US20080145688A1 - Method of joining tantalum clade steel structures - Google Patents

Method of joining tantalum clade steel structures Download PDF

Info

Publication number
US20080145688A1
US20080145688A1 US11/638,625 US63862506A US2008145688A1 US 20080145688 A1 US20080145688 A1 US 20080145688A1 US 63862506 A US63862506 A US 63862506A US 2008145688 A1 US2008145688 A1 US 2008145688A1
Authority
US
United States
Prior art keywords
tantalum
steel
layer
powder
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/638,625
Other languages
English (en)
Inventor
Steven A. Miller
Leonid N. Shekhter
Stefan Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Glas Trust Corp Ltd
HC Starck GmbH
Materion Newton Inc
Original Assignee
HC Starck GmbH
HC Starck Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39253943&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20080145688(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to US11/638,625 priority Critical patent/US20080145688A1/en
Application filed by HC Starck GmbH, HC Starck Inc filed Critical HC Starck GmbH
Assigned to H.C. STARCK, INC., H.C. STARCK GMBH reassignment H.C. STARCK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZIMMERMAN, STEFAN, SHEKHTER, LEONID N., MILLER, STEVEN A.
Assigned to DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT reassignment DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (MEZZANINE) Assignors: H.C. STARCK INC.
Assigned to DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT reassignment DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (SECOND LIEN) Assignors: H.C. STARCK INC.
Assigned to DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT reassignment DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SECURITY AGENT INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (SENIOR) Assignors: H.C. STARCK INC.
Priority to JP2009541551A priority patent/JP5268937B2/ja
Priority to EP07869148.2A priority patent/EP2097558B1/en
Priority to EP20140166073 priority patent/EP2818577A1/en
Priority to PCT/US2007/087214 priority patent/WO2008076748A2/en
Priority to EP16152858.3A priority patent/EP3023516B1/en
Publication of US20080145688A1 publication Critical patent/US20080145688A1/en
Priority to US13/026,370 priority patent/US8002169B2/en
Priority to US13/184,665 priority patent/US8113413B2/en
Priority to US13/343,113 priority patent/US8448840B2/en
Assigned to COMMERZBANKAG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE SENIOR SECURED PARTIES reassignment COMMERZBANKAG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE SENIOR SECURED PARTIES SECURITY AGREEMENT Assignors: H.C. STARCK INC.
Assigned to COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE MEZZANINE SECURED PARTIES reassignment COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE MEZZANINE SECURED PARTIES SECURITY AGREEMENT Assignors: H.C. STARCK INC.
Assigned to COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE SECOND LIEN SECURED PARTIES reassignment COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGENT FOR THE BENEFIT OF THE SECOND LIEN SECURED PARTIES SECURITY AGREEMENT Assignors: H.C. STARCK INC.
Priority to US13/848,404 priority patent/US8777090B2/en
Priority to US14/293,643 priority patent/US9095932B2/en
Assigned to GLAS TRUST CORPORATION LIMITED reassignment GLAS TRUST CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF MEZZANINE SECURED PARTIES
Assigned to GLAS TRUST CORPORATION LIMITED reassignment GLAS TRUST CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF SENIOR SECURED PARTIES
Assigned to GLAS TRUST CORPORATION LIMITED reassignment GLAS TRUST CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF SECOND LIEN SECURED PARTIES
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Assigned to H.C. STARCK INC. reassignment H.C. STARCK INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: GLAS TRUST CORPORATION LIMITED
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12069—Plural nonparticulate metal components
    • Y10T428/12076—Next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]

Definitions

  • Tantalum is a highly corrosion resistant, bio-friendly metal. As a result it finds wide use in reactors, heat exchangers, piping and the like in the chemical and pharmaceutical processing industries. Because tantalum is very expensive often the structural components used in this equipment are made up of a steel or stainless steel section for strength purposes that is clad with a thin sheet of tantalum to prevent interaction with the process fluid. In order for the tantalum sheet to provide corrosion protection for a whole vessel many such sheets must be joined together into a single impermeable piece. Many techniques have been used but all of them are costly, have severe deficiencies, and cause the cost of the basic tantalum clad steel section to be higher than necessary. This invention provides a low cost, chemical resistant, material and manpower efficient means of joining the tantalum sheets together.
  • Cold spray or kinetic spray is an emerging industrial technology that is being employed to solve many industrial manufacturing challenges (see, e.g., U.S. Pat. Nos. 6,924,974, 6,444,259, 6,491,208 and 6,905,728).
  • Cold spray employs a high velocity gas jet to rapidly accelerate powder particles to high velocity such that when they impact a surface the particles bond to the surface to form an integral, well bonded and dense coating.
  • tantalum is a preferred corrosion resistant material in industries that process chemically aggressive liquids. Because of tantalum's high cost rather than being used as a thick structural member, it is frequently used in thin layers as a protective cladding on steel or stainless steel. Many techniques have been developed to attach tantalum clad to the substrate material such as high temperature brazing (U.S. Pat. No. 4,291,104), low temperature soldering (U.S. Pat. No. 4,011,981), diffusion bonding (U.S. Pat. No. 5,693,203), explosive bonding (U.S. Pat. No. 4,291,104), and flouroelastomers (U.S. Pat. No. 4,140,172).
  • high temperature brazing U.S. Pat. No. 4,291,104
  • low temperature soldering U.S. Pat. No. 4,011,981
  • diffusion bonding U.S. Pat. No. 5,693,203
  • explosive bonding U.S. Pat. No. 4,291,104
  • flouroelastomers U.
  • U.S. Pat. No. 4,073,427 solves the problem of joining the sheets by providing a machined groove around the entire perimeter of all of the structural parts to be joined.
  • the structural steel is then welded and a machined tantalum batten is inserted in the groove to isolate the tantalum from the steel when the tantalum is welded.
  • the tantalum sheet can then be bent flat (it has to be bent up initially to allow insertion of the batten) and the final tantalum weld performed.
  • purge holes must be provided in the steel element to allow for the introduction of inert gases to protect the final tantalum weld.
  • U.S. Pat. No. 4,818,629 provides a similar approach except that three battens are used, one steel and two tantalum battens. This approach requires two welds as well as multiple purge holes drilled in the steel backing sheet.
  • U.S. Pat. No. 5,305,946 attempts to improve on the above processes by providing a wide single batten that completely fills the gap between the two tantalum sheets and then double welding a tantalum closure across the top of the tantalum sheets. All of the references discussed so far are done so in terms of joining flat sections. The problems become far more difficult when welding rings to rings to form long vessels, or domes to rings to provide a pressure closure or even vessel penetrations for piping. Bending the tantalum sheet in a circular pattern, then bending 90 degrees out of the plane of the circle, inserting the batten and bending the two tantalum sheets flat again is time consuming and difficult.
  • U.S. Pat. No. 4,459,062 describes a process using a plasma arc spray overlay to cover the contaminated weld of the tantalum protective layer.
  • a high temperature plasma arc spray is used to provide a protective layer of tantalum over the contaminated weld. Because these joints are used on large structures they usually must be made in air, thus the hot plasma arc causes both the tantalum sheet and the tantalum powder to oxidize due to the plasma's very high temperature.
  • the result is a porous, lamellar structure in the deposit that is high in oxygen content.
  • the porosity and porous grain boundaries greatly reduce the corrosion resistance by percolation effects and the high oxygen content results in a less ductile (than the tantalum sheet) deposit that is prone to cracking and can fail during operation. Additionally, because the coating is put down hot, and because the coefficient of thermal expansion for tantalum is almost double that of steel, as the structure cools the brittle plasma spray deposit is put in a state of tensile stress, a stress that potentially can lead to cracking and failure of the coating.
  • U.S. Pat. No. 6,749,002 describes a method of spray joining articles.
  • the patent indicates that cold spray as well as the many types of hot spray forming techniques (such as plasma and twin wire arc spraying) could be used.
  • the method is severely limited in that at least one of the articles must be a spray formed steel article and the sprayed particles must be steel particles.
  • this method is used for making structural steel joints involving at least one steel component.
  • the structural steel joint is provided by traditional welding techniques.
  • the sprayed material join to the steel.
  • the cold sprayed material in this case tantalum, is used to join the tantalum surface coating and to provide an impermeable corrosion resistant layer of tantalum between two or more co-existing Ta sheets.
  • U.S. Pat. 6,258,402 is even more limited in that it describes a method for repairing spray formed steel tooling. It too requires a steel spray formed part on which a steel spray formed coating will be used to fill a region which has been damaged or somehow eroded away. Additionally, once the spray forming is complete, the spray formed filler is melted and fused using conventional electric welding processes. The purpose of the invention below is to avoid heating and especially melting of the tantalum during the joining processes.
  • FIG. 1 shows the tantalum clad sections before joining.
  • FIG. 2 shows the sections joined together.
  • FIG. 3 shows another embodiment of the invention where a lap joint is used.
  • FIG. 4 shows another embodiment of the invention where a double lap joint is used.
  • FIG. 5 is a micrograph of a cross section of a tantalum cold sprayed joint that has been etched to reveal prior particle boundaries.
  • FIG. 6 shows the same cross section as shown in FIG. 5 after annealing at 1150° C. for one and a half hours.
  • the present invention is broadly directed to a process for joining tantalum clad steel structures comprising:
  • the invention is also directed to a tantalum weld or joint, wherein the weld or joint is formed by cold spraying tantalum powder and consists of elongated tantalum powder particles, elongated normal to the direction of the spray direction, and wherein the powdered particles have a random crystallographic orientation.
  • the invention is also directed to a tantalum weld or joint, wherein the weld or joint is formed by cold spraying tantalum powder followed by heta treatment and consists of equiaxed grains of approximately the same size as or smaller than the sprayed powder and wherein the grains have a random crystallographic orientation.
  • a double sided lap joint may be used, although a single sided lap joint may be employed as well.
  • each tantalum clad section is produced by cold spraying tantalum powder directly onto the respective steel layer in a pattern such that a portion of each steel layer in an edge region is not sprayed and is thus left exposed. This embodiment does, not require the use of a bonding layer.
  • a local failure can develop in tantalum clad vessels and do occur frequently.
  • a local failure is when the bulk of the cladding is fine, but a small crack or pinhole may have developed in the clad. This can result from a manufacturing defect (e.g., a gouged tantalum layer, a weld defect or an inclusion), a local hot spot or improper process chemistry.
  • the normal procedure is to enter the vessel, cut out the defect and then weld a patch on top. Of course in doing this there is the risk of overheating the tantalum layer and oxidizing it or causing an undesirable reaction with the steel below the weld.
  • cold spray could be used to repair these defects without incurring any of the risks just mentioned.
  • steel is intended to include both steel and stainless steel.
  • This invention the cold welding of the tantalum sheet using cold spray technology, forms a high density, low cost, corrosion resistant joint free from the deleterious phase mentioned above. It further allows the joining of clad steel parts where the tantalum clad to steel bonding agent is a low melting temperature solder, brazing material or even a structural adhesive.
  • the tantalum layer and the steel substrate require no special machining to provide locations for the insertion of protective battens, since battens are not used. Obviously, machining of battens or other protective strips is not required.
  • the protective cladding can be simply cut with either a straight or beveled edge such that the desired amount of steel substrate is left exposed prior to bonding of the cladding to the plate.
  • a separate bonding or brazing layer may or may not be present depending on how the tantalum is bonded to steel.
  • the clad sections may simply be placed together and the structral steel butt welded to form a single unit. The resultant seam is then filled, and cold welded together by cold spraying tantalum powder into the seam and over the edges of the tantalum clad layer.
  • the cold spray process is done at low temperatures, there is no harmful dissolution of the steel into the cold sprayed tantalum joint.
  • the tantalum joint is fully dense with no porosity or oxygen pick up which would impair the joints performance.
  • the spraying could be done while the components are held at operational temperatures of less than 250° C.
  • the present invention also raises the potential for greatly decreasing the cost of the basic tantalum clad steel component. Since the joining of the tantalum layer is done at low temperatures, there is no potential for burn through of the cladding as with high temperature processes that melt the clad to form a fusion joint. Thus, reliable cold joining on tantalum cladding of very low thicknesses is possible.
  • thickeness of the tantalum clad as low as about 0.005 inches (preferably from about 0.005 inches to about 0.040 inches, more preferably from about 0.005 inches to about 0.020 inches, and most preferably from about 0.005 inches to about 0.010 inches).
  • various gas/powder velocities can be used in the cold spray process. Generally these velocities are in the range of from 300 to 2,000 meters/second. It is generally advantageous for the powder particles to be available in an amount in the stream, which guarantees a flow rate density of the particles from 0.01 to 100 grams/(second cm 2 ) preferably from 0.01 grams/(second cm 2 ) up to 20 grams/(second cm 2 ) and most preferably from of 0.05 grams/(second cm 2 ) up to 17 grams/(second cm 2 ).
  • a stable gas such as nitrogen, or an inert gas such as argon or helium is used as the gas with which the metal powder forms the gas/powder mixture.
  • the process may be used to join many types of metals used as protective cladding such as niobium, titanium, zirconium, molybdenum and tungsten.
  • FIG. 1 two sections, 1 and 2 , are placed adjacent each other. Each section has a tantalum layer 3 , over a steel layer 4 , with a bonding or brazing layer 5 therebetween. Each section has a portion ( 6 and 7 ) of the steel layer that is not covered (these exposed sections are only idenfied by number in FIG. 1 —but are shown in each figure). In the left hand section, the portion is exposed via a beveled edge 8 , while in the right section, the portion is exposed via a straight edge 9 .
  • the beveled edge embodiment is generally preferred.
  • tanatlum could be cold sprayed onto the steel (thus eliminating the need for a bonding or brazing layer).
  • the spray configuration could be such that edge portions of the steel would be left uncoated.
  • portions of the tantalum layer and, if present, the bonding or brazing layer could be removed to expose the steel edge portions.
  • the exposed portions of the steel are welded 10 and a tantalum powder, 11 , is sprayed over the welded edges as well over the tantalum layer adjacent to the exposed portions.
  • FIG. 3 shows a single lap weld ( 12 ).
  • This approach has the advantage of requiring less Ta powder to make the weld (there is no gap to fill) but has the disadvantage that once the steel structure is welded, the larger (upper) piece of tantalum has to be bent and hammered down flat over the lower (smaller) piece of tantalum (another labor operation).
  • FIG. 4 shows another embodiment wherein a double lap weld ( 15 ) is employed.
  • This approach eliminates the bending and hammering operation required by the embodiment shown in FIG. 3 , but does use more powder and requires a tantalum batten, 13 , to fill the gap formed by the exposed steel portions and a tantalum sheet, 14 , to join the two tantalum sections.
  • a 0.020′′ thick tantalum sheet was bonded to a nominal 3 ⁇ 8′′ steel plate, using a high temperature, silver-copper eutectic braze (Bag-8, commercially available from Lucas Milhaupt of Cudahy Wis.). Then a groove was milled approximately 0.022′′ deep and nominally 0.20′′ wide down the length of the tantalum cladding to simulate the gap that would be left between the tantalum sheets after welding of the steel plate.
  • tantalum powder 15-30 microns in size (Amperit #151, special grade, commercially available from H.C.
  • sheet tantalum will provide an impervious, protective barrier
  • the powder based coating In order for the powder based coating to be protective, it must not only in itself resist corrosive attack but it must also be sufficiently dense (with no interconnected porosity) to prevent percolation by the acids through the coating. Typically for a coating to prevent percolation via interconnected porosity, the coating must be greater than 95% dense. In the tests conducted, the cold sprayed tantalum coating densities were typically greater than 97.5%.
  • FIG. 5 is a micrograph of a cross section of a tantalum cold sprayed joint that has been etched to reveal the prior particle boundaries (“PPB”).
  • the powder that was used in the spray process was made by the hydride/dehydride process which produces a blocky approximately equiaxed powder (defined as powder having an aspect ratio of approximately 1).
  • FIG. 6 is a micrograph of the same joint as shown in FIG. 5 that has been annealed at 1150° C. for 1.5 hours.
  • the new equiaxed grains retain the near perfect random crystallographic orientation displayed in the original as sprayed structure as can be shown by EBSD analysis.
  • the joint has a unique structure of fine, non-directional equiaxed grains that have a random crystallographic orientation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Arc Welding In General (AREA)
  • Powder Metallurgy (AREA)
  • Laminated Bodies (AREA)
US11/638,625 2006-12-13 2006-12-13 Method of joining tantalum clade steel structures Abandoned US20080145688A1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
US11/638,625 US20080145688A1 (en) 2006-12-13 2006-12-13 Method of joining tantalum clade steel structures
EP07869148.2A EP2097558B1 (en) 2006-12-13 2007-12-12 Method of joining tantalum clad steel structures
EP20140166073 EP2818577A1 (en) 2006-12-13 2007-12-12 Method for joining tantalum clad steel structures
PCT/US2007/087214 WO2008076748A2 (en) 2006-12-13 2007-12-12 Method of joining tantalum clad steel structures
JP2009541551A JP5268937B2 (ja) 2006-12-13 2007-12-12 タンタル被覆鋼構造体を接合する方法
EP16152858.3A EP3023516B1 (en) 2006-12-13 2007-12-12 Method of joining metal clad steel structures
US13/026,370 US8002169B2 (en) 2006-12-13 2011-02-14 Methods of joining protective metal-clad structures
US13/184,665 US8113413B2 (en) 2006-12-13 2011-07-18 Protective metal-clad structures
US13/343,113 US8448840B2 (en) 2006-12-13 2012-01-04 Methods of joining metallic protective layers
US13/848,404 US8777090B2 (en) 2006-12-13 2013-03-21 Methods of joining metallic protective layers
US14/293,643 US9095932B2 (en) 2006-12-13 2014-06-02 Methods of joining metallic protective layers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/638,625 US20080145688A1 (en) 2006-12-13 2006-12-13 Method of joining tantalum clade steel structures

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/026,370 Continuation US8002169B2 (en) 2006-12-13 2011-02-14 Methods of joining protective metal-clad structures
US13/184,665 Continuation US8113413B2 (en) 2006-12-13 2011-07-18 Protective metal-clad structures

Publications (1)

Publication Number Publication Date
US20080145688A1 true US20080145688A1 (en) 2008-06-19

Family

ID=39253943

Family Applications (6)

Application Number Title Priority Date Filing Date
US11/638,625 Abandoned US20080145688A1 (en) 2006-12-13 2006-12-13 Method of joining tantalum clade steel structures
US13/026,370 Active US8002169B2 (en) 2006-12-13 2011-02-14 Methods of joining protective metal-clad structures
US13/184,665 Active US8113413B2 (en) 2006-12-13 2011-07-18 Protective metal-clad structures
US13/343,113 Active US8448840B2 (en) 2006-12-13 2012-01-04 Methods of joining metallic protective layers
US13/848,404 Active US8777090B2 (en) 2006-12-13 2013-03-21 Methods of joining metallic protective layers
US14/293,643 Active US9095932B2 (en) 2006-12-13 2014-06-02 Methods of joining metallic protective layers

Family Applications After (5)

Application Number Title Priority Date Filing Date
US13/026,370 Active US8002169B2 (en) 2006-12-13 2011-02-14 Methods of joining protective metal-clad structures
US13/184,665 Active US8113413B2 (en) 2006-12-13 2011-07-18 Protective metal-clad structures
US13/343,113 Active US8448840B2 (en) 2006-12-13 2012-01-04 Methods of joining metallic protective layers
US13/848,404 Active US8777090B2 (en) 2006-12-13 2013-03-21 Methods of joining metallic protective layers
US14/293,643 Active US9095932B2 (en) 2006-12-13 2014-06-02 Methods of joining metallic protective layers

Country Status (4)

Country Link
US (6) US20080145688A1 (ja)
EP (3) EP2818577A1 (ja)
JP (1) JP5268937B2 (ja)
WO (1) WO2008076748A2 (ja)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080216602A1 (en) * 2005-05-05 2008-09-11 H. C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US20080271779A1 (en) * 2007-05-04 2008-11-06 H.C. Starck Inc. Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom
US20100015467A1 (en) * 2006-11-07 2010-01-21 H.C. Starck Gmbh & Co., Kg Method for coating a substrate and coated product
US20100055487A1 (en) * 2005-05-05 2010-03-04 H.C. Starck Gmbh Method for coating a substrate surface and coated product
US20100086800A1 (en) * 2008-10-06 2010-04-08 H.C. Starck Inc. Method of manufacturing bulk metallic structures with submicron grain sizes and structures made with such method
US20100170937A1 (en) * 2009-01-07 2010-07-08 General Electric Company System and Method of Joining Metallic Parts Using Cold Spray Technique
US20100272889A1 (en) * 2006-10-03 2010-10-28 H.C. Starch Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US8002169B2 (en) 2006-12-13 2011-08-23 H.C. Starck, Inc. Methods of joining protective metal-clad structures
EP2448709A1 (de) * 2009-06-30 2012-05-09 Siemens AG Verfahren zum verkleiden eines bauteils mit einer durch kaltspritzen verschlossenen selbst tragenden verkleidung
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US20130082033A1 (en) * 2011-09-29 2013-04-04 H.C. Starck, Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
WO2014005041A1 (en) 2012-06-29 2014-01-03 Shiloh Industries, Inc. Welded blank assembly and method
US9289855B2 (en) 2012-05-25 2016-03-22 Shiloh Industries, Inc. Sheet metal piece having weld notch and method of forming the same
US20160089750A1 (en) * 2014-09-29 2016-03-31 U.S. Army Research Laboratory ATTN:RDRL-LOC-I Method to join dissimilar materials by the cold spray process
CN107598331A (zh) * 2017-10-26 2018-01-19 宝鸡市永盛泰钛业有限公司 一种钛管的焊接方法
US9956636B2 (en) 2013-03-14 2018-05-01 Shiloh Industries, Inc. Welded blank assembly and method
US20180193949A1 (en) * 2012-11-30 2018-07-12 Shiloh Industries, Inc. Method of forming a weld notch in a sheet metal piece
CN109402545A (zh) * 2017-08-18 2019-03-01 东莞中集专用车有限公司 牵引销保护装置
EP3448612A1 (de) * 2016-04-27 2019-03-06 ThyssenKrupp Steel Europe AG Mehrschichtbauteil und verfahren zu dessen herstellung
CN111872385A (zh) * 2020-06-30 2020-11-03 中国石油天然气集团有限公司 一种双金属复合油井管螺纹接头的局部增材制造方法

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8240544B2 (en) * 2005-08-02 2012-08-14 Linde Aktiengesellschaft Introduction of nanoparticles
US9168366B2 (en) 2008-12-19 2015-10-27 Icu Medical, Inc. Medical connector with closeable luer connector
CN102034823B (zh) * 2009-09-30 2013-01-02 意法半导体研发(深圳)有限公司 用于spu和stog良好性能的功率晶体管的布局和焊盘布图规划
CN102019488B (zh) * 2010-12-08 2012-06-27 西安优耐特容器制造有限公司 一种铌和钢的电弧熔焊-钎焊方法
AU2012304344B2 (en) 2011-09-09 2016-02-04 Icu Medical, Inc. Medical connectors with fluid-resistant mating interfaces
CN104039483B (zh) 2011-12-30 2017-03-01 思高博塔公司 涂层组合物
WO2014066569A1 (en) * 2012-10-24 2014-05-01 Magna International Inc. Laser metal deposition welding of automotive parts
CA2899891A1 (en) * 2013-03-14 2014-10-02 Adam L. CHAMBERLAIN Bi-cast turbine vane
WO2015081209A1 (en) 2013-11-26 2015-06-04 Scoperta, Inc. Corrosion resistant hardfacing alloy
WO2015191458A1 (en) 2014-06-09 2015-12-17 Scoperta, Inc. Crack resistant hardfacing alloys
US9655414B2 (en) 2014-09-19 2017-05-23 Leachgarner, Inc. Age hardenable clad metal having silver fineness and a surface layer with enhanced resistance to tarnish, scratching, and wear
CN107532265B (zh) 2014-12-16 2020-04-21 思高博塔公司 含多种硬质相的韧性和耐磨铁合金
WO2016115248A1 (en) 2015-01-16 2016-07-21 Sikorsky Aircraft Corporation Cold spray method to join or in certain cases strengthen metals
US10357842B2 (en) * 2015-02-11 2019-07-23 Ultraflote L.L.C. Method for welding nonferrous metal sheets
WO2017040775A1 (en) 2015-09-04 2017-03-09 Scoperta, Inc. Chromium free and low-chromium wear resistant alloys
EP3347501B8 (en) 2015-09-08 2021-05-12 Oerlikon Metco (US) Inc. Non-magnetic, strong carbide forming alloys for powder manufacture
JP2018537291A (ja) 2015-11-10 2018-12-20 スコペルタ・インコーポレイテッドＳｃｏｐｅｒｔａ， Ｉｎｃ． 酸化抑制ツインワイヤーアークスプレー材料
CN105420722B (zh) * 2015-11-11 2018-05-25 北京宝丰钢结构工程有限公司 钢结构防腐工艺
CA3017642A1 (en) 2016-03-22 2017-09-28 Scoperta, Inc. Fully readable thermal spray coating
CN105880851A (zh) * 2016-05-20 2016-08-24 西安建筑科技大学 一种层状双金属复合材料的无过渡层对接焊方法
CN106001967A (zh) * 2016-07-18 2016-10-12 西安交通大学 双层金属复合板对焊焊接方法
US11365658B2 (en) 2017-10-05 2022-06-21 Tenneco Automotive Operating Company Inc. Acoustically tuned muffler
DE102018124198A1 (de) 2017-10-05 2019-04-11 Tenneco Automotive Operating Company Inc. Akustisch abgestimmter Schalldämpfer
CN107779860B (zh) * 2017-10-27 2019-03-08 西安必盛激光科技有限公司 一种液压立柱活塞杆及中缸筒激光熔覆方法
US11199116B2 (en) 2017-12-13 2021-12-14 Tenneco Automotive Operating Company Inc. Acoustically tuned muffler
RU2706988C1 (ru) * 2018-05-25 2019-11-21 Публичное акционерное общество "Челябинский трубопрокатный завод" (ПАО "ЧТПЗ") Способ многослойной гибридной лазерно-дуговой сварки стальных плакированных труб
CN109202244B (zh) * 2018-08-31 2021-04-02 西安理工大学 一种应用于电阻点焊钽Ta1和Q235钢的中间层合金及其制备方法
US11939646B2 (en) 2018-10-26 2024-03-26 Oerlikon Metco (Us) Inc. Corrosion and wear resistant nickel based alloys
US11268429B2 (en) 2019-01-17 2022-03-08 Tenneco Automotive Operating Company Inc. Diffusion surface alloyed metal exhaust component with inwardly turned edges
US11268430B2 (en) 2019-01-17 2022-03-08 Tenneco Automotive Operating Company Inc. Diffusion surface alloyed metal exhaust component with welded edges
CA3133822A1 (en) 2019-03-22 2020-10-01 Dmc Global Inc. Cladded article with clad layer having varying thickness
CA3136967A1 (en) 2019-05-03 2020-11-12 Oerlikon Metco (Us) Inc. Powder feedstock for wear resistant bulk welding configured to optimize manufacturability
US10975743B1 (en) 2020-03-13 2021-04-13 Tenneco Automotive Operating Company Inc. Vehicle exhaust component

Citations (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436299A (en) * 1965-12-17 1969-04-01 Celanese Corp Polymer bonding
US3990784A (en) * 1974-06-05 1976-11-09 Optical Coating Laboratory, Inc. Coated architectural glass system and method
US4011981A (en) * 1975-03-27 1977-03-15 Olin Corporation Process for bonding titanium, tantalum, and alloys thereof
US4073427A (en) * 1976-10-07 1978-02-14 Fansteel Inc. Lined equipment with triclad wall construction
US4140172A (en) * 1976-12-23 1979-02-20 Fansteel Inc. Liners and tube supports for industrial and chemical process equipment
US4202932A (en) * 1978-07-21 1980-05-13 Xerox Corporation Magnetic recording medium
US4291104A (en) * 1978-04-17 1981-09-22 Fansteel Inc. Brazed corrosion resistant lined equipment
US4459062A (en) * 1981-09-11 1984-07-10 Monsanto Company Clad metal joint closure
US4483819A (en) * 1981-07-31 1984-11-20 Hermann C. Starck Berlin Production of highly capacitive agglomerated valve metal powder and valve metal electrodes for the production of electrolytic capacitors
US4508563A (en) * 1984-03-19 1985-04-02 Sprague Electric Company Reducing the oxygen content of tantalum
US4510171A (en) * 1981-09-11 1985-04-09 Monsanto Company Clad metal joint closure
US4537641A (en) * 1983-03-18 1985-08-27 Hermann C. Starck Berlin Process for producing valve-metal anodes for electrolytic capacitors
US4722756A (en) * 1987-02-27 1988-02-02 Cabot Corp Method for deoxidizing tantalum material
US4731111A (en) * 1987-03-16 1988-03-15 Gte Products Corporation Hydrometallurical process for producing finely divided spherical refractory metal based powders
US4818629A (en) * 1985-08-26 1989-04-04 Fansteel Inc. Joint construction for lined equipment
US4915745A (en) * 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
US4964906A (en) * 1989-09-26 1990-10-23 Fife James A Method for controlling the oxygen content of tantalum material
US5091244A (en) * 1990-08-10 1992-02-25 Viratec Thin Films, Inc. Electrically-conductive, light-attenuating antireflection coating
US5147125A (en) * 1989-08-24 1992-09-15 Viratec Thin Films, Inc. Multilayer anti-reflection coating using zinc oxide to provide ultraviolet blocking
US5242481A (en) * 1989-06-26 1993-09-07 Cabot Corporation Method of making powders and products of tantalum and niobium
US5302414A (en) * 1990-05-19 1994-04-12 Anatoly Nikiforovich Papyrin Gas-dynamic spraying method for applying a coating
US5305946A (en) * 1992-11-05 1994-04-26 Nooter Corporation Welding process for clad metals
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5679473A (en) * 1993-04-01 1997-10-21 Asahi Komag Co., Ltd. Magnetic recording medium and method for its production
US5795626A (en) * 1995-04-28 1998-08-18 Innovative Technology Inc. Coating or ablation applicator with a debris recovery attachment
US5859654A (en) * 1996-10-31 1999-01-12 Hewlett-Packard Company Print head for ink-jet printing a method for making print heads
US5954856A (en) * 1996-04-25 1999-09-21 Cabot Corporation Method of making tantalum metal powder with controlled size distribution and products made therefrom
US5972065A (en) * 1997-07-10 1999-10-26 The Regents Of The University Of California Purification of tantalum by plasma arc melting
US5993513A (en) * 1996-04-05 1999-11-30 Cabot Corporation Method for controlling the oxygen content in valve metal materials
US6136062A (en) * 1998-10-13 2000-10-24 H. C. Starck Gmbh & Co. Kg Niobium powder and a process for the production of niobium and/or tantalum powders
US6139913A (en) * 1999-06-29 2000-10-31 National Center For Manufacturing Sciences Kinetic spray coating method and apparatus
US6171363B1 (en) * 1998-05-06 2001-01-09 H. C. Starck, Inc. Method for producing tantallum/niobium metal powders by the reduction of their oxides with gaseous magnesium
US6197082B1 (en) * 1999-02-17 2001-03-06 H.C. Starck, Inc. Refining of tantalum and tantalum scrap with carbon
US6238456B1 (en) * 1997-02-19 2001-05-29 H. C. Starck Gmbh & Co. Kg Tantalum powder, method for producing same powder and sintered anodes obtained from it
US6258402B1 (en) * 1999-10-12 2001-07-10 Nakhleh Hussary Method for repairing spray-formed steel tooling
US6261337B1 (en) * 1999-08-19 2001-07-17 Prabhat Kumar Low oxygen refractory metal powder for powder metallurgy
US20020112955A1 (en) * 2001-02-14 2002-08-22 H.C. Starck, Inc. Rejuvenation of refractory metal products
US20020112789A1 (en) * 2001-02-20 2002-08-22 H.C. Starck, Inc. Refractory metal plates with uniform texture and methods of making the same
US6444259B1 (en) * 2001-01-30 2002-09-03 Siemens Westinghouse Power Corporation Thermal barrier coating applied with cold spray technique
US6482743B1 (en) * 1999-09-13 2002-11-19 Sony Corporation Method of forming a semiconductor device using CMP to polish a metal film
US6502767B2 (en) * 2000-05-03 2003-01-07 Asb Industries Advanced cold spray system
US20030023132A1 (en) * 2000-05-31 2003-01-30 Melvin David B. Cyclic device for restructuring heart chamber geometry
US6521173B2 (en) * 1999-08-19 2003-02-18 H.C. Starck, Inc. Low oxygen refractory metal powder for powder metallurgy
US6558447B1 (en) * 1999-05-05 2003-05-06 H.C. Starck, Inc. Metal powders produced by the reduction of the oxides with gaseous magnesium
US6589311B1 (en) * 1999-07-07 2003-07-08 Hitachi Metals Ltd. Sputtering target, method of making same, and high-melting metal powder material
US20030190413A1 (en) * 2002-04-05 2003-10-09 Van Steenkiste Thomas Hubert Method of maintaining a non-obstructed interior opening in kinetic spray nozzles
US20030219542A1 (en) * 2002-05-25 2003-11-27 Ewasyshyn Frank J. Method of forming dense coatings by powder spraying
US20040037954A1 (en) * 2002-06-04 2004-02-26 Linde Aktiengesellschaft Process and device for cold gas spraying
US20040065546A1 (en) * 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
US6722584B2 (en) * 2001-05-02 2004-04-20 Asb Industries, Inc. Cold spray system nozzle
US20040076807A1 (en) * 2002-10-21 2004-04-22 Ford Motor Company Method of spray joining articles
US20040126499A1 (en) * 2002-06-04 2004-07-01 Linde Aktiengesellschaft Process and device for cold gas spraying
US6759085B2 (en) * 2002-06-17 2004-07-06 Sulzer Metco (Us) Inc. Method and apparatus for low pressure cold spraying
US6770154B2 (en) * 2001-09-18 2004-08-03 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6773969B2 (en) * 2002-12-18 2004-08-10 Au Optronics Corp. Method of forming a thin film transistor
US6855236B2 (en) * 1999-12-28 2005-02-15 Kabushiki Kaisha Toshiba Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus
US20050084701A1 (en) * 2003-10-20 2005-04-21 The Boeing Company Sprayed preforms for forming structural members
US20050120957A1 (en) * 2002-01-08 2005-06-09 Flame Spray Industries, Inc. Plasma spray method and apparatus for applying a coating utilizing particle kinetics
US6905728B1 (en) * 2004-03-22 2005-06-14 Honeywell International, Inc. Cold gas-dynamic spray repair on gas turbine engine components
US6911124B2 (en) * 1998-09-24 2005-06-28 Applied Materials, Inc. Method of depositing a TaN seed layer
US20050142021A1 (en) * 2002-01-24 2005-06-30 Aimone Paul R. Refractory metal and alloy refining by laser forming and melting
US6915964B2 (en) * 2001-04-24 2005-07-12 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6919275B2 (en) * 1997-11-26 2005-07-19 Applied Materials, Inc. Method of preventing diffusion of copper through a tantalum-comprising barrier layer
US20050155856A1 (en) * 2002-09-20 2005-07-21 Kunihiro Oda Tantalum sputtering target and method for preparation thereof
US6924974B2 (en) * 2002-03-22 2005-08-02 David H. Stark Hermetically sealed micro-device package using cold-gas dynamic spray material deposition
US20050220995A1 (en) * 2004-04-06 2005-10-06 Yiping Hu Cold gas-dynamic spraying of wear resistant alloys on turbine blades
US6953742B2 (en) * 2000-11-01 2005-10-11 Applied Materials, Inc. Tantalum barrier layer for copper metallization
US6962407B2 (en) * 2000-06-07 2005-11-08 Fuji Photo Film Co., Ltd. Inkjet recording head, method of manufacturing the same, and inkjet printer
US20050252450A1 (en) * 2002-01-08 2005-11-17 Flame Spray Industries, Inc. Plasma spray method and apparatus for applying a coating utilizing particle kinetics
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060032735A1 (en) * 2001-02-14 2006-02-16 Aimone Paul R Rejuvenation of refractory metal products
US20060042728A1 (en) * 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
US20060045785A1 (en) * 2004-08-30 2006-03-02 Yiping Hu Method for repairing titanium alloy components
US20060090593A1 (en) * 2004-11-03 2006-05-04 Junhai Liu Cold spray formation of thin metal coatings
US7053294B2 (en) * 2001-07-13 2006-05-30 Midwest Research Institute Thin-film solar cell fabricated on a flexible metallic substrate
US20060121187A1 (en) * 2004-12-03 2006-06-08 Haynes Jeffrey D Vacuum cold spray process
US7067197B2 (en) * 2003-01-07 2006-06-27 Cabot Corporation Powder metallurgy sputtering targets and methods of producing same
US7081148B2 (en) * 2001-09-18 2006-07-25 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US7101447B2 (en) * 2000-02-02 2006-09-05 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US7108893B2 (en) * 2002-09-23 2006-09-19 Delphi Technologies, Inc. Spray system with combined kinetic spray and thermal spray ability
US7128988B2 (en) * 2002-08-29 2006-10-31 Lambeth Systems Magnetic material structures, devices and methods
US7164205B2 (en) * 2003-06-30 2007-01-16 Sharp Kabushiki Kaisha Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
US7170915B2 (en) * 2003-07-23 2007-01-30 Intel Corporation Anti-reflective (AR) coating for high index gain media
US7175802B2 (en) * 2001-09-17 2007-02-13 Heraeus, Inc. Refurbishing spent sputtering targets
US7183206B2 (en) * 2000-09-27 2007-02-27 Contour Semiconductor, Inc. Fabrication of semiconductor devices
US7192623B2 (en) * 1998-11-16 2007-03-20 Commissariat A L'energie Atomique Thin layer of hafnium oxide and deposit process
US7208230B2 (en) * 2003-08-29 2007-04-24 General Electric Company Optical reflector for reducing radiation heat transfer to hot engine parts
US20070172378A1 (en) * 2004-01-30 2007-07-26 Nippon Tungsten Co., Ltd. Tungsten based sintered compact and method for production thereof
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US7399335B2 (en) * 2005-03-22 2008-07-15 H.C. Starck Inc. Method of preparing primary refractory metal
US20080171215A1 (en) * 2007-01-16 2008-07-17 H.C. Starck Inc. High density refractory metals & alloys sputtering targets
US20080216602A1 (en) * 2005-05-05 2008-09-11 H. C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US7479299B2 (en) * 2005-01-26 2009-01-20 Honeywell International Inc. Methods of forming high strength coatings
US20100015467A1 (en) * 2006-11-07 2010-01-21 H.C. Starck Gmbh & Co., Kg Method for coating a substrate and coated product
US20100055487A1 (en) * 2005-05-05 2010-03-04 H.C. Starck Gmbh Method for coating a substrate surface and coated product
US20100061876A1 (en) * 2008-09-09 2010-03-11 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US20100086800A1 (en) * 2008-10-06 2010-04-08 H.C. Starck Inc. Method of manufacturing bulk metallic structures with submicron grain sizes and structures made with such method

Family Cites Families (247)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028787A (en) 1975-09-15 1977-06-14 Cretella Salvatore Refurbished turbine vanes and method of refurbishment thereof
US4050133A (en) 1976-06-07 1977-09-27 Cretella Salvatore Method of refurbishing turbine vanes and the like
US4059442A (en) 1976-08-09 1977-11-22 Sprague Electric Company Method for making a porous tantalum pellet
JPS5467198U (ja) 1977-10-18 1979-05-12
US4135286A (en) 1977-12-22 1979-01-23 United Technologies Corporation Sputtering target fabrication method
US4209375A (en) 1979-08-02 1980-06-24 The United States Of America As Represented By The United States Department Of Energy Sputter target
US4349954A (en) 1980-11-26 1982-09-21 The United States Of America As Represented By The United States National Aeronautics And Space Administration Mechanical bonding of metal method
SE434353B (sv) * 1981-02-06 1984-07-23 Nyby Uddeholm Ab Poros sinterkropp med god korrosionsbestendighet och sett att framstella denna
CA1173128A (en) 1981-10-13 1984-08-21 Pok F. Lee Echo cancellation using transversal filters
CA1202599A (en) 1982-06-10 1986-04-01 Michael G. Down Upgrading titanium, zirconium and hafnium powders by plasma processing
JPS5920470A (ja) 1982-07-26 1984-02-02 Murata Mfg Co Ltd スパツタリング用タ−ゲツト
JPS5936809U (ja) 1982-08-31 1984-03-08 株式会社土屋製作所 燃料フイルタ
JPS624861A (ja) * 1985-07-01 1987-01-10 Nippon Steel Corp 物体接合法
US4818559A (en) 1985-08-08 1989-04-04 Sumitomo Chemical Company, Limited Method for producing endosseous implants
US4688691A (en) * 1986-01-22 1987-08-25 Nooter Corporation Process for attaching clad components and pressure vessel formed thereby
JPS62230967A (ja) 1986-03-31 1987-10-09 Mitsubishi Metal Corp 光磁気記録薄膜の形成に用いられた強磁性材製使用済みターゲットの再生方法
JPS63100177U (ja) 1986-12-19 1988-06-29
BR8702042A (pt) 1986-12-22 1988-07-12 Kawasaki Steel Co Aparelho e processo para recobrimento por aspersao de um material refratario sobre uma construcao refrataria
CH669609A5 (ja) 1986-12-23 1989-03-31 Balzers Hochvakuum
JPS63227774A (ja) 1987-03-16 1988-09-22 Seiko Epson Corp スパツタリング用タ−ゲツト
JPS6415353A (en) 1987-07-08 1989-01-19 Toshiba Corp Alloy for thermal spraying
JPH0198359A (ja) 1987-10-12 1989-04-17 Nec Corp 加入者集線通信システム
JPH0756190B2 (ja) 1987-11-17 1995-06-14 清水建設株式会社 構造物の振動抑制装置
US5273204A (en) * 1988-03-25 1993-12-28 Howmet Corporation Method for joining materials by metal spraying
US4905886A (en) 1988-07-20 1990-03-06 Grumman Aerospace Corporation Method for diffusion bonding of metals and alloys using thermal spray deposition
US4923531A (en) 1988-09-23 1990-05-08 Rmi Company Deoxidation of titanium and similar metals using a deoxidant in a molten metal carrier
JPH0756Y2 (ja) 1990-02-20 1995-01-11 金沢樹脂工業株式会社 育苗箱
US5160534A (en) 1990-06-15 1992-11-03 Hitachi Metals Ltd. Titanium-tungsten target material for sputtering and manufacturing method therefor
US5270858A (en) 1990-10-11 1993-12-14 Viratec Thin Films Inc D.C. reactively sputtered antireflection coatings
US5271965A (en) 1991-01-16 1993-12-21 Browning James A Thermal spray method utilizing in-transit powder particle temperatures below their melting point
JPH04323366A (ja) 1991-04-19 1992-11-12 Asahi Glass Co Ltd スパッタリング用ターゲット及びその製造方法
JPH0515915U (ja) 1991-08-16 1993-03-02 オリンパス光学工業株式会社 内視鏡用把持鉗子
JPH0593254A (ja) * 1991-09-30 1993-04-16 Sumitomo Metal Ind Ltd 金属接合方法
JPH05232580A (ja) 1991-11-28 1993-09-10 Misawa Homes Co Ltd スピーカー装置
US5230459A (en) 1992-03-18 1993-07-27 Tosoh Smd, Inc. Method of bonding a sputter target-backing plate assembly assemblies produced thereby
US5554889A (en) 1992-04-03 1996-09-10 Motorola, Inc. Structure and method for metallization of semiconductor devices
US5269899A (en) 1992-04-29 1993-12-14 Tosoh Smd, Inc. Cathode assembly for cathodic sputtering apparatus
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
JPH06144124A (ja) 1992-11-09 1994-05-24 Mazda Motor Corp 自動車の内装部材取付方法
JPH06158300A (ja) 1992-11-19 1994-06-07 Tokyo Tungsten Co Ltd 高融点金属ターゲット材，及びその製造方法
JP3197640B2 (ja) 1992-11-30 2001-08-13 朝日興業株式会社 気泡発生装置
US5330798A (en) 1992-12-09 1994-07-19 Browning Thermal Systems, Inc. Thermal spray method and apparatus for optimizing flame jet temperature
US5428882A (en) 1993-04-05 1995-07-04 The Regents Of The University Of California Process for the fabrication of aluminum metallized pyrolytic graphite sputtering targets
JPH06346232A (ja) 1993-06-11 1994-12-20 Asahi Glass Co Ltd スパッタリング用ターゲットおよびその製造方法
US5466355A (en) 1993-07-15 1995-11-14 Japan Energy Corporation Mosaic target
US5487822A (en) 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5433835B1 (en) 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US5392981A (en) 1993-12-06 1995-02-28 Regents Of The University Of California Fabrication of boron sputter targets
KR100357482B1 (ko) 1993-12-10 2003-03-10 도토기키 가부시키가이샤 광촉매기능을갖는다기능재료및그의제조방법
JPH07228966A (ja) 1994-02-16 1995-08-29 Mitsubishi Materials Corp クロム長尺円筒ターゲットの製造方法
US5687600A (en) 1994-10-26 1997-11-18 Johnson Matthey Electronics, Inc. Metal sputtering target assembly
US6103392A (en) 1994-12-22 2000-08-15 Osram Sylvania Inc. Tungsten-copper composite powder
KR100236685B1 (ko) 1995-02-22 2000-01-15 와다 아끼히로 시임용접 방법 및 장치
JPH08252642A (ja) * 1995-03-16 1996-10-01 Asahi Chem Ind Co Ltd クラッド板成形加工品及びその成形方法
US5836506A (en) 1995-04-21 1998-11-17 Sony Corporation Sputter target/backing plate assembly and method of making same
WO1997008359A1 (fr) 1995-08-23 1997-03-06 Asahi Glass Company Ltd. Cible, son procede de production et procede de formation d'une couche tres refringente
DE19532244C2 (de) 1995-09-01 1998-07-02 Peak Werkstoff Gmbh Verfahren zur Herstellung von dünnwandigen Rohren (I)
US5766544A (en) 1996-03-15 1998-06-16 Kemp Development Corporation Process for fluidizing particulate material within a rotatable retort
US6269536B1 (en) 1996-03-28 2001-08-07 H.C. Starck, Inc. Production of low oxygen metal wire
US5738770A (en) 1996-06-21 1998-04-14 Sony Corporation Mechanically joined sputtering target and adapter therefor
KR100237316B1 (ko) 1996-08-01 2000-01-15 박호군 자성 박막 형성을 위한 스파터링 타겟 및 그 제조방법
US5863398A (en) 1996-10-11 1999-01-26 Johnson Matthey Electonics, Inc. Hot pressed and sintered sputtering target assemblies and method for making same
JP3098204B2 (ja) 1997-03-07 2000-10-16 ティーディーケイ株式会社 光磁気記録用合金ターゲット、その製造方法およびその再生方法
JPH10275887A (ja) 1997-03-31 1998-10-13 Nec Corp 半導体装置
US20030052000A1 (en) 1997-07-11 2003-03-20 Vladimir Segal Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method
JPH1169637A (ja) 1997-08-15 1999-03-09 Kokusai Electric Co Ltd 携帯用電子機器
US6010583A (en) 1997-09-09 2000-01-04 Sony Corporation Method of making unreacted metal/aluminum sputter target
DE19747385A1 (de) 1997-10-27 1999-04-29 Linde Ag Herstellung von Formteilen
JP3052240B2 (ja) 1998-02-27 2000-06-12 東京タングステン株式会社 Ｘ線管用回転陽極及びその製造方法
JPH11256323A (ja) 1998-03-12 1999-09-21 Matsushita Electric Ind Co Ltd スパッタリング方法及び装置
JPH11269637A (ja) 1998-03-24 1999-10-05 Sumitomo Metal Mining Co Ltd 大型スパッタリングターゲットの製造方法
JPH11269639A (ja) 1998-03-24 1999-10-05 Sumitomo Metal Mining Co Ltd スパッタリングターゲットの再生方法
US6189663B1 (en) 1998-06-08 2001-02-20 General Motors Corporation Spray coatings for suspension damper rods
US6875324B2 (en) 1998-06-17 2005-04-05 Tanaka Kikinzoku Kogyo K.K. Sputtering target material
WO2000006793A1 (en) 1998-07-27 2000-02-10 Applied Materials, Inc. Sputtering target assembly
JP2000052438A (ja) 1998-08-11 2000-02-22 Sulzer Innotec Ag 繊維・プラスチック化合物材料の連続的形状体の製造法及び該方法を行うプラント
US6071389A (en) 1998-08-21 2000-06-06 Tosoh Smd, Inc. Diffusion bonded sputter target assembly and method of making
US6749103B1 (en) 1998-09-11 2004-06-15 Tosoh Smd, Inc. Low temperature sputter target bonding method and target assemblies produced thereby
JP2000155196A (ja) * 1998-11-19 2000-06-06 Hitachi Nuclear Eng Co Ltd 放射性廃棄物処分容器
US6328927B1 (en) 1998-12-24 2001-12-11 Praxair Technology, Inc. Method of making high-density, high-purity tungsten sputter targets
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
KR20000062587A (ko) 1999-03-02 2000-10-25 로버트 에이. 바쎄트 박막 증착에 사용 및 재사용하기 위한 열분사에 의한스퍼터 타깃의 제조 및 재충전 방법
US6165413A (en) 1999-07-08 2000-12-26 Praxair S.T. Technology, Inc. Method of making high density sputtering targets
US6478902B2 (en) 1999-07-08 2002-11-12 Praxair S.T. Technology, Inc. Fabrication and bonding of copper sputter targets
US6283357B1 (en) 1999-08-03 2001-09-04 Praxair S.T. Technology, Inc. Fabrication of clad hollow cathode magnetron sputter targets
DE19942916A1 (de) 1999-09-08 2001-03-15 Linde Gas Ag Herstellen von aufschäumbaren Metallkörpern und Metallschäumen
US6245390B1 (en) 1999-09-10 2001-06-12 Viatcheslav Baranovski High-velocity thermal spray apparatus and method of forming materials
JP4240679B2 (ja) 1999-09-21 2009-03-18 ソニー株式会社 スパッタリング用ターゲットの製造方法
JP3632524B2 (ja) 1999-09-24 2005-03-23 東ソー株式会社 Ｍｇ含有ＩＴＯスパッタリングターゲットおよびＭｇ含有ＩＴＯ蒸着材の製造方法
JP4510959B2 (ja) 1999-10-07 2010-07-28 キヤノンアネルバ株式会社 反応性スパッタリング装置
JP2001123267A (ja) 1999-10-26 2001-05-08 Sanyo Special Steel Co Ltd Ｇｅ−Ｓｂ−Ｔｅ系スパッタリングターゲット材の製造方法
US6267851B1 (en) 1999-10-28 2001-07-31 Applied Komatsu Technology, Inc. Tilted sputtering target with shield to block contaminants
RU2166421C1 (ru) 1999-12-06 2001-05-10 Государственный космический научно-производственный центр им. М.В. Хруничева Способ восстановления изделий
US6878250B1 (en) 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
US7122069B2 (en) 2000-03-29 2006-10-17 Osram Sylvania Inc. Mo-Cu composite powder
US6432804B1 (en) 2000-05-22 2002-08-13 Sharp Laboratories Of America, Inc. Sputtered silicon target for fabrication of polysilicon thin film transistors
US6582572B2 (en) 2000-06-01 2003-06-24 Seagate Technology Llc Target fabrication method for cylindrical cathodes
US6748902B1 (en) 2000-06-09 2004-06-15 Brian Boesch System and method for training of animals
US6464933B1 (en) 2000-06-29 2002-10-15 Ford Global Technologies, Inc. Forming metal foam structures
US6725522B1 (en) 2000-07-12 2004-04-27 Tosoh Smd, Inc. Method of assembling target and backing plates
US6497797B1 (en) 2000-08-21 2002-12-24 Honeywell International Inc. Methods of forming sputtering targets, and sputtering targets formed thereby
JP3791829B2 (ja) 2000-08-25 2006-06-28 株式会社日鉱マテリアルズ パーティクル発生の少ないスパッタリングターゲット
US6409897B1 (en) 2000-09-20 2002-06-25 Poco Graphite, Inc. Rotatable sputter target
US6413578B1 (en) 2000-10-12 2002-07-02 General Electric Company Method for repairing a thermal barrier coating and repaired coating formed thereby
US7041204B1 (en) 2000-10-27 2006-05-09 Honeywell International Inc. Physical vapor deposition components and methods of formation
US6946039B1 (en) 2000-11-02 2005-09-20 Honeywell International Inc. Physical vapor deposition targets, and methods of fabricating metallic materials
US6669782B1 (en) 2000-11-15 2003-12-30 Randhir P. S. Thakur Method and apparatus to control the formation of layers useful in integrated circuits
US20020090464A1 (en) 2000-11-28 2002-07-11 Mingwei Jiang Sputter chamber shield
US6491208B2 (en) 2000-12-05 2002-12-10 Siemens Westinghouse Power Corporation Cold spray repair process
WO2002049785A1 (en) 2000-12-18 2002-06-27 Tosoh Smd, Inc. Low temperature sputter target/backing plate joining technique and assemblies made thereby
TWI232241B (en) 2001-03-13 2005-05-11 Ind Tech Res Inst Method of regenerating a phase change sputtering target for optical storage media
EP1371748A4 (en) 2001-03-14 2009-07-29 Nippon Mining Co SPRAY TARGET, SUPPORT PLATE OR APPARATUS IN SPRAY DEVICE PRODUCING VERY LITTLE PARTICLES, AND ELECTRIC DISCHARGE MACHINE RUGOSIFICATION METHOD
TW558471B (en) 2001-03-28 2003-10-21 Phild Co Ltd Method and device for manufacturing metallic particulates and manufactured metallic particulates
US6797137B2 (en) 2001-04-11 2004-09-28 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal
DE10126100A1 (de) 2001-05-29 2002-12-05 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
US6592935B2 (en) 2001-05-30 2003-07-15 Ford Motor Company Method of manufacturing electromagnetic devices using kinetic spray
US7201940B1 (en) 2001-06-12 2007-04-10 Advanced Cardiovascular Systems, Inc. Method and apparatus for thermal spray processing of medical devices
JP4332832B2 (ja) 2001-07-06 2009-09-16 富士電機デバイステクノロジー株式会社 垂直磁気記録媒体およびその製造方法
US6780458B2 (en) 2001-08-01 2004-08-24 Siemens Westinghouse Power Corporation Wear and erosion resistant alloys applied by cold spray technique
US20030082297A1 (en) 2001-10-26 2003-05-01 Siemens Westinghouse Power Corporation Combustion turbine blade tip restoration by metal build-up using thermal spray techniques
JP4162467B2 (ja) 2001-10-30 2008-10-08 三井金属鉱業株式会社 スパッタリングターゲットの製造方法
JP4312431B2 (ja) 2001-11-30 2009-08-12 新日鉄マテリアルズ株式会社 ターゲット材
US20030178301A1 (en) 2001-12-21 2003-09-25 Lynn David Mark Planar magnetron targets having target material affixed to non-planar backing plates
US20030175142A1 (en) 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
BE1014736A5 (fr) 2002-03-29 2004-03-02 Alloys For Technical Applic S Procede de fabrication et de recharge de cibles pour pulverisation cathodique.
US6623796B1 (en) 2002-04-05 2003-09-23 Delphi Technologies, Inc. Method of producing a coating using a kinetic spray process with large particles and nozzles for the same
WO2003106733A1 (en) 2002-06-14 2003-12-24 Tosoh Smd, Inc. Target and method of diffusion bonding target to backing plate
US20040005449A1 (en) 2002-07-05 2004-01-08 Kabushiki Kaisha Kobe Seiko Sho Foamed resin laminate sound insulation board and method for manufacturing the same
