JPH0451192U - - Google Patents
Info
- Publication number
- JPH0451192U JPH0451192U JP9321490U JP9321490U JPH0451192U JP H0451192 U JPH0451192 U JP H0451192U JP 9321490 U JP9321490 U JP 9321490U JP 9321490 U JP9321490 U JP 9321490U JP H0451192 U JPH0451192 U JP H0451192U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- opening
- heat dissipation
- circuit section
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
Description
第１図は本考案の一実施例の放熱装置の構成を
示す要部断面図、第２図は本考案の一実施例の放
熱装置構成を示す斜視図、第３図は従来の放熱装
置の構成を示す断面図である。 ２１……ケース、２５……放熱板、２７……蓋
、２９……開口部。
示す要部断面図、第２図は本考案の一実施例の放
熱装置構成を示す斜視図、第３図は従来の放熱装
置の構成を示す断面図である。 ２１……ケース、２５……放熱板、２７……蓋
、２９……開口部。
Claims (1)
- ケースに収納した回路部を覆う蓋に開口部を設
け、前記回路部の放熱板を前記開口部で前記蓋の
面よりも突出して外部に露出させてなる構成の放
熱装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321490U JPH0451192U (ja) | 1990-09-04 | 1990-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9321490U JPH0451192U (ja) | 1990-09-04 | 1990-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451192U true JPH0451192U (ja) | 1992-04-30 |
Family
ID=31830245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9321490U Pending JPH0451192U (ja) | 1990-09-04 | 1990-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451192U (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06255592A (ja) * | 1993-03-02 | 1994-09-13 | Koito Ind Ltd | 座席装置 |
| JPH0732993U (ja) * | 1993-12-03 | 1995-06-16 | 富士通テン株式会社 | 電子機器の放熱構造 |
| JPH1098287A (ja) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | 回路基板モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器 |
| WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03255697A (ja) * | 1989-12-04 | 1991-11-14 | Hitachi Ltd | 集積回路用放熱構造体 |
-
1990
- 1990-09-04 JP JP9321490U patent/JPH0451192U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03255697A (ja) * | 1989-12-04 | 1991-11-14 | Hitachi Ltd | 集積回路用放熱構造体 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06255592A (ja) * | 1993-03-02 | 1994-09-13 | Koito Ind Ltd | 座席装置 |
| JPH0732993U (ja) * | 1993-12-03 | 1995-06-16 | 富士通テン株式会社 | 電子機器の放熱構造 |
| JPH1098287A (ja) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | 回路基板モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器 |
| WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |