JP7154910B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus having a chuck table that holds a workpiece.

2. Description of the Related Art A processing technique is known in which workpieces such as various semiconductor substrates, resin package substrates, glass substrates, and ceramics substrates are cut with a cutting blade or ground with a grinding wheel to be thinned. Problems caused by processing, such as chipping and cracking of the workpiece due to clogging and crushing of the grindstone, are discovered in the inspection process after the processing of each workpiece is completed. Problems may occur continuously. For this reason, with the aim of quickly detecting the occurrence of troubles during processing and detecting their signs to prevent troubles, we have developed a chuck table that holds the workpiece and a blade mount that secures the cutting blade to the spindle. There is known a device equipped with an AE sensor and detecting an elastic wave generated during processing (see, for example, Patent Documents 1 and 2).

JP-A-60-062445 Japanese Patent No. 6223239

In order to capture the elastic waves generated in the workpiece as accurately as possible, it is preferable to fix the AE sensor to a chuck table on which the workpiece is directly fixed as in Patent Document 1. However, since the chuck table needs to be replaced for each size and type of workpiece, when the AE sensor is fixed to the chuck table as in Patent Document 1, the chuck table must incorporate the AE sensor. Therefore, there is a problem that the cost of the chuck table increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and it is possible to eliminate the need to incorporate an AE sensor in the chuck table and to accurately capture the elastic waves generated in the workpiece held by the chuck table. It aims at providing the processing apparatus which makes.

In order to solve the above-described problems and achieve the object, a processing apparatus according to the present invention includes a chuck table base having a mounting surface on its upper surface, and a detachable chuck table base whose lower surface is in close contact with the mounting surface. A processing apparatus comprising: a chuck table that is freely fixed and sucks and holds a workpiece on an upper holding surface; and a processing unit that processes the workpiece held by the chuck table, wherein the operation of the processing unit The chuck table base is provided with an AE sensor for detecting an elastic wave generated in the chuck table by the chuck table. The flat lower surface of the chuck table is placed on the flat mounting surface of the base, and a negative pressure is applied to the mounting surface of the chuck table base so that the lower surface is brought into close contact with the mounting surface. It is fixed to the chuck table base .

In this configuration, the chuck table is internally provided with a holding surface suction passage that communicates the lower surface with the holding surface, and a negative pressure is applied to the lower surface of the chuck table on the mounting surface of the chuck table base. A chuck table suction path for detachably fixing the chuck table to the chuck table base, and a workpiece suction path for applying a negative pressure to the chuck table placed on the mounting surface by communicating with the suction path for the holding surface of the chuck table. It is also possible to adopt a configuration in which the path and are open.

Further, the machining unit may be a cutting unit in which a cutting blade having an annular cutting edge on its outer peripheral edge is mounted on a spindle with a rotating shaft parallel to the holding surface. Alternatively, the processing unit may be a grinding unit in which a grinding wheel having an annularly arranged grinding wheel on its lower surface is mounted on a spindle of a rotation axis orthogonal to the holding surface.

In the processing apparatus according to the present invention, an AE sensor for detecting elastic waves generated in the chuck table by the action of the processing unit is arranged on the chuck table base, and is mounted on the mounting surface of the upper surface of the chuck table base. Since the chuck table can be replaced according to the change in size of the workpiece, there is no need to incorporate an AE sensor in the chuck table, and the elastic wave generated in the workpiece held by the chuck table can be accurately detected. It has the effect of being able to capture well.

FIG. 1 is a perspective view showing a processing apparatus according to Embodiment 1. FIG. FIG. 2 is a partial side cross-sectional view for explaining the configuration of the main part of the processing apparatus of FIG. 1. FIG. 3 is a partial side cross-sectional view of the main part of the processing apparatus of FIG. 1. FIG. FIG. 4 is a partial side cross-sectional view for explaining the cutting operation of the workpiece held on the chuck table of the processing apparatus of FIG. FIG. 5 is a partial side cross-sectional view showing a main part of a processing apparatus according to Embodiment 2. FIG.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
FIG. 1 is a perspective view showing a processing apparatus according to Embodiment 1. FIG. FIG. 2 is a partial side cross-sectional view for explaining the configuration of the main part of the processing apparatus of FIG. 1. FIG. 3 is a partial side cross-sectional view of the main part of the processing apparatus of FIG. 1. FIG. FIG. 4 is a partial side cross-sectional view for explaining the cutting operation of the workpiece held on the chuck table of the processing apparatus of FIG. Note that the X-axis direction, Y-axis direction, and Z-axis direction used in the following description are perpendicular to each other.

First, the workpiece 100 to be processed by the processing apparatus 2 according to Embodiment 1 will be described. The workpiece 100 is, as shown in FIG. 1, a disk-shaped semiconductor wafer or optical device wafer having a substrate 101 made of silicon, sapphire, gallium, or the like. A workpiece 100 has devices 104 formed in regions partitioned in a grid pattern by a plurality of dividing lines 103 formed on a surface 102 of a substrate 101 .

A dicing tape 106 , which is an adhesive tape having a larger diameter than the substrate 101 , is attached to the back surface 105 of the workpiece 100 on the back side of the front surface 102 , and an annular frame 107 is attached to the outer circumference of the dicing tape 106 . That is, the workpiece 100 is supported by the opening of the annular frame 107 via the dicing tape 106 . In this embodiment, the frame unit 108 is configured by including the workpiece 100 , the dicing tape 106 and the annular frame 107 . An annular region 106 A of the dicing tape 106 is formed between the workpiece 100 and the annular frame 107 .

The material, shape, structure, size, and the like of the substrate 101 of the workpiece 100 are not limited. For example, a substrate of any shape made of materials such as ceramics, resin, and metal can be used as the workpiece. . Also, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 104 . Furthermore, a low dielectric constant insulating film, also called a Low-k layer, is laminated as a functional layer on the surface 102 of the substrate 101 of the workpiece 100, and the low dielectric constant insulating film supports the circuit constituting the device 104. may be configured.

Next, the processing device 2 according to Embodiment 1 will be described. As shown in FIG. 1, the processing apparatus 2 includes a base 4 on which each component is mounted. An X-axis movement mechanism 6 as a processing feed unit is provided on the upper surface of the base 4 . The X-axis moving mechanism 6 includes a pair of X-axis guide rails 8 substantially parallel to the X-axis direction, which is the processing feed direction. ing.

A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw 12 parallel to the X-axis guide rail 8 is screwed into this nut portion. An X-axis pulse motor 14 is connected to one end of the X-axis ball screw 12 . By rotating the X-axis ball screw 12 with the X-axis pulse motor 14, the X-axis moving table 10 moves along the X-axis guide rail 8 in the X-axis direction. The X-axis moving mechanism 6 is provided with an X-axis measuring unit (not shown) for measuring the position of the X-axis moving table 10 in the X-axis direction.

When the X-axis moving table 10 is moved in the X-axis direction by the X-axis moving mechanism 6, the chuck table 30 moves through the θ table 16 and the chuck table base 20 arranged above the X-axis moving table 10. sent. The upper side of the X-axis moving mechanism 6 including the X-axis moving table 10 is covered with a table cover 18 and a bellows-shaped cover (not shown).

A θ table 16 is provided on the upper surface side of the X-axis moving table 10 . The θ table 16 has a rotation drive source (not shown) such as a motor, and rotates the chuck table base 20 and the chuck table 30 arranged above about a rotation axis substantially parallel to the Z-axis direction, which is the cutting feed direction. .

The processing apparatus 2 includes a chuck table base 20 provided on the upper surface side of the X-axis moving table 10 via a θ table 16, as shown in FIG. The chuck table base 20 is formed of a conductor such as metal, and as shown in FIGS. and clamps 22 which are four frame holding portions arranged on the outer periphery of the frame unit 108 to hold and fix the frame 107 of the frame unit 108 . The chuck table base 20 has a flat mounting surface 23 on the upper surface of the body portion 21 for mounting and supporting the chuck table 30 .

The clamp 22 is provided movably in the radial direction with respect to the main body 21, and is adapted to the radial size of the chuck table 30, which is selectively used according to the radial sizes of the workpiece 100 and the frame unit 108. Based on this, it can be moved as appropriate.