DE10231203B4 (de) 2002-07-10 2009-09-10 Interpane Entwicklungs-Und Beratungsgesellschaft Mbh Targetträgeranordnung
US20040016635A1 (en) 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
US20070189916A1 (en) 2002-07-23 2007-08-16 Heraeus Incorporated Sputtering targets and methods for fabricating sputtering targets having multiple materials
CA2433613A1 (en) 2002-08-13 2004-02-13 Russel J. Ruprecht, Jr. Spray method for mcralx coating
US6743468B2 (en) 2002-09-23 2004-06-01 Delphi Technologies, Inc. Method of coating with combined kinetic spray and thermal spray
AU2003277000A1 (en) 2002-09-25 2004-04-19 Alcoa Inc. Coated vehicle wheel and method
EP1550735B1 (en) 2002-10-09 2010-12-15 National Institute for Materials Science Method of forming metal coating with hvof spray gun and thermal spray apparatus
CA2444917A1 (en) 2002-10-18 2004-04-18 United Technologies Corporation Cold sprayed copper for rocket engine applications
DE60326621D1 (de) 2002-10-21 2009-04-23 Cabot Corp Verfahren zur herstellung eines sputtertargets und sputtertarget
DE10253794B4 (de) 2002-11-19 2005-03-17 Hühne, Erwin Dieter Niedertemperatur Hochgeschwindigkeits-Flammspritzsystem
KR20050084444A (ko) 2002-12-20 2005-08-26 코닌클리케 필립스 일렉트로닉스 엔.브이. 매크로커맨드들을 구비한 시스템
US6872427B2 (en) 2003-02-07 2005-03-29 Delphi Technologies, Inc. Method for producing electrical contacts using selective melting and a low pressure kinetic spray process
DE60313222T2 (de) 2003-02-20 2008-01-03 N.V. Bekaert S.A. Verfahren zur herstellung eines zerstäubungstargets
JP4637819B2 (ja) 2003-02-24 2011-02-23 テクナ・プラズマ・システムズ・インコーポレーテッド スパッタリングターゲットを製造するための方法および装置
US20040262157A1 (en) 2003-02-25 2004-12-30 Ford Robert B. Method of forming sputtering target assembly and assemblies made therefrom
JP4000075B2 (ja) 2003-02-27 2007-10-31 株式会社東芝 ロータの補修方法
JP4422975B2 (ja) 2003-04-03 2010-03-03 株式会社コベルコ科研 スパッタリングターゲットおよびその製造方法
JP4163986B2 (ja) 2003-04-09 2008-10-08 新日本製鐵株式会社 不溶性電極及びその製造方法
US7278353B2 (en) 2003-05-27 2007-10-09 Surface Treatment Technologies, Inc. Reactive shaped charges and thermal spray methods of making same
EP1639620A2 (en) 2003-06-20 2006-03-29 Cabot Corporation Method and design for sputter target attachment to a backing plate
JP3890041B2 (ja) 2003-07-09 2007-03-07 株式会社リケン ピストンリング及びその製造方法
US6992261B2 (en) 2003-07-15 2006-01-31 Cabot Corporation Sputtering target assemblies using resistance welding
US7425093B2 (en) 2003-07-16 2008-09-16 Cabot Corporation Thermography test method and apparatus for bonding evaluation in sputtering targets
US7314650B1 (en) 2003-08-05 2008-01-01 Leonard Nanis Method for fabricating sputter targets
JP4310251B2 (ja) 2003-09-02 2009-08-05 新日本製鐵株式会社 コールドスプレー用ノズル及びコールドスプレー被膜の製造方法
EP1666630A4 (en) 2003-09-12 2012-06-27 Jx Nippon Mining & Metals Corp SPUTTERTARGET AND METHOD FOR FINISHING THE SURFACE OF SUCH A TARGET
US7351450B2 (en) 2003-10-02 2008-04-01 Delphi Technologies, Inc. Correcting defective kinetically sprayed surfaces
US7335341B2 (en) 2003-10-30 2008-02-26 Delphi Technologies, Inc. Method for securing ceramic structures and forming electrical connections on the same
WO2005079209A2 (en) 2003-11-26 2005-09-01 The Regents Of The University Of California Nanocrystalline material layers using cold spray
US20050147742A1 (en) 2004-01-07 2005-07-07 Tokyo Electron Limited Processing chamber components, particularly chamber shields, and method of controlling temperature thereof
JP2005232580A (ja) 2004-02-23 2005-09-02 Toyoshima Seisakusho:Kk 分割スパッタリングターゲット
US7832619B2 (en) 2004-02-27 2010-11-16 Howmet Corporation Method of making sputtering target
US7504008B2 (en) 2004-03-12 2009-03-17 Applied Materials, Inc. Refurbishment of sputtering targets
US7244466B2 (en) 2004-03-24 2007-07-17 Delphi Technologies, Inc. Kinetic spray nozzle design for small spot coatings and narrow width structures
JP4826066B2 (ja) 2004-04-27 2011-11-30 住友金属鉱山株式会社 非晶質の透明導電性薄膜およびその製造方法、並びに、該非晶質の透明導電性薄膜を得るためのスパッタリングターゲットおよびその製造方法
US7066375B2 (en) 2004-04-28 2006-06-27 The Boeing Company Aluminum coating for the corrosion protection of welds
DE102004029354A1 (de) 2004-05-04 2005-12-01 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
WO2006001976A2 (en) 2004-06-15 2006-01-05 Tosoh Smd, Inc. High purity target manufacturing methods
US20060006064A1 (en) 2004-07-09 2006-01-12 Avi Tepman Target tiles in a staggered array
ITMN20040016A1 (it) 2004-07-13 2004-10-13 Amfag Spa Utensile raschiatore per aereatore installato su rubinetto
US20060011470A1 (en) 2004-07-16 2006-01-19 Hatch Gareth P Sputtering magnetron control devices
EP1626433B1 (de) 2004-08-10 2007-02-21 Applied Materials GmbH & Co. KG Magnetronsputtereinrichtung, Zylinderkathode und Verfahren zur Aufbringung von dünnen Mehrkomponentenschichten auf einem Substrat
JP2006052440A (ja) 2004-08-11 2006-02-23 Hyogo Prefecture 無電解めっき用触媒液及び無電解めっき皮膜の形成方法
WO2006034054A1 (en) 2004-09-16 2006-03-30 Belashchenko Vladimir E Deposition system, method and materials for composite coatings
CN101052746B (zh) 2004-09-25 2010-04-14 Abb技术股份公司 用于制造耐烧蚀的涂层以及用于真空开关箱的相应屏蔽件
DE102004059716B3 (de) 2004-12-08 2006-04-06 Siemens Ag Verfahren zum Kaltgasspritzen
US7378132B2 (en) 2004-12-14 2008-05-27 Honeywell International, Inc. Method for applying environmental-resistant MCrAlY coatings on gas turbine components
CN100364618C (zh) 2004-12-27 2008-01-30 戴萌 一种用于骨修补的外科植入物材料
US20060137969A1 (en) 2004-12-29 2006-06-29 Feldewerth Gerald B Method of manufacturing alloy sputtering targets
US7399355B2 (en) 2005-02-22 2008-07-15 Halliburton Energy Services, Inc. Fluid loss control additive and cement compositions comprising same
US7354659B2 (en) 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining
DE102005018618A1 (de) 2005-04-21 2006-10-26 Rheinmetall Waffe Munition Gmbh Waffenrohr und Verfahren zur Beschichtung der inneren Oberfläche des Waffenrohres
US20060251872A1 (en) 2005-05-05 2006-11-09 Wang Jenn Y Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
US20060266639A1 (en) 2005-05-24 2006-11-30 Applied Materials, Inc. Sputtering target tiles having structured edges separated by a gap
US7316763B2 (en) 2005-05-24 2008-01-08 Applied Materials, Inc. Multiple target tiles with complementary beveled edges forming a slanted gap therebetween
KR100620213B1 (ko) 2005-05-31 2006-09-06 어플라이드 사이언스(주) 스퍼터링 타겟의 솔더 본딩 방법
US7550055B2 (en) 2005-05-31 2009-06-23 Applied Materials, Inc. Elastomer bonding of large area sputtering target
KR100683124B1 (ko) 2005-06-04 2007-02-15 재단법인서울대학교산학협력재단 초음속 분사 적층기술을 이용한 금형의 보수 방법
US7644745B2 (en) 2005-06-06 2010-01-12 Applied Materials, Inc. Bonding of target tiles to backing plate with patterned bonding agent
US7652223B2 (en) 2005-06-13 2010-01-26 Applied Materials, Inc. Electron beam welding of sputtering target tiles
US20060289305A1 (en) 2005-06-27 2006-12-28 Applied Materials, Inc. Centering mechanism for aligning sputtering target tiles
US20070012557A1 (en) 2005-07-13 2007-01-18 Applied Materials, Inc Low voltage sputtering for large area substrates
JP4200156B2 (ja) 2005-09-15 2008-12-24 麒麟麦酒株式会社 飲料注出装置の洗浄システム
US7837929B2 (en) 2005-10-20 2010-11-23 H.C. Starck Inc. Methods of making molybdenum titanium sputtering plates and targets
JP4795157B2 (ja) 2005-10-24 2011-10-19 新日本製鐵株式会社 コールドスプレー装置
US7624910B2 (en) * 2006-04-17 2009-12-01 Lockheed Martin Corporation Perforated composites for joining of metallic and composite materials
US7618500B2 (en) 2005-11-14 2009-11-17 Lawrence Livermore National Security, Llc Corrosion resistant amorphous metals and methods of forming corrosion resistant amorphous metals
US8480864B2 (en) 2005-11-14 2013-07-09 Joseph C. Farmer Compositions of corrosion-resistant Fe-based amorphous metals suitable for producing thermal spray coatings
US8075712B2 (en) 2005-11-14 2011-12-13 Lawrence Livermore National Security, Llc Amorphous metal formulations and structured coatings for corrosion and wear resistance
US8187720B2 (en) 2005-11-14 2012-05-29 Lawrence Livermore National Security, Llc Corrosion resistant neutron absorbing coatings
US20070116890A1 (en) 2005-11-21 2007-05-24 Honeywell International, Inc. Method for coating turbine engine components with rhenium alloys using high velocity-low temperature spray process
CA2560030C (en) 2005-11-24 2013-11-12 Sulzer Metco Ag A thermal spraying material, a thermally sprayed coating, a thermal spraying method an also a thermally coated workpiece
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
CA2571099C (en) 2005-12-21 2015-05-05 Sulzer Metco (Us) Inc. Hybrid plasma-cold spray method and apparatus
DE502006001063D1 (de) 2006-01-10 2008-08-21 Siemens Ag Kaltspritzanlage und Kaltspritzverfahren mit moduliertem Gasstrom
US7402277B2 (en) 2006-02-07 2008-07-22 Exxonmobil Research And Engineering Company Method of forming metal foams by cold spray technique
TW200738896A (en) 2006-04-12 2007-10-16 Wintek Corp Sputtering target
EP1849887A1 (de) 2006-04-26 2007-10-31 Sulzer Metco AG Target für eine Sputterquelle
JP5210498B2 (ja) 2006-04-28 2013-06-12 株式会社アルバック 接合型スパッタリングターゲット及びその作製方法
US20070289864A1 (en) 2006-06-15 2007-12-20 Zhifei Ye Large Area Sputtering Target
US20070289869A1 (en) 2006-06-15 2007-12-20 Zhifei Ye Large Area Sputtering Target
US7815782B2 (en) 2006-06-23 2010-10-19 Applied Materials, Inc. PVD target
KR101377574B1 (ko) 2006-07-28 2014-03-26 삼성전자주식회사 프락시 모바일 아이피를 사용하는 이동통신 시스템에서보안 관리 방법 및 그 시스템
US20080041720A1 (en) 2006-08-14 2008-02-21 Jaeyeon Kim Novel manufacturing design and processing methods and apparatus for PVD targets
WO2008079461A2 (en) 2006-09-08 2008-07-03 Reactive Nanotechnologies, Inc. Reactive multilayer joining with improved metallization techniques
US8020748B2 (en) 2006-09-12 2011-09-20 Toso SMD, Inc. Sputtering target assembly and method of making same
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US20080110746A1 (en) 2006-11-09 2008-05-15 Kardokus Janine K Novel manufacturing design and processing methods and apparatus for sputtering targets
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
WO2008081585A1 (ja) 2007-01-05 2008-07-10 Kabushiki Kaisha Toshiba スパッタリングターゲットとその製造方法
US20110303535A1 (en) 2007-05-04 2011-12-15 Miller Steven A Sputtering targets and methods of forming the same
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US7914856B2 (en) 2007-06-29 2011-03-29 General Electric Company Method of preparing wetting-resistant surfaces and articles incorporating the same
US20090010792A1 (en) 2007-07-02 2009-01-08 Heraeus Inc. Brittle metal alloy sputtering targets and method of fabricating same
US7871563B2 (en) 2007-07-17 2011-01-18 Williams Advanced Materials, Inc. Process for the refurbishing of a sputtering target
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
CA2701059C (en) 2007-11-01 2012-08-07 Sumitomo Metal Industries, Ltd. Piercing and rolling plug, method of regenerating such piercing and rolling plug, and equipment line for regenerating such piercing and rolling plug
TWI367904B (en) 2007-12-06 2012-07-11 Ind Tech Res Inst Aliphatic copolyester and its preparation, melt-blown nonwovens and fiber woven fabrics comprising the aliphatic copolyester
US8173206B2 (en) 2007-12-20 2012-05-08 General Electric Company Methods for repairing barrier coatings
US9334557B2 (en) 2007-12-21 2016-05-10 Sapurast Research Llc Method for sputter targets for electrolyte films
JP2009221543A (ja) 2008-03-17 2009-10-01 Hitachi Cable Ltd スパッタリングターゲット材
GB2459917B (en) 2008-05-12 2013-02-27 Sinito Shenzhen Optoelectrical Advanced Materials Company Ltd A process for the manufacture of a high density ITO sputtering target
DE102008024504A1 (de) 2008-05-21 2009-11-26 Linde Ag Verfahren und Vorrichtung zum Kaltgasspritzen
EP2135973A1 (en) 2008-06-18 2009-12-23 Centre National de la Recherche Scientifique Method for the manufacturing of sputtering targets using an inorganic polymer
JP5092939B2 (ja) 2008-07-01 2012-12-05 日立電線株式会社 Ｔｆｔ用平板型銅スパッタリングターゲット材及びスパッタリング方法
US20100012488A1 (en) 2008-07-15 2010-01-21 Koenigsmann Holger J Sputter target assembly having a low-temperature high-strength bond
US8192799B2 (en) 2008-12-03 2012-06-05 Asb Industries, Inc. Spray nozzle assembly for gas dynamic cold spray and method of coating a substrate with a high temperature coating
JP4348396B1 (ja) 2008-12-26 2009-10-21 田中貴金属工業株式会社 再生ターゲットの製造方法
US20100170937A1 (en) 2009-01-07 2010-07-08 General Electric Company System and Method of Joining Metallic Parts Using Cold Spray Technique
US8268237B2 (en) 2009-01-08 2012-09-18 General Electric Company Method of coating with cryo-milled nano-grained particles
US8363787B2 (en) 2009-03-25 2013-01-29 General Electric Company Interface for liquid metal bearing and method of making same
KR101294329B1 (ko) 2009-03-30 2013-08-07 삼성코닝정밀소재 주식회사 대형 스퍼터링 타겟재 제조방법
US8673122B2 (en) 2009-04-07 2014-03-18 Magna Mirrors Of America, Inc. Hot tile sputtering system
US8821701B2 (en) 2010-06-02 2014-09-02 Clifton Higdon Ion beam sputter target and method of manufacture
US20120017521A1 (en) 2010-07-26 2012-01-26 Matthew Murray Botke Variable performance building cladding according to view angle
US20120061235A1 (en) 2010-10-27 2012-03-15 Primestar Solar, Inc. Mixed sputtering target of cadmium sulfide and cadmium telluride and methods of their use
US9399816B2 (en) 2010-11-30 2016-07-26 Dow Global Technologies Llc Refurbishing copper and indium containing alloy sputter targets and use of such targets in making copper and indium-based films
US9412568B2 (en) 2011-09-29 2016-08-09 H.C. Starck, Inc. Large-area sputtering targets
KR20140108268A (ko) 2011-12-16 2014-09-05 에이치. 씨. 스타아크 아이앤씨 스퍼터링 타겟들의 스프레이 재생

