carbitol, butyl carbitol acetate, turpentine oil, ⁇ -tvneol, ethyl ethyl solvent, butyl phthalate and the like can be used.
- BaTiO powder is added to the internal electrode paste 22 as a co-material.
- the aTiO powder has the same BaTiO as the main component of the dielectric layer 12 (and the green sheet 20).
- the difference between the shrinkage ratio and the sintering start temperature between the green sheet 22 and the green sheet 20 is significantly reduced.
- the green sheet 20 coated with the internal electrode paste 22 as described above is laminated on the green sheet 21 so that the internal electrode paste 22 faces upward (see FIG. 3A).
- about 300 green sheets 20 manufactured by the same manufacturing method are sequentially laminated so that the positions of the internal electrode pastes 22 are alternately changed (see FIG. 3B).
- a green sheet 21 coated with nothing is placed on the laminated Darine sheet 20, and the green sheet 21, the green sheet 20 and the internal electrode paste 22 adjacent to each other are pressed by pressing in the laminating direction. Are pressed together.
- a laminate 26 in which the green sheets 20 and the internal electrode pastes 22 are alternately laminated is produced.
- the laminate 26 is cut into rectangular regions 24 corresponding to one capacitor and chipped (see FIG. 3 (c)). Thereafter, by firing the laminated body 26 chipped at, for example, about 1200 ° C., the green sheet 21, the green sheet 20, and the internal electrode paste 22 become the above-described surface layer 11, dielectric layer 12, and internal electrode layer 14, respectively. On the other hand, the laminated body 26 becomes the capacitor body 16 in which the dielectric layers 12 and the internal electrode layers 14 are alternately laminated. Further, surface treatment is performed by treating the capacitor element body 16 in a barrel containing water and a polishing medium. The surface polishing may be performed at the stage of the laminate 26.
- external electrodes 18 are formed so as to cover a pair of end surfaces 16a and 16b of the end surfaces of capacitor element body 16 that extend in the laminating direction and face each other, thereby completing ceramic capacitor 10. (See Fig. 3 (d)).
- a method of forming the external electrode 18 will be specifically described.
- a conductive paste for external electrodes including copper powder (first powder), nickel powder (second powder), and an organic binder is prepared.
- the average particle size of the nickel powder is 0.2 m
- the weight ratio of the nickel powder to the copper powder is 2 wt%.
- the external electrode paste is applied to the end faces 16a and 16b of the capacitor body 16.
- the capacitor element 16 coated with the external electrode paste is subjected to a heat treatment at 800 ° C. in a neutral atmosphere or a reducing atmosphere to sinter the external electrode paste to form the external electrode 18.
- the surface 18a of the external electrode 18 is subjected to a plating treatment with copper, nickel, tin, or the like.
- connection reliability and wettability between the solder used when mounting the ceramic capacitor 10 on the substrate and the external electrode 18 are improved.
- the external electrode paste contains nickel powder in addition to copper powder.
- An external electrode obtained by firing such an external electrode paste will be described with reference to FIG. Figure 4 shows (a) firing the electrode paste to which nickel powder has not been added. It is a cross-sectional photograph of the external electrode obtained by the above method, and (b) is a cross-sectional photograph of the external electrode obtained by firing an electrode base to which nickel powder is added.
- FIG. 4 when nickel is not added to the external electrode paste (see FIG. 4 (a)), few voids are formed in the external electrode, and a slight amount of the void is formed by copper or the like. It can be seen that it is almost enclosed by the metal components.
- nickel is added to the external electrode paste (see Fig.
- the inventors of the present invention examined whether or not the external electrode 18 having high porosity would cause an explosion. As a result, it was found that such an external electrode significantly suppressed the explosion. It was also found that when a metal lower in copper (having a low ionizing tendency), such as cobalt or titanium, was added to the external electrode paste instead of nickel, the explosion was also suppressed. This is because, when a metal lower than copper is added to the external electrode paste, the metal suppresses excessive sintering of copper, and forms an external electrode 18 having a porosity effective to suppress explosion. This is considered to be because the moisture of the plating applied to the external electrode 18 during the mounting is likely to evaporate into the air.
- a metal lower in copper having a low ionizing tendency
- the weight ratio of nickel powder to Cu powder and the average particle size of nickel powder are important factors for exhibiting the above-described effect of suppressing explosion. I was able to help you. That is, the weight ratio of the nickel powder to the Cu powder needs to be 0.5-10 wt%, and the average particle diameter of the nickel powder needs to be 0.2-10 / zm. If the weight ratio of nickel powder to Cu powder is less than 0.5 wt%, or if the average particle size of nickel powder is greater than 10 / zm, sintering of copper by nickel is sufficiently suppressed. As a result, the porosity of the external electrode is reduced.
- the weight ratio of nickel powder to copper powder is greater than 10 wt%, or if the average particle size of the nickel powder is less than 0.2 m, excessive suppression of copper sintering by nickel is performed, and external The porosity of the electrode becomes too high, which adversely affects the strength of the external electrode.