As shown in FIGS. 2, 3 and 4, the chuck table base 20 applies a negative pressure to the lower surface 34 of the chuck table 30 mounted on the mounting surface 23 of the chuck table base 20 inside the main body 21. The chuck table suction path 24 for detachably fixing the chuck table 30 to the chuck table base 20 and the holding surface suction path 36 of the chuck table 30 mounted on the mounting surface 23 are communicated with each other to apply negative pressure. A workpiece suction path 25 is formed. The chuck table suction path 24 and the workpiece suction path 25 are opened in the mounting surface 23 of the body portion 21 of the chuck table base 20 .

As shown in FIGS. 2, 3 and 4, a chuck table suction path 24 is connected to a suction source 28 via a first open/close valve 26 on the opposite side of the mounting surface 23 of the main body 21 of the chuck table base 20 . It is connected to the. Similarly, a workpiece suction path 25 is connected to a suction source 28 via a second opening/closing valve 27 on the opposite side of the mounting surface 23 of the main body 21 of the chuck table base 20 . The suction source 28 supplies negative pressure to the mounting surface 23 of the chuck table base 20 via the chuck table suction path 24 . The suction source 28 also supplies negative pressure to the holding surface 33 holding the workpiece 100 via the dicing tape 106 on the chuck table 30 via the workpiece suction path 25 and the holding surface suction path 36 .

An AE (Acoustic Emission) sensor 29 for detecting elastic waves generated on the chuck table 30 mounted on the mounting surface 23 of the chuck table base 20 due to the action of the processing unit 60 shown in FIGS. , are arranged on the chuck table base 20 as shown in FIGS. The AE sensor 29 is arranged along the mounting surface 23 inside the body portion 21 of the chuck table base 20 . The AE sensor 29 is made of materials such as barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb(Zi,Ti)O ₃ ), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), and the like. It converts the vibration of the chuck table 30 into a voltage, which is a vibration signal.

As shown in FIGS. 2, 3, and 4, the processing apparatus 2 is detachably fixed with its lower surface 34 in close contact with the mounting surface 23 of the chuck table base 20, and the workpiece 100 is held by the holding surface 33 on its upper surface. is provided with a chuck table 30 for sucking and holding the . The chuck table 30 includes a suction portion 31 forming a flat holding surface 33 on the upper surface, and a table body 32 forming a flat lower surface 34 .

The suction portion 31 is fitted into a recess portion 35 in the center of the upper surface of the table body 32 . The suction portion 31 is made of porous ceramics or the like having a large number of porous holes, and suction-holds the frame unit 108 with the entire holding surface 33 .

The table main body 32 is made of a conductor such as metal and formed in a disk shape, and has a recessed portion 35 formed in the central portion of the upper surface thereof. In addition, the table body 32 applies negative pressure to the dicing tape 106 side of the frame unit 108 placed on the holding surface 33 via the suction portion 31 , so that the workpiece 100 can be attached to and detached from the chuck table 30 . A holding surface suction path 36 is formed to hold the . The holding surface suction path 36 is opened in the lower surface 34 and the recessed portion 35 of the table body 32 .

A sealing member 38 is provided between the mounting surface 23 of the chuck table base 20 and the lower surface 34 of the chuck table 30 to communicate the workpiece suction path 25 and the holding surface suction path 36 in a sealed state. The chuck table base 20 side of the sealing member 38 is fitted into a sealing member fitting portion 25 a provided in the opening of the workpiece suction path 25 on the mounting surface 23 side, and the chuck table 30 side is fitted into the lower surface of the holding surface suction path 36 . It is fitted in a sealing member fitting portion 36a provided in the opening on the 34 side.

The chuck table 30 is used interchangeably according to the size and type of the workpiece 100 and the frame unit 108 . The chuck table 30, as shown in FIG. 30-2, which is used when the diameter is relatively large, is exemplified. The chuck table 30-1 and chuck table 30-2 have the same configuration except for the size in the radial direction.