Patent Citations (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436299A (en) * 1965-12-17 1969-04-01 Celanese Corp Polymer bonding
US3990784A (en) * 1974-06-05 1976-11-09 Optical Coating Laboratory, Inc. Coated architectural glass system and method
US4011981A (en) * 1975-03-27 1977-03-15 Olin Corporation Process for bonding titanium, tantalum, and alloys thereof
US4073427A (en) * 1976-10-07 1978-02-14 Fansteel Inc. Lined equipment with triclad wall construction
US4140172A (en) * 1976-12-23 1979-02-20 Fansteel Inc. Liners and tube supports for industrial and chemical process equipment
US4291104A (en) * 1978-04-17 1981-09-22 Fansteel Inc. Brazed corrosion resistant lined equipment
US4202932A (en) * 1978-07-21 1980-05-13 Xerox Corporation Magnetic recording medium
US4483819A (en) * 1981-07-31 1984-11-20 Hermann C. Starck Berlin Production of highly capacitive agglomerated valve metal powder and valve metal electrodes for the production of electrolytic capacitors
US4510171A (en) * 1981-09-11 1985-04-09 Monsanto Company Clad metal joint closure
US4459062A (en) * 1981-09-11 1984-07-10 Monsanto Company Clad metal joint closure
US4537641A (en) * 1983-03-18 1985-08-27 Hermann C. Starck Berlin Process for producing valve-metal anodes for electrolytic capacitors
US4508563A (en) * 1984-03-19 1985-04-02 Sprague Electric Company Reducing the oxygen content of tantalum
US4818629A (en) * 1985-08-26 1989-04-04 Fansteel Inc. Joint construction for lined equipment
US4722756A (en) * 1987-02-27 1988-02-02 Cabot Corp Method for deoxidizing tantalum material
US4731111A (en) * 1987-03-16 1988-03-15 Gte Products Corporation Hydrometallurical process for producing finely divided spherical refractory metal based powders
US4915745A (en) * 1988-09-22 1990-04-10 Atlantic Richfield Company Thin film solar cell and method of making
US4915745B1 (ja) * 1988-09-22 1992-04-07 A Pollock Gary
US5242481A (en) * 1989-06-26 1993-09-07 Cabot Corporation Method of making powders and products of tantalum and niobium
US5147125A (en) * 1989-08-24 1992-09-15 Viratec Thin Films, Inc. Multilayer anti-reflection coating using zinc oxide to provide ultraviolet blocking
US4964906A (en) * 1989-09-26 1990-10-23 Fife James A Method for controlling the oxygen content of tantalum material
US5302414A (en) * 1990-05-19 1994-04-12 Anatoly Nikiforovich Papyrin Gas-dynamic spraying method for applying a coating
US5302414B1 (en) * 1990-05-19 1997-02-25 Anatoly N Papyrin Gas-dynamic spraying method for applying a coating
US5091244A (en) * 1990-08-10 1992-02-25 Viratec Thin Films, Inc. Electrically-conductive, light-attenuating antireflection coating
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5305946A (en) * 1992-11-05 1994-04-26 Nooter Corporation Welding process for clad metals
US5679473A (en) * 1993-04-01 1997-10-21 Asahi Komag Co., Ltd. Magnetic recording medium and method for its production
US5795626A (en) * 1995-04-28 1998-08-18 Innovative Technology Inc. Coating or ablation applicator with a debris recovery attachment
US5993513A (en) * 1996-04-05 1999-11-30 Cabot Corporation Method for controlling the oxygen content in valve metal materials
US5954856A (en) * 1996-04-25 1999-09-21 Cabot Corporation Method of making tantalum metal powder with controlled size distribution and products made therefrom
US5859654A (en) * 1996-10-31 1999-01-12 Hewlett-Packard Company Print head for ink-jet printing a method for making print heads
US6238456B1 (en) * 1997-02-19 2001-05-29 H. C. Starck Gmbh & Co. Kg Tantalum powder, method for producing same powder and sintered anodes obtained from it
US5972065A (en) * 1997-07-10 1999-10-26 The Regents Of The University Of California Purification of tantalum by plasma arc melting
US6919275B2 (en) * 1997-11-26 2005-07-19 Applied Materials, Inc. Method of preventing diffusion of copper through a tantalum-comprising barrier layer
US6171363B1 (en) * 1998-05-06 2001-01-09 H. C. Starck, Inc. Method for producing tantallum/niobium metal powders by the reduction of their oxides with gaseous magnesium
US6911124B2 (en) * 1998-09-24 2005-06-28 Applied Materials, Inc. Method of depositing a TaN seed layer
US6136062A (en) * 1998-10-13 2000-10-24 H. C. Starck Gmbh & Co. Kg Niobium powder and a process for the production of niobium and/or tantalum powders
US7192623B2 (en) * 1998-11-16 2007-03-20 Commissariat A L'energie Atomique Thin layer of hafnium oxide and deposit process
US6197082B1 (en) * 1999-02-17 2001-03-06 H.C. Starck, Inc. Refining of tantalum and tantalum scrap with carbon
US6558447B1 (en) * 1999-05-05 2003-05-06 H.C. Starck, Inc. Metal powders produced by the reduction of the oxides with gaseous magnesium
US6139913A (en) * 1999-06-29 2000-10-31 National Center For Manufacturing Sciences Kinetic spray coating method and apparatus
US6589311B1 (en) * 1999-07-07 2003-07-08 Hitachi Metals Ltd. Sputtering target, method of making same, and high-melting metal powder material
US6261337B1 (en) * 1999-08-19 2001-07-17 Prabhat Kumar Low oxygen refractory metal powder for powder metallurgy
US6521173B2 (en) * 1999-08-19 2003-02-18 H.C. Starck, Inc. Low oxygen refractory metal powder for powder metallurgy
US6482743B1 (en) * 1999-09-13 2002-11-19 Sony Corporation Method of forming a semiconductor device using CMP to polish a metal film
US6258402B1 (en) * 1999-10-12 2001-07-10 Nakhleh Hussary Method for repairing spray-formed steel tooling
US6855236B2 (en) * 1999-12-28 2005-02-15 Kabushiki Kaisha Toshiba Components for vacuum deposition apparatus and vacuum deposition apparatus therewith, and target apparatus
US7101447B2 (en) * 2000-02-02 2006-09-05 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US6502767B2 (en) * 2000-05-03 2003-01-07 Asb Industries Advanced cold spray system
US20030023132A1 (en) * 2000-05-31 2003-01-30 Melvin David B. Cyclic device for restructuring heart chamber geometry
US6962407B2 (en) * 2000-06-07 2005-11-08 Fuji Photo Film Co., Ltd. Inkjet recording head, method of manufacturing the same, and inkjet printer
US7183206B2 (en) * 2000-09-27 2007-02-27 Contour Semiconductor, Inc. Fabrication of semiconductor devices
US6953742B2 (en) * 2000-11-01 2005-10-11 Applied Materials, Inc. Tantalum barrier layer for copper metallization
US6444259B1 (en) * 2001-01-30 2002-09-03 Siemens Westinghouse Power Corporation Thermal barrier coating applied with cold spray technique
US20020112955A1 (en) * 2001-02-14 2002-08-22 H.C. Starck, Inc. Rejuvenation of refractory metal products
US20060032735A1 (en) * 2001-02-14 2006-02-16 Aimone Paul R Rejuvenation of refractory metal products
US20020112789A1 (en) * 2001-02-20 2002-08-22 H.C. Starck, Inc. Refractory metal plates with uniform texture and methods of making the same
US7178744B2 (en) * 2001-04-24 2007-02-20 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6915964B2 (en) * 2001-04-24 2005-07-12 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6722584B2 (en) * 2001-05-02 2004-04-20 Asb Industries, Inc. Cold spray system nozzle
US7053294B2 (en) * 2001-07-13 2006-05-30 Midwest Research Institute Thin-film solar cell fabricated on a flexible metallic substrate
US7175802B2 (en) * 2001-09-17 2007-02-13 Heraeus, Inc. Refurbishing spent sputtering targets
US7081148B2 (en) * 2001-09-18 2006-07-25 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US6770154B2 (en) * 2001-09-18 2004-08-03 Praxair S.T. Technology, Inc. Textured-grain-powder metallurgy tantalum sputter target
US20050120957A1 (en) * 2002-01-08 2005-06-09 Flame Spray Industries, Inc. Plasma spray method and apparatus for applying a coating utilizing particle kinetics
US20050252450A1 (en) * 2002-01-08 2005-11-17 Flame Spray Industries, Inc. Plasma spray method and apparatus for applying a coating utilizing particle kinetics
US20050142021A1 (en) * 2002-01-24 2005-06-30 Aimone Paul R. Refractory metal and alloy refining by laser forming and melting
US6924974B2 (en) * 2002-03-22 2005-08-02 David H. Stark Hermetically sealed micro-device package using cold-gas dynamic spray material deposition
US20030190413A1 (en) * 2002-04-05 2003-10-09 Van Steenkiste Thomas Hubert Method of maintaining a non-obstructed interior opening in kinetic spray nozzles
US20030219542A1 (en) * 2002-05-25 2003-11-27 Ewasyshyn Frank J. Method of forming dense coatings by powder spraying
US20040037954A1 (en) * 2002-06-04 2004-02-26 Linde Aktiengesellschaft Process and device for cold gas spraying
US20040126499A1 (en) * 2002-06-04 2004-07-01 Linde Aktiengesellschaft Process and device for cold gas spraying
US6759085B2 (en) * 2002-06-17 2004-07-06 Sulzer Metco (Us) Inc. Method and apparatus for low pressure cold spraying
US7128988B2 (en) * 2002-08-29 2006-10-31 Lambeth Systems Magnetic material structures, devices and methods
US20050155856A1 (en) * 2002-09-20 2005-07-21 Kunihiro Oda Tantalum sputtering target and method for preparation thereof
US7108893B2 (en) * 2002-09-23 2006-09-19 Delphi Technologies, Inc. Spray system with combined kinetic spray and thermal spray ability
US20040065546A1 (en) * 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
US6749002B2 (en) * 2002-10-21 2004-06-15 Ford Motor Company Method of spray joining articles
US20040076807A1 (en) * 2002-10-21 2004-04-22 Ford Motor Company Method of spray joining articles
US6773969B2 (en) * 2002-12-18 2004-08-10 Au Optronics Corp. Method of forming a thin film transistor
US7067197B2 (en) * 2003-01-07 2006-06-27 Cabot Corporation Powder metallurgy sputtering targets and methods of producing same
US7164205B2 (en) * 2003-06-30 2007-01-16 Sharp Kabushiki Kaisha Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
US7170915B2 (en) * 2003-07-23 2007-01-30 Intel Corporation Anti-reflective (AR) coating for high index gain media
US7208230B2 (en) * 2003-08-29 2007-04-24 General Electric Company Optical reflector for reducing radiation heat transfer to hot engine parts
US20050084701A1 (en) * 2003-10-20 2005-04-21 The Boeing Company Sprayed preforms for forming structural members
US20070172378A1 (en) * 2004-01-30 2007-07-26 Nippon Tungsten Co., Ltd. Tungsten based sintered compact and method for production thereof
US6905728B1 (en) * 2004-03-22 2005-06-14 Honeywell International, Inc. Cold gas-dynamic spray repair on gas turbine engine components
US20050220995A1 (en) * 2004-04-06 2005-10-06 Yiping Hu Cold gas-dynamic spraying of wear resistant alloys on turbine blades
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060045785A1 (en) * 2004-08-30 2006-03-02 Yiping Hu Method for repairing titanium alloy components
US20060042728A1 (en) * 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
US20060090593A1 (en) * 2004-11-03 2006-05-04 Junhai Liu Cold spray formation of thin metal coatings
US20060121187A1 (en) * 2004-12-03 2006-06-08 Haynes Jeffrey D Vacuum cold spray process
US7479299B2 (en) * 2005-01-26 2009-01-20 Honeywell International Inc. Methods of forming high strength coatings
US7399335B2 (en) * 2005-03-22 2008-07-15 H.C. Starck Inc. Method of preparing primary refractory metal
US20080216602A1 (en) * 2005-05-05 2008-09-11 H. C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US20100055487A1 (en) * 2005-05-05 2010-03-04 H.C. Starck Gmbh Method for coating a substrate surface and coated product
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20100015467A1 (en) * 2006-11-07 2010-01-21 H.C. Starck Gmbh & Co., Kg Method for coating a substrate and coated product
US20080171215A1 (en) * 2007-01-16 2008-07-17 H.C. Starck Inc. High density refractory metals & alloys sputtering targets
US20100061876A1 (en) * 2008-09-09 2010-03-11 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US20100086800A1 (en) * 2008-10-06 2010-04-08 H.C. Starck Inc. Method of manufacturing bulk metallic structures with submicron grain sizes and structures made with such method

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7910051B2 (en) 2005-05-05 2011-03-22 H.C. Starck Gmbh Low-energy method for fabrication of large-area sputtering targets
US8802191B2 (en) 2005-05-05 2014-08-12 H. C. Starck Gmbh Method for coating a substrate surface and coated product
US20100055487A1 (en) * 2005-05-05 2010-03-04 H.C. Starck Gmbh Method for coating a substrate surface and coated product
US20080216602A1 (en) * 2005-05-05 2008-09-11 H. C. Starck Gmbh Coating process for manufacture or reprocessing of sputter targets and x-ray anodes
US8715386B2 (en) 2006-10-03 2014-05-06 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US8226741B2 (en) 2006-10-03 2012-07-24 H.C. Starck, Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20100272889A1 (en) * 2006-10-03 2010-10-28 H.C. Starch Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20100015467A1 (en) * 2006-11-07 2010-01-21 H.C. Starck Gmbh & Co., Kg Method for coating a substrate and coated product
US20130264013A1 (en) * 2006-12-13 2013-10-10 Steven A. Miller Methods of joining metallic protective layers
US8448840B2 (en) 2006-12-13 2013-05-28 H.C. Starck Inc. Methods of joining metallic protective layers
US8777090B2 (en) * 2006-12-13 2014-07-15 H.C. Starck Inc. Methods of joining metallic protective layers
US8113413B2 (en) 2006-12-13 2012-02-14 H.C. Starck, Inc. Protective metal-clad structures
US9095932B2 (en) 2006-12-13 2015-08-04 H.C. Starck Inc. Methods of joining metallic protective layers
US8002169B2 (en) 2006-12-13 2011-08-23 H.C. Starck, Inc. Methods of joining protective metal-clad structures
US8883250B2 (en) 2007-05-04 2014-11-11 H.C. Starck Inc. Methods of rejuvenating sputtering targets
US9783882B2 (en) 2007-05-04 2017-10-10 H.C. Starck Inc. Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8491959B2 (en) 2007-05-04 2013-07-23 H.C. Starck Inc. Methods of rejuvenating sputtering targets
US20080271779A1 (en) * 2007-05-04 2008-11-06 H.C. Starck Inc. Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom
US8961867B2 (en) 2008-09-09 2015-02-24 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8470396B2 (en) 2008-09-09 2013-06-25 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US20100086800A1 (en) * 2008-10-06 2010-04-08 H.C. Starck Inc. Method of manufacturing bulk metallic structures with submicron grain sizes and structures made with such method
US8043655B2 (en) 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
US20100170937A1 (en) * 2009-01-07 2010-07-08 General Electric Company System and Method of Joining Metallic Parts Using Cold Spray Technique
EP2206804A1 (en) 2009-01-07 2010-07-14 General Electric Company System and Method of Joining Metallic Parts Using Cold Spray Technique
EP2448709A1 (de) * 2009-06-30 2012-05-09 Siemens AG Verfahren zum verkleiden eines bauteils mit einer durch kaltspritzen verschlossenen selbst tragenden verkleidung
CN102470488A (zh) * 2009-06-30 2012-05-23 西门子公司 通过冷喷射封闭的自支承护套来为构件敷设护套的方法
US8703233B2 (en) 2011-09-29 2014-04-22 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets by cold spray
US9412568B2 (en) 2011-09-29 2016-08-09 H.C. Starck, Inc. Large-area sputtering targets
US20130082033A1 (en) * 2011-09-29 2013-04-04 H.C. Starck, Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9108273B2 (en) * 2011-09-29 2015-08-18 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9120183B2 (en) 2011-09-29 2015-09-01 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets
US9293306B2 (en) * 2011-09-29 2016-03-22 H.C. Starck, Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US8734896B2 (en) 2011-09-29 2014-05-27 H.C. Starck Inc. Methods of manufacturing high-strength large-area sputtering targets
US9564299B2 (en) * 2011-09-29 2017-02-07 H.C. Starck, Inc. Methods of manufacturing large-area sputtering targets using interlocking joints
US9289855B2 (en) 2012-05-25 2016-03-22 Shiloh Industries, Inc. Sheet metal piece having weld notch and method of forming the same
US9604311B2 (en) 2012-06-29 2017-03-28 Shiloh Industries, Inc. Welded blank assembly and method
WO2014005041A1 (en) 2012-06-29 2014-01-03 Shiloh Industries, Inc. Welded blank assembly and method
US11198195B2 (en) 2012-06-29 2021-12-14 TWB Company, LLC Welded blank assembly and method
EP2866966A4 (en) * 2012-06-29 2016-07-13 Shiloh Ind Inc WELDED ROHLING AND METHOD
US10821546B2 (en) * 2012-11-30 2020-11-03 Shiloh Industries, Inc. Method of forming a weld notch in a sheet metal piece
US20180193949A1 (en) * 2012-11-30 2018-07-12 Shiloh Industries, Inc. Method of forming a weld notch in a sheet metal piece
US9956636B2 (en) 2013-03-14 2018-05-01 Shiloh Industries, Inc. Welded blank assembly and method
EP3620255A1 (en) * 2013-03-14 2020-03-11 Shiloh Industries, Inc. Method of making a welded blank assembly
US20160089750A1 (en) * 2014-09-29 2016-03-31 U.S. Army Research Laboratory ATTN:RDRL-LOC-I Method to join dissimilar materials by the cold spray process
US10501827B2 (en) * 2014-09-29 2019-12-10 The United Statesd of America as represented by the Secretary of the Army Method to join dissimilar materials by the cold spray process
EP3448612A1 (de) * 2016-04-27 2019-03-06 ThyssenKrupp Steel Europe AG Mehrschichtbauteil und verfahren zu dessen herstellung
CN109402545A (zh) * 2017-08-18 2019-03-01 东莞中集专用车有限公司 牵引销保护装置
CN107598331A (zh) * 2017-10-26 2018-01-19 宝鸡市永盛泰钛业有限公司 一种钛管的焊接方法
CN111872385A (zh) * 2020-06-30 2020-11-03 中国石油天然气集团有限公司 一种双金属复合油井管螺纹接头的局部增材制造方法

