TWI787319B - Processing device - Google Patents
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- TWI787319B TWI787319B TW107127909A TW107127909A TWI787319B TW I787319 B TWI787319 B TW I787319B TW 107127909 A TW107127909 A TW 107127909A TW 107127909 A TW107127909 A TW 107127909A TW I787319 B TWI787319 B TW I787319B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16P—SAFETY DEVICES IN GENERAL; SAFETY DEVICES FOR PRESSES
- F16P7/00—Emergency devices preventing damage to a machine or apparatus
- F16P7/02—Emergency devices preventing damage to a machine or apparatus by causing the machine to stop on the occurrence of dangerous conditions therein
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
[課題]不會有按錯的情形,而輕易觸控觸控面板上的驅動停止按鍵。 [解決手段]本發明之切削裝置係按照對觸控面板(75)的操作,以控制手段控制單元的驅動的切削裝置(1),形成為單元開始驅動之後,以預定的時序將單元的驅動停止的驅動停止按鍵(81)被全面顯示在觸控面板的構成。藉由該構成,不會有按錯驅動停止按鍵的情形,可輕易觸控觸控面板上的驅動停止按鍵。[Problem] Touch the drive stop button on the touch panel easily without pressing the wrong button. [Solution] The cutting device of the present invention is a cutting device (1) in which the drive of the unit is controlled by the control means according to the operation of the touch panel (75). The stopped driving stop button (81) is fully displayed on the configuration of the touch panel. With this configuration, there is no case of pressing the driving stop button by mistake, and the driving stop button on the touch panel can be easily touched.
Description
本發明係關於將工件加工的加工裝置。The present invention relates to a machining device for machining workpieces.
以往,以進行半導體晶圓加工的加工裝置而言,已知有切削裝置、研削裝置、研磨裝置、雷射加工裝置等各種加工裝置。在該等加工裝置,一般配備有受理加工條件等操作指令的輸入的觸控面板式的顯示監視器,藉由顯示監視器,兼作輸入裝置與顯示裝置。在加工裝置的顯示監視器係顯示有驅動停止按鍵,作為安全對策,在維護時等,操作人員人工操作裝置各部時,藉由驅動停止按鍵被觸控,使裝置各部緊急停止(參照例如專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, various processing apparatuses such as cutting apparatuses, grinding apparatuses, lapping apparatuses, and laser processing apparatuses are known as processing apparatuses for processing semiconductor wafers. These processing devices are generally equipped with a touch panel type display monitor that accepts input of operation commands such as processing conditions, and the display monitor doubles as an input device and a display device. The display monitor of the processing device displays a drive stop button. As a safety measure, when the operator manually operates each part of the device during maintenance, the drive stop button is touched to make each part of the device emergency stop (see for example the patent document 1). [Prior Art Document] [Patent Document]
[專利文獻1]日本特開2014-113669號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-113669
(發明所欲解決之課題)(Problem to be solved by the invention)
但是,若在觸控面板的一部分顯示有驅動停止按鍵,在維護或安裝等時,在操作人員正在監視裝置的動作的期間,操作人員的視線係在裝置內而無法觀看觸控面板。因此,欲緊急停止時,有按錯觸控面板上的按鍵、或按壓驅動停止按鍵耗時的問題。若為設在加工裝置的框體的EMO(Emergency Off)開關,雖然可減少按錯等,但是加工裝置的全部功能會停止,因此必須再起動或初期化,復原時耗費時間。However, if a drive stop button is displayed on a part of the touch panel, during maintenance or installation, etc., while the operator is monitoring the operation of the device, the operator's line of sight is in the device and cannot see the touch panel. Therefore, when an emergency stop is desired, there is a problem of pressing a wrong button on the touch panel or pressing a drive stop button which takes time. If it is an EMO (Emergency Off) switch installed on the frame of the processing device, it can reduce mis-pressing, etc., but all functions of the processing device will stop, so it must be restarted or initialized, and it will take time to restore.
本發明係鑑於該情形而完成者,目的之一在提供不會有按錯的情形,而可輕易觸控觸控面板上的驅動停止按鍵的加工裝置。 (解決課題之手段)The present invention has been made in view of this situation, and one of the objects is to provide a processing device that can easily touch a drive stop button on a touch panel without making a mistake in pressing it. (means to solve the problem)
本發明之一態樣之加工裝置係具備有:可驅動的單元;顯示該單元的操作畫面的觸控面板;及按照對該觸控面板的操作,來控制單元的驅動的控制手段,該加工裝置之特徵為:該單元開始驅動而以預定的時序,將單元的驅動停止的驅動停止按鍵被全面顯示在該觸控面板。A processing device according to an aspect of the present invention is provided with: a driveable unit; a touch panel displaying an operation screen of the unit; and a control means for controlling the drive of the unit according to the operation of the touch panel. The device is characterized in that a driving stop button for stopping the driving of the unit at a predetermined timing after starting the driving of the unit is fully displayed on the touch panel.
藉由該構成,由於在觸控面板的全面顯示有驅動停止按鍵,因此即使觸控觸控面板的任何位置,均可使單元驅動停止。因此,即使在操作人員無法觀看觸控面板的狀態下,亦不會有按錯驅動停止按鍵的情形,而可將單元正確緊急停止。 (發明之效果)With this configuration, since the drive stop button is displayed on the entire touch panel, even if any position on the touch panel is touched, the drive of the unit can be stopped. Therefore, even in the state where the operator cannot see the touch panel, there is no situation of pressing the driving stop button by mistake, and the unit can be correctly stopped in an emergency. (Effect of Invention)
藉由本發明,由於在觸控面板的全面顯示有驅動停止按鍵,因此不會有按錯驅動停止按鍵的情形,可輕易觸控觸控面板上的驅動停止按鍵。With the present invention, since the drive stop button is displayed on the entire touch panel, there is no situation of pressing the drive stop button by mistake, and the drive stop button on the touch panel can be easily touched.
以下參照所附圖示,說明本實施形態之切削裝置。圖1係本實施形態之切削裝置的外觀斜視圖。圖2係本實施形態之切削裝置的內部的斜視圖。圖3係顯示比較例的操作畫面的顯示例的圖。其中,在本實施形態中,係例示切削裝置作為加工裝置來進行說明,但是加工裝置若具備有觸控面板,即未特別限定。The cutting device of this embodiment will be described below with reference to the attached drawings. Fig. 1 is an external perspective view of a cutting device according to this embodiment. Fig. 2 is a perspective view of the inside of the cutting device of the present embodiment. FIG. 3 is a diagram showing a display example of an operation screen of a comparative example. In addition, in this embodiment, although the cutting apparatus was demonstrated as an example and demonstrated as a processing apparatus, if a processing apparatus is equipped with a touch panel, it will not specifically limit.
在切削裝置1係設有受理操作人員的操作的觸控面板75,藉由觸控面板75設定有各種加工條件。切削裝置1係構成為根據在觸控面板75所設定的設定條件,使切削刀71(參照圖2)與被保持在吸盤平台14的工件W相對移動,將吸盤平台14上的工件W沿著分割預定線進行切削。工件W的表面係藉由格子狀的分割預定線而被區劃成複數區域,在經區劃的各區域係形成有各種元件。The
在工件W的背面貼著有切割帶T,在切割帶T的外周貼著有環狀框架F。工件W係在透過切割帶T而被支持在環狀框架F的狀態下被搬入至切削裝置1。其中,工件W若為成為加工對象者即可,亦可為例如元件形成完畢的半導體晶圓或光元件晶圓。此外,切割帶T係除了在帶件基材塗布有黏著層的一般的黏著帶之外,亦可為在帶件基材貼著有DAF的DAF(Die Attach Film)帶件。A dicing tape T is attached to the back of the workpiece W, and an annular frame F is attached to the outer periphery of the dicing tape T. As shown in FIG. The workpiece W is carried into the
切削裝置1係具有:覆蓋切削加工的加工空間的直方體狀的框體10、及鄰接於框體10而形成待機空間或洗淨空間的支持台13。支持台13的上面中央係以朝向框體10內延伸的方式形成有開口,該開口係覆蓋在可連同吸盤平台14一起移動的移動板15及蛇腹狀的防水蓋件16。在防水蓋件16的下方係設有使吸盤平台14以X軸方向移動的X軸移動機構50(參照圖2)。在圖1中係顯示使吸盤平台14移動至框體10的外部而在支持台13上待機的狀態。The
吸盤平台14係藉由多孔陶瓷材而形成有保持面17,藉由在該保持面17所產生的負壓,吸引保持工件W。在吸盤平台14的周圍係設有空氣驅動式的4個夾具18,藉由各夾具18,工件W的周圍的環狀框架F從四方被夾持固定。在吸盤平台14的上方係設有以Y軸方向延伸的一對定心導件21。藉由一對定心導件21的X軸方向的分離接近,相對吸盤平台14,工件W的X軸方向被定位。The
在支持台13係在吸盤平台14之鄰設有載置匣盒的升降機單元22。在升降機單元22,載置有匣盒的載台23被升降,匣盒內的工件W的取出放入位置在高度方向予以調整。在框體10的側面11係設有一邊使環狀框架F導引至一對定心導件21一邊在匣盒取出放入工件W的推拉臂24。此外,在框體10的側面11係設有在一對定心導件21與吸盤平台14之間搬送工件W的搬入臂31、搬出臂41。Adjacent to the
推拉臂24係以被配設在框體10的側面11的水平移動機構25予以驅動。水平移動機構25係具有:被配置在框體10的側面11之與Y軸方向呈平行的一對導軌26;及以可在一對導軌26滑動的方式作設置的馬達驅動的滑件27。在滑件27的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿28。連結在滾珠螺桿28的一端部的驅動馬達29被旋轉驅動,藉此推拉臂24沿著一對導軌26而以Y軸方向實施推拉動作。The push-
搬入臂31及搬出臂41係以配設在框體10的側面11的水平移動機構32、42予以驅動。水平移動機構32、42係具有:被配置在框體10的側面11之與Y軸方向呈平行的一對導軌33、43;及可在一對導軌33、43滑動的方式作設置的馬達驅動的滑件34、44。在滑件34、44的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿35、45。連結在滾珠螺桿35、45的一端部的驅動馬達36、46被旋轉驅動,藉此搬入臂31及搬出臂41沿著一對導軌33、43而以Y軸方向予以搬送移動。The carry-in
如圖2所示,在框體10及支持台13(參照圖1)內的基台19上,係設有將吸盤平台14以X軸方向移動的X軸移動機構50。X軸移動機構50係具有:被配置在基台19上之與X軸方向呈平行的一對導軌51、及可在一對導軌51滑動的方式作設置的馬達驅動的X軸平台52。在X軸平台52的背面側係形成有未圖示之螺帽部,在該螺帽部螺合有滾珠螺桿53。連結在滾珠螺桿53的一端部的驅動馬達54被旋轉驅動,藉此吸盤平台14沿著一對導軌51而以X軸方向移動。As shown in FIG. 2 , an
在基台19上係以跨越吸盤平台14的移動路徑的方式設有立設的門型的立壁部20。在立壁部20係設有:將切削手段70以Y軸方向移動的Y軸移動機構60;及將切削手段70以Z軸方向移動的Z軸移動機構65。Y軸移動機構60係具有:配置在立壁部20的前面之與Y軸方向呈平行的一對導軌61;及可在一對導軌61滑動的方式作設置的Y軸平台62。Z軸移動機構65係具有:配置在Y軸平台62上之與Z軸方向呈平行的一對導軌66;及以可在一對導軌66滑動的方式作設置的Z軸平台67。A door-shaped
在各Z軸平台67的下部係設有切削工件W的切削手段70。在Y軸平台62及Z軸平台67的背面側係分別形成有螺帽部,在該等螺帽部螺合有滾珠螺桿63、68。在Y軸平台62用的滾珠螺桿63、Z軸平台67用的滾珠螺桿68的一端部係分別連結有驅動馬達64、69。藉由驅動馬達64、69,各自的滾珠螺桿63、68被旋轉驅動,藉此各切削手段70沿著導軌61以Y軸方向移動,各切削手段70沿著導軌66以Z軸方向移動。A cutting means 70 for cutting the workpiece W is provided below each Z-
在各切削手段70的心軸係可旋轉地裝設有將被保持在吸盤平台14的工件W進行切削的切削刀71。各切削刀71係以結合劑固定例如鑽石砥粒而成形為圓板狀。此外,在切削手段70的心軸殼係設有對準用的顯微鏡(未圖示)。返回至圖1,在框體10的前面12係設置有觸控面板75。在觸控面板75係除了各種加工條件的設定畫面之外,顯示有吸盤平台14或切削手段70等各單元的操作畫面等。此外,詳容後述,在觸控面板75係顯示有在維護時或安裝時使各單元停止的驅動停止按鍵81(參照圖6)。A
但是,如圖3的比較例所示,在一般的操作畫面中,為了在維護時或安裝時以手動使切削手段等單元停止,在畫面角落較小地顯示有驅動停止按鍵91。在維護時或安裝時,操作人員必須注視單元的驅動,因此無法一邊觀看觸控面板的操作畫面一邊確認單元的驅動。因此,欲使單元緊急停止時,必須將視線從單元回到操作畫面來觸控驅動停止按鍵91,但是難以瞬時觸控驅動停止按鍵91。However, as shown in the comparative example of FIG. 3 , on a general operation screen, in order to manually stop units such as cutting means during maintenance or installation, a
驅動停止按鍵91係較小地被顯示在畫面的角落,因此難以在操作畫面找到驅動停止按鍵91,此外有將驅動停止按鍵91按錯成別的按鍵之虞。此點,若為EMO開關74(參照圖1),由框體10突出而設,以明顯的顏色形成為充分大小,因此在緊急時,操作人員可瞬時按入EMO開關74。在EMO開關74的周圍由於沒有類似的開關,因此不會有按錯的情形而可確實停止單元,但是由於裝置的全部功能停止,因此再起動等時耗費時間。The
因此,在本實施形態中,在觸控面板75(參照圖1)的全面顯示驅動停止按鍵81(參照圖6),藉此即使在維護時或安裝時注視單元的驅動的狀態下,亦可瞬時觸控驅動停止按鍵81。不會有如EMO開關74(參照圖1)般使其他功能停止的情形,而僅有所需單元被停止。此外,由於在觸控面板75的全面以驅動停止按鍵81顯示,因此不會有按錯其他按鍵的情形。如上所示,藉由驅動停止按鍵81,容易停止單元,並且可確實防止因按到其他按鍵所造成的錯誤作動。Therefore, in the present embodiment, the driving stop button 81 (see FIG. 6 ) is displayed on the entire touch panel 75 (see FIG. 1 ), so that even when the unit is driven during maintenance or installation, it is possible to The momentary touch drives the
以下參照圖4及圖5,說明單元的操作控制。圖4係本實施形態之觸控面板的剖面模式圖。圖5係顯示本實施形態之單元的操作控制的區塊圖。其中,本實施形態之單元係例如表示:吸盤平台、切削手段、推拉臂、搬入臂、搬出臂、顯微鏡。此外,本實施形態之驅動軸係例如表示:X軸移動機構、Y軸移動機構、Z軸移動機構、各臂的水平移動機構、吸盤平台的旋轉軸、心軸的旋轉軸、顯微鏡上下移動軸。The operation control of the unit will be described below with reference to FIG. 4 and FIG. 5 . Fig. 4 is a schematic cross-sectional view of the touch panel of the present embodiment. Fig. 5 is a block diagram showing the operation control of the unit of this embodiment. Among them, the units of this embodiment represent, for example, a suction cup platform, a cutting means, a push-pull arm, a carrying-in arm, a carrying-out arm, and a microscope. In addition, the driving shaft system of the present embodiment represents, for example: X-axis moving mechanism, Y-axis moving mechanism, Z-axis moving mechanism, horizontal moving mechanism of each arm, rotation axis of the suction cup platform, rotation axis of the mandrel, microscope vertical movement axis .
如圖4所示,觸控面板75係所謂靜電電容方式的觸控面板,在液晶面板76上積層玻璃基板77、透明電極膜78、保護膜79而構成。在液晶面板76係顯示有操作畫面,以指尖觸碰面板上面,藉此可在操作畫面輸入各種資訊。此時,在玻璃基板77的四個角落設有電極(未圖示),對各電極施加電壓而使觸控面板全體發生均一電場,由指尖觸碰到觸控面板75的畫面時的靜電電容的變化來檢測指尖的座標。As shown in FIG. 4 , the
如圖5所示,在觸控面板75係顯示在人工操作時受理對各單元88的各種操作的操作畫面S1。若在操作畫面S1使單元88被驅動,由操作畫面S1切換成全面顯示驅動停止按鍵81(參照圖6)的停止畫面S2。在該觸控面板75係連接有按照面板操作來控制單元88的驅動的控制手段85。在控制手段85係設有:按照顯示在觸控面板75的驅動按鍵來使驅動軸89驅動的驅動控制部86;及使停止單元88的驅動的驅動停止按鍵81顯示在觸控面板75的全面的顯示控制部87。As shown in FIG. 5 , the
驅動控制部86係按照觸控面板75的操作,控制各單元88的驅動軸89的驅動及停止。例如,若在觸控面板75顯示有操作畫面S1的狀態下被按下驅動按鍵,藉由驅動控制部86,透過驅動軸89來使單元88被驅動。此外,若在觸控面板75顯示有停止畫面S2的狀態下使驅動停止按鍵81被按下,藉由驅動控制部86,透過驅動軸89,單元88被停止。顯示控制部87係在人工操作時使操作畫面S1顯示在觸控面板75,單元88開始驅動之後,以預定時序切換成停止畫面S2而使驅動停止按鍵81顯示在面板全面。The
在觸控面板75的全面顯示有驅動停止按鍵81時,觸控面板75的畫面全體作為感測區域來發揮功能。因此,無關於觸控面板75的觸控位置,單元88的驅動被停止。其中,驅動停止按鍵81係可在單元88開始驅動之後被自動顯示,亦可在單元88開始驅動之後,藉由按下切換按鍵等而以手動顯示。因此,預定的時序係指單元88開始驅動之後的時序,除了單元88開始驅動的時序之外,包含有以手動使驅動停止按鍵81顯示的時序。When the
如上所示,因全面顯示觸控面板75的驅動停止按鍵81,可使驅動中的單元88輕易緊急停止。其中,控制手段85的各部係藉由執行各種處理的處理器或記憶體等所構成。記憶體係視用途而由ROM(Read Only Memory,唯讀記憶體)、RAM(Random Access Memory,隨機存取記憶體)等一個或複數記憶媒體所構成。在記憶體係記憶有例如裝置各部的驅動控制用程式或顯示控制用程式。此外,控制手段85亦可有別於切削裝置1全體的控制,另外設為觸控面板75專用。As described above, since the
參照圖6,說明顯示出驅動停止按鍵的停止畫面。圖6係顯示本實施形態之停止畫面的顯示例的圖。其中,在圖6中係適當使用圖5的符號來進行說明。Referring to FIG. 6 , the stop screen displaying the drive stop button will be described. Fig. 6 is a diagram showing a display example of a stop screen in this embodiment. In addition, in FIG. 6, the code|symbol of FIG. 5 is used suitably for description.
