TWI787319B - 加工裝置 - Google Patents

加工裝置 Download PDF

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Publication number
TWI787319B
TWI787319B TW107127909A TW107127909A TWI787319B TW I787319 B TWI787319 B TW I787319B TW 107127909 A TW107127909 A TW 107127909A TW 107127909 A TW107127909 A TW 107127909A TW I787319 B TWI787319 B TW I787319B
Authority
TW
Taiwan
Prior art keywords
touch panel
unit
drive
screen
stop button
Prior art date
Application number
TW107127909A
Other languages
English (en)
Chinese (zh)
Other versions
TW201910948A (zh
Inventor
佐脇悟志
花島聡
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201910948A publication Critical patent/TW201910948A/zh
Application granted granted Critical
Publication of TWI787319B publication Critical patent/TWI787319B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16P—SAFETY DEVICES IN GENERAL; SAFETY DEVICES FOR PRESSES
    • F16P7/00—Emergency devices preventing damage to a machine or apparatus
    • F16P7/02—Emergency devices preventing damage to a machine or apparatus by causing the machine to stop on the occurrence of dangerous conditions therein
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Dicing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107127909A 2017-08-16 2018-08-10 加工裝置 TWI787319B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017157067A JP6983004B2 (ja) 2017-08-16 2017-08-16 加工装置
JP2017-157067 2017-08-16

Publications (2)

Publication Number Publication Date
TW201910948A TW201910948A (zh) 2019-03-16
TWI787319B true TWI787319B (zh) 2022-12-21

Family

ID=65464243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127909A TWI787319B (zh) 2017-08-16 2018-08-10 加工裝置

Country Status (4)

Country Link
JP (1) JP6983004B2 (ko)
KR (1) KR102523322B1 (ko)
CN (1) CN109404711B (ko)
TW (1) TWI787319B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7226410B2 (ja) * 2020-08-04 2023-02-21 トヨタ自動車株式会社 車載インターフェース装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04189443A (ja) * 1990-11-21 1992-07-07 Hitachi Seiko Ltd 工作機械の停止スイッチ装置
WO2004018149A1 (en) * 2002-08-23 2004-03-04 Eung Gyu Jung Cnc milling machine provided with remote control panel
US20050155043A1 (en) * 2004-01-08 2005-07-14 Schulz Kurt S. Human-machine interface system and method for remotely monitoring and controlling a machine
JP2012045251A (ja) * 2010-08-30 2012-03-08 Toyota Motor Corp 脚動作支援装置
JP2012227205A (ja) * 2011-04-15 2012-11-15 Fuji Mach Mfg Co Ltd 部品実装ライン
TW201245917A (en) * 2011-05-11 2012-11-16 Mitsubishi Electric Corp Numeral control apparatus
JP2014113669A (ja) * 2012-12-11 2014-06-26 Disco Abrasive Syst Ltd 切削装置
CN104932419A (zh) * 2014-03-19 2015-09-23 Dmg森精机株式会社 使用手动操作工作机械的模拟装置
CN106662859A (zh) * 2014-08-20 2017-05-10 Sig技术股份公司 处理单元、用于操作处理单元的方法和处理单元的用途

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341299A (ja) * 1989-07-10 1991-02-21 Fujitsu Ltd 地震時に装置を停止させるための装置
JP2002052443A (ja) * 2000-08-08 2002-02-19 Okamoto Machine Tool Works Ltd 平面研削装置
JP4432472B2 (ja) * 2002-11-29 2010-03-17 富士ゼロックス株式会社 ユーザインタフェース装置
JP2005046979A (ja) * 2003-07-31 2005-02-24 Disco Abrasive Syst Ltd 切削装置
SE529122C2 (sv) * 2004-09-24 2007-05-02 Jokab Safety Ab Skyddsanordning för områdesbegränsning och övervakning
JP2007027167A (ja) * 2005-07-12 2007-02-01 Yamagata Casio Co Ltd 部品搭載装置の非常停止方法
JP4257549B2 (ja) * 2007-07-17 2009-04-22 トヨタ自動車株式会社 操作装置
WO2010050154A1 (ja) * 2008-10-27 2010-05-06 日本電気株式会社 情報処理装置
EP2284668A3 (en) * 2009-06-15 2012-06-27 SMART Technologies ULC Interactive input system and components therefor
CN103224170A (zh) * 2012-01-26 2013-07-31 钱嘉诚 电梯错按及无人即时清除装置
JP5926418B2 (ja) * 2015-04-23 2016-05-25 京セラ株式会社 携帯端末装置
CN104964154A (zh) * 2015-06-29 2015-10-07 安徽宝昱电子科技有限公司 机械设备的紧急停止装置
CN204868111U (zh) * 2015-08-14 2015-12-16 天津津研机械设计有限公司 一种符合用户操作习惯的数控机床人机面板
JP6812306B2 (ja) * 2017-06-05 2021-01-13 株式会社クボタ 作業車両の停止システム及びそれを具備する作業車両

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04189443A (ja) * 1990-11-21 1992-07-07 Hitachi Seiko Ltd 工作機械の停止スイッチ装置
WO2004018149A1 (en) * 2002-08-23 2004-03-04 Eung Gyu Jung Cnc milling machine provided with remote control panel
US20050155043A1 (en) * 2004-01-08 2005-07-14 Schulz Kurt S. Human-machine interface system and method for remotely monitoring and controlling a machine
JP2012045251A (ja) * 2010-08-30 2012-03-08 Toyota Motor Corp 脚動作支援装置
JP2012227205A (ja) * 2011-04-15 2012-11-15 Fuji Mach Mfg Co Ltd 部品実装ライン
TW201245917A (en) * 2011-05-11 2012-11-16 Mitsubishi Electric Corp Numeral control apparatus
JP2014113669A (ja) * 2012-12-11 2014-06-26 Disco Abrasive Syst Ltd 切削装置
CN104932419A (zh) * 2014-03-19 2015-09-23 Dmg森精机株式会社 使用手动操作工作机械的模拟装置
CN106662859A (zh) * 2014-08-20 2017-05-10 Sig技术股份公司 处理单元、用于操作处理单元的方法和处理单元的用途

Also Published As

Publication number Publication date
CN109404711A (zh) 2019-03-01
CN109404711B (zh) 2023-06-02
TW201910948A (zh) 2019-03-16
JP2019034370A (ja) 2019-03-07
JP6983004B2 (ja) 2021-12-17
KR20190019015A (ko) 2019-02-26
KR102523322B1 (ko) 2023-04-18

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