WO2009107303A1 - 電磁シールド構造およびそれを用いた無線装置、電磁シールドの製造方法 - Google Patents
電磁シールド構造およびそれを用いた無線装置、電磁シールドの製造方法 Download PDFInfo
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- WO2009107303A1 WO2009107303A1 PCT/JP2008/072341 JP2008072341W WO2009107303A1 WO 2009107303 A1 WO2009107303 A1 WO 2009107303A1 JP 2008072341 W JP2008072341 W JP 2008072341W WO 2009107303 A1 WO2009107303 A1 WO 2009107303A1
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- electromagnetic
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- side plate
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- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 68
- 239000004020 conductor Substances 0.000 claims description 8
- 230000005672 electromagnetic field Effects 0.000 abstract description 5
- 230000005012 migration Effects 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 17
- 239000002184 metal Substances 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 15
- 230000005855 radiation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 3
- 208000032365 Electromagnetic interference Diseases 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
- H04B15/02—Reducing interference from electric apparatus by means located at or near the interfering apparatus
- H04B15/04—Reducing interference from electric apparatus by means located at or near the interfering apparatus the interference being caused by substantially sinusoidal oscillations, e.g. in a receiver or in a tape-recorder
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- the present invention relates to an electromagnetic shield structure loaded on a digital device such as an integrated circuit (Large Scale Integration, hereinafter referred to as LSI) or a module in a device using wireless communication such as a mobile phone, and a wireless device using the electromagnetic shield structure It is about.
- LSI Large Scale Integration
- electromagnetic waves caused by harmonic components of the digital clock signal may be radiated into the space and affect surrounding electronic devices.
- an electronic device in which a digital system circuit and an analog system circuit (or a wireless system circuit) are mixed when an electromagnetic wave that matches a radio frequency is mixed into a wireless system circuit among electromagnetic waves generated from an LSI that is a digital system circuit, Electromagnetic noise may occur and affect the signal quality of the receiving antenna. For this reason, in a wireless device in which a digital circuit and an analog circuit are mixed, a technique for suppressing electromagnetic noise radiated from an LSI is important for maintaining signal quality.
- a power supply decoupling technique is known as an electromagnetic noise suppression technique from LSI.
- An example is shown in FIG.
- the power supply decoupling structure 100 suppresses electromagnetic noise radiated from the power supply terminal 103 of the LSI 102 mounted on the substrate 101.
- the power supply decoupling structure 100 has a configuration in which a decoupling capacitor 104 is connected to a power supply terminal 103 and a ground terminal 105 of an LSI 102.
- a ground terminal 105 provided on the surface of the substrate 101 is electrically connected to a ground layer 107 provided inside the substrate 101 via a via hole 106 extending in the thickness direction of the substrate 101.
- the use of the capacitor 104 causes high-frequency electromagnetic noise generated from the power supply system of the LSI 102 to pass through the capacitor 104 to the ground terminal 105 and the substrate 101 on the surface of the substrate 101. As a result, leakage of the noise to other locations can be suppressed.
- electromagnetic shielding technology is also used as a technology for suppressing electromagnetic noise from the LSI.
- This electromagnetic shielding technique basically involves covering the entire LSI with a metal lid and connecting it to the ground of the substrate, an example of which is shown in FIG.
- FIG. 6 the same reference numerals as those in FIG. 7 are assigned to portions corresponding to the elements in FIG.
- FIG. 6A shows an example of a typical metal shield structure 200.
- the metal shield structure 200 is provided on the substrate 101 and includes a metal shield 201.
- the shield 201 has a top plate 202 having a size larger than that of the LSI 102 mounted on the substrate 101, and four pieces each covering the four side surfaces of the LSI 102 provided on the four sides of the top plate 202, respectively.
- Side plate 203 Side plate 203.
- the substrate 101 has a multilayer structure, and a solid pattern ground layer 107 is formed on the inner layer of the substrate 101 as shown in FIG. 6C.
- a plurality of via holes 204 extending in the thickness direction are formed in the substrate 101. These via holes 204 are arranged in a wall shape at a narrow pitch along each side plate 203 of the shield 201.
- the shield 201 is electrically connected (grounded) to the ground layer 107 via the via hole 204.
- the upper and lower surfaces of the LSI 102 are sandwiched between the top plate 202 of the shield 201 and the ground layer 107 in the substrate 101, and the side surfaces thereof are connected to the side plate 203 of the shield 201 and via holes. 204 walls (via holes 204 arranged in a wall shape).
- the entire circumference of the LSI 102 is surrounded by the conductor plate (metal plate), so that electromagnetic noise generated from the LSI 102 is shielded.
- the amount of electromagnetic noise radiated around the LSI 102 is reduced. That is, electromagnetic noise radiation from the LSI 102 can be suppressed.
- Japanese Patent No. 3738755 proposes a shield structure in which a pair of side plates 203 on two opposite sides of the shield 201 are removed and heat is radiated therefrom. This shield structure is said to be effective in reducing EMI (Electro-Magnetic Interference) generated from a single LSI.
- EMI Electro-Magnetic Interference
- the metal shield structure 200 of FIG. 6 and the shield structure of Japanese Patent No. 3738755 suppress only the radiation of electromagnetic noise from the LSI. That is, these shield structures consider only suppression of electromagnetic noise radiated from a single LSI, and do not consider a state in which wireless devices such as antennas that receive electromagnetic noise are mixed. In other words, it is not intended for a configuration in which an electromagnetic noise receiving element such as an antenna coexists on a substrate in addition to an electromagnetic noise radiation source such as an LSI. For this reason, there is a demand for an electromagnetic shield configuration that is effective in a wireless device in which a digital circuit (digital device) and an analog circuit (analog device) are mixedly mounted.
- an object of the present invention is to provide an electromagnetic shield structure capable of suppressing mixing of electromagnetic noise generated from a digital device into a wireless device, and a wireless device using the electromagnetic shield structure.
- Another object of the present invention is to provide an electromagnetic shield structure having a power supply decoupling function of a digital device in addition to an electromagnetic shield function, and a radio apparatus using the same.
- the electromagnetic shield structure according to the first aspect of the present invention is: An electromagnetic shield structure comprising a first shield and a second shield disposed on the substrate so as to cover a digital device mounted on the substrate,
- the first shield is formed from a conductor electrically connected to the ground terminal of the substrate, and is disposed on the outermost side of the electromagnetic shield structure
- the second shield includes a conductive first structure part and a conductive second structure part formed separately from each other, and the first structure part and the second structure part are respectively formed on the substrate.
- the first structure part and the second structure part are arranged so that the opening surfaces provided at one end thereof are opposed to each other with a predetermined gap,
- the digital device is between the first structure portion and the second structure portion and is covered with the first structure portion and the second structure portion.
- the digital device which is a source of electromagnetic noise
- the first shield and the second shield are covered with the first shield and the second shield.
- the electromagnetic noise radiated from the device is shielded. Therefore, mixing of the electromagnetic noise into the wireless device can be suppressed.
- first structure portion and the second structure portion of the second shield are temporarily excited by the digital device, they are provided at one ends of the first structure portion and the second structure portion, respectively. Since the opening surfaces are opposed to each other, electromagnetic fields radiated from the opening surfaces are canceled out, and as a result, radiation of electromagnetic noise from the first structure portion and the second structure portion is reduced. Is possible. Thus, mixing of electromagnetic noise generated from the digital device into the wireless device can be effectively suppressed.
- the first shield has a U-shaped cross section and has a size covering the digital device, and the top plate The first side plate disposed on one side of the top plate and the second side plate disposed on the other side of the top plate facing the one side.
- each of the first structure portion and the second structure portion of the second shield has an L-shaped cross section, and It is formed from a top plate that covers the digital device and a side plate that is bent and connected to one side of the top plate.
- a dielectric is provided between the top plate of the first shield and the top plate of the second shield.
- the power supply decoupling function of the digital device can be obtained in addition to the electromagnetic shielding function.
- the first shield and the second shield are such that the side plate of the first shield and the side plate of the second shield are orthogonal to each other. Or arranged so as to be parallel to each other.
- the top plate of the first structure part and the top plate of the second structure part of the second shield are targeted electromagnetic waves. It has a length that is not approximately equal to 1 ⁇ 4 ( ⁇ / 4) of the noise wavelength ⁇ .
- the DC power supplies having different values are connected to each other through the first structure portion and the second structure portion of the second shield.
- a digital device can be connected.
- the first shield, the second shield, and the dielectric are electromagnetic waves that suppress electromagnetic noise from the digital device.
- the shield function it also has a power supply decoupling function that suppresses electromagnetic noise from the power supply of the digital device.
- the second shield has an integrated configuration in which the gap between the first structure portion and the second structure portion is eliminated.
- the first shield and the second shield are arranged so that the side plate of the first shield and the side plate of the second shield are orthogonal to each other, and the first shield and the second shield A dielectric is provided between the two.
- the power supply decoupling function of the digital device can be obtained in addition to the electromagnetic shielding function.
- a wireless device provides: A wireless device in which a wireless device and a digital device are mounted on a substrate, An electromagnetic shield structure including a first shield and a second shield disposed on the substrate so as to cover the digital device;
- the first shield is formed from a conductor electrically connected to the ground terminal of the substrate, and is disposed on the outermost side of the electromagnetic shield structure,
- the second shield includes a conductive first structure part and a conductive second structure part formed separately from each other, and the first structure part and the second structure part are respectively formed on the substrate.
- the first structure part and the second structure part are arranged so that the opening surfaces provided at one end thereof are opposed to each other with a predetermined gap,
- the digital device is between the first structure portion and the second structure portion and is covered with the first structure portion and the second structure portion.
- the digital device that is a source of electromagnetic noise is covered with the electromagnetic shield structure including the first shield and the second shield. Therefore, electromagnetic noise radiated from the digital device can be shielded. Therefore, mixing of the electromagnetic noise into the wireless device can be suppressed.
- the electromagnetic shield structure even if the first structure portion and the second structure portion of the second shield are temporarily excited by the digital device, the first structure portion and the second structure portion Since the opening surfaces provided at one end face each other, the electromagnetic fields radiated from the opening surfaces cancel each other, and as a result, electromagnetic noise from the first structure portion and the second structure portion. Can be reduced. Thus, mixing of electromagnetic noise generated from the digital device into the wireless device can be effectively suppressed.
- the first shield is provided on a top plate that covers the digital device, and a first side and a second side of the top plate that face each other.
- a first side plate and a second side plate disposed; the first side plate is disposed on a side closer to the wireless device; and the second side plate is disposed on a side farther from the wireless device.
- the first shield has a U-shaped cross section and has a size covering the digital device, and the ceiling.
- the first side plate is disposed on one side of the plate and the second side plate is disposed on the other side opposite to the one side of the top plate.
- the first structure portion and the second structure portion of the second shield are each L-shaped in cross section, A top plate that covers the digital device and a side plate that is bent and connected to one side of the top plate.
- a dielectric is provided between the top plate of the first shield and the top plate of the second shield.
- the power supply decoupling function of the digital device can be obtained in addition to the electromagnetic shielding function.
- the first shield and the second shield are arranged such that a side plate of the first shield and a side plate of the second shield are orthogonal to each other. Or it arrange
- the top plate of the first structure part and the top plate of the second structure part of the second shield are subject to electromagnetic noise.
- the digital power is supplied to the DC power sources having different values through the first structure portion and the second structure portion of the second shield.
- System devices can be connected.
- the first shield, the second shield, and the dielectric are electromagnetic shields that suppress electromagnetic noise from the digital device.
- it also has a power supply decoupling function that suppresses electromagnetic noise from the power supply of the digital device.
- the second shield has an integrated configuration in which the gap between the first structure portion and the second structure portion is eliminated.
- the first shield and the second shield are arranged so that the side plate of the first shield and the side plate of the second shield are orthogonal to each other, and the first shield and the second shield A dielectric is provided between the two.
- the first shield, the second shield, and the dielectric form a capacitor, the power supply decoupling function of the digital device can be obtained in addition to the electromagnetic shielding function.
- a radio apparatus provides: A wireless device in which a wireless device and a digital device are mounted on a substrate, An electromagnetic shield having a U-shaped cross-section disposed so as to cover the digital device,
- the electromagnetic shield includes a top plate having a size covering the digital device, and a pair of first side plates and second side plates respectively disposed on the first side and the second side of the top plate facing each other.
- the first side plate is disposed on the side close to the wireless device, and the second side plate is disposed on the side far from the wireless device.
- the digital device that is a source of electromagnetic noise is covered with the electromagnetic shield, and the first side plate has an electromagnetic shielding effect. Since it is arranged at an optimum position, electromagnetic noise radiated from the digital device can be shielded. Therefore, mixing of the electromagnetic noise into the wireless device can be suppressed with a simple configuration.
- the manufacturing method of the electromagnetic shield of this invention is as follows.
- a method of manufacturing an electromagnetic shield comprising a first shield and a second shield disposed on the substrate so as to cover a digital device mounted on the substrate,
- the conductor forming the first shield is electrically connected to the ground terminal of the substrate, and the first shield is formed by arranging the first shield on the outermost side.
- the electrically conductive first structure part and the electrically conductive second structure part formed separately from each other forming the second shield are electrically connected to the power supply terminals of the substrate, respectively, and the first structure part And at one end of the second structure portion, the opening surfaces face each other with a predetermined gap, and the digital device is between the first structure portion and the second structure portion, and the first structure portion and the second structure portion
- the second shield is formed by arranging so as to be covered by the second structure portion.
- the electromagnetic shield structure according to the first aspect of the present invention and the wireless device according to the second aspect have an effect that electromagnetic noise generated from the digital device can be prevented from being mixed into the wireless device.
- the dielectric is provided between the first shield and the second shield, an effect that a power supply decoupling function of a digital device can be obtained in addition to an electromagnetic shielding function is obtained.
- the wireless device according to the third aspect of the present invention has an effect that the electromagnetic noise generated from the digital device can be prevented from being mixed into the wireless device with a simple configuration.
- Electromagnetic shield structure 2 Antenna (wireless device) 3 1st shield 3a Top plate 3b 1st side plate 3c 2nd side plate 4 2nd shield 4a 1st L-type structure part (1st structure part) 4b 2nd L type structure part (2nd structure part) 4c, 4e Top plate 4d 1st L type structure part side plate 4f 2nd L type structure part side plate 5 Dielectric 6a, 6b Ground terminal 7a, 7b Power supply terminal 42 Shield 101 Substrate 102 LSI (digital system device)
- FIG. 1A is a perspective view thereof
- FIG. 1B is an exploded perspective view thereof
- FIG. 2 is a side view thereof.
- the electromagnetic shield structure 1 is mounted on a known wireless device (for example, a wireless communication device such as a mobile phone), and from electromagnetic noise radiated from the LSI 102 which is a digital device, or from the power supply system of the LSI 102.
- a known wireless device for example, a wireless communication device such as a mobile phone
- An electromagnetic shielding function that suppresses conduction of electromagnetic noise to the antenna 2 that is a wireless device and a power supply decoupling function of the LSI 102 are provided.
- the electromagnetic shield structure 1 used in the wireless device is electrically connected to a ground layer 107 inside a substrate 101 having a multilayer structure via ground terminals 6 a and 6 b on the substrate 101.
- the first shield 3 connected (grounded), the second shield 4 electrically connected to the power terminals 7a and 7b of the substrate 101, and the dielectric provided between the first shield 3 and the second shield 4 And 5.
- the LSI 102 that is an electromagnetic noise source mounted on the substrate 101 is covered in the order of the second shield 4, the dielectric 5, and the first shield 3 from a position close to that. .
- the first shield 3 has a U-shaped cross section and is arranged so as to cover the LSI 102.
- the first shield 3 is formed by bending a metal plate into a U-shaped cross section, and includes one rectangular top plate 3a, a rectangular first side plate 3b connected to one side of the top plate 3a, A rectangular second side plate 3c integrally connected to the other side of the top plate 3a facing the first side plate 3b (on the opposite side of the first side plate 3b).
- the first side plate 3b and the second side plate 3c are connected to the top plate 3a at an angle of approximately 90 degrees and face each other.
- the top plate 3 a is disposed substantially parallel to the substrate 101.
- the first side plate 3 b and the second side plate 3 c are substantially perpendicular to the substrate 101.
- first side plate 3b and second side plate 3c have the same shape and the same size, and are electrically connected to the ground terminals 6a and 6b on the substrate 101 by solder or the like at their lower ends. Connected to (grounded). The first shield 3 is thus fixed on the substrate 101.
- the second shield 4 has a configuration in which a first L-type structure portion 4a and a second L-type structure portion 4b formed in an L-shaped cross section are combined.
- Each of the first L-type structure portion 4a and the second L-type structure portion 4b is formed of a metal plate bent in an L-shaped cross section.
- the first L-type structure portion 4a includes a rectangular top plate 4c, and a rectangular side plate connected to one side of the top plate 4c at an angle of about 90 degrees with respect to the top plate 4c (hereinafter referred to as a first L-type structure portion side plate). 4d).
- the second L-type structure portion 4b has the same dimensions and shape as the first L-type structure portion 4a, and is connected to a rectangular top plate 4e and one side of the top plate 4e at an angle of approximately 90 degrees with respect to the top plate 4e. And a rectangular side plate (hereinafter also referred to as a second L-type structure portion side plate) 4f.
- the top plates 4 c and 4 e are disposed substantially parallel to the substrate 101.
- the side plates 4d and 4f are substantially perpendicular to the substrate 101.
- the first L-type structure portion 4a and the second L-type structure portion 4b include an opening surface (notch portion) 4g provided at one end of the top plate 4c of the first L-type structure portion 4a (the side opposite to the side plate 4d), and the second L-type structure portion 4b.
- An opening surface (notch portion) 4h provided at one end of the top portion 4e of the structure portion 4b (opposite side of the side plate 4f) is opposed with a slight gap G therebetween.
- the opening surfaces (notches) 4g and 4h are substantially parallel.
- the second shield 4 sandwiches the LSI 102 between the side plate 4d of the first L-type structure portion 4a and the side plate 4f of the second L-type structure portion 4b, and the top plate 4c of the first L-type structure portion 4a and the top of the second L-type structure portion 4b.
- the LSI 102 is covered with a plate 4e.
- power terminals 7a and 7b are formed on the outer sides of the two opposite side surfaces of the LSI 102, respectively.
- the first L-type structure part side plate 4d and the second L-type structure part side plate 4f of the second shield 4 are electrically connected to the power supply terminals 7a and 7b, respectively, by solder or the like. In this way, the second shield 4 is fixed on the substrate 101.
- ground terminals 6a and 6b are formed outside the other two side surfaces of the LSI 102 facing each other on the surface layer of the substrate 101, the ground terminals 6a and 6b and the power supply terminals 7a and 7b are in a direction orthogonal to each other. It is extended.
- the first L-type structure part side plate 4d and the second L-type structure part side plate 4f of the second shield 4 are orthogonal to the first side plate 3b and the second side plate 3c of the first shield 3.
- top plate 4c of the first L-type structure portion 4a of the second shield 4 and the top plate 4e of the second L-type structure portion 4b On the top plate 4c of the first L-type structure portion 4a of the second shield 4 and the top plate 4e of the second L-type structure portion 4b, a rectangular plate-like shape that is substantially equal in size to the top plate 3a of the first shield 3 A dielectric 5 is placed. The top plate 3 a of the first shield 3 is in close contact with the upper surface of the dielectric 5.
- the ground terminals 6a and 6b to which the first shield 3 is connected are provided with a plurality of ground connection vias (described later) along their longitudinal directions.
- the first shield 3 is electrically grounded to the ground layer 107 provided in the inner layer of the substrate 101 through these vias.
- an LSI 102 that is a source of electromagnetic noise and an antenna 2 in which electromagnetic noise is mixed are mounted on the same substrate 101, and the first shield 3 and the second shield constituting the electromagnetic shield structure 1.
- the shield 4 has a power decoupling function (power decoupling function) in addition to a function of suppressing the emission of electromagnetic noise (electromagnetic noise suppressing function).
- the first shield 3 has a size larger than that of the LSI 102, and is mounted on the substrate 101 together with the LSI 102.
- the substrate 101 is a multilayer substrate, having a ground layer 107 made of a solid pattern on the inner layer, and having rectangular ground terminals 6a and 6b for grounding on the surface layer.
- the ground terminals 6a and 6b are electrically connected (grounded) to the ground layer 107 through the inner via holes 10, respectively.
- the ground terminals 6a and 6b are selected to have substantially the same length as the first side plate 3b and the second side plate 3b of the first shield 3, and a plurality of via holes 10 are arranged at a narrow pitch inside the substrate 101 along the longitudinal direction thereof. To form a via hole row (not shown). This is to enhance the grounding between the ground terminals 6a and 6b and the ground layer 107.
- this via hole row behaves equivalently as a metal wall. Therefore, when the first shield 3 is electrically connected to the ground terminals 6a and 6b, the upper and lower surfaces and the left and right surfaces of the LSI 102 are shielded by the metal plates, and therefore the first shield 3, the via hole row, and the ground layer 107 are formed. A shield structure is formed. As a result, electromagnetic noise from the LSI 102 can be effectively suppressed.
- the second shield 4 is connected to the power supply system of the substrate 101, and here is electrically connected to power supply terminals 7 a and 7 b that supply a predetermined potential to the LSI power supply terminal 11.
- a first shield 3 that is slightly larger in width is covered on the second shield 4, and the first side plate 3 b and the second side plate 3 c of the first shield 3 are the first L-type structure part side plates of the second shield 4. 4d and the second L-shaped structure side plate 4f.
- a dielectric 5 having a size corresponding to the top plate 3a of the first shield 3 is provided between the first shield 3 and the second shield 4.
- the top plate 3a of the first shield 3 and the top plates 4c and 4e of the second shield 4 behave like electrode plates, and the first shield 3 and the top plate 3a are provided by the dielectric 5 provided between the two electrode plates.
- the insulating property of the second shield 4 is maintained.
- the first shield 3 and the second shield 4 form a capacitor (capacitor) and have a function as power supply system decoupling.
- the capacitor generally has a low impedance in a high frequency band
- the power supply terminals 7a and 7b are equivalent to being grounded to the ground layer 107 by the second shield 4 in terms of high frequency.
- the second shield 4 acts as an electromagnetic shield against high-frequency noise radiated from the LSI 102 even if it is configured to be connected to the power supply system.