- the external electrode paste used in Example 1 was composed of Cu powder as a main component, Ni powder having a weight ratio to Cu powder of 2 wt% and an average particle diameter of 0.2 m, an organic binder, a dispersant, and an organic solvent. It is obtained by mixing a solvent and the like, and dispersing it with a ball mill or a roll mill to form a paste. Then, using this external electrode paste, external electrodes of the ceramic capacitor were formed. The baking of the Cu terminal electrode was not performed at 800 ° C in a neutral atmosphere or a reducing atmosphere, and a ceramic capacitor was obtained as a sample. The porosity, porosity, explosion failure and external electrode strength of this sample were examined. Also, by changing the type of metal to be added, the weight ratio to Cu powder and the average particle size, a total of 14 samples were prepared, and for each sample, the degree of porosity, porosity, explosion failure and external electrode The strength was examined (see Figure 5).
- Example 2 is a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 2 m.
- the “Example 3” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 10 / zm.
- the “Example 4” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 2 m, and the weight ratio to the Cu powder was changed to 0.5 wt%.
- Example 5 was a sample in which the average particle diameter of the Ni powder used in the “Example 1” sample was changed to 2 m, and the weight ratio to the Cu powder was changed to lwt%.
- the “Example 6” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 2 m, and the weight ratio to the Cu powder was changed to 4 wt%.
- the “Example 7” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 2 m, and the weight ratio to the Cu powder was changed to 10 wt%.
- Example 8 was a sample in which, instead of the Ni powder used in the "Example 1" sample, a Co powder having an average particle diameter of 2 m and a weight ratio to the Cu powder of 2 wt% was used. is there.
- Example 9 The sample was a sample in which the Ni powder used in the "Example 1" sample was replaced by a Ti powder having an average particle diameter of 2 wt% with respect to the Cu powder.
- Example 1 For comparison, a sample without addition of Ni powder was prepared as a sample of "Comparative Example 1".
- the “Comparative Example 2” sample had an average particle size of 0.05 / zm ⁇ of the Ni powder used in the “Example 1” sample.
- the weight ratio to Cu powder was changed to 2 wt%.
- the “Comparative Example 3” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 20 m, and the weight ratio to the Cu powder was changed to 2 wt%.
- the average particle size of the Ni powder used in the ⁇ Example 1 '' sample was changed to 2 m, and the weight ratio to the Cu powder was set to 0.
- the “Comparative Example 5” sample was a sample in which the average particle size of the Ni powder used in the “Example 1” sample was changed to 2 m and the weight ratio to the Cu powder was changed to 20 wt%.
- the “gap degree” is an item indicating the degree of a space where nothing is filled in the terminal electrode, and was measured by cross-sectional observation with an SEM.
- the “porosity” is defined by the following equation (1) using the density (actual density) derived based on the volume and weight of the sintered sample of the terminal electrode and the theoretical density of the components of the terminal electrode. , And is a value obtained by digitizing the above-mentioned degree of void.
- OC is the porosity
- d is the actual density
- d is the theoretical density
- FIG. 6 is a schematic plan view showing a substrate used for intensity measurement used in the present example. That is, on a simulated mounting board (100 mm X 40 mm) 30 made of glass cloth base epoxy resin, a pair of band-shaped copper foils (width 1. Omm) 32 A, 32 B A solder resist film 34 is formed on the copper foils 32A and 32B. Note that ⁇ 32 ⁇ , 32B (i3 ⁇ 43 ⁇ 436a, 36b, 38a, 38bi) is output! / ⁇ . Then, the external electrodes are positioned so that the external electrodes are located on the opposite ends 36a, 38a of both copper foils 32A, 32B. A sample (not shown) is placed on the mounting substrate 30.
- a sample (not shown) is placed on the mounting substrate 30.
- cream solder was applied to an external electrode of a sample to be subjected to strength measurement by using a metal mask (thickness: 0.25 mm). Then, the sample was mounted on the substrate 30 by a reflow soldering method (peak temperature: 240 ° C.). Then, using a pressing head 40 having a shape as shown in FIG. 7, a load was applied to a substantially central portion of the sample 42 at a displacement speed of 30 mmZmin. And 5 A sample that was not broken until a load of N was applied was determined to be good, and a sample that was broken was determined to be defective.
- the destruction of the sample refers to, for example, a case where a part or the whole of the external electrode 44 is peeled off from the sample body.
- the ceramic electronic component is not limited to a ceramic capacitor, but may be various electronic components such as a piezoelectric chip component and a chip varistor component!
