WO2001095687A1 - Structure de refroidissement d'un dispositif de communication - Google Patents
Structure de refroidissement d'un dispositif de communication Download PDFInfo
- Publication number
- WO2001095687A1 WO2001095687A1 PCT/JP2000/003655 JP0003655W WO0195687A1 WO 2001095687 A1 WO2001095687 A1 WO 2001095687A1 JP 0003655 W JP0003655 W JP 0003655W WO 0195687 A1 WO0195687 A1 WO 0195687A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- shield case
- housing
- wall
- communication device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
Definitions
- the present invention relates to a communication device, and more particularly, to a heat radiation structure that radiates heat generated by a heat generating element disposed in a housing.
- FIG. 17 is a cross-sectional configuration diagram showing a main configuration of a conventional portable communication device disclosed in Japanese Patent Publication No. 11-204970.
- 1 is a heat-generating element (hereinafter referred to as a heat-generating element)
- 2 is a printed circuit board on which a communication circuit having the heat-generating element 1 is mounted
- 4 is the above-mentioned printed circuit board.
- a housing for accommodating 2, and 10 is a heat sink.
- Air has a very low thermal conductivity of 0.026 W / mK. If there is an air layer between the heating element 1 and the housing 4, the thermal resistance between the heating element 1 and the housing 4 is large, and the temperature difference Therefore, there is a problem that the temperature of the heating element 1 becomes high. For this reason
- thermo conductivity 230 W / mK
- carbon thermo conductivity: 50
- One end of the heat sink 10 made of a system material is attached to the heating element 1 in close contact, and the other end is attached to the inner wall of the low temperature housing 4.
- the thermal resistance from the heating element 1 to the housing 4 is reduced, and the element temperature can be reduced.
- the thermal constraints of portable communication devices include a decrease in device temperature.
- FIG. 18 is a cross-sectional configuration diagram showing a main configuration of another electronic device (optical receiver) having a heat dissipation function, which is disclosed in Japanese Patent Application Publication No. 10-41678.
- 1 is a heat-generating circuit element such as an amplifier circuit and a demodulation circuit (hereinafter, referred to as a heat-generating element)
- 2 is a printed circuit board on which the heat-generating element 1 is mounted
- 3 is a shield case for shielding the heat-generating element 1
- 4 Denotes a housing
- 11 and 12 denote a heat conductive sheet made of silicon or the like provided in an air layer between the heating element 1 and the shield case 3 and an air layer between the shield case 3 and the housing 4, respectively.
- the thermal resistance between the heating element 1 and the housing 4 is reduced as in the conventional example, and the temperature difference is reduced, so that the element temperature can be reduced. Since the heat from the element is locally transmitted to the inner wall of the housing 4 to which one end is attached, there is a problem that the surface temperature of the housing is locally increased.
- FIG. 19 is a cross-sectional view showing the main structure of another electronic device having a heat-dissipating function disclosed in Japanese Patent Publication No. 63-124,598.
- reference numeral 1 denotes an integrated circuit, which is a heat-generating circuit element (hereinafter, referred to as a heat-generating element).
- Reference numeral 2 denotes a printed circuit board on which the heating element 1 is mounted, 3 denotes a shield case provided on the back surface of the printed circuit board 2 for shielding the printed circuit board 2, and 13 denotes a shield case formed between the back surface of the printed circuit board 2 and the shield case 3. It is a thermally conductive insulator filled in between.
- the heat generated in the heating element 1 can be radiated, but in the case of this conventional example, since the heat conductive insulator 13 is mounted via the printed circuit board 2, However, the temperature rise of the element by the thermal resistance of the printed circuit board cannot be reduced.
- the heat conductive insulator 13 a heat conductive material (1/100 to 1200 of aluminum) having a relatively low thermal conductivity compared to a metal material such as aluminum is used. As a result, a large volume of heat conductive material was required to sufficiently diffuse heat, and there was a problem that the entire device became heavy.
- FIG. 20 is a cross-sectional configuration diagram showing a main configuration of another electronic device (printed wiring board device) having a heat radiation function disclosed in Japanese Utility Model Application Laid-Open No. 3-84696.
- reference numeral 1 denotes a semiconductor component, which is a heat-generating element (hereinafter referred to as a heat-generating element).
- Reference numeral 2 denotes a printed wiring board on which the heating element 1 is mounted, and reference numeral 3 denotes a shielding plate attached to the printed wiring board 2, which electrically shields the printed wiring board from other printed wiring boards.
- Reference numeral 14 denotes an L-shaped bracket provided between the heating element 1 and the shielding plate 3.
- the heat generated in the heating element 1 can be radiated from the shielding plate 3, but in the case of this conventional example, a metal material is mounted near the semiconductor component, and the electrical characteristics are guaranteed. There is a problem that heat cannot be sufficiently diffused in the plane of the shielding plate 3 with the L-shaped bracket.
- the present invention has been made in order to solve the above-described problems, and has as its object to provide a communication device capable of efficiently lowering the temperature of a heating element and lowering the surface temperature of a housing. It is the purpose. Disclosure of the invention
- a first communication device is mounted on a printed circuit board and has a communication circuit having a heat-generating element; and covers the communication circuit and shields electromagnetic waves.
- a shield case a housing for housing a printed circuit board on which the shield case and the communication circuit are mounted, a heat diffusion member mounted along an inner wall of the shield case and diffusing heat in a surface direction, and the shield case And a heat insulating layer provided between the inner wall of the housing. According to this, it is possible to suppress the temperature of the housing from becoming locally high, and to efficiently lower the temperature of the heating element.
- a second communication device is the first communication device, wherein an electrically insulating heat conductive member is provided between the heat diffusion member and the heat generating element. According to this, electric characteristics can be guaranteed, and even if a small-sized heat conductive member is inserted, a high cooling effect can be obtained, and the temperature of the heat generating element can be efficiently reduced.
- a third communication device includes a communication circuit mounted on a printed board and having a heat-generating element, a metal-based shield case that covers the communication circuit and shields electromagnetic waves, and a metal-based shield case.
- An electrically insulating heat conductive member provided between the heating element and the heat-generating element; a housing for storing the printed circuit board on which the shield case and the communication circuit are mounted; and the shield case described above.
- a heat insulating layer provided between the inner wall of the housing. According to this, it is possible to suppress the temperature of the housing from becoming locally high, and it is possible to efficiently reduce the temperature of the heat generating element.
- a communication circuit that is mounted and has a heat-generating element; a shield case that covers the communication circuit and shields electromagnetic waves; a housing that houses a print substrate on which the shield case and the communication circuit are mounted; A heat diffusion member that is mounted along the outer wall of the housing and diffuses heat in the surface direction; and a heat insulating layer provided between the heat diffusion member and the inner wall of the housing.
- a fifth communication device is the fourth communication device, wherein an electrically insulating heat conductive member is provided between the inner wall of the shield case and the heat generating element. According to this, electric characteristics can be guaranteed, and a high cooling effect can be obtained even when a small-sized heat conductive member is inserted, so that the temperature of the heating element can be efficiently reduced.
- the sixth to eighth communication devices according to the present invention are the first, third, and fourth communication devices described above, wherein each of the first, third, and fourth communication devices performs heat diffusion in a surface direction on an inner wall or an outer wall of the housing. A member is attached. According to this, the housing temperature can be further uniformed and the housing temperature can be reduced.
- the heat diffusion member provided on the inner wall of the housing faces the heat-generating element in the shield case.
- the part facing the part or the part provided on the outer side of the shield case has a shape protruding toward the shield case. According to this, there is an effect that the housing does not become partially heated.
- the first to third to fourth communication devices according to the present invention are the same as the first, third, and fourth communication devices described above, except that the installation positions of parts provided outside the shield case are removed.
- the heat equalizing member is provided on the outer wall of the case or on the inner wall of the housing except for the inner wall portion of the housing facing the above-mentioned components. According to this, there is an effect that the housing does not become partially heated.
- the fifteenth to seventeenth communication devices according to the present invention each include the first, third, and fourth communication devices described above, wherein the housing has a portion facing the heat-generating element in the shield case or Provided outside the shield case The part facing the component has a shape protruding outward. According to this, there is an effect that the housing does not become partially heated.
- the eighteenth to twenty-fourth communication devices according to the present invention are the first, third, and fourth communication devices, respectively, wherein the housing has a portion facing the heat-generating element in the shield case or The part provided on the outside of the shield case and facing the component has a shape protruding inward. According to this, even if the temperature of the housing is locally increased, it is difficult for the human body to touch the portion where the temperature is increased, so that inconvenience due to the temperature increase can be avoided.
- FIG. 1 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a first embodiment of the present invention
- FIG. 2 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a second embodiment of the present invention
- FIG. 3 is a cross-sectional configuration diagram illustrating a main configuration of another portable communication device according to the second embodiment of the present invention.
- FIG. 4 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to the third embodiment of the present invention.
- FIG. 5 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a fourth embodiment of the present invention.
- FIG. 1 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a first embodiment of the present invention
- FIG. 2 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a second embodiment of the present invention
- FIG. 6 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a fifth embodiment of the present invention.
- FIG. 7 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a sixth embodiment of the present invention.
- FIG. 8 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a seventh embodiment of the present invention.
- FIG. 9 is a sectional view showing the main structure of a portable communication device according to Embodiment 8 of the present invention, and
- FIG. 11 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a ninth embodiment of the present invention.
- FIG. 11 is a cross-sectional configuration diagram illustrating a main configuration of another portable communication device according to a ninth embodiment of the present invention. Is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to Embodiment 10 of the present invention.
- FIG. 13 is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to Embodiment 11 of the present invention.
- FIG. 14 is a sectional view showing the main configuration of a portable communication device according to Embodiment 12 of the present invention.
- FIG. 15 is a sectional view showing a main configuration of a portable communication device according to Embodiment 13 of the present invention.
- FIG. 16 is a portable communication device according to Embodiments 1, 2, and 6 of the present invention. Fig.
- FIG. 17 compares the cooling effect obtained by the heat dissipation structure of the device.
- Fig. 17 is a cross-sectional view showing the main structure of a conventional electronic device having a heat dissipation function.
- Fig. 18 is another electronic device having the conventional heat dissipation function.
- FIG. 19 is a cross-sectional configuration diagram showing a main configuration of a device,
- FIG. 19 is a cross-sectional configuration diagram showing a main configuration of yet another electronic device having a conventional heat dissipation function, and
- FIG. 20 is another electronic device having a conventional heat dissipation function.
- FIG. 2 is a cross-sectional configuration diagram illustrating a main configuration of the device.
- FIG. 1 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a first embodiment of the present invention.
- 1 is a heating element (hereinafter referred to as a heating element)
- 2 is a printed circuit board on which a communication circuit having a heating element 1 is mounted
- 3 is a communication circuit for suppressing the incidence of noise due to external electromagnetic waves.