- the 2nd shield 4 is comprised from the combination of the 1st L type
- the top plate 4c of the first L-type structure unit 4a and the top plate 4e of the second L-type structure unit 4b are arranged so as to cover the LSI 102, and the gap G between the top plates 4c and 4e is extremely narrow compared to the wavelength ⁇ . Has been. For this reason, electromagnetic noise at high frequencies radiated from the LSI 102 can be shielded not only by the first shield 3 but also by the first L-type structure portion 4a and the second L-type structure portion 4b arranged on the left and right sides of the LSI 102. .
- the second shield 4 has a configuration in which the divided first L-type structure portion 4a and second L-type structure portion 4b are made non-conductive with a slight gap G therebetween. For this reason, in the second shield 4, the first L-type structure portion 4 a and the second L-type structure portion 4 b connected to the power source are divided in a direct current manner. Two power supply voltages having different values can be supplied.
- this electromagnetic shield structure 1 it is possible to supply different voltages to the first L-type structure unit 4a and the second L-type structure unit 4b even when the LSI 102 is a two-power supply type LSI group, for example. Power decoupling is also possible.
- the lengths L1 and L2 of the top plate are reduced by the electromagnetic noise to be radiated.
- the resonance length is about 1 ⁇ 4 of the wavelength ⁇ (integer multiple of ⁇ / 4)
- it resonates to behave like a patch antenna, and electromagnetic waves are generated from the opening surface 4g of the top plate 4c and the opening surface 4h of the top plate 4e. The field may be radiated.
- the first L-type structure portion 4a and the second L-type structure portion 4b face each other so as to sandwich the LSI 102, and are provided at the tip of the top plate 4c of the first L-type structure portion 4a.
- the opening surface 4g and the opening surface 4h provided at the tip of the top plate 4e of the second L-type structure portion 4b are configured to face each other.
- the first shield 3 is configured in consideration of the relationship with the position of the antenna 2, and a greater shielding effect is drawn out. That is, as shown in FIG. 1A, FIG. 1B, and FIG. 2, the first shield 3 is disposed closer to the antenna 2 than the second shield 4, so the first shield 3 is as shown below. With special features.
- the first shield 3 has a second side plate 3c arranged on one side of the four sides of the top plate 3a on the side where the antenna 2 is located, and one side opposite to the second side plate 3c.
- the first side plate 3b is disposed on the side.
- the present inventor uses electromagnetic field analysis to mix the amount of noise generated from the LSI 102 into the antenna 2. Evaluated.
- Model A is the structure of the 1st shield 3 described in FIG. 1A, Comprising: Of the four sides of the top plate 3a, the side on which the antenna 2 is located (the side closest to the antenna 2) and the side opposite thereto A pair of the first side plate 3b and the second side plate 3c are arranged on each side (the side farthest from the antenna 2).
- Model B the first side plate 3b and the second side plate 3c are present on the side where the antenna 2 is located (the side closest to the antenna 2) and the side facing it (the side farthest from the antenna 2).
- An opening surface not to be disposed is disposed, and a pair of first side plate 3b and second side plate 3c are disposed on the other two sides, respectively.
- a loop model was used with reference to that disclosed in Japanese Patent No. 3885830 (Japanese Patent Application No. 2006-162491).
- the antenna 2 a monopole antenna was used.
- a loop model of the LSI 102 was excited at a frequency of 1 GHz, and a noise current mixed into the antenna 2 was calculated as a noise amount.
- the noise mixed into the antenna 2 was greatly reduced by about 40 dB compared to the model B by covering the LSI 102 with the first shield 3 as in the model A.
- the shielding effect for suppressing the noise amount was about 8 dB lower, and that the shielding effect of the model A was much larger.
- 20 dB of the shield effect said here is equivalent to an electric current becoming 1/10.
- the model A in which the first side plate 3b and the second side plate 3c are arranged on a pair of sides including the side on which the antenna 2 is located is more preferable. A greater shielding effect was obtained, and it was confirmed that the configuration was effective.
- the first side plate 3b and the second side plate 3c of the first shield 3 according to the positional relationship with the antenna 2. That is, in the case of the wireless device according to the first embodiment, in order to suppress the amount of noise generated from the LSI 102 and mixed into the antenna 2, it is desirable to simply provide the first side plate 3b and the second side plate 3c. It has been found that it is important to consider the positions of the first side plate 3b and the second side plate 3c with respect to the antenna 2 without necessarily obtaining the shielding effect.
- the electromagnetic shield structure 1 In the electromagnetic shield structure 1 according to the present invention, an effective shield configuration with respect to the position of the antenna 2 is realized, and a double shield configuration including the first shield 3 and the second shield 4 is realized. Further, in addition to such a shielding function, a power source decoupling function of the LSI 102 is also provided by realizing a capacitor configuration using the dielectric 5. For this reason, the electromagnetic shield structure 1 is effective for suppressing noise radiated from the LSI 102 and suppressing noise mixed into the antenna 2, and in particular, the wireless device on which the antenna 2 is mounted is effective.
- the electromagnetic shield structure 1 of the first embodiment includes the first shield 3 and the second shield 4 arranged so as to cover the LSI 102 mounted on the substrate 101.
- the first shield 3 is formed of a conductor that is electrically connected to the ground terminals 6 a and 6 b of the substrate 101 and is disposed on the outermost side of the electromagnetic shield structure 1.
- the second shield 4 includes a conductive first L-type structure portion 4a and a conductive second L-type structure portion 4b formed separately from each other, and the first L-type structure portion 4a and the second L-type structure portion. 4b are electrically connected to the power supply terminals 7a and 7b of the substrate 101, respectively.
- first L-type structure portion 4a and the second L-type structure portion 4b are arranged so that the opening surfaces 4g and 4h provided at one end thereof face each other with a predetermined gap G, and the LSI 102
- the first L-type structure portion 4a and the second L-type structure portion 4b are covered with the first L-type structure portion 4a and the second L-type structure portion 4b.
