TWI787319B - Processing device - Google Patents

Processing device Download PDF

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Publication number
TWI787319B
TWI787319B TW107127909A TW107127909A TWI787319B TW I787319 B TWI787319 B TW I787319B TW 107127909 A TW107127909 A TW 107127909A TW 107127909 A TW107127909 A TW 107127909A TW I787319 B TWI787319 B TW I787319B
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Taiwan
Prior art keywords
touch panel
unit
drive
screen
stop button
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TW107127909A
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Chinese (zh)
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TW201910948A (en
Inventor
佐脇悟志
花島聡
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日商迪思科股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16PSAFETY DEVICES IN GENERAL; SAFETY DEVICES FOR PRESSES
    • F16P7/00Emergency devices preventing damage to a machine or apparatus
    • F16P7/02Emergency devices preventing damage to a machine or apparatus by causing the machine to stop on the occurrence of dangerous conditions therein
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

Abstract

[課題]不會有按錯的情形,而輕易觸控觸控面板上的驅動停止按鍵。   [解決手段]本發明之切削裝置係按照對觸控面板(75)的操作,以控制手段控制單元的驅動的切削裝置(1),形成為單元開始驅動之後,以預定的時序將單元的驅動停止的驅動停止按鍵(81)被全面顯示在觸控面板的構成。藉由該構成,不會有按錯驅動停止按鍵的情形,可輕易觸控觸控面板上的驅動停止按鍵。[Problem] Touch the drive stop button on the touch panel easily without pressing the wrong button. [Solution] The cutting device of the present invention is a cutting device (1) in which the drive of the unit is controlled by the control means according to the operation of the touch panel (75). The stopped driving stop button (81) is fully displayed on the configuration of the touch panel. With this configuration, there is no case of pressing the driving stop button by mistake, and the driving stop button on the touch panel can be easily touched.

Description

加工裝置Processing device

本發明係關於將工件加工的加工裝置。The present invention relates to a machining device for machining workpieces.

以往,以進行半導體晶圓加工的加工裝置而言,已知有切削裝置、研削裝置、研磨裝置、雷射加工裝置等各種加工裝置。在該等加工裝置,一般配備有受理加工條件等操作指令的輸入的觸控面板式的顯示監視器,藉由顯示監視器,兼作輸入裝置與顯示裝置。在加工裝置的顯示監視器係顯示有驅動停止按鍵,作為安全對策,在維護時等,操作人員人工操作裝置各部時,藉由驅動停止按鍵被觸控,使裝置各部緊急停止(參照例如專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, various processing apparatuses such as cutting apparatuses, grinding apparatuses, lapping apparatuses, and laser processing apparatuses are known as processing apparatuses for processing semiconductor wafers. These processing devices are generally equipped with a touch panel type display monitor that accepts input of operation commands such as processing conditions, and the display monitor doubles as an input device and a display device. The display monitor of the processing device displays a drive stop button. As a safety measure, when the operator manually operates each part of the device during maintenance, the drive stop button is touched to make each part of the device emergency stop (see for example the patent document 1). [Prior Art Document] [Patent Document]

[專利文獻1]日本特開2014-113669號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-113669

(發明所欲解決之課題)(Problem to be solved by the invention)

但是,若在觸控面板的一部分顯示有驅動停止按鍵,在維護或安裝等時,在操作人員正在監視裝置的動作的期間,操作人員的視線係在裝置內而無法觀看觸控面板。因此,欲緊急停止時,有按錯觸控面板上的按鍵、或按壓驅動停止按鍵耗時的問題。若為設在加工裝置的框體的EMO(Emergency Off)開關,雖然可減少按錯等,但是加工裝置的全部功能會停止,因此必須再起動或初期化,復原時耗費時間。However, if a drive stop button is displayed on a part of the touch panel, during maintenance or installation, etc., while the operator is monitoring the operation of the device, the operator's line of sight is in the device and cannot see the touch panel. Therefore, when an emergency stop is desired, there is a problem of pressing a wrong button on the touch panel or pressing a drive stop button which takes time. If it is an EMO (Emergency Off) switch installed on the frame of the processing device, it can reduce mis-pressing, etc., but all functions of the processing device will stop, so it must be restarted or initialized, and it will take time to restore.

本發明係鑑於該情形而完成者,目的之一在提供不會有按錯的情形,而可輕易觸控觸控面板上的驅動停止按鍵的加工裝置。 (解決課題之手段)The present invention has been made in view of this situation, and one of the objects is to provide a processing device that can easily touch a drive stop button on a touch panel without making a mistake in pressing it. (means to solve the problem)

本發明之一態樣之加工裝置係具備有:可驅動的單元;顯示該單元的操作畫面的觸控面板;及按照對該觸控面板的操作,來控制單元的驅動的控制手段,該加工裝置之特徵為:該單元開始驅動而以預定的時序,將單元的驅動停止的驅動停止按鍵被全面顯示在該觸控面板。A processing device according to an aspect of the present invention is provided with: a driveable unit; a touch panel displaying an operation screen of the unit; and a control means for controlling the drive of the unit according to the operation of the touch panel. The device is characterized in that a driving stop button for stopping the driving of the unit at a predetermined timing after starting the driving of the unit is fully displayed on the touch panel.

藉由該構成,由於在觸控面板的全面顯示有驅動停止按鍵,因此即使觸控觸控面板的任何位置,均可使單元驅動停止。因此,即使在操作人員無法觀看觸控面板的狀態下,亦不會有按錯驅動停止按鍵的情形,而可將單元正確緊急停止。 (發明之效果)With this configuration, since the drive stop button is displayed on the entire touch panel, even if any position on the touch panel is touched, the drive of the unit can be stopped. Therefore, even in the state where the operator cannot see the touch panel, there is no situation of pressing the driving stop button by mistake, and the unit can be correctly stopped in an emergency. (Effect of Invention)

藉由本發明,由於在觸控面板的全面顯示有驅動停止按鍵,因此不會有按錯驅動停止按鍵的情形,可輕易觸控觸控面板上的驅動停止按鍵。With the present invention, since the drive stop button is displayed on the entire touch panel, there is no situation of pressing the drive stop button by mistake, and the drive stop button on the touch panel can be easily touched.

以下參照所附圖示,說明本實施形態之切削裝置。圖1係本實施形態之切削裝置的外觀斜視圖。圖2係本實施形態之切削裝置的內部的斜視圖。圖3係顯示比較例的操作畫面的顯示例的圖。其中,在本實施形態中,係例示切削裝置作為加工裝置來進行說明,但是加工裝置若具備有觸控面板,即未特別限定。The cutting device of this embodiment will be described below with reference to the attached drawings. Fig. 1 is an external perspective view of a cutting device according to this embodiment. Fig. 2 is a perspective view of the inside of the cutting device of the present embodiment. FIG. 3 is a diagram showing a display example of an operation screen of a comparative example. In addition, in this embodiment, although the cutting apparatus was demonstrated as an example and demonstrated as a processing apparatus, if a processing apparatus is equipped with a touch panel, it will not specifically limit.

在切削裝置1係設有受理操作人員的操作的觸控面板75,藉由觸控面板75設定有各種加工條件。切削裝置1係構成為根據在觸控面板75所設定的設定條件,使切削刀71(參照圖2)與被保持在吸盤平台14的工件W相對移動,將吸盤平台14上的工件W沿著分割預定線進行切削。工件W的表面係藉由格子狀的分割預定線而被區劃成複數區域,在經區劃的各區域係形成有各種元件。The cutting device 1 is provided with a touch panel 75 that accepts an operator's operation, and various processing conditions are set on the touch panel 75 . The cutting device 1 is configured to move the cutting blade 71 (see FIG. 2 ) relative to the workpiece W held on the chuck table 14 according to the setting conditions set on the touch panel 75, and move the workpiece W on the chuck table 14 along the Divide the planned line for cutting. The surface of the workpiece W is divided into a plurality of regions by grid-shaped dividing lines, and various elements are formed in each divided region.

在工件W的背面貼著有切割帶T,在切割帶T的外周貼著有環狀框架F。工件W係在透過切割帶T而被支持在環狀框架F的狀態下被搬入至切削裝置1。其中,工件W若為成為加工對象者即可,亦可為例如元件形成完畢的半導體晶圓或光元件晶圓。此外,切割帶T係除了在帶件基材塗布有黏著層的一般的黏著帶之外,亦可為在帶件基材貼著有DAF的DAF(Die Attach Film)帶件。A dicing tape T is attached to the back of the workpiece W, and an annular frame F is attached to the outer periphery of the dicing tape T. As shown in FIG. The workpiece W is carried into the cutting device 1 while being supported by the ring frame F through the dicing tape T. As shown in FIG. Here, the workpiece W may be any object to be processed, and may be, for example, a semiconductor wafer or an optical element wafer on which elements have been formed. In addition, the dicing tape T may be a DAF (Die Attach Film) tape in which DAF is attached to the tape base, in addition to a general adhesive tape in which an adhesive layer is coated on the tape base.

切削裝置1係具有:覆蓋切削加工的加工空間的直方體狀的框體10、及鄰接於框體10而形成待機空間或洗淨空間的支持台13。支持台13的上面中央係以朝向框體10內延伸的方式形成有開口,該開口係覆蓋在可連同吸盤平台14一起移動的移動板15及蛇腹狀的防水蓋件16。在防水蓋件16的下方係設有使吸盤平台14以X軸方向移動的X軸移動機構50(參照圖2)。在圖1中係顯示使吸盤平台14移動至框體10的外部而在支持台13上待機的狀態。The cutting device 1 includes a cuboid frame 10 covering a machining space for cutting, and a support table 13 adjacent to the frame 10 to form a waiting space or a cleaning space. An opening is formed in the center of the upper surface of the supporting platform 13 to extend toward the inside of the frame body 10 , and the opening is covered by a moving plate 15 that can move together with the suction cup platform 14 and a bellows-shaped waterproof cover 16 . Below the waterproof cover 16 is provided an X-axis moving mechanism 50 (see FIG. 2 ) for moving the suction cup table 14 in the X-axis direction. In FIG. 1 , the chuck table 14 is moved to the outside of the housing 10 and is on standby on the support table 13 .

吸盤平台14係藉由多孔陶瓷材而形成有保持面17,藉由在該保持面17所產生的負壓,吸引保持工件W。在吸盤平台14的周圍係設有空氣驅動式的4個夾具18,藉由各夾具18,工件W的周圍的環狀框架F從四方被夾持固定。在吸盤平台14的上方係設有以Y軸方向延伸的一對定心導件21。藉由一對定心導件21的X軸方向的分離接近,相對吸盤平台14,工件W的X軸方向被定位。The chuck platform 14 is formed with a holding surface 17 by porous ceramic material, and the workpiece W is sucked and held by negative pressure generated on the holding surface 17 . Four air-driven clamps 18 are provided around the chuck table 14 , and the annular frame F around the workpiece W is clamped and fixed from four sides by each clamp 18 . A pair of centering guides 21 extending in the Y-axis direction are arranged above the suction cup platform 14 . By the separation and approach of the pair of centering guides 21 in the X-axis direction, the workpiece W is positioned in the X-axis direction relative to the chuck table 14 .

在支持台13係在吸盤平台14之鄰設有載置匣盒的升降機單元22。在升降機單元22,載置有匣盒的載台23被升降,匣盒內的工件W的取出放入位置在高度方向予以調整。在框體10的側面11係設有一邊使環狀框架F導引至一對定心導件21一邊在匣盒取出放入工件W的推拉臂24。此外,在框體10的側面11係設有在一對定心導件21與吸盤平台14之間搬送工件W的搬入臂31、搬出臂41。Adjacent to the suction cup platform 14 on the support table 13 is an elevator unit 22 for loading the cassettes. In the elevator unit 22 , the stage 23 on which the cassette is placed is raised and lowered, and the loading and unloading position of the workpiece W in the cassette is adjusted in the height direction. On the side surface 11 of the frame body 10 is provided a push-pull arm 24 for taking out and placing the workpiece W in the magazine while guiding the ring frame F to the pair of centering guides 21 . In addition, a carry-in arm 31 and a carry-out arm 41 for transporting the workpiece W between the pair of centering guides 21 and the chuck table 14 are provided on the side surface 11 of the housing 10 .

推拉臂24係以被配設在框體10的側面11的水平移動機構25予以驅動。水平移動機構25係具有:被配置在框體10的側面11之與Y軸方向呈平行的一對導軌26;及以可在一對導軌26滑動的方式作設置的馬達驅動的滑件27。在滑件27的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿28。連結在滾珠螺桿28的一端部的驅動馬達29被旋轉驅動,藉此推拉臂24沿著一對導軌26而以Y軸方向實施推拉動作。The push-pull arm 24 is driven by a horizontal movement mechanism 25 disposed on the side surface 11 of the frame body 10 . The horizontal movement mechanism 25 includes: a pair of guide rails 26 parallel to the Y-axis direction arranged on the side surface 11 of the housing 10 ; and a motor-driven slider 27 slidably provided on the pair of guide rails 26 . A nut portion (not shown) is formed on the back side of the slider 27 , and the ball screw 28 is screwed to the nut portion. The drive motor 29 connected to one end of the ball screw 28 is rotationally driven, whereby the push-pull arm 24 performs a push-pull motion in the Y-axis direction along the pair of guide rails 26 .

搬入臂31及搬出臂41係以配設在框體10的側面11的水平移動機構32、42予以驅動。水平移動機構32、42係具有:被配置在框體10的側面11之與Y軸方向呈平行的一對導軌33、43;及可在一對導軌33、43滑動的方式作設置的馬達驅動的滑件34、44。在滑件34、44的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿35、45。連結在滾珠螺桿35、45的一端部的驅動馬達36、46被旋轉驅動,藉此搬入臂31及搬出臂41沿著一對導軌33、43而以Y軸方向予以搬送移動。The carry-in arm 31 and the carry-out arm 41 are driven by the horizontal movement mechanisms 32 and 42 arranged on the side surface 11 of the housing 10 . The horizontal movement mechanism 32, 42 has: a pair of guide rails 33, 43 arranged on the side 11 of the frame body 10 parallel to the Y-axis direction; The sliders 34,44. A nut portion (not shown) is formed on the back side of the slider 34 , 44 , and the ball screw 35 , 45 is screwed to the nut portion. The drive motors 36 , 46 connected to one ends of the ball screws 35 , 45 are rotationally driven, whereby the carry-in arm 31 and the carry-out arm 41 are conveyed in the Y-axis direction along the pair of guide rails 33 , 43 .

如圖2所示,在框體10及支持台13(參照圖1)內的基台19上,係設有將吸盤平台14以X軸方向移動的X軸移動機構50。X軸移動機構50係具有:被配置在基台19上之與X軸方向呈平行的一對導軌51、及可在一對導軌51滑動的方式作設置的馬達驅動的X軸平台52。在X軸平台52的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿53。連結在滾珠螺桿53的一端部的驅動馬達54被旋轉驅動,藉此吸盤平台14沿著一對導軌51而以X軸方向移動。As shown in FIG. 2 , an X-axis moving mechanism 50 for moving the chuck table 14 in the X-axis direction is provided on the base 19 inside the frame body 10 and the support table 13 (see FIG. 1 ). The X-axis moving mechanism 50 includes: a pair of guide rails 51 parallel to the X-axis direction arranged on the base 19 , and a motor-driven X-axis stage 52 provided to slide on the pair of guide rails 51 . A nut portion (not shown) is formed on the back side of the X-axis table 52 , and the ball screw 53 is screwed to the nut portion. The drive motor 54 connected to one end of the ball screw 53 is rotationally driven, whereby the chuck table 14 moves in the X-axis direction along the pair of guide rails 51 .

在基台19上係以跨越吸盤平台14的移動路徑的方式設有立設的門型的立壁部20。在立壁部20係設有:將切削手段70以Y軸方向移動的Y軸移動機構60;及將切削手段70以Z軸方向移動的Z軸移動機構65。Y軸移動機構60係具有:配置在立壁部20的前面之與Y軸方向呈平行的一對導軌61;及可在一對導軌61滑動的方式作設置的Y軸平台62。Z軸移動機構65係具有:配置在Y軸平台62上之與Z軸方向呈平行的一對導軌66;及以可在一對導軌66滑動的方式作設置的Z軸平台67。A door-shaped vertical wall portion 20 is provided on the base 19 so as to straddle the moving path of the chuck table 14 . The vertical wall portion 20 is provided with: a Y-axis moving mechanism 60 for moving the cutting means 70 in the Y-axis direction; and a Z-axis moving mechanism 65 for moving the cutting means 70 in the Z-axis direction. The Y-axis moving mechanism 60 has: a pair of guide rails 61 parallel to the Y-axis direction arranged in front of the vertical wall portion 20 ; and a Y-axis platform 62 that can slide on the pair of guide rails 61 . The Z-axis moving mechanism 65 has: a pair of guide rails 66 arranged on the Y-axis platform 62 parallel to the Z-axis direction; and a Z-axis platform 67 slidable on the pair of guide rails 66 .

在各Z軸平台67的下部係設有切削工件W的切削手段70。在Y軸平台62及Z軸平台67的背面側係分別形成有螺帽部,在該等螺帽部螺合有滾珠螺桿63、68。在Y軸平台62用的滾珠螺桿63、Z軸平台67用的滾珠螺桿68的一端部係分別連結有驅動馬達64、69。藉由驅動馬達64、69,各自的滾珠螺桿63、68被旋轉驅動,藉此各切削手段70沿著導軌61以Y軸方向移動,各切削手段70沿著導軌66以Z軸方向移動。A cutting means 70 for cutting the workpiece W is provided below each Z-axis stage 67 . Nut portions are respectively formed on the back sides of the Y-axis stage 62 and the Z-axis stage 67 , and ball screws 63 , 68 are screwed to these nut portions. Drive motors 64 and 69 are respectively connected to one ends of the ball screw 63 for the Y-axis stage 62 and the ball screw 68 for the Z-axis stage 67 . By driving the motors 64 , 69 , the respective ball screws 63 , 68 are rotationally driven, whereby each cutting means 70 moves along the guide rail 61 in the Y-axis direction, and each cutting means 70 moves along the guide rail 66 in the Z-axis direction.

在各切削手段70的心軸係可旋轉地裝設有將被保持在吸盤平台14的工件W進行切削的切削刀71。各切削刀71係以結合劑固定例如鑽石砥粒而成形為圓板狀。此外,在切削手段70的心軸殼係設有對準用的顯微鏡(未圖示)。返回至圖1,在框體10的前面12係設置有觸控面板75。在觸控面板75係除了各種加工條件的設定畫面之外,顯示有吸盤平台14或切削手段70等各單元的操作畫面等。此外,詳容後述,在觸控面板75係顯示有在維護時或安裝時使各單元停止的驅動停止按鍵81(參照圖6)。A cutting blade 71 for cutting the workpiece W held on the chuck table 14 is rotatably mounted on the spindle system of each cutting means 70 . Each cutting blade 71 is formed into a disc shape by fixing, for example, diamond abrasive grains with a bonding agent. In addition, a microscope (not shown) for alignment is provided on the spindle housing of the cutting means 70 . Returning to FIG. 1 , a touch panel 75 is provided on the front surface 12 of the housing 10 . In addition to the setting screen of various processing conditions, the touch panel 75 displays the operation screen of each unit, such as the chuck table 14 and the cutting means 70, etc. FIG. In addition, as will be described in detail later, a drive stop button 81 (see FIG. 6 ) for stopping each unit at the time of maintenance or installation is displayed on the touch panel 75 .

但是,如圖3的比較例所示,在一般的操作畫面中,為了在維護時或安裝時以手動使切削手段等單元停止,在畫面角落較小地顯示有驅動停止按鍵91。在維護時或安裝時,操作人員必須注視單元的驅動,因此無法一邊觀看觸控面板的操作畫面一邊確認單元的驅動。因此,欲使單元緊急停止時,必須將視線從單元回到操作畫面來觸控驅動停止按鍵91,但是難以瞬時觸控驅動停止按鍵91。However, as shown in the comparative example of FIG. 3 , on a general operation screen, in order to manually stop units such as cutting means during maintenance or installation, a drive stop button 91 is displayed in a small size at the corner of the screen. At the time of maintenance or installation, since the operator has to watch the drive of the unit, it is impossible to check the drive of the unit while looking at the operation screen of the touch panel. Therefore, when the unit is to be stopped in an emergency, it is necessary to turn the line of sight back from the unit to the operation screen and touch the driving stop button 91 , but it is difficult to touch the driving stop button 91 instantaneously.

驅動停止按鍵91係較小地被顯示在畫面的角落,因此難以在操作畫面找到驅動停止按鍵91,此外有將驅動停止按鍵91按錯成別的按鍵之虞。此點,若為EMO開關74(參照圖1),由框體10突出而設,以明顯的顏色形成為充分大小,因此在緊急時,操作人員可瞬時按入EMO開關74。在EMO開關74的周圍由於沒有類似的開關,因此不會有按錯的情形而可確實停止單元,但是由於裝置的全部功能停止,因此再起動等時耗費時間。The drive stop button 91 is small and displayed at the corner of the screen, so it is difficult to find the drive stop button 91 on the operation screen, and there is a risk of pressing the drive stop button 91 as another button by mistake. In this regard, if it is the EMO switch 74 (refer to FIG. 1 ), it is protruded from the frame body 10 and is formed in a sufficient size with a clear color, so the operator can press the EMO switch 74 instantaneously in case of emergency. Since there is no similar switch around the EMO switch 74, the unit can be reliably stopped without pressing it by mistake, but it takes time to restart because all functions of the device are stopped.

因此,在本實施形態中,在觸控面板75(參照圖1)的全面顯示驅動停止按鍵81(參照圖6),藉此即使在維護時或安裝時注視單元的驅動的狀態下,亦可瞬時觸控驅動停止按鍵81。不會有如EMO開關74(參照圖1)般使其他功能停止的情形,而僅有所需單元被停止。此外,由於在觸控面板75的全面以驅動停止按鍵81顯示,因此不會有按錯其他按鍵的情形。如上所示,藉由驅動停止按鍵81,容易停止單元,並且可確實防止因按到其他按鍵所造成的錯誤作動。Therefore, in the present embodiment, the driving stop button 81 (see FIG. 6 ) is displayed on the entire touch panel 75 (see FIG. 1 ), so that even when the unit is driven during maintenance or installation, it is possible to The momentary touch drives the stop button 81 . No other functions are disabled like the EMO switch 74 (see FIG. 1 ), but only the required units are disabled. In addition, since the drive stop button 81 is displayed on the entire surface of the touch panel 75, there is no chance of pressing other buttons by mistake. As shown above, by driving the stop button 81, it is easy to stop the unit, and it is possible to surely prevent erroneous actions caused by pressing other buttons.

以下參照圖4及圖5,說明單元的操作控制。圖4係本實施形態之觸控面板的剖面模式圖。圖5係顯示本實施形態之單元的操作控制的區塊圖。其中,本實施形態之單元係例如表示:吸盤平台、切削手段、推拉臂、搬入臂、搬出臂、顯微鏡。此外,本實施形態之驅動軸係例如表示:X軸移動機構、Y軸移動機構、Z軸移動機構、各臂的水平移動機構、吸盤平台的旋轉軸、心軸的旋轉軸、顯微鏡上下移動軸。The operation control of the unit will be described below with reference to FIG. 4 and FIG. 5 . Fig. 4 is a schematic cross-sectional view of the touch panel of the present embodiment. Fig. 5 is a block diagram showing the operation control of the unit of this embodiment. Among them, the units of this embodiment represent, for example, a suction cup platform, a cutting means, a push-pull arm, a carrying-in arm, a carrying-out arm, and a microscope. In addition, the driving shaft system of the present embodiment represents, for example: X-axis moving mechanism, Y-axis moving mechanism, Z-axis moving mechanism, horizontal moving mechanism of each arm, rotation axis of the suction cup platform, rotation axis of the mandrel, microscope vertical movement axis .

如圖4所示,觸控面板75係所謂靜電電容方式的觸控面板,在液晶面板76上積層玻璃基板77、透明電極膜78、保護膜79而構成。在液晶面板76係顯示有操作畫面,以指尖觸碰面板上面,藉此可在操作畫面輸入各種資訊。此時,在玻璃基板77的四個角落設有電極(未圖示),對各電極施加電壓而使觸控面板全體發生均一電場,由指尖觸碰到觸控面板75的畫面時的靜電電容的變化來檢測指尖的座標。As shown in FIG. 4 , the touch panel 75 is a so-called capacitive touch panel, and is configured by laminating a glass substrate 77 , a transparent electrode film 78 , and a protective film 79 on a liquid crystal panel 76 . An operation screen is displayed on the liquid crystal panel 76, and various information can be input on the operation screen by touching the panel with a fingertip. At this time, electrodes (not shown) are provided on the four corners of the glass substrate 77, and a voltage is applied to each electrode to generate a uniform electric field on the entire touch panel, and the static electricity generated when the screen of the touch panel 75 is touched by a fingertip Changes in capacitance to detect the coordinates of the fingertip.

如圖5所示,在觸控面板75係顯示在人工操作時受理對各單元88的各種操作的操作畫面S1。若在操作畫面S1使單元88被驅動,由操作畫面S1切換成全面顯示驅動停止按鍵81(參照圖6)的停止畫面S2。在該觸控面板75係連接有按照面板操作來控制單元88的驅動的控制手段85。在控制手段85係設有:按照顯示在觸控面板75的驅動按鍵來使驅動軸89驅動的驅動控制部86;及使停止單元88的驅動的驅動停止按鍵81顯示在觸控面板75的全面的顯示控制部87。As shown in FIG. 5 , the touch panel 75 displays an operation screen S1 for accepting various operations on each unit 88 during manual operation. When the unit 88 is driven on the operation screen S1, the operation screen S1 is switched to a stop screen S2 in which the driving stop button 81 (see FIG. 6 ) is fully displayed. The touch panel 75 is connected with a control means 85 for controlling the drive of the unit 88 according to the panel operation. The control means 85 is provided with: a drive control unit 86 that drives the drive shaft 89 according to the drive keys displayed on the touch panel 75; The display control unit 87.

驅動控制部86係按照觸控面板75的操作,控制各單元88的驅動軸89的驅動及停止。例如,若在觸控面板75顯示有操作畫面S1的狀態下被按下驅動按鍵,藉由驅動控制部86,透過驅動軸89來使單元88被驅動。此外,若在觸控面板75顯示有停止畫面S2的狀態下使驅動停止按鍵81被按下,藉由驅動控制部86,透過驅動軸89,單元88被停止。顯示控制部87係在人工操作時使操作畫面S1顯示在觸控面板75,單元88開始驅動之後,以預定時序切換成停止畫面S2而使驅動停止按鍵81顯示在面板全面。The drive control unit 86 controls the drive and stop of the drive shaft 89 of each unit 88 in accordance with the operation of the touch panel 75 . For example, if the driving button is pressed while the touch panel 75 is displaying the operation screen S1 , the unit 88 is driven by the driving control unit 86 through the driving shaft 89 . In addition, if the drive stop button 81 is pressed in the state where the stop screen S2 is displayed on the touch panel 75 , the unit 88 is stopped by the drive control unit 86 through the drive shaft 89 . The display control unit 87 displays the operation screen S1 on the touch panel 75 during manual operation, and switches to the stop screen S2 at a predetermined timing after the unit 88 starts driving to display the drive stop button 81 on the entire panel.

在觸控面板75的全面顯示有驅動停止按鍵81時,觸控面板75的畫面全體作為感測區域來發揮功能。因此,無關於觸控面板75的觸控位置,單元88的驅動被停止。其中,驅動停止按鍵81係可在單元88開始驅動之後被自動顯示,亦可在單元88開始驅動之後,藉由按下切換按鍵等而以手動顯示。因此,預定的時序係指單元88開始驅動之後的時序,除了單元88開始驅動的時序之外,包含有以手動使驅動停止按鍵81顯示的時序。When the drive stop button 81 is displayed on the entire touch panel 75 , the entire screen of the touch panel 75 functions as a sensing area. Therefore, regardless of the touch position of the touch panel 75, the drive of the unit 88 is stopped. Wherein, the driving stop button 81 can be automatically displayed after the unit 88 starts driving, and can also be displayed manually by pressing a switching button or the like after the unit 88 starts driving. Therefore, the predetermined timing refers to the timing after the drive of the unit 88 is started, and includes the timing of manually displaying the drive stop button 81 in addition to the timing of the start of the drive of the unit 88 .

如上所示,因全面顯示觸控面板75的驅動停止按鍵81,可使驅動中的單元88輕易緊急停止。其中,控制手段85的各部係藉由執行各種處理的處理器或記憶體等所構成。記憶體係視用途而由ROM(Read Only Memory,唯讀記憶體)、RAM(Random Access Memory,隨機存取記憶體)等一個或複數記憶媒體所構成。在記憶體係記憶有例如裝置各部的驅動控制用程式或顯示控制用程式。此外,控制手段85亦可有別於切削裝置1全體的控制,另外設為觸控面板75專用。As described above, since the drive stop button 81 of the touch panel 75 is fully displayed, the unit 88 being driven can be easily stopped in an emergency. Among them, each part of the control means 85 is constituted by a processor, a memory, etc. that execute various processes. The memory system is composed of one or more memory media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the application. In the memory system, for example, a drive control program or a display control program for each part of the device is stored. In addition, the control means 85 may be used exclusively for the touch panel 75 separately from the overall control of the cutting device 1 .

參照圖6,說明顯示出驅動停止按鍵的停止畫面。圖6係顯示本實施形態之停止畫面的顯示例的圖。其中,在圖6中係適當使用圖5的符號來進行說明。Referring to FIG. 6 , the stop screen displaying the drive stop button will be described. Fig. 6 is a diagram showing a display example of a stop screen in this embodiment. In addition, in FIG. 6, the code|symbol of FIG. 5 is used suitably for description.

如圖6A所示,在維護時或安裝時,係在觸控面板75的停止畫面S2全體顯示驅動停止按鍵81,在驅動停止按鍵81的一角顯示有由停止畫面S2恢復成操作畫面S1的結束鈕82。因此,在本實施形態中,嚴謹而言,並非觸控面板75的畫面全體成為驅動停止按鍵81,而是除了結束鈕82的顯示區域之外的剩餘區域成為驅動停止按鍵81。亦即,驅動停止按鍵81顯示在觸控面板75的全面,並非必定侷限於驅動停止按鍵81被顯示在畫面全體的構成,包含有驅動停止按鍵81被顯示在大致畫面全體的構成。As shown in FIG. 6A, during maintenance or installation, the drive stop button 81 is displayed on the entire stop screen S2 of the touch panel 75, and the end of returning to the operation screen S1 from the stop screen S2 is displayed on a corner of the drive stop button 81. Button 82. Therefore, in this embodiment, strictly speaking, not the entire screen of the touch panel 75 becomes the drive stop button 81 , but the remaining area except the display area of the end button 82 becomes the drive stop button 81 . That is, the display of the drive stop button 81 on the entire touch panel 75 is not necessarily limited to a configuration in which the drive stop button 81 is displayed on the entire screen, and includes a configuration in which the drive stop button 81 is displayed on substantially the entire screen.

此外,結束鈕82係以不會被操作人員誤觸的方式而被顯示在驅動停止按鍵81的一角。因此,即使在操作人員的視線離開觸控面板75的狀態下,亦防止結束鈕82被誤觸。此外,在停止畫面係僅顯示有驅動停止按鍵81及結束鈕82等2種按鍵,因此若目視觸控面板75,即可輕易特定結束鈕82的位置。如上所示,在視線離開觸控面板75的狀態下,係輕易觸控驅動停止按鍵81,若目視觸控面板75,亦輕易觸控結束鈕82。In addition, the end button 82 is displayed on the corner of the drive stop button 81 so that the operator will not accidentally touch it. Therefore, even in a state where the operator's line of sight is away from the touch panel 75 , the end button 82 is prevented from being accidentally touched. In addition, only two types of buttons, namely, the drive stop button 81 and the end button 82 , are displayed on the stop screen, so the position of the end button 82 can be easily identified by visually viewing the touch panel 75 . As shown above, when the line of sight is away from the touch panel 75 , it is easy to touch and drive the stop button 81 , and it is easy to touch the end button 82 when looking at the touch panel 75 .

此外,如圖6B所示,在維護時或安裝時,亦可在觸控面板75僅顯示驅動停止按鍵81。此外,驅動停止按鍵81係不僅使單元88驅動停止,亦可在單元88的驅動停止後,使單元88回復原點。例如,若在切削刀71(參照圖1)的接觸式安裝時觸控驅動停止按鍵81,不僅切削刀71的下降動作被停止,切削刀71恢復至原點位置而由與吸盤平台14的接觸位置分離。In addition, as shown in FIG. 6B , only the drive stop button 81 may be displayed on the touch panel 75 at the time of maintenance or installation. In addition, the driving stop button 81 not only stops the driving of the unit 88, but also returns the unit 88 to the original point after the driving of the unit 88 stops. For example, if the touch drive stop button 81 is touched during the contact installation of the cutting blade 71 (refer to FIG. 1 ), not only the descending action of the cutting blade 71 is stopped, but also the cutting blade 71 returns to the original position and is controlled by the contact with the suction cup platform 14. location separation.

參照圖7,說明使用觸控面板的單元的停止方法。圖7係顯示本實施形態之單元之停止方法之一例的圖。Referring to FIG. 7 , a method of stopping the unit using the touch panel will be described. Fig. 7 is a diagram showing an example of the method of stopping the unit of this embodiment.

如圖7A所示,若以維護等而使單元88(參照圖2)被驅動,切削裝置1的觸控面板75由操作畫面切換成停止畫面,在觸控面板75的全面顯示驅動停止按鍵81。操作人員係必須監視切削裝置1的單元88的動作,因此如箭號所示,操作人員的視線朝向切削裝置1的內部,而不在裝置外部的觸控面板75。此時,觸控面板75全體作為驅動停止按鍵81來發揮功能,因此操作人員若僅辨識觸控面板75的設置位置,在緊急時亦可對應。As shown in FIG. 7A , if the unit 88 (refer to FIG. 2 ) is driven for maintenance, etc., the touch panel 75 of the cutting device 1 switches from the operation screen to the stop screen, and the driving stop button 81 is displayed on the entire touch panel 75. . The operator has to monitor the action of the unit 88 of the cutting device 1 , so as indicated by the arrow, the operator's line of sight is toward the inside of the cutting device 1 , not the touch panel 75 outside the device. At this time, since the entire touch panel 75 functions as the drive stop button 81 , the operator can respond in case of emergency only by recognizing the installation position of the touch panel 75 .

如圖7B所示,若在單元88的驅動發生問題,藉由操作人員,觸控面板75的畫面被觸控。在觸控面板75係全面顯示有驅動停止按鍵81,因此藉由觸控觸控面板75的畫面的一部分,單元88被停止。如箭號所示,即使操作人員的視線離開觸控面板75的畫面,只要得知觸控面板75的設置位置,即可觸控驅動停止按鍵81,亦不會有發生按鍵按錯的情形。因此,可瞬時且正確觸控驅動停止按鍵81而使單元88停止。As shown in FIG. 7B , if a problem occurs in the driving of the unit 88 , the screen of the touch panel 75 is touched by the operator. Since the drive stop button 81 is displayed on the entire surface of the touch panel 75 , the unit 88 is stopped by touching a part of the screen of the touch panel 75 . As shown by the arrow, even if the operator's sight is away from the screen of the touch panel 75, as long as he knows the installation position of the touch panel 75, he can touch and drive the stop button 81, and there will be no situation of pressing the wrong button. Therefore, the unit 88 can be stopped by touching and driving the stop button 81 instantaneously and correctly.

如以上所示,藉由本實施形態之切削裝置1,由於在觸控面板75的全面顯示有驅動停止按鍵81,因此觸控觸控面板75的任何位置,均可使單元88驅動停止。因此,即使在操作人員無法觀看觸控面板75的狀態下,亦可不會按錯驅動停止按鍵81,而將單元88正確緊急停止。As mentioned above, with the cutting device 1 of this embodiment, since the drive stop button 81 is displayed on the entire surface of the touch panel 75, the drive of the unit 88 can be stopped by touching any position of the touch panel 75. Therefore, even in the state where the operator cannot see the touch panel 75, the unit 88 can be correctly stopped in an emergency without pressing the driving stop button 81 by mistake.

其中,在本實施形態中,係例示靜電電容方式(表面型靜電電容方式)的觸控面板,惟並非限定於該構成。若觸控面板為可顯示單元的操作畫面即可,亦可使用例如電阻膜方式、投影型靜電量方式、超音波表面彈性波方式、光學方式、電磁感應方式的任何觸控面板。In addition, in this embodiment, although the touch panel of the capacitance type (surface type capacitance type) was illustrated, it is not limited to this structure. As long as the touch panel can display the operation screen of the unit, any touch panel of a resistive film type, a projected electrostatic type, an ultrasonic surface elastic wave type, an optical type, or an electromagnetic induction type can also be used.

此外,在本實施形態中,係例示切削工件的切削裝置作為加工裝置來進行說明,惟並非限定於該構成。本發明係可適用於具備有觸控面板的其他加工裝置。例如,若為具備有觸控面板的加工裝置,亦可適用在切削裝置、研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、及將該等組合的群集裝置等其他加工裝置。In addition, in this embodiment, although the cutting apparatus which cuts a workpiece|work was illustrated and demonstrated as a processing apparatus, it is not limited to this structure. The present invention is applicable to other processing devices equipped with touch panels. For example, if it is a processing device equipped with a touch panel, it can also be applied to cutting devices, grinding devices, grinding devices, laser processing devices, plasma etching devices, edge trimming devices, expansion devices, brake devices, and the Combined cluster devices and other processing devices.

因此,在本實施形態中,係例示吸盤平台、切削手段、推拉臂、搬入臂、搬出臂、顯微鏡,作為單元,惟並非限定於該構成。單元若為可驅動的構成即可,亦可為例如在研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、群集裝置中所使用的各種加工手段、平台、搬送手段、顯微鏡等單元。Therefore, in this embodiment, a suction table, a cutting means, a push-pull arm, a carrying-in arm, a carrying-out arm, and a microscope are exemplified as units, but the structure is not limited thereto. As long as the unit can be driven, it can also be used for various processing methods such as grinding equipment, grinding equipment, laser processing equipment, plasma etching equipment, edge trimming equipment, expansion equipment, braking equipment, and clustering equipment. , platform, transport means, microscope and other units.

此外,在本實施形態中,係例示X軸移動機構、Y軸移動機構、Z軸移動機構、各臂的水平移動機構、吸盤平台的旋轉軸、心軸的旋轉軸、顯微鏡上下驅動軸,作為驅動軸,惟並非限定於該構成。驅動軸若為使其驅動的構成即可,亦可為在研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、群集裝置中所使用之以X軸方向、Y軸方向、Z軸方向、θ軸方向驅動的驅動軸。In addition, in this embodiment, the X-axis moving mechanism, the Y-axis moving mechanism, the Z-axis moving mechanism, the horizontal moving mechanism of each arm, the rotation axis of the chuck stage, the rotation axis of the spindle, and the vertical drive axis of the microscope are exemplified as The drive shaft is not limited to this configuration. As long as the drive shaft is configured to drive it, it can also be used in grinding devices, grinding devices, laser processing devices, plasma etching devices, edge trimming devices, expansion devices, brake devices, and cluster devices. Axis direction, Y-axis direction, Z-axis direction, θ-axis direction drive the drive shaft.

此外,以加工對象而言,亦可按照加工的種類,使用例如:半導體元件晶圓、光元件晶圓、封裝體基板、半導體基板、無機材料基板、氧化物晶圓、生陶瓷基板、壓電基板等各種工件。以半導體元件晶圓而言,亦可使用元件形成後的矽晶圓或化合物半導體晶圓。以光元件晶圓而言,亦可使用元件形成後的藍寶石晶圓或碳化矽晶圓。此外,以封裝體基板而言,亦可使用CSP(Chip Size Package)基板,以半導體基板而言,亦可使用矽或砷化鎵等,以無機材料基板而言,亦可使用藍寶石、陶瓷、玻璃等。此外,以氧化物晶圓而言,亦可使用元件形成後或元件形成前的鉭酸鋰、鈮酸鋰。In addition, in terms of processing objects, according to the type of processing, for example: semiconductor element wafers, optical element wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, raw ceramic substrates, piezoelectric Various workpieces such as substrates. In terms of semiconductor device wafers, silicon wafers or compound semiconductor wafers after device formation can also be used. In terms of optical element wafers, sapphire wafers or silicon carbide wafers after element formation can also be used. In addition, in terms of package substrates, CSP (Chip Size Package) substrates can also be used, in terms of semiconductor substrates, silicon or gallium arsenide can also be used, and in terms of inorganic material substrates, sapphire, ceramics, glass etc. In addition, as an oxide wafer, lithium tantalate and lithium niobate after element formation or before element formation can also be used.

此外,以上說明本發明之實施形態,惟亦可為將上述實施形態及變形例全體或部分組合者,來作為本發明之其他實施形態。In addition, although the embodiment of the present invention was described above, a combination of all or part of the above-described embodiment and modified examples may be used as another embodiment of the present invention.

此外,本發明之實施形態並非為限定於上述實施形態及變形例者,亦可在未脫離本發明之技術思想的主旨的範圍內作各種變更、置換、變形。再者,若可藉由技術的進步或衍生的其他技術,以其他做法來實現本發明之技術思想,亦可使用該方法來實施。因此,申請專利範圍係涵蓋可能包含在本發明之技術思想範圍內的所有實施形態。In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments and modified examples, and various changes, substitutions, and modifications can be made without departing from the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used for implementation. Therefore, the scope of the patent application covers all the implementation forms that may be included in the scope of the technical thought of the present invention.

此外,在本實施形態中,係說明將本發明適用在切削裝置的構成,但是亦可適用在以觸控面板使其驅動的其他裝置。 [產業上可利用性]In addition, in this embodiment, although the structure which applied this invention to the cutting apparatus was demonstrated, it can also be applied to other apparatus which drives it with a touch panel. [industrial availability]

如以上說明所示,本發明係具有可輕易觸控觸控面板上的驅動停止按鍵的效果,有用於切削工件的切削裝置。As described above, the present invention has the effect of being able to easily touch the driving stop button on the touch panel, and is useful as a cutting device for cutting workpieces.