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- Microelectronics & Electronic Packaging (AREA)
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- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Priority Applications (1)
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JP2005514583A JPWO2005036571A1 (ja) | 2003-10-08 | 2004-10-06 | 電極ペースト、セラミック電子部品及びその製造方法 |
Applications Claiming Priority (2)
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JP2003349766 | 2003-10-08 | ||
JP2003-349766 | 2003-10-08 |
Publications (1)
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WO2005036571A1 true WO2005036571A1 (ja) | 2005-04-21 |
Family
ID=34431017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/014755 WO2005036571A1 (ja) | 2003-10-08 | 2004-10-06 | 電極ペースト、セラミック電子部品及びその製造方法 |
Country Status (5)
Country | Link |
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JP (1) | JPWO2005036571A1 (ja) |
KR (1) | KR100866478B1 (ja) |
CN (1) | CN1849678A (ja) |
TW (1) | TWI245298B (ja) |
WO (1) | WO2005036571A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216622A (ja) * | 2005-02-01 | 2006-08-17 | Murata Mfg Co Ltd | 積層コンデンサ |
US20130134836A1 (en) * | 2011-11-25 | 2013-05-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
US20140139971A1 (en) * | 2011-07-08 | 2014-05-22 | Kemet Electronics Corporation | Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials |
JPWO2013132966A1 (ja) * | 2012-03-05 | 2015-07-30 | 株式会社村田製作所 | 電子部品および電子部品と接合対象物との接合構造体の形成方法 |
JPWO2013132965A1 (ja) * | 2012-03-05 | 2015-07-30 | 株式会社村田製作所 | 電子部品 |
US11302480B2 (en) * | 2019-07-22 | 2022-04-12 | Tdk Corporation | Ceramic electronic device with varying roughness terminal electrode |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4577325B2 (ja) * | 2007-03-29 | 2010-11-10 | Tdk株式会社 | 貫通型積層コンデンサ |
CN102105954B (zh) * | 2009-01-28 | 2014-04-09 | 株式会社村田制作所 | 层叠型电子零件 |
KR20110067509A (ko) * | 2009-12-14 | 2011-06-22 | 삼성전기주식회사 | 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법 |
KR101079546B1 (ko) | 2009-12-30 | 2011-11-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20150041490A (ko) * | 2013-10-08 | 2015-04-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR20150080739A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 외부전극용 도전성 페이스트, 칩형 전자부품 및 그 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240116A (ja) * | 1984-05-14 | 1985-11-29 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPH0836914A (ja) * | 1994-07-26 | 1996-02-06 | Taiyo Yuden Co Ltd | セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05275272A (ja) * | 1991-03-19 | 1993-10-22 | Nippon Steel Corp | 電子セラミック部品の端子電極形成方法 |
JPH07335477A (ja) * | 1994-06-15 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JPH08306580A (ja) * | 1995-05-11 | 1996-11-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法及びセラミック電子部品 |
JPH10144559A (ja) | 1996-11-05 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 端子電極ペースト、積層電子部品、およびその製造方法 |
JP2002198253A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | セラミック電子部品及び導電性ペースト |
-
2004
- 2004-10-06 WO PCT/JP2004/014755 patent/WO2005036571A1/ja active Application Filing
- 2004-10-06 JP JP2005514583A patent/JPWO2005036571A1/ja active Pending
- 2004-10-06 KR KR1020067006889A patent/KR100866478B1/ko not_active IP Right Cessation
- 2004-10-06 CN CNA2004800257231A patent/CN1849678A/zh active Pending
- 2004-10-08 TW TW093130621A patent/TWI245298B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240116A (ja) * | 1984-05-14 | 1985-11-29 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPH0836914A (ja) * | 1994-07-26 | 1996-02-06 | Taiyo Yuden Co Ltd | セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006216622A (ja) * | 2005-02-01 | 2006-08-17 | Murata Mfg Co Ltd | 積層コンデンサ |
JP4650007B2 (ja) * | 2005-02-01 | 2011-03-16 | 株式会社村田製作所 | 積層コンデンサ |
US20140139971A1 (en) * | 2011-07-08 | 2014-05-22 | Kemet Electronics Corporation | Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials |
US20130134836A1 (en) * | 2011-11-25 | 2013-05-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
JPWO2013132966A1 (ja) * | 2012-03-05 | 2015-07-30 | 株式会社村田製作所 | 電子部品および電子部品と接合対象物との接合構造体の形成方法 |
JPWO2013132965A1 (ja) * | 2012-03-05 | 2015-07-30 | 株式会社村田製作所 | 電子部品 |
US9412517B2 (en) | 2012-03-05 | 2016-08-09 | Murata Manufacturing Co., Ltd. | Electronic part |
US9691546B2 (en) | 2012-03-05 | 2017-06-27 | Murata Manufacturing Co., Ltd. | Electronic part and method for forming joint structure of electronic part and joining object |
US11302480B2 (en) * | 2019-07-22 | 2022-04-12 | Tdk Corporation | Ceramic electronic device with varying roughness terminal electrode |
Also Published As
Publication number | Publication date |
---|---|
KR20060085683A (ko) | 2006-07-27 |
CN1849678A (zh) | 2006-10-18 |
TW200525564A (en) | 2005-08-01 |
TWI245298B (en) | 2005-12-11 |
JPWO2005036571A1 (ja) | 2007-11-22 |
KR100866478B1 (ko) | 2008-11-03 |
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