- the electromagnetic shield structure 1 has a shield function that suppresses the influence of electromagnetic noise radiated from the LSI 102 by the first shield 3 and the second shield 4, and the first L-type structure portion 4 a and the second L-type structure. Even if the structure portion 4b is excited by the LSI 102, the opening surface 4g of the first L-type structure portion 4a and the opening surface 4h of the second L-type structure portion 4b are opposed to each other. As a result, it is possible to reduce the emission of electromagnetic noise from the first L-type structure part 4a and the second L-type structure part 4b.
- the LSI 102 that is a source of electromagnetic noise is covered with a double shield structure of the first shield 3 and the second shield 4, and the second side plate 3 c of the first shield 3 close to the antenna 2 is covered. Since the configuration is such that the shield effect is arranged at an optimum position where the effect is further obtained, the effect of suppressing the noise entering the antenna 2 can be obtained together with the effect of shielding the noise radiated from the LSI 102.
- the first shield 3 and the second shield 4 sandwiching the dielectric 5 form a capacitor.
- the power supply decoupling function of the LSI 102 is also provided. That is, the first shield 3 and the second shield 4 behave like a pair of electrode plates across the dielectric 5 and also function as a capacitor. Therefore, the power terminals 7a and 7b and the ground terminals 6a and 6b of the LSI 102 are A capacitor is inserted between them, which is effective for decoupling noise from the power supply system.
- the electromagnetic shielding structure 1 is effective for suppressing noise generated from a digital device such as the LSI 102 and suppressing noise mixing into the antenna 2 due to the shielding effect and the decoupling effect. This is effective in a wireless device equipped with a functional module, a wireless device antenna 2 and the like.
- the first L-type structure part side plate 4d and the second L-type structure part side plate 4f of the second shield 4 are arranged so as to be orthogonal to the first side plate 3b and the second side plate 3c of the first shield 3.
- the first L-type structure part side plate 4 d and the second L-type structure part side plate 4 f of the second shield 4 are parallel to the first side plate 3 b and the second side plate 3 c of the first shield 3. You may arrange in.
- FIG. 3 shows an electromagnetic shield structure 21 according to a second embodiment of the present invention
- FIG. 3A is a perspective view thereof
- FIG. 3B is an exploded perspective view thereof
- FIG. 3C is a side view thereof.
- the same reference numerals are given to portions common to the configurations of FIGS. 1 and 2 described in the first embodiment.
- the first L-type structure part side plate 4d and the second L-type structure part side plate 4f of the second shield 4 are parallel to the first side plate 3b and the second side plate 3c of the first shield 3. It is arranged to be.
- the power terminals 22a and 22b on the substrate 101 are also arranged corresponding to the positions of the first L-type structure part side plate 4d and the second L-type structure part side plate 4f of the second shield 4.
- the electromagnetic shield structure 21 of the present embodiment is different from the first embodiment described above in terms of the positions of the power supply terminals 22a and 22b and the arrangement position of the second shield 4, and other configurations and mounting structures are the same as those described above. The same as in the first embodiment.
- the decoupling is performed.
- a ring capacitor is also formed.
- the first side plate 3b and the second side plate 3c of the first shield 3 are respectively provided on one side on which the antenna 2 is disposed and on the other side opposite to the one side.
- the electromagnetic shield structure 21 according to the second embodiment also provides a shielding function and a decoupling function, suppresses noise generated from the LSI 102 mounted on the wireless device, and an antenna. This is effective for suppressing noise mixing into 2.
- the second shield 4 may not be divided into two parts but may be integrated.
- FIG. 4 shows an electromagnetic shield structure 31 according to a third embodiment of the present invention
- FIG. 4A is a perspective view thereof
- FIG. 4B is an exploded perspective view thereof.
- the same reference numerals are given to the portions common to the configurations of FIGS. 1 and 2 described in the first embodiment.
- the electromagnetic shield structure 31 according to the third embodiment has a configuration in which the second shield 32 is integrated. As shown in FIGS. 4A and 4B, this electromagnetic shield structure 31 is integrated such that the second shield 32 is formed in a U-shaped cross section and does not have the gap G (see FIG. 1B) as in the first embodiment. Have a configuration.
- the pair of first L-type structure part side plates 32d and second L-type structure part side plates 32c provided on the two opposing sides of the rectangular top plate 32a of the second shield 32 are the first shield 3 first. It arrange
- the electromagnetic shield structure 31 is effective for suppressing noise from the LSI 102 and suppressing mixing of noise into the antenna 2.
- the electromagnetic shield structure according to the present invention may suppress electromagnetic noise radiated from the LSI and noise mixed into the antenna of the wireless device by using only the electromagnetic shield function.
- FIG. 5 shows an example of the electromagnetic shield structure 41 of the fourth embodiment using only the electromagnetic shield function
- FIG. 5A is a perspective view thereof
- FIG. 5B is a side view thereof.
- the same reference numerals are given to portions common to the configurations of FIGS. 1 and 2 described in the first embodiment.
- This electromagnetic shield structure 41 is configured by only the shield 42 grounded to the ground layer 107 by removing the second shield 4 (see FIG. 1B) as in the first embodiment described above, and simplification of parts. It is illustrated.
- the rectangular top plate 42a of the shield 42 is integrally formed with a rectangular first side plate 42d on one side where the antenna is located, and a rectangular second side plate 42c is integrally formed on the other side facing the one side. Is formed.
- the shield 42 can suppress the noise mixed into the antenna 2 by the first side plate 42d and the second side plate 42c.
- the above first to fourth embodiments show preferred examples of the present invention. Therefore, the present invention is not limited to these embodiments.
- the electromagnetic shield structure may be applied to general noise radiation sources such as modules in addition to LSI, and various modifications are possible. Needless to say.
- the present invention can be widely applied as an electromagnetic shield for high-frequency equipment that generates electromagnetic noise.
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Abstract
Description
基板上に実装されたデジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールド構造であって、
前記第1シールドは、前記基板のグランド端子に電気的に接続された導体から形成されていると共に、当該電磁シールド構造の最も外側に配置されており、
前記第2シールドは、互いに別体として形成された導電性の第1構造部および導電性の第2構造部を備えていると共に、前記第1構造部および前記第2構造部はそれぞれ前記基板の電源端子に電気的に接続されており、
前記第1構造部および前記第2構造部は、それらの一端にそれぞれ設けられた開口面が所定の間隙をおいて互いに対向するように配置されており、
前記デジタル系デバイスは、前記第1構造部と前記第2構造部の間にあって前記第1構造部と前記第2構造部によって覆われていることを特徴とするものである。
無線系デバイスとデジタル系デバイスとが基板上に実装された無線装置であって、
前記デジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールド構造を有し、
前記第1シールドは、前記基板のグランド端子に電気的に接続された導体から形成されていると共に、当該電磁シールド構造の最も外側に配置されており、
前記第2シールドは、互いに別体として形成された導電性の第1構造部および導電性の第2構造部を備えていると共に、前記第1構造部および前記第2構造部はそれぞれ前記基板の電源端子に電気的に接続されており、
前記第1構造部および前記第2構造部は、それらの一端にそれぞれ設けられた開口面が所定の間隙をおいて互いに対向するように配置されており、
前記デジタル系デバイスは、前記第1構造部と前記第2構造部の間にあって前記第1構造部と前記第2構造部によって覆われていることを特徴とするものである。
無線系デバイスとデジタル系デバイスとが基板上に実装された無線装置であって、
前記デジタル系デバイスを覆うように配置された、断面コ字状の電磁シールドを備え、
前記電磁シールドは、前記デジタル系デバイスを覆う大きさを有する天板と、前記天板の互いに対向する第1辺と第2辺にそれぞれ配置された一対の第1側板および第2側板とを有していて、前記第1側板が前記無線系デバイスに近い側に配置され、前記第2側板が前記無線系デバイスから遠い側に配置されることを特徴とするものである。
基板上に実装されたデジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールドの製造方法であって、
前記第1シールドを形成する導体を前記基板のグランド端子に電気的に接続すると共に、当該第1シールドを最も外側に配置することで前記第1シールドを形成し、
前記第2シールドを形成する互いに別体として形成された導電性の第1構造部および導電性の第2構造部を、それぞれ前記基板の電源端子に電気的に接続すると共に、前記第1構造部および前記第2構造部の一端に開口面が所定の間隙をおいて互いに対向し、且つ、前記デジタル系デバイスが前記第1構造部と前記第2構造部の間にあって当該第1構造部と当該第2構造部により覆われるように配置する、ことで前記第2のシールドを形成する。
2 アンテナ(無線系デバイス)
3 第1シールド
3a 天板
3b 第1側板
3c 第2側板
4 第2シールド
4a 第1L型構造部(第1構造部)
4b 第2L型構造部(第2構造部)
4c、4e 天板
4d 第1L型構造部側板
4f 第2L型構造部側板
5 誘電体
6a、6b グランド端子
7a、7b 電源端子
42 シールド
101 基板
102 LSI(デジタル系デバイス)
図1及び図2は、本発明の第1実施形態による電磁シールド構造1を示しており、図1Aはその斜視図、図1Bはその分解斜視図、図2はその側面図である。
次に、本発明によるシールド構造の変形例を示す。
その他の実施の形態として、第2シールド4を2分割構造としないで、一体化構造としても良い。
さらに、本発明による電磁シールド構造は、電磁シールド機能だけを利用して、LSIから放射する電磁ノイズの抑制、および無線装置のアンテナへ混入するノイズの抑制を行っても良い。
上記第1~4実施形態は、本発明の好適な例を示すものである。したがって、本発明はこれらの実施形態に限定されず、例えば、電磁シールド構造は、LSIのほかにモジュールなどの一般的なノイズ放射源に対して適用してもよく、種々の変形が可能なことは言うまでもない。
Claims (21)
- 基板上に実装されたデジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールド構造であって、
前記第1シールドは、前記基板のグランド端子に電気的に接続された導体から形成されていると共に、当該電磁シールド構造の最も外側に配置されており、
前記第2シールドは、互いに別体として形成された導電性の第1構造部および導電性の第2構造部を備えていると共に、前記第1構造部および前記第2構造部はそれぞれ前記基板の電源端子に電気的に接続されており、
前記第1構造部および前記第2構造部は、それらの一端にそれぞれ設けられた開口面が所定の間隙をおいて互いに対向するように配置されており、
前記デジタル系デバイスは、前記第1構造部と前記第2構造部の間にあって前記第1構造部と前記第2構造部によって覆われていることを特徴とする電磁シールド構造。 - 前記第1シールドが、断面コ字状であって、前記デジタル系デバイスを覆う大きさを有する天板と、前記天板の一辺に配置された第1側板と、前記一辺に対向する前記天板の他の一辺に配置された第2側板とから形成されている請求項1に記載の電磁シールド構造。
- 前記第2シールドの前記第1構造部と前記第2構造部が、それぞれ、断面L字状であって、前記デジタル系デバイスを覆う天板と、前記天板の一辺に屈曲して接続された側板とから形成されている請求項1に記載の電磁シールド構造。
- 前記第1シールドの天板と前記第2シールドの天板の間に、誘電体が設けられている請求項1に記載の電磁シールド構造。
- 前記第1シールドと前記第2シールドが、前記第1シールドの側板と前記第2シールドの側板とが互いに直交するように、または互いに平行となるように配置されている請求項1に記載の電磁シールド構造。
- 前記第2シールドの前記第1構造部の天板と前記第2構造部の天板が、対象とする電磁ノイズの波長λの概ね1/4(λ/4)に等しくない長さを持っている請求項1に記載の電磁シールド構造。
- 前記第2シールドの前記第1構造部と前記第2構造部を介して、互いに異なる値の直流電源に前記デジタル系デバイスを接続可能とされている請求項1に記載の電磁シールド構造。
- 前記第1シールドと前記第2シールドと前記誘電体とが、前記デジタル系デバイスからの電磁ノイズを抑制する電磁シールド機能に加えて、前記デジタル系デバイスの電源からの電磁ノイズを抑制する電源デカップリング機能をも有している請求項4に記載の電磁シールド構造。
- 前記第2シールドが、前記第1構造部と前記第2構造部の間の前記間隙を無くした一体型構成とされていて、前記第1シールドと前記第2シールドが、前記第1シールドの側板と前記第2シールドの側板とが互いに直交するように配置されるとともに、前記第1シールドと前記第2シールドの間に誘電体が設けられている請求項1に記載の電磁シールド構造。
- 無線系デバイスとデジタル系デバイスとが基板上に実装された無線装置であって、
前記デジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールド構造を有し、
前記第1シールドは、前記基板のグランド端子に電気的に接続された導体から形成されていると共に、当該電磁シールド構造の最も外側に配置されており、
前記第2シールドは、互いに別体として形成された導電性の第1構造部および導電性の第2構造部を備えていると共に、前記第1構造部および前記第2構造部はそれぞれ前記基板の電源端子に電気的に接続されており、
前記第1構造部および前記第2構造部は、それらの一端にそれぞれ設けられた開口面が所定の間隙をおいて互いに対向するように配置されており、
前記デジタル系デバイスは、前記第1構造部と前記第2構造部の間にあって前記第1構造部と前記第2構造部によって覆われていることを特徴とする無線装置。 - 前記第1シールドが、前記デジタル系デバイスを覆う天板と、前記天板の互いに対向する第1辺と第2辺にそれぞれ配置された一対の第1側板および第2側板とを有していて、
前記第1側板が前記無線系デバイスに近い側に配置され、前記第2側板が前記無線系デバイスから遠い側に配置されている請求項10に記載の無線装置。 - 前記第1シールドが、断面コ字状であって、前記デジタル系デバイスを覆う大きさを有する天板と、前記天板の一辺に配置された第1側板と、前記天板の一辺に対向する他の一辺に配置された第2側板とから形成されている請求項10に記載の無線装置。
- 前記第2シールドの前記第1構造部と前記第2構造部が、それぞれ、断面L字状であって、前記デジタル系デバイスを覆う天板と、前記天板の一辺に屈曲して接続された側板とから形成されている請求項10に記載の無線装置。
- 前記第1シールドの天板と前記第2シールドの天板の間に、誘電体が設けられている請求項10に記載の無線装置。
- 前記第1シールドと前記第2シールドが、前記第1シールドの側板と前記第2シールドの側板とが互いに直交するように、または互いに平行となるように配置されている請求項10に記載の無線装置。
- 前記第2シールドの前記第1構造部の天板と前記第2構造部の天板が、対象とする電磁ノイズの波長λの概ね1/4(λ/4)に等しくない長さを持っている請求項10に記載の無線装置。
- 前記第2シールドの前記第1構造部と前記第2構造部を介して、互いに異なる値の直流電源に前記デジタル系デバイスを接続可能である請求項10に記載の無線装置。
- 前記第1シールドと前記第2シールドと前記誘電体とが、前記デジタル系デバイスからの電磁ノイズを抑制する電磁シールド機能に加えて、前記デジタル系デバイスの電源からの電磁ノイズを抑制する電源デカップリング機能をも有している請求項14に記載の無線装置。
- 前記第2シールドが、前記第1構造部と前記第2構造部の間の前記間隙を無くした一体型構成とされていて、前記第1シールドと前記第2シールドが、前記第1シールドの側板と前記第2シールドの側板とが互いに直交するように配置されていると共に、前記第1シールドと前記第2シールドの間に誘電体が設けられている請求項10に記載の無線装置。
- 無線系デバイスとデジタル系デバイスとが基板上に実装された無線装置であって、
前記デジタル系デバイスを覆うように配置された、断面コ字状の電磁シールドを備え、
前記電磁シールドは、前記デジタル系デバイスを覆う大きさを有する天板と、前記天板の互いに対向する第1辺と第2辺にそれぞれ配置された一対の第1側板および第2側板とを有していて、前記第1側板が前記無線系デバイスに近い側に配置され、前記第2側板が前記無線系デバイスから遠い側に配置されることを特徴とする無線装置。 - 基板上に実装されたデジタル系デバイスを覆うように前記基板上に配置された、第1シールドおよび第2シールドを備えてなる電磁シールドの製造方法であって、
前記第1シールドを形成する導体を前記基板のグランド端子に電気的に接続すると共に、当該第1シールドを最も外側に配置することで前記第1シールドを形成し、
前記第2シールドを形成する互いに別体として形成された導電性の第1構造部および導電性の第2構造部を、それぞれ前記基板の電源端子に電気的に接続すると共に、前記第1構造部および前記第2構造部の一端に開口面が所定の間隙をおいて互いに対向し、且つ、前記デジタル系デバイスが前記第1構造部と前記第2構造部の間にあって当該第1構造部と当該第2構造部により覆われるように配置する、ことで前記第2のシールドを形成する、
電磁シールドの製造方法。
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US12/866,224 US8379408B2 (en) | 2008-02-28 | 2008-12-09 | Electromagnetic shield structure, wireless device using the structure, and method of manufacturing electromagnetic shield |
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US8379408B2 (en) | 2013-02-19 |
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JPWO2009107303A1 (ja) | 2011-06-30 |
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