1‧‧‧切削裝置(加工裝置)10‧‧‧框體11‧‧‧側面12‧‧‧前面13‧‧‧支持台14‧‧‧吸盤平台(單元)15‧‧‧移動板16‧‧‧防水蓋件17‧‧‧保持面18‧‧‧夾具19‧‧‧基台21‧‧‧定心導件22‧‧‧升降機單元23‧‧‧載台24‧‧‧推拉臂(單元)25‧‧‧水平移動機構26‧‧‧導軌27‧‧‧滑件28‧‧‧滾珠螺桿31‧‧‧搬入臂(單元)32、42‧‧‧水平移動機構33、43‧‧‧導軌34、44‧‧‧滑件35、45‧‧‧滾珠螺桿36、46‧‧‧驅動馬達41‧‧‧搬出臂(單元)50‧‧‧X軸移動機構51‧‧‧導軌52‧‧‧X軸平台53‧‧‧滾珠螺桿54‧‧‧驅動馬達60‧‧‧Y軸移動機構61‧‧‧導軌62‧‧‧Y軸平台63、68‧‧‧滾珠螺桿64、69‧‧‧驅動馬達65‧‧‧Z軸移動機構66‧‧‧導軌67‧‧‧Z軸平台70‧‧‧切削手段(單元)71‧‧‧切削刀74‧‧‧EMO開關75‧‧‧觸控面板76‧‧‧液晶面板77‧‧‧玻璃基板78‧‧‧透明電極膜79‧‧‧保護膜81‧‧‧驅動停止按鍵82‧‧‧結束鈕85‧‧‧控制手段86‧‧‧驅動控制部87‧‧‧顯示控制部88‧‧‧單元89‧‧‧驅動軸91‧‧‧驅動停止按鍵F‧‧‧環狀框架S1‧‧‧操作畫面S2‧‧‧停止畫面T‧‧‧切割帶W‧‧‧工件1‧‧‧cutting device (processing device) 10‧‧‧frame body 11‧‧‧side 12‧‧‧front 13‧‧‧support table 14‧‧‧suction cup platform (unit) 15‧‧‧moving plate 16‧‧ ‧Waterproof cover 17‧‧‧Retaining surface 18‧‧‧Clamp 19‧‧‧Abutment 21‧‧‧Centering guide 22‧‧‧Elevator unit 23‧‧‧Stand 24‧‧‧Push-pull arm (unit) 25‧‧‧horizontal moving mechanism 26‧‧‧guide rail 27‧‧‧slider 28‧‧‧ball screw 31‧‧‧loading arm (unit) 32, 42‧‧‧horizontal moving mechanism 33, 43‧‧‧guide rail 34 . Axis platform 53‧‧‧ball screw 54‧‧‧drive motor 60‧‧‧Y-axis moving mechanism 61‧‧‧guide rail 62‧‧‧Y-axis platform 63, 68‧‧‧ball screw 64,69‧‧‧drive motor 65‧‧‧Z-axis moving mechanism 66‧‧‧guide rail 67‧‧‧Z-axis platform 70‧‧‧cutting means (unit)71‧‧‧cutter 74‧‧‧EMO switch 75‧‧‧touch panel76‧ ‧‧LCD Panel 77‧‧‧Glass Substrate 78‧‧‧Transparent Electrode Film 79‧‧‧Protective Film 81‧‧‧Drive Stop Button 82‧‧‧End Button 85‧‧‧Control Means 86‧‧‧Drive Control Unit 87 ‧‧‧Display control unit 88‧‧‧Unit 89‧‧‧Drive shaft 91‧‧‧Drive stop button F‧‧‧ring frame S1‧‧‧operation screen S2‧‧‧stop screen T‧‧‧cutting belt W ‧‧‧Workpiece

圖1係本實施形態之切削裝置的外觀斜視圖。   圖2係本實施形態之切削裝置的內部的斜視圖。   圖3係顯示比較例的軸動作畫面的顯示例的圖。   圖4係本實施形態之觸控面板的剖面模式圖。   圖5係顯示本實施形態之單元的操作控制的區塊圖。   圖6係顯示本實施形態之停止畫面的顯示例的圖。   圖7係顯示本實施形態之單元之停止方法之一例的圖。Fig. 1 is an external perspective view of a cutting device according to this embodiment. Fig. 2 is a perspective view of the inside of the cutting device of this embodiment. Fig. 3 is a diagram showing a display example of an axis operation screen in a comparative example. Fig. 4 is a schematic cross-sectional view of the touch panel of this embodiment. Fig. 5 is a block diagram showing the operation control of the unit of this embodiment. Fig. 6 is a diagram showing a display example of a stop screen in this embodiment. Fig. 7 is a diagram showing an example of the method of stopping the unit of this embodiment.

1‧‧‧切削裝置(加工裝置) 1‧‧‧Cutting device (processing device)

75‧‧‧觸控面板 75‧‧‧Touch panel

81‧‧‧驅動停止按鍵 81‧‧‧Drive stop button

Claims (2)

一種加工裝置,其係具備有:可驅動的單元;顯示該單元的操作畫面的觸控面板;及按照對該觸控面板的操作,來控制單元的驅動的控制手段,該加工裝置之特徵為:該控制手段係具有:驅動控制部,其係按照該觸控面板的操作,控制該單元的驅動及停止;及顯示控制部,其係控制該觸控面板的顯示畫面,該驅動控制部係若顯示在該觸控面板的該操作畫面上的驅動按鍵被按下時,即驅動該單元,該顯示控制部係若該單元開始驅動而以預定的時序將該觸控面板的顯示畫面由該操作畫面切換成停止畫面時,在該停止畫面,顯示該觸控面板的畫面全體已形成為可受理操作的感測區域的驅動停止按鍵,該驅動控制部係若顯示在該觸控面板的該停止畫面上的該驅動停止按鍵被按下時,即停止該單元的驅動。 A processing device, which is equipped with: a driveable unit; a touch panel displaying the operation screen of the unit; and a control means for controlling the drive of the unit according to the operation of the touch panel, the processing device is characterized by : the control means has: a drive control unit, which controls the drive and stop of the unit according to the operation of the touch panel; and a display control unit, which controls the display screen of the touch panel, and the drive control unit is If the driving button displayed on the operation screen of the touch panel is pressed, the unit is driven, and the display control part changes the display screen of the touch panel from the display screen of the touch panel at a predetermined timing when the unit starts to be driven. When the operation screen is switched to a stop screen, on the stop screen, a drive stop button that has formed the entire screen of the touch panel as a sensing area that can accept operations is displayed. If the drive control unit displays on the touch panel When the drive stop button on the stop screen is pressed, the drive of the unit is stopped. 如請求項1之加工裝置,其中,該顯示控制部係以該單元開始了驅動之後的時序,將該觸控面板的顯示畫面由該操作畫面切換成該停止畫面。 The processing device according to claim 1, wherein the display control unit switches the display screen of the touch panel from the operation screen to the stop screen at a timing after the unit starts driving.
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