- a resin-based shield case is covered
- 4 is a housing for storing the shield case 3 and the printed circuit board 2.
- Reference numeral 5 denotes a heat diffusion sheet (heat diffusion member) mounted along the inner wall of the shield case 3 and diffusing heat in a surface direction.
- Examples of the material of the heat diffusion sheet 5 include metal flakes having high thermal conductivity, such as aluminum (thermal conductivity: 236 W / mK) and copper (thermal conductivity: 403 W / mK), as well as thickness.
- Graphite sheet of about 0.02 to 0.1 mm thermal conductivity in plane direction: 800 W / mK, thermal conductivity in thickness direction: 5 W / mK can be used.
- Reference numeral 6 denotes a heat insulating layer provided between the shield case 3 and the inner wall of the housing 4, and is made of an air layer (thermal conductivity: 0.026 W / mK) and a heat insulating material.
- Urethane foam (thermal conductivity: 0.018 to 0.03 W / mK) may be used as the heat insulating material.
- ⁇ is a heat diffusion sheet 5 and a heating element A heat conductive sheet (heat conductive member) mounted between 1 and 1.
- the material of the heat conductive sheet 7 is a silicon-based, electrically insulating material with a heat conductivity of 1 to 10 W / mK. Some materials such as silicone rubber can be used.
- the heat dissipation QF and QR are determined by the balance of the thermal resistance R from the heating element to the outside air on the upper side of the housing and the thermal resistance RR from the heating element to the outside air on the lower side of the housing.
- the relationship between the temperature rise ⁇ T and the amount of heat radiation and thermal resistance of the housing is expressed by equation (2).
- ⁇ ⁇ 1 Temperature difference due to convective heat transfer of air between outside air and housing surface
- ⁇ ⁇ 2 Temperature difference due to heat conduction by the thickness of the housing
- ⁇ ⁇ 5 Temperature difference due to heat conduction of layer between heating element and shield case
- the temperature differences ⁇ 2 to ⁇ 5 are represented by equation (4), and the temperature difference ⁇ 1 is represented by equation (5).
- the temperature between the heating element 1 and the shield case 3 is reduced by filling the layer between the heating element 1 and the shield case 3 with a material having high thermal conductivity (usually 1 to 10 W / mK). That is, among the laminated components facing the heating element 1, the layer having the largest temperature difference per unit length is the layer between the heating element 1 and the shield case 3 where heat is not diffused. Therefore, even if a small volume of the heat conductive sheet 7 is introduced, a high cooling effect can be obtained, and the element temperature can be efficiently reduced.
- a material having high thermal conductivity usually 1 to 10 W / mK
- the heat diffusion sheet 5 is attached to the inner wall of the shield case 3.
- heat is diffused in the direction of the heat diffusion sheet 5 and the heat transfer area is enlarged.
- the solution from equations (4) and (5) thus, there is an effect that the temperature difference generated in the components after the heat diffusion sheet 5 can be reduced.
- heat can be diffused and uniformized as close as possible to the heating element 1, and the temperature difference from the heat diffusion sheet 5 to the outside air can be increased. ( ⁇ T 1 to ⁇ T 4) can be reduced to lower the element temperature.
- the temperature of the housing 4 immediately below the element on the sheet mounting side becomes lower on the surface of the housing 4 on the side opposite to the sheet mounting side because the thermal resistance in the vertical direction with respect to the sheet surface is reduced by mounting the heat diffusion sheet 5.
- the effect is determined by the balance between the effect of increasing the amount of heat flowing through the seat mounting side (A) and the effect of increasing the heat transfer area and reducing the temperature difference (B). Therefore, by setting the effect of (B) to be greater than (A), the surface temperature of the housing immediately below the element can be reduced.
- the heat insulating layer (air layer in FIG. 1) 6 is provided between the shield case 3 and the inner wall of the housing 4, heat is hardly transmitted to the housing 4, This has the effect that the temperature does not easily rise.
- the temperature of the housing can be prevented from being locally high, and the temperature of the heating element can be reduced. There is an effect that can be reduced efficiently.
- the heat diffusion sheet 5 provided on the inner wall of the shield case 3 is constituted by one sheet, but the sheet may be divided into a plurality of sheets.
- FIG. 2 is a cross-sectional configuration diagram illustrating a main configuration of a portable communication device according to a second embodiment of the present invention
- FIG. 3 is a cross-sectional configuration diagram illustrating a main configuration of another portable communication device according to the second embodiment of the present invention.
- Fig. 2 shows that an air layer
- FIG. 3 shows an example in which a foam material 26 is provided as the heat insulating layer 6.
- reference numeral 27 denotes an air space.
- the heat conductive sheet 7 was not provided between the heat diffusion sheet 5 and the heating element 1, and an air layer 27 was provided between the heat diffusion sheet 5 and the heating element 1. .
- the temperature of the element can be sufficiently lowered below the allowable temperature by mounting the heat diffusion sheet 5 on the inner wall of the shield case 2.
- FIG. 4 is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to a third embodiment of the present invention.
- 33 is a metallic shield case.
- the shield case is made of a metal material, and the function of the heat diffusion sheet 5 in the first embodiment is given to this metal-based shield case 33.
- a heat conductive sheet 7 is attached between the heating element 1 and the inner wall of the metallic shield case, and an air space 6 is provided between the metallic shield case 33 and the housing 4.
