KR100866478B1 - 세라믹 전자부품 및 그 제조방법 - Google Patents
세라믹 전자부품 및 그 제조방법 Download PDFInfo
- Publication number
- KR100866478B1 KR100866478B1 KR1020067006889A KR20067006889A KR100866478B1 KR 100866478 B1 KR100866478 B1 KR 100866478B1 KR 1020067006889 A KR1020067006889 A KR 1020067006889A KR 20067006889 A KR20067006889 A KR 20067006889A KR 100866478 B1 KR100866478 B1 KR 100866478B1
- Authority
- KR
- South Korea
- Prior art keywords
- powder
- external electrode
- electrode paste
- ceramic
- sample
- Prior art date
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- 239000002003 electrode paste Substances 0.000 title claims abstract description 63
- 239000000919 ceramic Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000843 powder Substances 0.000 claims abstract description 87
- 239000002245 particle Substances 0.000 claims abstract description 28
- 238000010304 firing Methods 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 abstract description 19
- 239000003990 capacitor Substances 0.000 abstract description 16
- 230000009172 bursting Effects 0.000 abstract description 11
- 229910003322 NiCu Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- -1 For example Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00349766 | 2003-10-08 | ||
JP2003349766 | 2003-10-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060085683A KR20060085683A (ko) | 2006-07-27 |
KR100866478B1 true KR100866478B1 (ko) | 2008-11-03 |
Family
ID=34431017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067006889A KR100866478B1 (ko) | 2003-10-08 | 2004-10-06 | 세라믹 전자부품 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2005036571A1 (ja) |
KR (1) | KR100866478B1 (ja) |
CN (1) | CN1849678A (ja) |
TW (1) | TWI245298B (ja) |
WO (1) | WO2005036571A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4650007B2 (ja) * | 2005-02-01 | 2011-03-16 | 株式会社村田製作所 | 積層コンデンサ |
JP4577325B2 (ja) * | 2007-03-29 | 2010-11-10 | Tdk株式会社 | 貫通型積層コンデンサ |
CN102105954B (zh) * | 2009-01-28 | 2014-04-09 | 株式会社村田制作所 | 层叠型电子零件 |
KR20110067509A (ko) * | 2009-12-14 | 2011-06-22 | 삼성전기주식회사 | 외부전극용 도전성 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법 |
KR101079546B1 (ko) | 2009-12-30 | 2011-11-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
US9779874B2 (en) * | 2011-07-08 | 2017-10-03 | Kemet Electronics Corporation | Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials |
KR101288151B1 (ko) * | 2011-11-25 | 2013-07-19 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
CN104145317B (zh) * | 2012-03-05 | 2016-12-21 | 株式会社村田制作所 | 电子部件 |
CN104160463B (zh) | 2012-03-05 | 2017-09-29 | 株式会社村田制作所 | 电子部件及电子部件与接合对象物的接合结构体的形成方法 |
KR20150041490A (ko) * | 2013-10-08 | 2015-04-16 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR20150080739A (ko) * | 2014-01-02 | 2015-07-10 | 삼성전기주식회사 | 외부전극용 도전성 페이스트, 칩형 전자부품 및 그 제조방법 |
JP7379899B2 (ja) * | 2019-07-22 | 2023-11-15 | Tdk株式会社 | セラミック電子部品 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240116A (ja) * | 1984-05-14 | 1985-11-29 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPH05275272A (ja) * | 1991-03-19 | 1993-10-22 | Nippon Steel Corp | 電子セラミック部品の端子電極形成方法 |
JPH07335477A (ja) * | 1994-06-15 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JPH0836914A (ja) * | 1994-07-26 | 1996-02-06 | Taiyo Yuden Co Ltd | セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品 |
JPH08306580A (ja) * | 1995-05-11 | 1996-11-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法及びセラミック電子部品 |
JPH10144559A (ja) | 1996-11-05 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 端子電極ペースト、積層電子部品、およびその製造方法 |
JP2002198253A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | セラミック電子部品及び導電性ペースト |
-
2004
- 2004-10-06 CN CNA2004800257231A patent/CN1849678A/zh active Pending
- 2004-10-06 KR KR1020067006889A patent/KR100866478B1/ko not_active IP Right Cessation
- 2004-10-06 JP JP2005514583A patent/JPWO2005036571A1/ja active Pending
- 2004-10-06 WO PCT/JP2004/014755 patent/WO2005036571A1/ja active Application Filing
- 2004-10-08 TW TW093130621A patent/TWI245298B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60240116A (ja) * | 1984-05-14 | 1985-11-29 | 京セラ株式会社 | 積層型磁器コンデンサ |
JPH05275272A (ja) * | 1991-03-19 | 1993-10-22 | Nippon Steel Corp | 電子セラミック部品の端子電極形成方法 |
JPH07335477A (ja) * | 1994-06-15 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JPH0836914A (ja) * | 1994-07-26 | 1996-02-06 | Taiyo Yuden Co Ltd | セラミック電子部品用焼付型導電性ペースト及びセラミック電子部品 |
JPH08306580A (ja) * | 1995-05-11 | 1996-11-22 | Murata Mfg Co Ltd | セラミック電子部品の製造方法及びセラミック電子部品 |
JPH10144559A (ja) | 1996-11-05 | 1998-05-29 | Matsushita Electric Ind Co Ltd | 端子電極ペースト、積層電子部品、およびその製造方法 |
JP2002198253A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | セラミック電子部品及び導電性ペースト |
Also Published As
Publication number | Publication date |
---|---|
CN1849678A (zh) | 2006-10-18 |
KR20060085683A (ko) | 2006-07-27 |
TWI245298B (en) | 2005-12-11 |
WO2005036571A1 (ja) | 2005-04-21 |
TW200525564A (en) | 2005-08-01 |
JPWO2005036571A1 (ja) | 2007-11-22 |
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