如圖6A所示,在維護時或安裝時,係在觸控面板75的停止畫面S2全體顯示驅動停止按鍵81,在驅動停止按鍵81的一角顯示有由停止畫面S2恢復成操作畫面S1的結束鈕82。因此,在本實施形態中,嚴謹而言,並非觸控面板75的畫面全體成為驅動停止按鍵81,而是除了結束鈕82的顯示區域之外的剩餘區域成為驅動停止按鍵81。亦即,驅動停止按鍵81顯示在觸控面板75的全面,並非必定侷限於驅動停止按鍵81被顯示在畫面全體的構成,包含有驅動停止按鍵81被顯示在大致畫面全體的構成。As shown in FIG. 6A, during maintenance or installation, the
此外,結束鈕82係以不會被操作人員誤觸的方式而被顯示在驅動停止按鍵81的一角。因此,即使在操作人員的視線離開觸控面板75的狀態下,亦防止結束鈕82被誤觸。此外,在停止畫面係僅顯示有驅動停止按鍵81及結束鈕82等2種按鍵,因此若目視觸控面板75,即可輕易特定結束鈕82的位置。如上所示,在視線離開觸控面板75的狀態下,係輕易觸控驅動停止按鍵81,若目視觸控面板75,亦輕易觸控結束鈕82。In addition, the
此外,如圖6B所示,在維護時或安裝時,亦可在觸控面板75僅顯示驅動停止按鍵81。此外,驅動停止按鍵81係不僅使單元88驅動停止,亦可在單元88的驅動停止後,使單元88回復原點。例如,若在切削刀71(參照圖1)的接觸式安裝時觸控驅動停止按鍵81,不僅切削刀71的下降動作被停止,切削刀71恢復至原點位置而由與吸盤平台14的接觸位置分離。In addition, as shown in FIG. 6B , only the
參照圖7,說明使用觸控面板的單元的停止方法。圖7係顯示本實施形態之單元之停止方法之一例的圖。Referring to FIG. 7 , a method of stopping the unit using the touch panel will be described. Fig. 7 is a diagram showing an example of the method of stopping the unit of this embodiment.
如圖7A所示,若以維護等而使單元88(參照圖2)被驅動,切削裝置1的觸控面板75由操作畫面切換成停止畫面,在觸控面板75的全面顯示驅動停止按鍵81。操作人員係必須監視切削裝置1的單元88的動作,因此如箭號所示,操作人員的視線朝向切削裝置1的內部,而不在裝置外部的觸控面板75。此時,觸控面板75全體作為驅動停止按鍵81來發揮功能,因此操作人員若僅辨識觸控面板75的設置位置,在緊急時亦可對應。As shown in FIG. 7A , if the unit 88 (refer to FIG. 2 ) is driven for maintenance, etc., the
如圖7B所示,若在單元88的驅動發生問題,藉由操作人員,觸控面板75的畫面被觸控。在觸控面板75係全面顯示有驅動停止按鍵81,因此藉由觸控觸控面板75的畫面的一部分,單元88被停止。如箭號所示,即使操作人員的視線離開觸控面板75的畫面,只要得知觸控面板75的設置位置,即可觸控驅動停止按鍵81,亦不會有發生按鍵按錯的情形。因此,可瞬時且正確觸控驅動停止按鍵81而使單元88停止。As shown in FIG. 7B , if a problem occurs in the driving of the
如以上所示,藉由本實施形態之切削裝置1,由於在觸控面板75的全面顯示有驅動停止按鍵81,因此觸控觸控面板75的任何位置,均可使單元88驅動停止。因此,即使在操作人員無法觀看觸控面板75的狀態下,亦可不會按錯驅動停止按鍵81,而將單元88正確緊急停止。As mentioned above, with the
其中,在本實施形態中,係例示靜電電容方式(表面型靜電電容方式)的觸控面板,惟並非限定於該構成。若觸控面板為可顯示單元的操作畫面即可,亦可使用例如電阻膜方式、投影型靜電量方式、超音波表面彈性波方式、光學方式、電磁感應方式的任何觸控面板。In addition, in this embodiment, although the touch panel of the capacitance type (surface type capacitance type) was illustrated, it is not limited to this structure. As long as the touch panel can display the operation screen of the unit, any touch panel of a resistive film type, a projected electrostatic type, an ultrasonic surface elastic wave type, an optical type, or an electromagnetic induction type can also be used.
此外,在本實施形態中,係例示切削工件的切削裝置作為加工裝置來進行說明,惟並非限定於該構成。本發明係可適用於具備有觸控面板的其他加工裝置。例如,若為具備有觸控面板的加工裝置,亦可適用在切削裝置、研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、及將該等組合的群集裝置等其他加工裝置。In addition, in this embodiment, although the cutting apparatus which cuts a workpiece|work was illustrated and demonstrated as a processing apparatus, it is not limited to this structure. The present invention is applicable to other processing devices equipped with touch panels. For example, if it is a processing device equipped with a touch panel, it can also be applied to cutting devices, grinding devices, grinding devices, laser processing devices, plasma etching devices, edge trimming devices, expansion devices, brake devices, and the Combined cluster devices and other processing devices.
因此,在本實施形態中,係例示吸盤平台、切削手段、推拉臂、搬入臂、搬出臂、顯微鏡,作為單元,惟並非限定於該構成。單元若為可驅動的構成即可,亦可為例如在研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、群集裝置中所使用的各種加工手段、平台、搬送手段、顯微鏡等單元。Therefore, in this embodiment, a suction table, a cutting means, a push-pull arm, a carrying-in arm, a carrying-out arm, and a microscope are exemplified as units, but the structure is not limited thereto. As long as the unit can be driven, it can also be used for various processing methods such as grinding equipment, grinding equipment, laser processing equipment, plasma etching equipment, edge trimming equipment, expansion equipment, braking equipment, and clustering equipment. , platform, transport means, microscope and other units.
此外,在本實施形態中,係例示X軸移動機構、Y軸移動機構、Z軸移動機構、各臂的水平移動機構、吸盤平台的旋轉軸、心軸的旋轉軸、顯微鏡上下驅動軸,作為驅動軸,惟並非限定於該構成。驅動軸若為使其驅動的構成即可,亦可為在研削裝置、研磨裝置、雷射加工裝置、電漿蝕刻裝置、邊緣修整裝置、擴張裝置、制動裝置、群集裝置中所使用之以X軸方向、Y軸方向、Z軸方向、θ軸方向驅動的驅動軸。In addition, in this embodiment, the X-axis moving mechanism, the Y-axis moving mechanism, the Z-axis moving mechanism, the horizontal moving mechanism of each arm, the rotation axis of the chuck stage, the rotation axis of the spindle, and the vertical drive axis of the microscope are exemplified as The drive shaft is not limited to this configuration. As long as the drive shaft is configured to drive it, it can also be used in grinding devices, grinding devices, laser processing devices, plasma etching devices, edge trimming devices, expansion devices, brake devices, and cluster devices. Axis direction, Y-axis direction, Z-axis direction, θ-axis direction drive the drive shaft.
此外,以加工對象而言,亦可按照加工的種類,使用例如:半導體元件晶圓、光元件晶圓、封裝體基板、半導體基板、無機材料基板、氧化物晶圓、生陶瓷基板、壓電基板等各種工件。以半導體元件晶圓而言,亦可使用元件形成後的矽晶圓或化合物半導體晶圓。以光元件晶圓而言,亦可使用元件形成後的藍寶石晶圓或碳化矽晶圓。此外,以封裝體基板而言,亦可使用CSP(Chip Size Package)基板,以半導體基板而言,亦可使用矽或砷化鎵等,以無機材料基板而言,亦可使用藍寶石、陶瓷、玻璃等。此外,以氧化物晶圓而言,亦可使用元件形成後或元件形成前的鉭酸鋰、鈮酸鋰。In addition, in terms of processing objects, according to the type of processing, for example: semiconductor element wafers, optical element wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, raw ceramic substrates, piezoelectric Various workpieces such as substrates. In terms of semiconductor device wafers, silicon wafers or compound semiconductor wafers after device formation can also be used. In terms of optical element wafers, sapphire wafers or silicon carbide wafers after element formation can also be used. In addition, in terms of package substrates, CSP (Chip Size Package) substrates can also be used, in terms of semiconductor substrates, silicon or gallium arsenide can also be used, and in terms of inorganic material substrates, sapphire, ceramics, glass etc. In addition, as an oxide wafer, lithium tantalate and lithium niobate after element formation or before element formation can also be used.
此外,以上說明本發明之實施形態,惟亦可為將上述實施形態及變形例全體或部分組合者,來作為本發明之其他實施形態。In addition, although the embodiment of the present invention was described above, a combination of all or part of the above-described embodiment and modified examples may be used as another embodiment of the present invention.
此外,本發明之實施形態並非為限定於上述實施形態及變形例者,亦可在未脫離本發明之技術思想的主旨的範圍內作各種變更、置換、變形。再者,若可藉由技術的進步或衍生的其他技術,以其他做法來實現本發明之技術思想,亦可使用該方法來實施。因此,申請專利範圍係涵蓋可能包含在本發明之技術思想範圍內的所有實施形態。In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments and modified examples, and various changes, substitutions, and modifications can be made without departing from the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used for implementation. Therefore, the scope of the patent application covers all the implementation forms that may be included in the scope of the technical thought of the present invention.
此外,在本實施形態中,係說明將本發明適用在切削裝置的構成,但是亦可適用在以觸控面板使其驅動的其他裝置。 [產業上可利用性]In addition, in this embodiment, although the structure which applied this invention to the cutting apparatus was demonstrated, it can also be applied to other apparatus which drives it with a touch panel. [industrial availability]
如以上說明所示,本發明係具有可輕易觸控觸控面板上的驅動停止按鍵的效果,有用於切削工件的切削裝置。As described above, the present invention has the effect of being able to easily touch the driving stop button on the touch panel, and is useful as a cutting device for cutting workpieces.
1‧‧‧切削裝置(加工裝置)10‧‧‧框體11‧‧‧側面12‧‧‧前面13‧‧‧支持台14‧‧‧吸盤平台(單元)15‧‧‧移動板16‧‧‧防水蓋件17‧‧‧保持面18‧‧‧夾具19‧‧‧基台21‧‧‧定心導件22‧‧‧升降機單元23‧‧‧載台24‧‧‧推拉臂(單元)25‧‧‧水平移動機構26‧‧‧導軌27‧‧‧滑件28‧‧‧滾珠螺桿31‧‧‧搬入臂(單元)32、42‧‧‧水平移動機構33、43‧‧‧導軌34、44‧‧‧滑件35、45‧‧‧滾珠螺桿36、46‧‧‧驅動馬達41‧‧‧搬出臂(單元)50‧‧‧X軸移動機構51‧‧‧導軌52‧‧‧X軸平台53‧‧‧滾珠螺桿54‧‧‧驅動馬達60‧‧‧Y軸移動機構61‧‧‧導軌62‧‧‧Y軸平台63、68‧‧‧滾珠螺桿64、69‧‧‧驅動馬達65‧‧‧Z軸移動機構66‧‧‧導軌67‧‧‧Z軸平台70‧‧‧切削手段(單元)71‧‧‧切削刀74‧‧‧EMO開關75‧‧‧觸控面板76‧‧‧液晶面板77‧‧‧玻璃基板78‧‧‧透明電極膜79‧‧‧保護膜81‧‧‧驅動停止按鍵82‧‧‧結束鈕85‧‧‧控制手段86‧‧‧驅動控制部87‧‧‧顯示控制部88‧‧‧單元89‧‧‧驅動軸91‧‧‧驅動停止按鍵F‧‧‧環狀框架S1‧‧‧操作畫面S2‧‧‧停止畫面T‧‧‧切割帶W‧‧‧工件1‧‧‧cutting device (processing device) 10‧‧‧
圖1係本實施形態之切削裝置的外觀斜視圖。 圖2係本實施形態之切削裝置的內部的斜視圖。 圖3係顯示比較例的軸動作畫面的顯示例的圖。 圖4係本實施形態之觸控面板的剖面模式圖。 圖5係顯示本實施形態之單元的操作控制的區塊圖。 圖6係顯示本實施形態之停止畫面的顯示例的圖。 圖7係顯示本實施形態之單元之停止方法之一例的圖。Fig. 1 is an external perspective view of a cutting device according to this embodiment. Fig. 2 is a perspective view of the inside of the cutting device of this embodiment. Fig. 3 is a diagram showing a display example of an axis operation screen in a comparative example. Fig. 4 is a schematic cross-sectional view of the touch panel of this embodiment. Fig. 5 is a block diagram showing the operation control of the unit of this embodiment. Fig. 6 is a diagram showing a display example of a stop screen in this embodiment. Fig. 7 is a diagram showing an example of the method of stopping the unit of this embodiment.
1‧‧‧切削裝置(加工裝置) 1‧‧‧Cutting device (processing device)
75‧‧‧觸控面板 75‧‧‧Touch panel
81‧‧‧驅動停止按鍵 81‧‧‧Drive stop button
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---|---|---|---|---|
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04189443A (en) * | 1990-11-21 | 1992-07-07 | Hitachi Seiko Ltd | Stop switch device for machine tool |
WO2004018149A1 (en) * | 2002-08-23 | 2004-03-04 | Eung Gyu Jung | Cnc milling machine provided with remote control panel |
US20050155043A1 (en) * | 2004-01-08 | 2005-07-14 | Schulz Kurt S. | Human-machine interface system and method for remotely monitoring and controlling a machine |
JP2012045251A (en) * | 2010-08-30 | 2012-03-08 | Toyota Motor Corp | Device for supporting leg action |
JP2012227205A (en) * | 2011-04-15 | 2012-11-15 | Fuji Mach Mfg Co Ltd | Component mounting line |
TW201245917A (en) * | 2011-05-11 | 2012-11-16 | Mitsubishi Electric Corp | Numeral control apparatus |
JP2014113669A (en) * | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | Cutting device |
CN104932419A (en) * | 2014-03-19 | 2015-09-23 | Dmg森精机株式会社 | Simulation Apparatus for Manual Operation of Machine Tool |
CN106662859A (en) * | 2014-08-20 | 2017-05-10 | Sig技术股份公司 | Processing installation, method for operating a processing installation, and use of a processing installation |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0341299A (en) * | 1989-07-10 | 1991-02-21 | Fujitsu Ltd | Device for stopping apparatus in earthquake |
JP2002052443A (en) * | 2000-08-08 | 2002-02-19 | Okamoto Machine Tool Works Ltd | Surface grinding device |
JP4432472B2 (en) * | 2002-11-29 | 2010-03-17 | 富士ゼロックス株式会社 | User interface device |
JP2005046979A (en) * | 2003-07-31 | 2005-02-24 | Disco Abrasive Syst Ltd | Cutting device |
SE529122C2 (en) * | 2004-09-24 | 2007-05-02 | Jokab Safety Ab | Protective device for area restriction and surveillance |
JP2007027167A (en) * | 2005-07-12 | 2007-02-01 | Yamagata Casio Co Ltd | Emergency stopping method of component mounting apparatus |
JP4257549B2 (en) * | 2007-07-17 | 2009-04-22 | トヨタ自動車株式会社 | Operating device |
US8872775B2 (en) * | 2008-10-27 | 2014-10-28 | Nec Corporation | Information processing apparatus |
US20110032215A1 (en) * | 2009-06-15 | 2011-02-10 | Smart Technologies Ulc | Interactive input system and components therefor |
CN103224170A (en) * | 2012-01-26 | 2013-07-31 | 钱嘉诚 | Elevator calling instant cancellation device in case of mistaken calling or calling by people before leaving |
JP5926418B2 (en) * | 2015-04-23 | 2016-05-25 | 京セラ株式会社 | Mobile terminal device |
CN104964154A (en) * | 2015-06-29 | 2015-10-07 | 安徽宝昱电子科技有限公司 | Emergency stopping device of mechanical equipment |
CN204868111U (en) * | 2015-08-14 | 2015-12-16 | 天津津研机械设计有限公司 | Man -machine panel of digit control machine tool that accords with user action custom |
JP6812306B2 (en) * | 2017-06-05 | 2021-01-13 | 株式会社クボタ | Work vehicle stop system and work vehicle equipped with it |
-
2017
- 2017-08-16 JP JP2017157067A patent/JP6983004B2/en active Active
-
2018
- 2018-08-03 KR KR1020180090763A patent/KR102523322B1/en active IP Right Grant
- 2018-08-08 CN CN201810895808.9A patent/CN109404711B/en active Active
- 2018-08-10 TW TW107127909A patent/TWI787319B/en active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04189443A (en) * | 1990-11-21 | 1992-07-07 | Hitachi Seiko Ltd | Stop switch device for machine tool |
WO2004018149A1 (en) * | 2002-08-23 | 2004-03-04 | Eung Gyu Jung | Cnc milling machine provided with remote control panel |
US20050155043A1 (en) * | 2004-01-08 | 2005-07-14 | Schulz Kurt S. | Human-machine interface system and method for remotely monitoring and controlling a machine |
JP2012045251A (en) * | 2010-08-30 | 2012-03-08 | Toyota Motor Corp | Device for supporting leg action |
JP2012227205A (en) * | 2011-04-15 | 2012-11-15 | Fuji Mach Mfg Co Ltd | Component mounting line |
TW201245917A (en) * | 2011-05-11 | 2012-11-16 | Mitsubishi Electric Corp | Numeral control apparatus |
JP2014113669A (en) * | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | Cutting device |
CN104932419A (en) * | 2014-03-19 | 2015-09-23 | Dmg森精机株式会社 | Simulation Apparatus for Manual Operation of Machine Tool |
CN106662859A (en) * | 2014-08-20 | 2017-05-10 | Sig技术股份公司 | Processing installation, method for operating a processing installation, and use of a processing installation |
Also Published As
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KR102523322B1 (en) | 2023-04-18 |
TW201910948A (en) | 2019-03-16 |
JP2019034370A (en) | 2019-03-07 |
JP6983004B2 (en) | 2021-12-17 |
CN109404711B (en) | 2023-06-02 |
CN109404711A (en) | 2019-03-01 |
KR20190019015A (en) | 2019-02-26 |
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