JP2006203018A - 電子機器における表面温度分布の調節方法 - Google Patents
電子機器における表面温度分布の調節方法 Download PDFInfo
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- JP2006203018A JP2006203018A JP2005013640A JP2005013640A JP2006203018A JP 2006203018 A JP2006203018 A JP 2006203018A JP 2005013640 A JP2005013640 A JP 2005013640A JP 2005013640 A JP2005013640 A JP 2005013640A JP 2006203018 A JP2006203018 A JP 2006203018A
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- 238000000034 method Methods 0.000 title claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 35
- 239000010439 graphite Substances 0.000 claims abstract description 35
- 230000020169 heat generation Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】電子機器の外装ケース1と、この外装ケース1内に納められた発熱電子部品3と、外装ケース1の内側に設けられ発熱電子部品3から発する局所的な熱を所定範囲に分散させるグラファイトシート5からなり、発熱電子部品3と対峙するグラファイトシート5領域に貫通孔6を設けるとともに、この貫通孔6の孔径を調節して電子機器の表面温度を調節するのである。
【選択図】図3
Description
3 発熱電子部品
5 グラファイトシート
6 貫通孔
Claims (3)
- 電子機器の外装ケースと、この外装ケース内に納められた発熱電子部品と、外装ケースの内側に設けられ前記発熱電子部品から発する局所的な熱を所定範囲に分散させるグラファイトシートからなり、前記発熱電子部品と対峙する前記グラファイトシート領域に貫通孔を設けるとともに、この貫通孔の孔径を調節することを特徴とした電子機器における表面温度分布の調節方法。
- 貫通孔を複数設け、前記貫通孔の配置および孔径を調節することを特徴とした請求項1に記載の電子機器における表面温度分布の調節方法。
- グラファイトシートに設けられた貫通孔周辺を発熱電子部品に当接させたことを特徴とする請求項1に記載の電子機器における表面温度分布の調節方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005013640A JP4483598B2 (ja) | 2005-01-21 | 2005-01-21 | グラファイトシートを備えた電子機器 |
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JP2005013640A JP4483598B2 (ja) | 2005-01-21 | 2005-01-21 | グラファイトシートを備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
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JP2006203018A true JP2006203018A (ja) | 2006-08-03 |
JP4483598B2 JP4483598B2 (ja) | 2010-06-16 |
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JP2005013640A Expired - Fee Related JP4483598B2 (ja) | 2005-01-21 | 2005-01-21 | グラファイトシートを備えた電子機器 |
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JP (1) | JP4483598B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
JP2009094196A (ja) * | 2007-10-05 | 2009-04-30 | Nec Corp | 携帯通信機の放熱構造 |
GB2474141B (en) * | 2008-06-27 | 2013-01-23 | Hewlett Packard Development Co | Dissipating heat within housings for electrical components |
US9426930B2 (en) | 2010-12-07 | 2016-08-23 | Hewlett-Packard Development Company, L.P. | Dissipating heat within housings for electrical components |
WO2016190291A1 (ja) * | 2015-05-27 | 2016-12-01 | コニカミノルタ株式会社 | 携帯端末 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10229287A (ja) * | 1996-12-13 | 1998-08-25 | Mitsubishi Electric Corp | 冷却構造、これを用いた携帯型電子機器及び冷却構造形成方法 |
JP2001044673A (ja) * | 1999-07-30 | 2001-02-16 | Oki Electric Ind Co Ltd | 発熱部品の放熱構造 |
JP2001142574A (ja) * | 1999-11-18 | 2001-05-25 | Hitachi Ltd | 電子装置 |
WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |
JP2002334958A (ja) * | 2001-05-08 | 2002-11-22 | Aiwa Co Ltd | 放熱装置 |
-
2005
- 2005-01-21 JP JP2005013640A patent/JP4483598B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10229287A (ja) * | 1996-12-13 | 1998-08-25 | Mitsubishi Electric Corp | 冷却構造、これを用いた携帯型電子機器及び冷却構造形成方法 |
JP2001044673A (ja) * | 1999-07-30 | 2001-02-16 | Oki Electric Ind Co Ltd | 発熱部品の放熱構造 |
JP2001142574A (ja) * | 1999-11-18 | 2001-05-25 | Hitachi Ltd | 電子装置 |
WO2001095687A1 (fr) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Structure de refroidissement d'un dispositif de communication |
JP2002334958A (ja) * | 2001-05-08 | 2002-11-22 | Aiwa Co Ltd | 放熱装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
JP2009094196A (ja) * | 2007-10-05 | 2009-04-30 | Nec Corp | 携帯通信機の放熱構造 |
GB2474141B (en) * | 2008-06-27 | 2013-01-23 | Hewlett Packard Development Co | Dissipating heat within housings for electrical components |
US8564943B2 (en) | 2008-06-27 | 2013-10-22 | Hewlett-Packard Development Company, L.P. | Dissipating heat within housings for electrical components |
US10234916B2 (en) | 2008-06-27 | 2019-03-19 | Hewlett-Packard Development Company, L.P. | Dissipating heat within housings for electrical components |
US9426930B2 (en) | 2010-12-07 | 2016-08-23 | Hewlett-Packard Development Company, L.P. | Dissipating heat within housings for electrical components |
WO2016190291A1 (ja) * | 2015-05-27 | 2016-12-01 | コニカミノルタ株式会社 | 携帯端末 |
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JP4483598B2 (ja) | 2010-06-16 |
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