TWI245298B - Electrode paste, ceramic electronic component and method for producing same - Google Patents
Electrode paste, ceramic electronic component and method for producing same Download PDFInfo
- Publication number
- TWI245298B TWI245298B TW093130621A TW93130621A TWI245298B TW I245298 B TWI245298 B TW I245298B TW 093130621 A TW093130621 A TW 093130621A TW 93130621 A TW93130621 A TW 93130621A TW I245298 B TWI245298 B TW I245298B
- Authority
- TW
- Taiwan
- Prior art keywords
- powder
- electrode paste
- ceramic
- metal
- external electrode
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 58
- 239000002003 electrode paste Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 93
- 239000002245 particle Substances 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003491 array Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 14
- 239000003985 ceramic capacitor Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 10
- 230000009172 bursting Effects 0.000 abstract description 4
- 238000010304 firing Methods 0.000 abstract description 3
- 229910003322 NiCu Inorganic materials 0.000 abstract 1
- 239000000523 sample Substances 0.000 description 50
- 239000010410 layer Substances 0.000 description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- BNHZZINHLCTQKT-UHFFFAOYSA-N butyl acetate;2-(2-hydroxyethoxy)ethanol Chemical compound OCCOCCO.CCCCOC(C)=O BNHZZINHLCTQKT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- FAUWSVSZYKETJJ-UHFFFAOYSA-N palladium titanium Chemical compound [Ti].[Pd] FAUWSVSZYKETJJ-UHFFFAOYSA-N 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003349766 | 2003-10-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200525564A TW200525564A (en) | 2005-08-01 |
| TWI245298B true TWI245298B (en) | 2005-12-11 |
Family
ID=34431017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093130621A TWI245298B (en) | 2003-10-08 | 2004-10-08 | Electrode paste, ceramic electronic component and method for producing same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2005036571A1 (ja) |
| KR (1) | KR100866478B1 (ja) |
| CN (1) | CN1849678A (ja) |
| TW (1) | TWI245298B (ja) |
| WO (1) | WO2005036571A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4650007B2 (ja) * | 2005-02-01 | 2011-03-16 | 株式会社村田製作所 | 積層コンデンサ |
| JP4577325B2 (ja) * | 2007-03-29 | 2010-11-10 | Ｔｄｋ株式会社 | 貫通型積層コンデンサ |
| CN102105954B (zh) * | 2009-01-28 | 2014-04-09 | 株式会社村田制作所 | 层叠型电子零件 |
| KR20110067509A (ko) * | 2009-12-14 | 2011-06-22 | 삼성전기주식회사 | 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법 |
| KR101079546B1 (ko) | 2009-12-30 | 2011-11-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| US9779874B2 (en) * | 2011-07-08 | 2017-10-03 | Kemet Electronics Corporation | Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials |
| KR101288151B1 (ko) * | 2011-11-25 | 2013-07-19 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
| CN104145317B (zh) * | 2012-03-05 | 2016-12-21 | 株式会社村田制作所 | 电子部件 |
| CN104160463B (zh) | 2012-03-05 | 2017-09-29 | 株式会社村田制作所 | 电子部件及电子部件与接合对象物的接合结构体的形成方法 |
| KR20150041490A (ko) * | 2013-10-08 | 2015-04-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
| KR20150080739A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 외부전극용 도전성 페이스트, 칩형 전자부품 및 그 제조방법 |
| JP7379899B2 (ja) * | 2019-07-22 | 2023-11-15 | Tdk株式会社 | セラミック電子部品 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240116A (ja) * | 1984-05-14 | 1985-11-29 | 京セラ株式会社 | 積層型磁器コンデンサ |
| JPH05275272A (ja) * | 1991-03-19 | 1993-10-22 | Nippon Steel Corp | 電子セラミック部品の端子電極形成方法 |
| JPH07335477A (ja) * | 1994-06-15 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
| JP3082154B2 (ja) * | 1994-07-26 | 2000-08-28 | 太陽誘電株式会社 | セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品 |
| JPH08306580A (ja) * | 1995-05-11 | 1996-11-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法及びセラミック電子部品 |
| JPH10144559A (ja) | 1996-11-05 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 端子電極ペースト、積層電子部品、およびその製造方法 |
| JP2002198253A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | セラミック電子部品及び導電性ペースト |
-
2004
- 2004-10-06 CN CNA2004800257231A patent/CN1849678A/zh active Pending
- 2004-10-06 KR KR1020067006889A patent/KR100866478B1/ko not_active IP Right Cessation
- 2004-10-06 JP JP2005514583A patent/JPWO2005036571A1/ja active Pending
- 2004-10-06 WO PCT/JP2004/014755 patent/WO2005036571A1/ja active Application Filing
- 2004-10-08 TW TW093130621A patent/TWI245298B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1849678A (zh) | 2006-10-18 |
| KR20060085683A (ko) | 2006-07-27 |
| WO2005036571A1 (ja) | 2005-04-21 |
| TW200525564A (en) | 2005-08-01 |
| JPWO2005036571A1 (ja) | 2007-11-22 |
| KR100866478B1 (ko) | 2008-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7206187B2 (en) | Ceramic electronic component and its manufacturing method | |
| CN104658756B (zh) | 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板 | |
| US8806728B2 (en) | Method of producing a laminated ceramic electronic component | |
| CN103971930B (zh) | 多层陶瓷电容器及其制造方法 | |
| CN102394174B (zh) | 陶瓷电子部件 | |
| CN103578762B (zh) | 层压式陶瓷电子元件及其制造方法 | |
| JP5855593B2 (ja) | 基板内蔵用積層セラミック電子部品及びその製造方法、基板内蔵用積層セラミック電子部品を備える印刷回路基板 | |
| US8743528B2 (en) | Capacitor | |
| TWI245298B (en) | Electrode paste, ceramic electronic component and method for producing same | |
| CN104282438A (zh) | 陶瓷电子部件及其制造方法 | |
| JP2010003891A (ja) | 積層セラミック電子部品およびその製造方法 | |
| JP2011139021A (ja) | 積層セラミックキャパシタ | |
| JP2007036003A (ja) | 積層コンデンサ | |
| JP2015023271A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
| JP2020057753A (ja) | 積層セラミック電子部品 | |
| JP5521695B2 (ja) | 電子部品 | |
| TW516353B (en) | Electro-conductive paste and method for manufacturing a multilayer ceramic electronic part using the same | |
| JP2014049435A (ja) | 外部電極用導電性ペースト組成物、これを含む積層セラミック電子部品及びその製造方法 | |
| JP2015037183A (ja) | 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板 | |
| JP2012099786A (ja) | 積層型セラミックキャパシタ及びその製造方法 | |
| US20110141658A1 (en) | Multilayer ceramic capacitor | |
| JP2023099415A (ja) | 積層型電子部品 | |
| JP4548471B2 (ja) | コンデンサアレイおよびその製造方法 | |
| JP2012009556A (ja) | セラミック電子部品及びその製造方法 | |
| JP4380145B2 (ja) | 導電ペースト及びセラミック電子部品の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |