US10674601B2 - Printed wiring board and camera module - Google Patents

Printed wiring board and camera module Download PDF

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Publication number
US10674601B2
US10674601B2 US16/011,203 US201816011203A US10674601B2 US 10674601 B2 US10674601 B2 US 10674601B2 US 201816011203 A US201816011203 A US 201816011203A US 10674601 B2 US10674601 B2 US 10674601B2
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Prior art keywords
metal core
mounting region
wiring board
core substrate
printed wiring
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US16/011,203
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US20180310401A1 (en
Inventor
Yuichi Sugiyama
Masashi Miyazaki
Hiroyuki Kobayashi
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Assigned to TAIYO YUDEN CO., LTD. reassignment TAIYO YUDEN CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUGIYAMA, YUICHI, MIYAZAKI, MASASHI, KOBAYASHI, HIROYUKI
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N5/2253—
    • H04N5/2258—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • the present disclosure relates to a printed wiring board and a camera module.
  • a printed wiring board including a metal core is known (e.g., Japanese Patent Publication Nos. S62-052988 and 2000-101245).
  • a metal core substrate including an individual piece having a rectangular front surface and a rectangular back surface, and four side surfaces connecting the front surface and the back surface; an insulation layer provided to each of a front surface and a back surface of the metal core substrate, the insulation layer being made of an insulating resin containing a filler; and a conductive pattern provided to the insulation layer provided each on the front surface and the back surface, the printed wiring board further comprising a first mounting region being a mounting region of a first image pickup device, the first mounting region provided on one side in a longitudinal direction in a front surface of the printed wiring board, the first mounting region having a first conductive pattern provided therein, the first conductive pattern configured to be electrically connected to the first image pickup device, a second mounting region being a mounting region of a second image pickup device, the second mounting region provided on another side in the longitudinal direction in the front surface of the printed wiring board, the second mounting region having a second conductive pattern provided therein, the second conductive pattern configured to be electrically connected to the second image pickup device, and
  • FIG. 1A is a plan view schematically illustrating a metal core substrate constituting a substrate according to a first embodiment.
  • FIG. 1B is a cross-sectional view taken along line A-A′ in a range of B-B′ in FIG. 1A .
  • FIG. 2 is a cross-sectional view schematically illustrating a portion corresponding to that in FIG. 1B in a printed wiring board according to a first embodiment.
  • FIG. 3A is a plan view schematically illustrating a metal core substrate constituting a substrate according to a second embodiment.
  • FIG. 3B is a cross-sectional view taken along line C-C′ in a range of D-D′ in FIG. 3A .
  • FIG. 4 is a cross-sectional view schematically illustrating a portion corresponding to that in FIG. 3B in a printed wiring board according to a second embodiment.
  • FIG. 5 is an enlarged cross-sectional view schematically illustrating a printed wiring board according to a first modified example.
  • FIG. 6 is an enlarged cross-sectional view schematically illustrating a printed wiring board according to a second modified example.
  • FIG. 7 is a plan view schematically illustrating a wiring density of a mounting region in a substrate according to a third embodiment.
  • FIGS. 8A and 8B are partial enlarged side views schematically illustrating a printed wiring board according to a third modified example.
  • FIGS. 9A, 9B, and 9C illustrate an example of wiring density.
  • FIGS. 10A, 10B, and 10C illustrate a metal core substrate that employs a rolled Cu layer and a copper plating film.
  • FIGS. 11A, 11B, and 11C illustrate an intimate contact configuration between a copper plating film and an insulation layer containing glass fibers.
  • FIGS. 12A, 12B, 12C, and 12D illustrate protruding pieces of a cross-shaped slit portion.
  • a printed wiring board according to an embodiment of the present disclosure will be described below with reference to drawings as appropriate.
  • the printed wiring board will be described as being suitably used as a printed wiring board for a camera module.
  • the printed wiring board according to an embodiment of the present disclosure is applicable to those other than a camera module.
  • FIG. 1A a plan view schematically illustrating a metal core substrate 11 constituting the printed wiring board 10 .
  • FIG. 1B is a cross-sectional view taken along line A-A′ in a range of B-B′ in FIG. 1A .
  • FIG. 2 is a cross-sectional view schematically illustrating a portion of the printed wiring board 10 corresponding to that in FIG. 1B .
  • the thickness direction of the printed wiring board 10 is defined as the Z-axis direction. Further, it is assumed that the printed wiring board 10 is disposed such that an upper surface 11 a and a lower surface 11 b of the metal core substrate 11 are parallel to an XY-plane orthogonal to the Z-axis. Further, it is assumed that a plurality of individual pieces 110 to 113 included in the printed wiring board 10 is disposed along the X-axis parallel to planned cutting lines CL 11 to CL 13 and the Y-axis parallel to planned cutting lines CL 14 to CL 16 orthogonal to the planned cutting lines CL 11 to CL 13 .
  • the printed wiring board 10 is suitably used as a printed wiring board for a camera module, and includes the metal core substrate 11 , an insulation layer 12 , and a solder resist layer 13 , 14 , as illustrated in FIG. 2 .
  • the printed wiring board 10 includes signal wiring and a conductor via that are not shown.
  • the printed wiring board 10 may be a so-called multilayer printed wiring board configured such that the insulation layer 12 and a conductor pattern including the signal wiring are laminated onto the front and back of the substrate in a repeated (alternate) manner while being insulated with the insulation layers 12 .
  • the metal core substrate 11 is a plate-shaped member constituted by, for example, a copper member, and provides stiffness to the printed wiring board 10 .
  • the metal core substrate 11 has a thickness equal to or smaller than 250 ⁇ m, for example, 210 ⁇ m, 160 ⁇ m, or 120 ⁇ m. Note that the metal core substrate 11 doubles as ground wiring.
  • the metal core substrate 11 includes a plurality of individual pieces.
  • the single metal core substrate 11 includes a large number of individual pieces, but here, a description will be given assuming that the metal core substrate 11 includes four individual pieces 110 to 113 , for convenience sake.
  • the plurality of individual pieces 110 to 113 has a quadrangular shape, and aligned in the X-axis direction (first direction) and the Y-axis direction (second direction). Only the predetermined number of the plurality of individual pieces 110 to 113 may be aligned in the X-axis direction and the Y-axis direction.
  • the plurality of individual pieces 110 to 113 has the same shape.
  • the metal core substrate 11 includes protruding pieces.
  • the protruding pieces are members to connect the individual pieces adjacent to each other, and are provided integrally with the individual pieces.
  • the plurality of individual pieces 110 to 113 has the same shape.
  • the protruding pieces 121 to 128 and 151 to 156 extend from the sides of the individual piece 110 , to connect the sides adjacent to each other of the individual pieces ( 111 , 113 , etc.) adjacent to each other.
  • the protruding pieces 121 to 124 are provided along the planned cutting line CL 11 , while protruding pieces 125 to 128 are provided along the planned cutting line CL 12 . Further, protruding pieces 151 to 153 are provided along the planned cutting line CL 15 , while protruding pieces 154 to 156 are provided along the planned cutting line CL 14 . As a result, the individual piece 110 surrounded by these protruding pieces 121 to 128 and 151 to 156 has a substantially rectangular shape that is formed by the lines along the planned cutting lines CL 11 , CL 12 , CL 14 , and CL 15 .
  • the planned cutting lines CL 11 to CL 16 are virtual lines, and the printed wiring board 10 is cut into the individual pieces along such virtual lines using, for example, a dicer. Considering that the blade of such a dicer has a predetermined width, and that the positions at which the printed wiring board 10 is cut by a dicer may deviate from the planned cutting lines CL 11 to CL 16 , the planned cutting lines CL 11 to CL 16 may be defined to have a predetermined width.
  • the individual piece 110 four sides along the planned cutting lines CL 11 , CL 12 , CL 14 , CL 15 are formed from cross-shaped hole portions 131 to 134 and hole portions 141 to 146 and 161 to 164 in addition to the above described protruding pieces 121 to 128 and 151 to 156 .
  • the cross-shaped hole portions 131 to 134 are formed at positions at which the planned cutting lines CL 11 , CL 12 , CL 14 , CL 15 intersect each other. Then, the protruding pieces 121 to 128 and 151 to 156 and the hole portions 141 to 146 and 161 to 164 each are alternately disposed between the cross-shaped hole portions 131 to 134 .
  • the cross-shaped hole portion 131 , the protruding piece 121 , hole portion 141 , the protruding piece 122 , the hole portion 142 , the protruding piece 123 , the hole portion 143 , the protruding piece 124 , and the cross-shaped hole portion 132 are aligned, in this order.
  • the cross-shaped hole portion 132 , the protruding piece 151 , the hole portion 161 , the protruding piece 152 , the hole portion 162 , the protruding piece 153 , and the cross-shaped hole portion 132 are aligned in this order.
  • the cross-shaped hole portions 131 , 133 , and 134 , the protruding pieces 125 to 128 and 154 to 156 , and the hole portions 144 to 146 and 163 to 164 are disposed.
  • the plurality of protruding pieces 121 to 128 and 151 to 156 are provided, at predetermined intervals, to the four sides formed in the individual piece 110 .
  • the predetermined intervals indicate a distance between the protruding pieces 121 to 128 and 151 to 156 adjacent each other (e.g., a distance between the protruding pieces 121 and 122 ), and corresponds to the length of the hole portions 141 to 143 along the planned cutting line CL 11 . It is preferable that such a predetermined interval is, for example, equal to or greater than the thickness D 11 of the protruding pieces 121 to 128 and 151 to 156 .
  • This predetermined interval is provided to prevent a short circuit which is caused such a burr, formed when cutting the protruding pieces 121 to 128 and 151 to 156 using, for example, a dicer, come in contact with the protruding pieces 121 to 128 and 151 to 156 .
  • the protruding pieces 121 , 124 , 125 , 128 , 151 , 153 , 154 , 156 are provided, at positions at which an offset corresponding to the thickness D 11 of the protruding pieces 121 to 128 is provided with respect to the corner portions 110 a to 110 d of the individual piece 110 , that is, at positions distant by D 12 to D 15 , respectively, from the corner portions 110 a to 110 d .
  • offsets D 12 to D 15 are provided to have a length of 105 ⁇ m in the metal core substrate 11 having a thickness of 210 ⁇ m, a length of 80 ⁇ m in the metal core substrate 11 having a thickness of 160 ⁇ m, or a length of 60 ⁇ m in the metal core substrate 11 having a thickness of 120 ⁇ m. Accordingly, the burr formed when cutting the protruding pieces 121 to 128 and 151 to 156 using, for example, a dicer can be prevented from extending to the outside of the individual piece 110 to damage other individual pieces and/or manufacturing devices, fall and contaminate manufacturing processes, or other.
  • the offsets D 12 to D 15 are made longer, the corner portions 110 a to 110 d are likely to be caught on something, and/or the individual piece 110 may be warped. Thus, it is desirable that the offsets D 12 to D 15 have such a length at which such an event does not occur.
  • the burrs produced by cutting the protruding pieces 121 , 124 , 125 , 128 , 151 , 153 , 154 , 156 using a dicing apparatus generally have a length of about the thickness D 11 of the protruding pieces 121 , 124 , 125 , 128 , 151 , 153 , 154 , 156 , or at least a length of about a half the length of the protruding pieces 121 , 124 , 125 , 128 , 151 , 153 , 154 , 156 .
  • the protruding pieces close to the corner portions, with the offsets D 12 to D 15 corresponding to the thickness D 11 of the protruding pieces 121 , 124 , 125 , 128 , 151 , 153 , 154 , 156 .
  • the offsets D 12 to D 15 are to be set at such a length as to prevent a large-scale printed wiring board from being warped and prevent the corner portions from being caught on other objects.
  • the thickness D 11 of the protruding pieces 121 to 128 and 151 to 156 is smaller than the thickness D 10 of the metal core substrate 11 .
  • the thickness D 11 of the protruding pieces 121 to 128 and 151 to 156 is, for example, 105 ⁇ m in the metal core substrate 11 having a thickness of 210 ⁇ , 80 ⁇ m in the metal core substrate 11 having a thickness of 160 ⁇ m, or 60 ⁇ m in the metal core substrate 11 having a thickness of 120 ⁇ m.
  • the protruding pieces 121 to 128 and 151 to 156 having the above-described thickness are formed such that, in the case of the protruding pieces 121 to 128 , recesses are formed in the lower surface 11 b of the metal core substrate 11 , for example, by half etching and, in the case of the protruding pieces 151 to 156 , recesses are formed in the upper surface 11 a of the metal core substrate 11 , for example, by half etching.
  • the total length of the protruding pieces 121 to 128 and 151 to 156 along the side of the individual piece 110 is equal to or greater than 50% of the length L 10 , L 15 of the sides, as expressed by the following formulas 1 and 2, and is, for example, equal to or greater than 400 ⁇ m.
  • L 15 ⁇ ( L 16 +L 17+ L 18) ⁇ 2 (formula 2)
  • protruding pieces adjacent to each other in the protruding pieces 121 to 128 and 151 to 156 in each side of the individual piece 110 are provided at positions different from each other in thickness direction of the metal core substrate 11 , as illustrated in FIG. 1B .
  • the protruding pieces 121 , 123 , 125 , 127 , 151 , 153 , 154 , and 156 are provided on the same plane as the upper surface 11 a of the metal core substrate 11
  • the protruding pieces 122 , 124 , 126 , 128 , 152 , and 155 are provided on the same plane as the lower surface 11 b of the metal core substrate 11 .
  • a punched portion can be formed by machining, such as punching and drilling, and chemical processing, such as etching.
  • the insulation layer 12 is formed on a surface of the metal core substrate 11 . In the insulation layer 12 , a wiring pattern is formed.
  • the insulation layer 12 is made of a thermosetting synthetic resin having insulation properties, such as an epoxy resin, a polyimide, a bismaleimide triazine resin, or these resins containing reinforcing filler such as glass fibers.
  • the solder resist layer 13 , 14 is an insulation film to protect a circuit pattern formed in the printed wiring board 10 , and is formed on a surface of the insulation layer 12 .
  • the solder resist layer 13 , 14 is made of, for example, a thermosetting epoxy resin. Further, such an electrode (not shown) provided on the front and back sides of the printed wiring board 10 is exposed on an opening portion (not shown) of the solder resist layer 13 , 14 .
  • the elastic modulus was about 23 GPa.
  • a dynamic viscoelastic measurement device (RSA3, TI Instruments, Inc.) was used as a measuring device, and the individual piece was subjected to three-point bending test with gaps of 10 mm in the center of the wiring board of the individual piece.
  • the elastic modulus was about 10 GPa.
  • a large-scale substrate and a large-scale wiring substrate are also referred to as an assembly substrate.
  • the metal core substrate 11 is prepared.
  • the cross-shaped hole portions 131 to 134 and the hole portions 141 to 146 and 161 to 164 are formed in the upper surface 11 a and the lower surface 11 b of the metal core substrate 11 , along the planned cutting lines CL 11 to CL 16 intersecting with one another.
  • the protruding pieces 121 to 128 and 151 to 156 are formed in a discontinuous manner.
  • the cross-shaped hole portions 131 to 134 and the hole portions 141 to 146 and 161 to 164 are formed such that the metal core substrate 11 is etched by, for example, a wet etching method.
  • the protruding pieces 121 to 128 and 151 to 156 are formed such that the metal core substrate 11 is half-etched by, for example, the wet etching method.
  • a through-hole and a dummy hole not shown may be formed by etching. Note that a through-hole, a dummy hole, and the like will be described with reference to FIGS. 9 and 10 .
  • an insulating resin material is laminated onto the metal core substrate 11 , to form the insulation layer 12 .
  • the cross-shaped hole portions 131 to 134 and the hole portions 141 to 146 and 161 to 164 as well as the recesses that are formed by half-etching to form the protruding pieces 121 to 128 and 151 to 156 are filled with an insulating material, so that the holes and recesses are filled therewith.
  • a wiring layer not shown may be formed.
  • a conductive pattern is formed on the insulation layer 12 .
  • Such a conductive pattern is insulated with an insulation layer and formed each on the front and back sides in the case of a two-layer printed board, while two each on the front and back sides in the case of four-layer printed circuit board. Note that the total number may be predetermined. Further, the conductive pattern on the front side and the conductive pattern on the back side are electrically connected through a through-hole, a Via, and/or the like.
  • the solder resist layers 13 , 14 are formed on the surfaces of the insulation layers 12 .
  • the metal core substrate 11 is cut along the planned cutting lines CL 11 to CL 16 by, for example, a dicer into the individual pieces 110 to 113 .
  • camera components such as image pickup devices are mounted to the individual pieces 110 to 113 .
  • a semiconductor element or a passive component which is different from the image pickup device, is mounted in a region (hereinafter, referred to as the component mounting region), which is different from a region (hereinafter, referred to as the “device mounting region”) in which the image pickup device is mounted.
  • the device mounting region and the component mounting region will be described later in detail.
  • the protruding pieces 121 to 128 and 151 to 156 can be provided as close to the corner portions 110 a to 110 d as possible, it is possible to prevent damage caused by warpage during a process flow. Furthermore, since the protruding pieces 121 to 128 and 151 to 156 are able to have a greater width, it is easy to handle the printed wiring board 10 even if the metal core substrate 11 becomes thin. Further, since the thin metal core substrate 11 can be used, it is possible to obtain the metal core substrate 11 having stiffness.
  • the printed wiring board 10 when the printed wiring board 10 has a large size, the printed wiring board 10 is prevented from being caught on something or warped due to the protruding pieces 121 to 128 and 151 to 156 , so that workability when manufacturing the printed wiring board 10 is enhanced.
  • the metal core substrate 11 is made of a metal member such as copper, it is not broken, for example, as in the case of a ceramic core when being mounted to a casing of a cell phone. Further, it is possible to ensure stiffness as a camera module wiring board after dicing.
  • FIG. 3A is a plan view schematically illustrating a metal core substrate 21 constituting the printed wiring board 20 .
  • FIG. 3B is a cross-sectional view taken along line C-C′ in a range of D-D′ in FIG. 3A .
  • FIG. 4 is a cross-sectional view schematically illustrating a portion of the printed wiring board 20 corresponding to that in FIG. 3B . Note that, in the drawings, an X-axis, a Y-axis, and a Z-axis are defined similarly as in the first embodiment.
  • the printed wiring board 20 includes the metal core substrate 21 , an insulation layer 22 , and a solder resist layer 23 , 24 , as in the printed wiring board 10 according to the first embodiment.
  • the printed wiring board 20 is different from the printed wiring board 10 according to the first embodiment, mainly in protruding pieces 221 to 226 and 251 to 256 and hole portions 241 to 244 and 261 to 264 . Accordingly, a description will be made hereinafter focusing on the metal core substrate 21 .
  • the individual pieces 210 to 213 in the metal core substrate 21 each have a quadrangular shape, and only the predetermined number thereof are aligned in the X-axis direction and the Y-axis direction, as in those in the first embodiment. Since the plurality of individual pieces 210 to 213 has the same shape, the individual piece 210 will be described below.
  • the protruding pieces 221 to 223 are provided along the planned cutting line CL 21
  • the protruding pieces 224 to 226 are provided along the planned cutting line CL 22
  • the protruding pieces 251 to 253 are provided along the planned cutting line CL 25
  • the protruding pieces 254 to 256 are provided along the planned cutting line CL 24 .
  • the individual piece 210 surrounded by theses protruding pieces 221 to 226 and 251 to 256 has a substantially rectangular shape that is formed by the lines along the planned cutting lines CL 21 , CL 22 , CL 24 , and CL 25 .
  • the protruding pieces 221 to 226 and 251 to 256 extend from the four sides of the individual piece 210 , and connect the sides adjacent to each other of the individual pieces ( 211 , 213 , etc.) adjacent to the individual piece 210 .
  • the plurality of protruding pieces 221 to 226 and 251 to 156 may be provided, at predetermined intervals, to the four sides formed in the individual piece 210 .
  • the predetermined intervals indicate a distance between the protruding pieces 221 to 226 and 251 to 256 adjacent each other (e.g., a distance between the protruding pieces 221 and 222 ), and corresponds to the length of the hole portions 241 , 242 along the planned cutting line CL 21 .
  • such a predetermined interval is, for example, equal to or greater than the thickness D 20 of the protruding pieces 221 to 226 and 251 to 256 .
  • the thickness D 20 of the protruding pieces 221 to 226 and 251 to 256 is equal to the thickness of the metal core substrate 21 , but may be smaller than the thickness of the metal core substrate 21 .
  • the protruding pieces 221 , 223 , 224 , 226 , 251 , 253 , 254 , and 256 i.e., the protruding pieces closest (next) to corner portions 210 a to 210 d of the individual piece 210 in each of the sides
  • the protruding pieces 221 , 223 , 224 , 226 , 251 , 253 , 254 , and 256 are provided, at positions at which an offset corresponding to the thickness D 20 of the protruding pieces 221 to 226 (metal core substrate 21 ) is provided with respect to the corner portions 210 a to 210 d of the individual piece 210 , that is, at positions distant by D 21 to D 24 , respectively, from the corner portions 210 a to 210 d .
  • offsets D 21 to D 24 are provided to have a length of 210 ⁇ m in the metal core substrate 21 having a thickness of 210 ⁇ m, a length of 160 ⁇ m in the metal core substrate 21 having a thickness of 160 ⁇ m, or a length of 120 ⁇ m in the metal core substrate 21 having a thickness of 120 ⁇ m.
  • the total length of the protruding pieces 221 to 226 and 251 to 156 along the side of the individual piece 210 is equal to or greater than 50% of the lengths L 20 , L 24 of the sides, as expressed by the following formulas 3 and 4.
  • the printed wiring board 20 having such a configuration is manufactured similarly to the printed wiring board 10 according to the first embodiment. However, since the half-etching method is not necessary to be used to form the protruding pieces 221 to 226 and 251 to 256 , the manufacturing method is simplified.
  • the protruding pieces 221 to 226 and 251 to 256 can be provided as close to the corner portions 210 a to 210 d as possible, it is possible to prevent damage caused by warpage during a process flow. Furthermore, since the protruding pieces 221 to 226 and 251 to 156 are able to have a greater width, it is easy to handle the printed wiring board 10 even if the metal core substrate 21 becomes thinner. Further, since the thin metal core substrate 21 can be used, it is possible to obtain the metal core substrate 21 having stiffness.
  • FIG. 7 is plan view schematically illustrating a wiring density of a part of a mounting region in the printed wiring board PC according to a third modified example.
  • FIG. 8 includes partial enlarged side views schematically illustrating the printed wiring board PC according to the third modified example.
  • FIG. 9 illustrates an example relating to wiring density. Note that in FIGS. 7, 8, and 9A to 9C , an X-axis, a Y-axis, and a Z-axis are defined similarly as in the first embodiment.
  • the printed wiring board PC has a configuration similar to that of the printed wiring board 10 illustrated in FIG. 2 . For example, the printed wiring board PC illustrated in FIG.
  • FIG. 7 is a four-layer substrate configured such that two layers are provided on the front side and two layers are provided on the back side, with the metal core substrate serving as the core.
  • FIG. 9B illustrates a conductive pattern P 1 of a first layer that is provided to the metal core substrate 51 in FIG. 9C
  • FIG. 9A illustrates a conductive pattern P 2 of a second layer.
  • a conductive pattern of the lower layer of the metal core substrate 51 is similarly formed of two-layer conductive patterns, although not shown in the drawings. Further, the conductive patterns on the front and back sides are electrically connected via a through-hole and/or a via.
  • the metal core substrate 11 , the insulation layer 12 , the solder resist layer 13 , 14 in FIG. 2 are applied to the metal core substrate 51 , an insulation layer 52 , solder resist layer 53 , 54 in FIGS. 7, 8, and 9 .
  • the conductive patterns P 1 , P 2 are constituted by wiring or an electrode formed integrally with wiring.
  • the conductive pattern P 1 of an inner layer is covered with an insulation layer of an upper layer, and the conductive pattern P 2 of an uppermost layer is covered with solder resist. Then, a part of the electrode is exposed from an opening portion of the solder resist.
  • metal terminals 55 are disposed in the periphery of the printed wiring board PC, and are exposed from opening portions of the solder resist 53 .
  • the metal terminals 55 wiring (not shown) covered with the solder resist layers 53 , 54 is provided.
  • the printed wiring board PC includes: the conductive patterns P 1 , P 2 , the metal terminals 55 which are included in the conductive patterns; a via; a through-hole; and the like, and components to contact the metal terminal 55 and other electrodes of the printed wiring board PC are mounted, so that a desired circuit is achieved.
  • achieved is a camera module in which image pickup devices are mounted.
  • the densities of the conductive patterns 56 A, 57 A in the device mounting region 56 and the component mounting region 57 are considered.
  • two image pickup devices synthesize two image data to achieve high resolution.
  • conductive patterns (wiring and electrodes) for this signal processing are concentrated in a region between two ICs, that is, in the component mounting region 57 .
  • components are also concentrated and fixed thereto.
  • the back surfaces of the chips are fixed to maintain stiffness, so that it is possible to place a conductive pattern having a density lower than a conductive pattern of the component mounting region 57 . For example, if removal of a conductive pattern is needed in order to adjust impedance, such a place should be in the device mounting region 56 .
  • the conductive patterns 56 A, 57 A are formed in the inner layer of the printed wiring board PC, higher stiffness can be maintained by virtue of the provision of conductive patterns. Accordingly, the conductive patterns 57 A are concentrated on the component mounting region 57 side, so that the density thereof is made higher than the densities of the device mounting regions 56 . Furthermore, since components other than the image pickup devices are fixed via this conductive patterns 57 A, solder, etc., it is possible to further increase stiffness. Further, by disposing such a conductive pattern 56 A as to have a low density under the chips, a portion that may cause deterioration of stiffness is placed under the chips.
  • FIG. 9C illustrates the metal core substrate 51 which is located in the core of the printed wiring board PC and is described in FIG. 1B . Subsequently, on an upper layer thereof, at least the insulation layer 52 is covered, and the conductive pattern P 1 of a first layer is provided thereto. Further, the conductive pattern P 2 of a second layer is provided via the insulation layer 52 . Note that two-layer conductive patterns are formed, similarly, on a lower layer of the metal core substrate 51 , but they are omitted here.
  • through-holes and dummy through-holes are provided in a uniform manner to some extent, which will be described with reference to FIG. 11 .
  • the holes of such through-holes and dummy through-holes are filled with a resin of the insulation layer or other insulating resin materials, and thus, by disposing them in a uniform manner, the balance of the metal core substrate 51 as a whole is equalized, so that generation of unnecessary stress is minimized.
  • wiring P 2 a is illustrated in the conductive pattern P 2 of the second layer.
  • This wiring P 2 a is, for example, a line of a differential circuit, and impedance variation, such as capacitive coupling, may occur between this differential line P 2 a and the conductive pattern P 1 of the first layer in some cases.
  • impedance variation such as capacitive coupling
  • the conductive pattern of the first layer indicated as GND is coated in the large area, the conductive pattern overlaps with the differential line P 2 a , and capacitance is coupled, and thus a removal region C may be provided.
  • the conductive patterns disposed on the back surface from the lower layer of the metal core substrate 51 are also similar thereto.
  • the stiffness of the metal core substrate 51 including a main component of a rolled Cu layer, the adhesion between the copper plating film layer and glass fiber sheet, the remaining-copper rate of conductive patterns being devised, it is possible to enhance stiffness of the printed wiring board PC, thereby being able to provide the printed wiring board PC that is thin, excellent in heat dissipation, and further does not break against impact.
  • FIG. 5 is an enlarged cross-sectional view schematically illustrating the printed wiring board 30 .
  • the printed wiring board 30 includes a metal core substrate 31 , an insulation layer (omitted in the drawings), a solder resist layer 33 , 34 , a conductive pattern 35 , as in the printed wiring board 20 according to the second embodiment. Note that an electrode exposed on the solder resist layer 33 , 34 , i.e., the conductive pattern 35 in this example, is schematically illustrated as the metal terminal 35 .
  • the metal terminal 35 is exposed on an opening portion of the solder resist layer 33 , and is provided at a position distant, by a distance D 31 , from the protruding piece 321 of the metal core substrate 31 .
  • the distance D 31 is equal to or greater than the thickness D 30 of the protruding piece 321 . Accordingly, it is possible to prevent the metal terminal 35 exposed on the surface of the solder resist layer 33 and a burr generated from the metal core substrate 31 from coming into contact with each other and being short-circuited.
  • FIG. 6 is an enlarged cross-sectional view schematically illustrating the printed wiring board 40 .
  • the printed wiring board 40 includes a metal core substrate 41 , an insulation layer 42 , a solder resist layer 43 , 44 , a conductive pattern 45 (metal terminal 45 ), as in the printed wiring board 10 according to the first embodiment. Note that the metal terminal 45 is exposed on an opening portion of the solder resist layer 43 , 44 .
  • the metal terminal 45 is exposed on the opening portion of the solder resist layer 43 , and is provided distant, by distances D 41 , D 42 , from protruding pieces 421 , 422 of the metal core substrate 41 , respectively.
  • the distances D 41 , D 42 are equal to or greater than a thickness D 40 of the protruding pieces 421 , 422 . Accordingly, it is possible to prevent the metal terminal 46 exposed on the surface of the solder resist layer 44 and a burr produced from the metal core substrate 41 from coming into contact with each other and being short-circuited.
  • FIG. 8 partially illustrates the printed wiring board PC.
  • the insulation layers IN are provided on both sides of a metal core substrate MC and conductive patterns are provided thereto.
  • conductive patterns electrode P 11 and wiring P 12
  • electrically connect image pickup devices and other components are provided, while on the back surface (not shown), for example, a solder ball electrode, rewiring of this electrode, and the like are provided.
  • the cross-sectional surfaces of the protruding pieces (bridges) BG 1 to BG 4 cut along the dicing line in FIG. 1A are exposed. Since these protruding pieces BG 1 to BG 4 are made of the same material as in the metal core substrate MC, the material is Cu. Further, the protruding pieces BG 1 to BG 4 are provided on the front and back surfaces in an alternate manner, as illustrated in FIG. 1B , which are illustrated as the protruding pieces BG 1 to BG 4 . Originally, if there is no solder short problem, BG 1 , BG 2 , BG 3 indicated by a dotted line, and BG 4 are obtained.
  • FIG. 8A illustrates conductive patterns given on the front surface of the printed wiring board PC, that is, in this example, the electrodes P 11 on the left side and the wiring P 12 on the right side are illustrated as conductive patterns other than GND. These conductive patterns may be disposed in the vicinity of the printed wiring board PC. Specifically, in a side surface F 1 close to the electrode P 11 , when the protruding piece BG 3 is provided at a portion corresponding to the X coordinate of the electrode, solder provided to the electrode P 11 might overflows from the electrode P 11 to the protruding piece BG 3 , which may result in a short.
  • the metal core substrate MC is grounded to GND, and thus, for example, an electrode and/or wiring applied with a signal other than GND results in a short, which may cause failure. Accordingly, in an example according to the present disclosure, the protruding piece BG 3 is avoided (moved) from BG 3 to BG 3 a in a design stage, as indicated by arrows, to prevent solder shorts.
  • no protruding piece is provided between BG 1 and BG 4 that are positioned on the front surface side, and instead the insulation layer is exposed. Further, in the case where there is a long wiring, a large-scale electrode, or the like, at least one or more of the protruding pieces BG 2 , BG 3 may be omitted between BG 1 and BG 4 .
  • FIG. 8B illustrates the end surfaces of protruding pieces 621 to 623 exposed on a side surface of a the printed wiring board 60 , and a metal terminal 65 disposed close to the coordinates of these protruding pieces.
  • the protruding pieces 621 to 623 are disposed, for example, so as not to overlap with the metal terminal 65 in the thickness direction of the printed wiring board 60 .
  • the metal terminal 65 and the protruding pieces 621 to 623 may be disposed so as to partially overlap with each other in the thickness direction of the printed wiring board 60 to the degree of about a design error.
  • the protruding pieces 621 to 623 only have to be formed in a direction of avoiding the metal terminal 65 in the X-direction. Note that an avoidance distance of the protruding pieces 621 to 623 is set so as to be distant by the thickness of the protruding pieces 621 to 623 or more.
  • stiffness means the degree of difficulty in dimensional change (deformation) against a bending force or twisting force, and from this viewpoint, high stiffness indicates that the excellent ability to maintain flatness of a flat substrate.
  • stiffness indicates the ability that the metal core substrate MC or the printed wiring board PC including the metal core substrate MC maintains flatness thereof. That is, it means the ability to have some degree of hardness as well as maintain flatness against various forces such as external force, stress, and heat. For example, in a two-lens camera module or the like, employment of a substrate having such flatness has such a merit that optical adjustments to both image pickup devices can be easily made. Thus, due to the trend toward lighter and more compact size, a thin printed wiring board that has stiffness and is resistant to fracture is to be employed.
  • the main material has three types: a resin substrate, an inorganic ceramic substrate made of glass or alumina, and a metal substrate made of copper or aluminum.
  • a resin substrate is mechanically weak and further is less resistant to temperature and is deformable.
  • the ceramic substrate when becoming thinner, increases this fragility so that it breaks immediately with an impact being applied thereto.
  • metal has a large thermal expansion rate, and may cause warpage.
  • a printed wiring board capable of overcoming these drawbacks and maintaining stiffness is desired.
  • a metal core substrate configured such that a main substrate made of rolled copper having a high elastic modulus is copper-plated on both sides thereof, thereby being able to obtain its stiffness, and thus a description thereof will be made below.
  • Cu foil is mainly divided into two types: one is rolled copper foil, and the other is Cu foil by plating (hereinafter, referred to as the copper plating film).
  • the former rolled copper foil is thinly rolled in a gradual manner by a rolling process, to be finished to have a predetermined thickness in the end, and the crystal thereof is, different from a copper plating film, and is largely expanded in a surface direction.
  • rolled copper foil has the main characteristics of high flexibility and great surface roughness. Further, since the rolled copper foil is compressed with a large pressure, stiffness/hardness thereof is more excellent than in the copper plating film.
  • the latter copper plating film includes: Cu plating used when forming a conductive pattern such as a printed board; and electrodeposited copper foil wound on a drum.
  • This electrodeposited copper foil is obtained by using a cylindrical metal drum cathode, performing electroplating up to the target thickness while rolling the drum, and continuously winding it thereon.
  • Cu plating employed for the printed board is formed into a printed board in an electroless or electrolytic manner by immersing it into plating solution.
  • the crystal structure thereof is smaller than that of the rolled copper foil, has a polycrystalline structure, and exhibit tubular structure by growing in the thickness direction.
  • the rolled copper foil since the rolled copper foil has a small surface roughness as described above, the adhesion thereof is smaller than that of the copper plating film.
  • the copper plating film has a polycrystalline structure growing in the thickness direction, and thus has a fine rough surface and higher adhesion as compared with that of the rolled copper.
  • FIG. 10B schematically illustrates these characteristics.
  • the reference character of the rolled Cu layer is given as RC (Rolled Copper), while the copper plating layer is given as CP (Copper Plating).
  • this copper plating layer CP has a polycrystalline structure, the roughness thereof can be made more noticeable by etching. This is because, generally, considering the etching rate of grains and grain boundaries, the etching rate of grain boundaries is higher.
  • the following construction is focused so as to employ both advantages. That is, the rolled Cu layer RC is employed as the main metal core substrate MC, and the plating layers CP are formed on both sides of this rolled Cu layer MC.
  • the merits of this structure will be described below.
  • the plating layer CP may be copper, silver, platinum, gold, Ni, Cr, or the like, but copper is employed here.
  • the plating layer CP having a thickness A of about 10 ⁇ m and the rolled Cu layer RC having a thickness B of 50 ⁇ m to 320 ⁇ m are employed.
  • increase in the thickness of the rolled Cu layer RC itself can ensure hardness and stiffness.
  • the thicknesses are expressed as 2A:B ⁇ (1:16) ⁇ (2:5) in a range of 2A ⁇ B.
  • the thickness of the plating layer CP is set to 10 ⁇ m, but specifically, it is about 6 ⁇ m to 10 ⁇ m.
  • a process of a contact hole (via) after forming the insulation layer IN and a process of roughening the plating layer CP, so as to come in intimate contact with an insulation layer IN include a process of etching the plating layer CP, such as a desmear process and light etching. It is found out that, if the plating layer CP does not have a thickness in the aforementioned range, the plating layer CP disappears when forming an electrode in the contact hole.
  • the portion covered with the insulation layer IN other than contacts C 2 to C 4 in FIG. 10 has a thickness in a range of about 6 ⁇ m to about 10 ⁇ m, since only a surface roughening process is performed thereto.
  • the material of the copper plating layer CP is copper which is the same material of the rolled Cu layer RC, and the adhesion therebetween is excellent. Further, since the copper plating layer CP itself is polycrystalline, the surface thereof has fine irregularities. When etching is further performed, the boundaries around the grains are removed, and the irregularities become further remarkable, that is, which resulting in a rough surface. These irregularities bring out anchor effects, which leads to the excellent adhesion with the resin of the insulation layer IN 1 .
  • FIG. 10B schematically illustrates such characteristics.
  • the portions depicted by triangles are polycrystalline plating layers. As described above, these polycrystalline layers are laminated into multiple layers, the surface polycrystalline layer is etched so that the irregularities appear. Note that the degree of roughness is high in the portion intimately contacting the insulation layer other than contacts, while the degree of roughness is low and gentle in the contacts C 3 , C 4 .
  • a sheet SH is a reinforcing sheet formed by weaving reinforced fibers such as carbon fibers, glass fibers or the like.
  • glass cloth is employed.
  • FIG. 11 schematically illustrates this. The characteristics thereof are that it is woven two-dimensionally (sheet-like manner), that is, woven thinly like cloth.
  • the sheet SH is formed such that a large number of lateral strings SH 1 and lengthwise string SH 2 are aligned and woven in such a manner as to be sewn with a needle and strings, as one example.
  • this single handkerchief itself can be softly warped and is deformable in its left, right, upper, and lower parts, however, it is integrally formed by being woven, and when an adhesive or the like is applied to this handkerchief and hardened, its stiffness is enhanced and also is not likely to fall apart. Furthermore, since fibers are woven like cloth, warpage and deformation upward, downward, leftward or rightward can be prevented. This is further improved if the material is glass or carbon.
  • the sheet-shaped insulation layers IN 1 are placed onto both surfaces of the metal core substrate MC.
  • the resin of such an insulation layer IN 1 is in intimate contact with the irregularities of the copper plating layer CP, and further, sheet-shaped reinforcing fibers (reinforcing filler) are placed onto the entire surface of the metal core substrate MC and integrated. That is, the reinforcing sheet SH is inserted, and the insulation layer IN hardened with a resin is in intimate contact with the copper plating layer CP by virtue of anchor effects while maintaining its plain surface shape.
  • stiffness/flatness as the printed wiring board PC further increases. Note that, when a description is made with reference to FIGS.
  • the insulation layer IN provided with the sheet SH is provided up to the outside of a region surrounded by outer dicing lines CL 11 , CL 13 , CL 14 , and CL 16 , and thus is provided to the protruding pieces, after singulation.
  • this reinforcing filler may be used for all the laminated insulation layers.
  • glass cloth and granular filler are used for reinforcement.
  • it is a double-sided board it is necessary that at least one layer of an insulation layer is provided on the front and back sides and the metal core substrate is sandwiched between the reinforcing fillers.
  • FIG. 11C illustrates a pattern of the metal core substrate MC.
  • Provision of a large hole in the metal core substrate MC reduces strength. That is, in order to enhance stiffness of the metal core substrate MC, it is better to avoid provision of a large hole therein. For example, it is preferable not to form a cavity for incorporating an IC or a chip capacitor. In specific, it is preferable to avoid formation of a cavity incorporating an IC chip considering the size thereof.
  • a large number of through-holes TH 1 are formed to connect a conductive pattern on the front side and a conductive pattern on the back side.
  • FIG. 11C schematically illustrates this. It is a matter of course that, after the positions of the necessary through-holes are determined, dummy through-holes are disposed considering the balance. Note that the diameter of these through-holes TH is about 300 ⁇ m to 500 ⁇ m.
  • the dummy through-holes TH 2 are formed when forming the through-holes TH 1 , so that the through-holes are dispersed as a whole, which can resolve the unbalance in the metal core substrate or printed circuit board. This can suppress deformation such as warpage of the metal core substrate or printed circuit board.
  • the resin of the insulation layer IN is filled in the through-holes TH.
  • the insulation layer IN is integrated with the resin layers on both sides of the metal core substrate MC of these through-holes. This can prevent the insulation layers from peeling.
  • the elimination of the dummy through-holes further enhances the stiffness. This is because a sheet obtained by weaving synthetic fibers, such as glass fibers, exists in the insulation layer and this insulation layer is in intimate contact with the plating layer by virtue of the anchor effects.
  • the thorough-holes including dummy through-holes are not necessarily provided in a uniform manner.
  • the total area of the through-holes is set to 30% to 5% relative to the area of the individual piece. Accordingly, the area other than the through-holes results in about 70% to 95%. This indicates more than a half in the individual piece is metal without holes, so that stiffness is greatly increased.
  • FIG. 10A illustrates the structure of the printed wiring board PC
  • FIG. 10B schematically illustrates three types of the structure of an encircled portion C 1 in FIG. 10A
  • the copper plating film CP has a polycrystalline structure, and has a tubular structure in the thickness direction, and this structure is schematically illustrated by triangles in FIG. 10B . Note that, in actuality, fine crystals of various sizes are disposed vertically and laterally at random and laminated, as if a plurality of layers is laminated.
  • the copper plating film CP of these fine crystals is roughened and an oxide film is further formed on the surface thereof, by processes which will be described below. This manufacturing method will be reviewed.
  • FIG. 10B illustrates solutions.
  • a contact C 2 has a structure involving this issue, and illustrates a state in which a contact hole is not processed at all.
  • a contact C 3 represents such a first solution that the copper plating film CP is removed via a contact hole V 1 to expose a rolled Cu layer. Then, in the bottom portion of the contact hole, a large crystal structure that is flat and spread in a surface direction without an oxide film is exposed. Thus, ions and water are not easily trapped, so that preferable contact can be achieved. It is important to completely expose the rolled Cu layer by overetching.
  • a surface layer of the copper plating film CP is removed via a contact hole V 1 to expose a flattened copper plating film. Then, in the bottom portion of the contact hole, an oxide film is removed and further a plating layer that is flattened to some extent from a rough surface is exposed, and thus ions and water are not easily trapped, so that preferable contact can be achieved.
  • FIG. 10C will be described. If all the metal core substrate is formed by plating and this metal core substrate is etched, variations in etching depth occur. This also applies to the copper plating film CP, and variations in etching depth and size occur, similarly, and thus, a core portion is constituted by a rolled Cu layer and a very thin copper plating film is formed on the surface thereof. As a result, etching variations of the copper plating film portion are reduced. Further, since ions, gases, and the like are blocked by the rolled Cu layer, a highly reliable printed wiring board can be achieved.
  • the tip of the whisker hit on something, they will drop as a burr. Accordingly, it is preferable to dispose bridges at intervals greater than the thickness of the bridges 121 to 124 as much as possible. Further, the burr produced at the bridge 121 may hit on a corner portion of the individual piece. That is, it is also preferable to dispose the bridge 121 inside, by the thickness of the bridge 121 , from the corner portion of the individual piece.
  • FIGS. 12A to 12D illustrate a cross-shaped slit at the center of FIG. 1A .
  • FIGS. 12A to 12D illustrate the bridges BG 1 to BG 4 formed at the central portion of the individual pieces 110 , 111 , 112 , and 113 .
  • Thin dashed lines are virtual lines depicted as burrs.
  • FIG. 12A is an example in which lines L 1 , L 2 of the bridge BG 1 are straight.
  • the bridge BG 1 is provided at a position distant, by the offset D 15 corresponding to the thickness of the bridges, from corner portions C 1 , C 2 .
  • FIG. 12B to 12D illustrate the bridges each in which a side L 2 recessed in a direction opposite to the corner portions C 1 , C 2 , so as to further prevent such burrs from contacting the corner portions.
  • the first bridge BG 1 adjacent to the corner portions is provided between the individual pieces 110 and 111 .
  • the side L 2 draws a parabola formed into a recessed part that is recessed in a direction opposite to the corner portions.
  • the bridge BG 2 is provided in the vertical direction so as to draw a parabola in a direction opposite to a corner C 3 .
  • the four bridges BG 1 to BG 4 are formed so as to draw a circular shape.
  • the four bridges BG 1 to BG 4 have roundness at the corners by etching, so that the cross-shaped slit appears to be of a circular shape. Note that the line L 1 is also recessed toward the corner C 1 . Further, in FIG. 12C , the line L 1 is straight.
  • FIG. 12D is a modified example of FIGS. 12B, 12C , and at least the line L 2 is not a parabola, but in such a shape obtained by bending a straight line at the center thereof so as to have an angle. Accordingly, the bridges BG 1 to BG 4 are formed so as to draw a rhombus.
  • the dicing line CL 15 corresponds to the most recessed place in the bridge BG 1 , a burr tends to be produced here. That is, the tip of such a burr is positioned on the further rear side of the offset D 15 . Thus, the burr can be further suppressed from falling.
  • the corner portions of the individual piece are rounded, it is also suppressed to be caught on the corner portions in the working process. Accordingly, it is possible to prevent burrs from falling upon impact in the working process.
  • the protruding pieces 121 - 128 , 151 - 156 ( 221 - 226 , 251 - 256 ) become longer by cutting, the protruding pieces 121 - 128 , 151 - 156 ( 221 - 226 , 251 - 256 ) do not come in contact with each other. Thus, it is possible to minimize falling of burrs. Further, it becomes possible that the protruding pieces 121 - 128 , 151 - 156 ( 221 - 226 , 251 - 256 ) have a long width. Thus, even if the metal core substrate 11 ( 21 ) becomes thinner, it can be handled.
  • the printed wiring board 10 is not caught on something or warped due to the protruding pieces 121 - 128 , 151 - 156 ( 221 - 226 , 251 - 256 ), workability when manufacturing the printed wiring board 10 is enhanced. Further, since a core thereof is formed using a metal member, it is not broken, for example, as in the case of a ceramic core when being mounted to a case.
  • the printed wiring board 30 ( 40 ) comprises: a metal core substrate 31 ( 41 ) including a plurality of metal individual pieces 310 - 313 ( 410 - 413 ) each constituted by a front surface and a back surface having a shape of a rectangle and four side surfaces connecting peripheries of the front surface and the back surface, the individual pieces being arranged in a first direction and a second direction orthogonal to the first direction, and a plurality of protruding pieces made of a same material as a material of the individual pieces 310 - 313 ( 410 - 413 ) and provided integrally therewith, the protruding pieces avoiding corner portions of the rectangle and connecting side surfaces of individual pieces adjacent to each other in the individual pieces; an insulation layer containing a reinforcing filler, the insulation layer 32 ( 42 ) being provided each on a front surface and a back surface of the metal core substrate; and a conductive pattern provided to a surface of the insulation layer 32 ( 42 ), an offset between a first protru
  • the printed wiring board 30 ( 40 ) comprises: a metal core substrate 31 ( 41 ) including a metal individual piece 310 - 313 ( 410 - 413 ) constituted by a front surface and a back surface having a shape of a rectangle and four side surfaces connecting peripheries of the front surface and the back surface, a plurality of protruding pieces 321 - 328 , 351 - 356 ( 421 - 428 , 451 - 456 ) made of a same material as a material of the individual piece 310 - 313 ( 410 - 413 ) and provided integrally therewith, the protruding piece avoiding corner portions of the rectangle, and protruding from the side surfaces of the individual piece 310 - 313 ( 410 - 413 ); an insulation layer 32 ( 42 ) containing a reinforcing filler, the insulation layer being provided each on a front surface and a back surface of the metal core substrate 31 ( 41 ); and a conductive pattern provided on a
  • the printed wiring board 30 ( 40 ) comprises:
  • the printed wiring board PC comprises: a metal core substrate MC including an individual piece BG 1 -BG 4 having a front surface, a back surface opposed to the front surface, and side surfaces connecting peripheries of the front surface and the back surface; an insulation layer IN containing a reinforcing filler, the insulation layer being provided each on a front surface and a back surface of the metal core substrate MC; and a wiring pattern provided to a surface of the insulation layer IN, the metal core substrate MC including a rolled Cu layer RC serving as a base and plating layers CP provided on both sides of the rolled Cu layer RC, the plating layers CP each having a rough surface.
  • the printed wiring board 30 ( 40 ) comprises: a metal core substrate 31 ( 41 ) including a plurality of metal individual pieces 310 - 313 ( 410 - 413 ) each constituted by a front surface and a back surface having a shape of a rectangle, the individual pieces being arranged in a first direction and a second direction orthogonal to the first direction, and a plurality of protruding pieces 321 - 328 , 351 - 356 ( 421 - 428 , 451 - 456 ) made of a same material as a material of the individual pieces 310 - 313 ( 410 - 413 ) and provided integrally therewith, the protruding pieces avoiding corner portions of the rectangle and connecting side surfaces of individual pieces adjacent to each other in the individual pieces 310 - 313 ( 410 - 413 ), the protruding pieces including a first protruding piece 321 , 324 , 325 , 328 , 351 , 353 , 354
  • the printed wiring board 30 ( 40 ) is not caught on something or warped due to the protruding piece 321 , 324 , 325 , 328 , 351 , 353 , 354 , 356 ( 421 , 424 , 425 , 428 , 451 , 453 , 454 , 456 ), workability when manufacturing the printed wiring board 30 , 40 is enhanced.
  • the printed wiring board 60 comprises: a metal core substrate 61 including an individual piece 610 - 613 having a front surface, a back surface, and four side surfaces, a plurality of protruding pieces 621 - 628 , 651 - 656 protruding from the side surfaces of the individual piece 610 - 613 ; an insulation layer 62 provided on a front surface and a back surface of the metal core substrate 61 including the protruding pieces 621 - 628 , 651 - 656 ; and a conductive pattern provided to the insulation layer 62 , a metal terminal 65 being provided in a periphery of at least one of a front side and a back side of the printed wiring board 60 , the metal terminal 65 having a potential different from a potential of the metal core substrate 61 , the protruding pieces 621 - 628 , 651 - 656 including a protruding piece close to the metal terminal 65 , the protruding piece being formed in a direction of
  • solder lies outside of the metal terminal 65 , it is possible to prevent occurrence of a short circuit between the metal terminal 65 and the protruding pieces 621 - 628 , 651 - 656 via solder.
  • the printed wiring board PC comprises: a metal core substrate MC including an individual piece BG constituted by a front surface and a back surface having a shape of a rectangle, and four side surfaces connecting the front surface and the back surface, and a plurality of protruding pieces BG 1 -BG 4 protruding outward from the side surfaces of the individual piece BG, the protruding pieces being integrally formed therewith; an insulation layer IN provided each on a front surface and a back surface of the metal core substrate MC; and a conductive pattern provided to the insulation layer IN, the printed wiring board including a device mounting region 56 in which a first image pickup device is provided, a device mounting region 56 in which a second image pickup device is provided, and a component mounting region 57 provided between the one device mounting region 56 and the other device mounting region, a mounting density of a conductive pattern on an inner layer corresponding to the component mounting region 57 being higher than a mounting density of a conductive pattern on an inner layer corresponding to the device mounting region 56 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
US16/011,203 2015-12-25 2018-06-18 Printed wiring board and camera module Active US10674601B2 (en)

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US11552022B2 (en) * 2020-06-29 2023-01-10 Samsung Electronics Co., Ltd. Package substrate and semiconductor package including the same
US12002763B2 (en) * 2020-06-29 2024-06-04 Samsung Electronics Co., Ltd. Package substrate and semiconductor package including the same

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JP6244499B2 (ja) 2017-12-06
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US20180310401A1 (en) 2018-10-25
WO2017111125A1 (ja) 2017-06-29
JPWO2017111125A1 (ja) 2017-12-21
JP2017204650A (ja) 2017-11-16
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CN108432352B (zh) 2019-11-26
JP2018037679A (ja) 2018-03-08

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