- the mounting of the heat diffusion sheet can be omitted, so that the assembly cost can be reduced.
- FIG. 5 is a sectional view showing the main configuration of a portable communication device according to Embodiment 4 of the present invention.
- 45 is a heat diffusion sheet attached to the outer wall of the shield case 3. Heating element 1 and the inner wall of shield case 3 An air layer 27 is provided, and a heat insulating layer (air layer) 6 is provided between the heat diffusion sheet 45 and the housing 4.
- the mounting area of the heat diffusion sheet is divided into small pieces, which may deteriorate the assemblability and the workability of the sheet, leading to an increase in cost.
- a heat diffusion sheet 45 is provided on the outer wall of the shield case 3, a large heat diffusion surface can be obtained so as not to interfere with other parts, and the sheet will not be divided into small parts, thus reducing processing costs. There is an effect that can be reduced.
- the outer wall of the shield case 3 is fitted with a heat diffusion sheet 45 that is the same as the shield case or larger than the shield case as shown in Fig. 5 as long as it does not interfere with other components, This has the effect of increasing the heat transfer area on the surface and, in particular, lowering the housing temperature.
- FIG. 6 is a sectional view showing a main configuration of a portable communication device according to a fifth embodiment of the present invention, which is different from that of the fourth embodiment in which the heat diffusion sheet 45 is attached to the outer wall of the shield case 3.
- a heat conductive sheet 7 is provided between the heating element 1 and the inner wall of the shield case 3.
- a heat insulating layer (air layer) 6 is provided between the heat diffusion sheet 45 and the housing 4.
- FIG. 7 is a cross-sectional view showing a main configuration of a portable communication device according to a sixth embodiment of the present invention.
- a heat diffusion sheet 65 for performing heat diffusion in the surface direction is attached.
- a heat insulation layer such as an air layer 6 is provided between the shield case 3 and the housing 4
- the housing 4 may be locally heated.
- a metal or carbon-based heat diffusion sheet 65 is attached to the inner wall of the housing 4 to diffuse heat, so that the housing 4 is not partially heated, and the housing temperature is reduced. can do.
- the heat diffusion sheet 65 is mounted on the inner wall of the housing 4 in this embodiment, it may be mounted on the outer wall of the housing 4. When it is provided on the outer wall, it may also serve as a seal that describes the product number.
- the internal antenna may be formed in a sheet shape, mounted on the inner wall of the housing, and also used as a heat dissipating component.
- FIG. 8 is a cross-sectional view showing a main configuration of a portable communication device according to a seventh embodiment of the present invention.
- the shape of the heat spread sheet 75 provided on the inner wall of the housing 4 is described.
- the portion of the shield case 3 facing the heating element 1 protrudes toward the shield case 3 side.
- An air space 76 is formed between the protrusion and the housing 4.
- a heat insulating layer such as an air layer 6 is provided between the shield case 3 and the housing 4 so that even if heat is not transmitted to the housing 4, Although the body 4 may become hot, in the seventh embodiment, a heat diffusion sheet 75 having an air layer 76 is provided on the inner wall of the housing and diffused on the housing surface other than the area immediately below the heating element, so that the housing is It has the effect of not getting hot partially.
- FIG. 9 is a sectional view showing the main configuration of a portable communication device according to Embodiment 8 of the present invention.
- 85 is a heat diffusion sheet provided on the inner wall of the housing 4
- 86 is an air space
- 8 is equipment parts provided outside the shield case 3. It is. ⁇
- the shield case 3 and the housing 4 can cope with such a case, and similarly to the seventh embodiment, the shape of the heat diffusion sheet 85 provided on the inner wall of the housing 4 is changed to the component provided on the outside of the shield case 3. The portion facing 8 protrudes toward the shield case 3 side. An air space 86 is formed between the protrusion and the housing 4.
- FIG. 10 is a sectional view showing a main configuration of a portable communication device according to a ninth embodiment of the present invention.
- no device component 8 is provided between the shield case 3 and the housing 4. It can cope with the case where the temperature of the housing 4 immediately below the component 8 becomes high due to the uniform existence and the uneven thermal resistance.
- reference numeral 9 denotes a temperature equalizing member, which is provided on an outer wall of the shield case 3 in a region other than a region where the device component 8 is mounted.
- the material of the heat equalizing member 9 is a heat dissipation path from the shield case 3 to the housing 4 via the device parts 8 and the heat sink from the shield case 3 to the housing 4 via the temperature equalizing member 9. It is better to use one that has the same thermal resistance as the heat dissipation path up to
- a soaking member 9 is installed on the outer wall of the shield case 3.
- the heat equalizing member 99 may be attached to the inner wall of the housing 4 in a region other than the region facing the device component 8.
- FIG. 11 illustrates such a case.
- FIG. 12 is a sectional view showing the main structure of a portable communication device according to Embodiment 10 of the present invention.
- reference numeral 104 denotes a housing, in which the surface shape of the housing immediately below the heating element 1 is a convex shape protruding outward.
- Other configurations are the same as those of the first embodiment.
- the air layer 6 between the shield case 3 and the housing 4 becomes It is thick and has high thermal resistance, so the surface temperature of the housing does not become locally hot.
- FIG. 13 is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to Embodiment 11 of the present invention.
- reference numeral 114 denotes a housing, and the surface shape of the housing immediately below the device component 8 provided outside the shield case 3 has a convex shape protruding outward.
- the presence of the component 8 causes uneven thermal resistance, and a large amount of heat flows to the component 8 having a low thermal resistance.
- the temperature of the housing 4 immediately below the component 8 is reduced. Even when the temperature rises, the air layer 6 between the shield case 3 and the housing 4 is thick immediately under the device parts and increases in thermal resistance, so that the surface temperature of the housing does not locally increase.
- FIG. 14 is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to Embodiment 12 of the present invention.
- reference numeral 124 denotes a housing, which is different from that of the tenth embodiment in that a housing portion having a convex shape on the outside of the housing has a convex shape on the contrary.
- FIG. 15 is a cross-sectional configuration diagram showing a main configuration of a portable communication device according to Embodiment 13 of the present invention.
- reference numeral 134 denotes a housing, which is different from that of the eleventh embodiment in that a housing portion having a convex shape on the outside of the housing is formed with a convex shape on the contrary.
- the heat diffusion sheet is provided on the inner wall or the outer wall of the housing, the heat diffusion sheet is partially convex, A heat equalizing member was provided on the outer wall of the shield case or the inner wall of the housing, and the shape of the housing was partially convex or concave, but the configuration of Examples 2 to 5 was the same as above.
- the configuration may be as follows.
- the communication device is a portable information terminal such as a mobile phone or the like. It can be applied to various communication devices such as other portable information terminals and household cordless telephones as well as wire-related devices.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA200610105569XA CN1976571A (zh) | 2000-06-06 | 2000-06-06 | 通信机器的散热构造 |
EP00935550A EP1233666A4 (en) | 2000-06-06 | 2000-06-06 | COOLING STRUCTURE OF A COMMUNICATION DEVICE |
PCT/JP2000/003655 WO2001095687A1 (fr) | 2000-06-06 | 2000-06-06 | Structure de refroidissement d'un dispositif de communication |
JP2002501855A JP3810734B2 (ja) | 2000-06-06 | 2000-06-06 | 通信機器 |
US10/048,924 US6570086B1 (en) | 2000-06-06 | 2000-06-06 | Cooling structure of communication device |
CN00812651.8A CN1290391C (zh) | 2000-06-06 | 2000-06-06 | 通信机器的散热构造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/003655 WO2001095687A1 (fr) | 2000-06-06 | 2000-06-06 | Structure de refroidissement d'un dispositif de communication |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/048,924 A-371-Of-International US6570086B1 (en) | 2000-06-06 | 2000-06-06 | Cooling structure of communication device |
US10/395,134 Division US20030161132A1 (en) | 2002-02-05 | 2003-03-25 | Communication device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001095687A1 true WO2001095687A1 (fr) | 2001-12-13 |
Family
ID=11736119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/003655 WO2001095687A1 (fr) | 2000-06-06 | 2000-06-06 | Structure de refroidissement d'un dispositif de communication |
Country Status (5)
Country | Link |
---|---|
US (1) | US6570086B1 (ja) |
EP (1) | EP1233666A4 (ja) |
JP (1) | JP3810734B2 (ja) |
CN (2) | CN1976571A (ja) |
WO (1) | WO2001095687A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10235047A1 (de) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Elektronikgehäuse mit integriertem Wärmeverteiler |
JP2005159346A (ja) * | 2003-11-21 | 2005-06-16 | Lg Electronics Inc | 放熱装置を有する携帯端末機 |
JP2006514427A (ja) * | 2002-11-19 | 2006-04-27 | ソニー・エリクソン・モバイルコミュニケーションズ, エービー | 電子部品を弾力的に支持する方法および電子装置 |
JP2006203018A (ja) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子機器における表面温度分布の調節方法 |
JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
JP2015012250A (ja) * | 2013-07-02 | 2015-01-19 | 株式会社村田製作所 | モジュールおよびこれを備える携帯機器 |
CN105050369A (zh) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | 一种智能终端 |
WO2017142286A1 (ko) * | 2016-02-18 | 2017-08-24 | 삼성전자주식회사 | 열 수집/확산 구조를 가진 전자 장치 |
WO2020084759A1 (ja) * | 2018-10-26 | 2020-04-30 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
WO2020153428A1 (ja) * | 2019-01-25 | 2020-07-30 | 株式会社デンソー | 無線通信装置 |
RU2774289C1 (ru) * | 2018-10-26 | 2022-06-16 | Джапан Тобакко Инк. | Корпус и снабженное им устройство для вдыхания ароматизатора |
JP2023078349A (ja) * | 2018-10-26 | 2023-06-06 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
US11862850B2 (en) | 2019-01-25 | 2024-01-02 | Denso Corporation | Wireless communication device |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4037810B2 (ja) * | 2003-09-05 | 2008-01-23 | Necアクセステクニカ株式会社 | 小型無線装置及びその実装方法 |
JP4265796B2 (ja) * | 2005-03-23 | 2009-05-20 | 富士通株式会社 | 受熱シート、電子機器及び受熱シートの製造方法 |
TWI283806B (en) | 2005-06-07 | 2007-07-11 | Htc Corp | Portable electronic device |
CN100463594C (zh) * | 2005-06-18 | 2009-02-18 | 鸿富锦精密工业(深圳)有限公司 | 具有散热功能的电磁屏蔽装置 |
CN100518467C (zh) * | 2005-06-27 | 2009-07-22 | 宏达国际电子股份有限公司 | 可携式电子装置 |
TWI259522B (en) * | 2005-08-02 | 2006-08-01 | Quanta Comp Inc | Electronic device |
US7595468B2 (en) * | 2005-11-07 | 2009-09-29 | Intel Corporation | Passive thermal solution for hand-held devices |
JP2007194830A (ja) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co Ltd | チューナモジュール |
TWM313957U (en) * | 2007-01-03 | 2007-06-11 | Chin-Fu Horng | Anti- electromagnetic interference shielding apparatus |
JP2008198917A (ja) * | 2007-02-15 | 2008-08-28 | Polymatech Co Ltd | 熱拡散シート及びその製造方法 |
TWM318903U (en) * | 2007-04-03 | 2007-09-11 | Chin-Fu Horng | Electromagnetic shielding device |
JP5087981B2 (ja) * | 2007-04-23 | 2012-12-05 | 富士通株式会社 | 電子機器 |
US20090002949A1 (en) * | 2007-06-29 | 2009-01-01 | Lucent Technologies Inc. | Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation |
WO2009107303A1 (ja) * | 2008-02-28 | 2009-09-03 | 日本電気株式会社 | 電磁シールド構造およびそれを用いた無線装置、電磁シールドの製造方法 |
CN101685330A (zh) * | 2008-09-24 | 2010-03-31 | 富准精密工业(深圳)有限公司 | 散热装置及具有该散热装置的笔记本电脑 |
JP5151948B2 (ja) * | 2008-12-10 | 2013-02-27 | ソニー株式会社 | 電子機器用放熱装置及び電子機器 |
JP2011077578A (ja) * | 2009-09-29 | 2011-04-14 | Mitsumi Electric Co Ltd | チューナモジュール |
DE102009054517B4 (de) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Steuergerät |
CN102098886B (zh) * | 2009-12-14 | 2013-09-25 | 和硕联合科技股份有限公司 | 机壳及其制作方法 |
TWI483093B (zh) * | 2009-12-30 | 2015-05-01 | Foxconn Tech Co Ltd | 筆記型電腦 |
US8169781B2 (en) * | 2010-04-06 | 2012-05-01 | Fsp Technology Inc. | Power supply and heat dissipation module thereof |
US20110255850A1 (en) * | 2010-04-19 | 2011-10-20 | Richard Hung Minh Dinh | Electronic subassemblies for electronic devices |
CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
US8760868B2 (en) * | 2011-08-30 | 2014-06-24 | Apple Inc. | Electronic device enclosures and heatsink structures with thermal management features |
US8804331B2 (en) * | 2011-12-02 | 2014-08-12 | Ati Technologies Ulc | Portable computing device with thermal management |
TW201351107A (zh) * | 2012-06-07 | 2013-12-16 | Askey Computer Corp | 具有散熱結構之電子裝置 |
CN103547111B (zh) * | 2012-07-09 | 2016-08-10 | 光宝电子(广州)有限公司 | 平面式散热结构及电子装置 |
CN103151318A (zh) * | 2013-03-07 | 2013-06-12 | 北京中石伟业科技股份有限公司 | 电子设备中发热芯片与壳体之间的散热管理系统及方法 |
US9215833B2 (en) * | 2013-03-15 | 2015-12-15 | Apple Inc. | Electronic device with heat dissipating electromagnetic interference shielding structures |
CN105230145B (zh) * | 2013-03-28 | 2019-03-08 | 安提特软件有限责任公司 | 用于电子设备的防护罩 |
CN104640416B (zh) * | 2013-11-08 | 2017-05-24 | 联想(北京)有限公司 | 一种电子设备 |
US9480185B2 (en) * | 2014-01-08 | 2016-10-25 | Enphase Energy, Inc. | Double insulated heat spreader |
US9282681B2 (en) * | 2014-01-21 | 2016-03-08 | Seagate Technology Llc | Dissipating heat during device operation |
EP3119172A4 (en) * | 2014-03-14 | 2017-11-15 | Kaneka Corporation | Electronic terminal device and method for assembling same |
CN108055815B (zh) | 2014-03-21 | 2020-04-21 | 华为终端有限公司 | 移动终端 |
US9420734B2 (en) * | 2014-04-01 | 2016-08-16 | Advanced Micro Devices, Inc. | Combined electromagnetic shield and thermal management device |
US9792961B2 (en) | 2014-07-21 | 2017-10-17 | Advanced Micro Devices, Inc. | Distributed computing with phase change material thermal management |
CN105704978A (zh) * | 2014-11-26 | 2016-06-22 | 英业达科技有限公司 | 电子装置 |
US9575523B2 (en) * | 2015-01-22 | 2017-02-21 | Microsoft Technology Licensing, Llc | Device sandwich structured composite housing |
CN104980083B (zh) * | 2015-03-31 | 2020-10-02 | 苏州律点信息科技有限公司 | 一种电动汽车电机控制器总成的壳体结构及装配方式 |