Also Published As

Publication number Publication date
WO2008076748A3 (en) 2009-05-07
JP2010513712A (ja) 2010-04-30
EP2097558B1 (en) 2014-05-28
US8113413B2 (en) 2012-02-14
EP3023516A1 (en) 2016-05-25
US20110132534A1 (en) 2011-06-09
US20110300396A1 (en) 2011-12-08
EP2818577A1 (en) 2014-12-31
US20120145316A1 (en) 2012-06-14
EP2097558A2 (en) 2009-09-09
US8448840B2 (en) 2013-05-28
US8777090B2 (en) 2014-07-15
EP3023516B1 (en) 2017-08-09
US9095932B2 (en) 2015-08-04
WO2008076748A2 (en) 2008-06-26
JP5268937B2 (ja) 2013-08-21
US20140311669A1 (en) 2014-10-23
US8002169B2 (en) 2011-08-23
US20130264013A1 (en) 2013-10-10

Similar Documents

Publication Publication Date Title
US9095932B2 (en) Methods of joining metallic protective layers
US11085102B2 (en) Coating compositions
US20080063889A1 (en) Reactive Multilayer Joining WIth Improved Metallization Techniques
JP5164828B2 (ja) ジルコニウムでライニングした鋼のプレート及びかかるプレートを用いて製造される化学デバイス要素部品
US7748598B2 (en) Method of joining clad metals and vessel produced thereby
US4510171A (en) Clad metal joint closure
KR20040013944A (ko) 내환경성 클래드 판재 및 그 제조방법
WO2016185408A2 (en) Brazing filler
NL2015990B1 (en) Process of butt-welding a laminated item, and an assembly comprising a butt-welded laminated item.
JP2704452B2 (ja) コーティング複合材の突合わせ接合方法及び該接合方法による長尺複合パイプの製造方法並びに金属精練用物質の搬送用パイプ
JPH04157072A (ja) 異材接合方法
JP2593758B2 (ja) チタンクラッド鋼板の端部溶接方法
JPH11129090A (ja) 厚金属基材表面への薄金属シートの溶接被覆方法
JPH0323074A (ja) 防汚性に優れた銅合金クラッド鋼の溶接施工法
JPS60180685A (ja) クラツド材
JPS5855191A (ja) クラッド金属密閉継手、その継手を作る方法、及びクラッド材料部材の継合方法
JPH05245648A (ja) 異材接合方法
JPH0289589A (ja) 高耐食性異材接合材およびその製造方法
JPH06234076A (ja) 複層鋼材の溶接方法
JPS626791A (ja) チタン被覆を鉄鋼母材表面に形成する方法
JP2002086269A (ja) 金属複合材およびその製造方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: H.C. STARCK GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MILLER, STEVEN A.;SHEKHTER, LEONID N.;ZIMMERMAN, STEFAN;REEL/FRAME:018683/0476;SIGNING DATES FROM 20061020 TO 20061117

Owner name: H.C. STARCK, INC., MASSACHUSETTS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MILLER, STEVEN A.;SHEKHTER, LEONID N.;ZIMMERMAN, STEFAN;REEL/FRAME:018683/0476;SIGNING DATES FROM 20061020 TO 20061117

AS Assignment

Owner name: DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SEC

Free format text: INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (SENIOR);ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:020036/0759

Effective date: 20071026

Owner name: DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SEC

Free format text: INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (SECOND LIEN);ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:020036/0851

Effective date: 20071026

Owner name: DRESDNER BANK AG, NIEDERLASSUNG LUXEMBOURG, AS SEC

Free format text: INTELLECTUAL PROPERTY RIGHTS SECURITY AGREEMENT (MEZZANINE);ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:020036/0864

Effective date: 20071026

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION

AS Assignment

Owner name: COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGE

Free format text: SECURITY AGREEMENT;ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:028503/0188

Effective date: 20120620

Owner name: COMMERZBANK AG, FILIALE LUXEMBURG, AS SECURITY AGE

Free format text: SECURITY AGREEMENT;ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:028503/0196

Effective date: 20120620

Owner name: COMMERZBANKAG, FILIALE LUXEMBURG, AS SECURITY AGEN

Free format text: SECURITY AGREEMENT;ASSIGNOR:H.C. STARCK INC.;REEL/FRAME:028503/0167

Effective date: 20120620

AS Assignment

Owner name: GLAS TRUST CORPORATION LIMITED, UNITED KINGDOM

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF MEZZANINE SECURED PARTIES;REEL/FRAME:039370/0697

Effective date: 20160322

Owner name: GLAS TRUST CORPORATION LIMITED, UNITED KINGDOM

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF SECOND LIEN SECURED PARTIES;REEL/FRAME:039370/0863

Effective date: 20160322

Owner name: GLAS TRUST CORPORATION LIMITED, UNITED KINGDOM

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COMMERZBANK AKTIENGESELLSCHAFT, FILIALE LUXEMBOURG, AS SECURITY AGENT FOR THE BENEFIT OF SENIOR SECURED PARTIES;REEL/FRAME:039370/0742

Effective date: 20160322

AS Assignment

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057986/0378

Effective date: 20211101

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057986/0362

Effective date: 20211101

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057986/0057

Effective date: 20211101

AS Assignment

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057993/0198

Effective date: 20211101

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057993/0188

Effective date: 20211101

Owner name: H.C. STARCK INC., GERMANY

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:GLAS TRUST CORPORATION LIMITED;REEL/FRAME:057993/0178

Effective date: 20211101