WO2018057651A1 (en) | 2016-09-22 | 2018-03-29 | Apple Inc. | Thermal distribution assembly in an electronic device |
CN106572618A (zh) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | 一种电路板 |
WO2019030809A1 (ja) * | 2017-08-08 | 2019-02-14 | Necプラットフォームズ株式会社 | 放熱構造体 |
CN108112227A (zh) * | 2017-11-22 | 2018-06-01 | 努比亚技术有限公司 | 一种屏蔽罩及电路板 |
US10701796B2 (en) * | 2018-06-25 | 2020-06-30 | Intel Corporation | Electromagnetic interference (EMI) shield |
US10462944B1 (en) * | 2018-09-25 | 2019-10-29 | Getac Technology Corporation | Wave absorbing heat dissipation structure |
JP2020106949A (ja) * | 2018-12-26 | 2020-07-09 | 富士通株式会社 | 電子機器、及び電子機器の筐体ユニット |
CN110366362B (zh) * | 2019-08-07 | 2020-08-07 | 李居强 | 电磁屏蔽散热装置 |
JP2021129059A (ja) * | 2020-02-14 | 2021-09-02 | シャープ株式会社 | 電子機器 |
US11457545B2 (en) | 2020-09-28 | 2022-09-27 | Google Llc | Thermal-control system of a media-streaming device and associated media-streaming devices |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223491U (ja) * | 1985-07-26 | 1987-02-13 | ||
JPH03257997A (ja) * | 1990-03-08 | 1991-11-18 | Matsushita Electric Ind Co Ltd | 電磁波シールド装置 |
JPH0446591U (ja) * | 1990-08-27 | 1992-04-21 | ||
JPH0451192U (ja) * | 1990-09-04 | 1992-04-30 | ||
JPH0730280A (ja) * | 1993-07-09 | 1995-01-31 | Sony Corp | シールドケース |
JPH07226466A (ja) * | 1994-02-09 | 1995-08-22 | Toshiba Corp | 半導体素子の冷却装置 |
US5801330A (en) * | 1995-02-09 | 1998-09-01 | Robert Bosch Gmbh | Housing for an electrical device having spring means |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3477101D1 (en) * | 1983-03-25 | 1989-04-13 | Mitsubishi Electric Corp | Heat radiator assembly for cooling electronic parts |
JPS6223491A (ja) | 1985-07-24 | 1987-01-31 | 川崎製鉄株式会社 | 篩網の目詰まり除去方法及び装置 |
JPS63124598A (ja) | 1986-11-14 | 1988-05-28 | 富士通株式会社 | 集積回路の放熱構造 |
JPS63153924A (ja) | 1986-12-18 | 1988-06-27 | Fujitsu Ltd | 携帯用通信装置の放熱構造 |
JPS6428897A (en) * | 1987-07-23 | 1989-01-31 | Matsushita Electric Ind Co Ltd | Hybrid integrated circuit |
JPH0632836B2 (ja) | 1989-03-20 | 1994-05-02 | 荏原インフイルコ株式会社 | 浄化槽汚泥の処理方法 |
JP3021552B2 (ja) | 1990-06-12 | 2000-03-15 | 富士電機株式会社 | パルス移相装置 |
JP3277937B2 (ja) | 1990-06-19 | 2002-04-22 | ダイキン工業株式会社 | アウトライン文字生成方法およびその装置 |
JPH07237243A (ja) * | 1994-02-28 | 1995-09-12 | Fujitsu Ltd | 電波シールドハウジング |
JPH1041678A (ja) * | 1996-07-25 | 1998-02-13 | Hitachi Ltd | 光受信器 |
JP2930923B2 (ja) * | 1996-12-13 | 1999-08-09 | 三菱電機株式会社 | 冷却構造、これを用いた携帯型電子機器及び冷却構造形成方法 |
US5991155A (en) * | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
JP2866632B2 (ja) | 1997-03-17 | 1999-03-08 | 三菱電機株式会社 | 放熱材 |
JP3518242B2 (ja) * | 1997-04-14 | 2004-04-12 | 株式会社日立製作所 | 電子装置 |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
US6053771A (en) * | 1997-08-20 | 2000-04-25 | Dell Usa L.P. | Electromagnetic shield connector |
JPH11204970A (ja) | 1998-01-12 | 1999-07-30 | Alps Electric Co Ltd | 電子機器 |
US6347035B1 (en) * | 1998-10-30 | 2002-02-12 | Fujitsu Limited | Low profile EMI shield with heat spreading plate |
JP3753875B2 (ja) * | 1998-11-30 | 2006-03-08 | 長野日本無線株式会社 | 電子機器 |
JP3257997B2 (ja) | 1999-09-17 | 2002-02-18 | 株式会社新東エコテクノ | 貯留糞尿液のエアーリフト撹拌機構、及びこれを用いた糞尿液の発酵処理装置 |
-
2000
- 2000-06-06 WO PCT/JP2000/003655 patent/WO2001095687A1/ja not_active Application Discontinuation
- 2000-06-06 US US10/048,924 patent/US6570086B1/en not_active Expired - Fee Related
- 2000-06-06 CN CNA200610105569XA patent/CN1976571A/zh active Pending
- 2000-06-06 JP JP2002501855A patent/JP3810734B2/ja not_active Expired - Fee Related
- 2000-06-06 CN CN00812651.8A patent/CN1290391C/zh not_active Expired - Fee Related
- 2000-06-06 EP EP00935550A patent/EP1233666A4/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223491U (ja) * | 1985-07-26 | 1987-02-13 | ||
JPH03257997A (ja) * | 1990-03-08 | 1991-11-18 | Matsushita Electric Ind Co Ltd | 電磁波シールド装置 |
JPH0446591U (ja) * | 1990-08-27 | 1992-04-21 | ||
JPH0451192U (ja) * | 1990-09-04 | 1992-04-30 | ||
JPH0730280A (ja) * | 1993-07-09 | 1995-01-31 | Sony Corp | シールドケース |
JPH07226466A (ja) * | 1994-02-09 | 1995-08-22 | Toshiba Corp | 半導体素子の冷却装置 |
US5801330A (en) * | 1995-02-09 | 1998-09-01 | Robert Bosch Gmbh | Housing for an electrical device having spring means |
Non-Patent Citations (1)
Title |
---|
See also references of EP1233666A4 * |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10235047A1 (de) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Elektronikgehäuse mit integriertem Wärmeverteiler |
CN100346682C (zh) * | 2002-07-31 | 2007-10-31 | 恩德莱斯和豪瑟尔两合公司 | 具有集成散热器的电子外壳 |
JP2006514427A (ja) * | 2002-11-19 | 2006-04-27 | ソニー・エリクソン・モバイルコミュニケーションズ, エービー | 電子部品を弾力的に支持する方法および電子装置 |
JP2005159346A (ja) * | 2003-11-21 | 2005-06-16 | Lg Electronics Inc | 放熱装置を有する携帯端末機 |
US7286360B2 (en) | 2003-11-21 | 2007-10-23 | Lg Electronics Inc. | Heat radiating system and method for a mobile communication terminal |
JP2006203018A (ja) * | 2005-01-21 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子機器における表面温度分布の調節方法 |
JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
JP2015012250A (ja) * | 2013-07-02 | 2015-01-19 | 株式会社村田製作所 | モジュールおよびこれを備える携帯機器 |
CN105050369A (zh) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | 一种智能终端 |
WO2017142286A1 (ko) * | 2016-02-18 | 2017-08-24 | 삼성전자주식회사 | 열 수집/확산 구조를 가진 전자 장치 |
CN108702858A (zh) * | 2016-02-18 | 2018-10-23 | 三星电子株式会社 | 具有集热/散热结构的电子设备 |
US11555657B2 (en) | 2016-02-18 | 2023-01-17 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US11047628B2 (en) | 2016-02-18 | 2021-06-29 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US10798849B2 (en) | 2016-02-18 | 2020-10-06 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US11098959B2 (en) | 2016-02-18 | 2021-08-24 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
RU2774289C1 (ru) * | 2018-10-26 | 2022-06-16 | Джапан Тобакко Инк. | Корпус и снабженное им устройство для вдыхания ароматизатора |
CN112969377A (zh) * | 2018-10-26 | 2021-06-15 | 日本烟草产业株式会社 | 壳体和具备该壳体的香味吸取器 |
JPWO2020084759A1 (ja) * | 2018-10-26 | 2021-10-21 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
TWI774868B (zh) * | 2018-10-26 | 2022-08-21 | 日商日本煙草產業股份有限公司 | 殼體及具備該殼體的香味吸嚐器 |
WO2020084759A1 (ja) * | 2018-10-26 | 2020-04-30 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
JP7258908B2 (ja) | 2018-10-26 | 2023-04-17 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
JP2023078349A (ja) * | 2018-10-26 | 2023-06-06 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
JP7296021B2 (ja) | 2018-10-26 | 2023-06-21 | 日本たばこ産業株式会社 | 筐体およびこれを備えた香味吸引器 |
US12059031B2 (en) | 2018-10-26 | 2024-08-13 | Japan Tobacco Inc. | Housing and flavor aspirator provided with same |
WO2020153428A1 (ja) * | 2019-01-25 | 2020-07-30 | 株式会社デンソー | 無線通信装置 |
US11862850B2 (en) | 2019-01-25 | 2024-01-02 | Denso Corporation | Wireless communication device |
Also Published As
Publication number | Publication date |
---|---|
CN1976571A (zh) | 2007-06-06 |
CN1290391C (zh) | 2006-12-13 |
EP1233666A1 (en) | 2002-08-21 |
JP3810734B2 (ja) | 2006-08-16 |
EP1233666A4 (en) | 2005-04-13 |
US6570086B1 (en) | 2003-05-27 |
CN1373982A (zh) | 2002-10-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2001095687A1 (fr) | Structure de refroidissement d'un dispositif de communication | |
JP2006210940A (ja) | 通信機器 | |
KR100652621B1 (ko) | 휴대용 단말기의 방열장치 | |
EP2262354B1 (en) | Assemblies and methods for dissipating heat from handheld electronic devices | |
US7623349B2 (en) | Thermal management apparatus and method for a circuit substrate | |
JP4404726B2 (ja) | 車載用電力変換装置 | |
JP4498419B2 (ja) | 電子機器 | |
JP4525460B2 (ja) | モバイル機器 | |
JP2017188601A (ja) | 電子機器 | |
US20030161132A1 (en) | Communication device | |
JP2000106495A (ja) | 電気電子器具の内部構造 | |
JP4269160B2 (ja) | 携帯端末機器のアンテナ構造 | |
JPH11143585A (ja) | 放熱構造を有する情報処理装置 | |
JP2001168560A (ja) | 電子回路ユニット | |
JP3569451B2 (ja) | 放熱装置を備える電子機器 | |
JP2001230578A (ja) | 携帯型通信端末の放熱構造 | |
JP2007049015A (ja) | 電子機器構造と、電子機器構造が用いられた電子機器 | |
JP2006303374A (ja) | 電子機器における放熱装置 | |
JP2010055642A (ja) | 電子機器 | |
JP2004193304A (ja) | 通信装置 | |
CN113268127A (zh) | 电子设备 | |
JP3753875B2 (ja) | 電子機器 | |
JPH06268113A (ja) | 電子機器用の放熱部材 | |
CN210381726U (zh) | 壳体组件及电子设备 | |
CN113271748A (zh) | 电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10048924 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2000935550 Country of ref document: EP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 008126518 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 2000935550 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2000935550 Country of ref document: EP |