When the lower surface 34 of the chuck table 30 is placed on the mounting surface 23 of the chuck table base 20 and is aligned, and the negative pressure of the suction source 28 is applied to the mounting surface 23 of the chuck table base 20, FIGS. 2, the flat mounting surface 23 and the flat lower surface 34 are brought into close contact with each other under negative pressure, and the chuck table 30 is fixed to the chuck table base 20. As shown in FIG. Further, when the dicing tape 106 side of the frame unit 108 is placed on the holding surface 33 of the chuck table 30 and aligned, and the negative pressure of the suction source 28 is applied to the holding surface 33 of the chuck table 30, as shown in FIG. Further, the flat holding surface 33 and the surface of the frame unit 108 below the dicing tape 106 are brought into contact with each other under negative pressure, and the frame unit 108 is fixed to the chuck table 30 .

In the present embodiment, the chuck table 30 includes the chuck table 30 made of porous ceramics or the like having a large number of porous holes, and the table body 32 . may be formed with suction grooves for applying negative pressure to the holding surface 33 of the chuck table 30 .

Further, as shown in FIG. 4 , when fixing the frame unit 108 to the chuck table 30 , the clamp 22 pulls down the frame 107 below the holding surface 33 of the chuck table 30 in the vertical direction to hold it. As a result, the dicing tape 106 is brought into close contact with the holding surface 33 , so that the workpiece 100 is firmly supported by the holding surface 33 via the dicing tape 106 .

Further, as shown in FIG. 1, a water case 19 is provided near the X-axis moving table 10 for temporarily storing waste fluid of cutting fluid such as pure water used during cutting. . The waste liquid stored in the water case 19 is discharged to the outside of the processing apparatus 2 through a drain (not shown) or the like. A transport mechanism (not shown) that transports the workpiece 100 to the chuck table 30 is provided at a position close to the chuck table 30 .

As shown in FIG. 1, a gate-shaped support structure 40 straddling the X-axis movement mechanism 6 is arranged on the upper surface of the base 4 . Two sets of processing unit moving mechanisms 42 functioning as an indexing feed unit and a cutting feed unit are provided on the upper front surface of the support structure 40 . Each processing unit moving mechanism 42 is arranged on the front surface of the support structure 40 and commonly includes a pair of Y-axis guide rails 44 generally parallel to the Y-axis direction, which is the indexing feed direction, that is, the horizontal direction in FIG. A Y-axis moving plate 46 constituting each processing unit moving mechanism 42 is slidably attached to the Y-axis guide rail 44 .

A nut portion (not shown) is provided on the back side of each Y-axis moving plate 46, and a Y-axis ball screw 48 substantially parallel to the Y-axis guide rail 44 is screwed into this nut portion. . A Y-axis pulse motor 50 is connected to one end of each Y-axis ball screw 48 . When the Y-ball screw 48 is rotated by the Y-axis pulse motor 50, the Y-axis moving plate 46 moves along the Y-axis guide rail 44 in the Y-axis direction.

A pair of Z-axis guide rails 52 substantially parallel to the Z-axis direction is provided on the front surface of each Y-axis moving plate 46 . A Z-axis movement plate 54 is slidably attached to the Z-axis guide rail 52 .

A nut portion (not shown) is provided on the back side of each Z-axis moving plate 54, and a Z-axis ball screw 56 parallel to the Z-axis guide rail 52 is screwed into each nut portion. A Z-axis pulse motor 58 is connected to one end of each Z-axis ball screw 56 . When the Z-axis ball screw 56 is rotated by the Z-axis pulse motor 58, the Z-axis moving plate 54 moves along the Z-axis guide rail 52 in the Z-axis direction.

Each processing unit moving mechanism 42 is provided with a Y-axis measuring unit (not shown) that measures the position of the Y-axis moving plate 46 in the Y-axis direction. Each machining unit moving mechanism 42 is provided with a Z-axis measuring unit (not shown) for measuring the position of the Z-axis moving plate 54 in the Z-axis direction.

A machining unit 60 for cutting the workpiece 100 held on the chuck table 30 is fixed below each Z-axis moving plate 54 . A camera 62 that is an imaging unit for imaging the workpiece 100 is provided at a position adjacent to the processing unit 60 . If the Y-axis moving plate 46 is moved in the Y-axis direction by each machining unit moving mechanism 42, the machining unit 60 and the camera 62 are indexed and fed, and if the Z-axis moving plate 54 is moved in the Z-axis direction, machining Unit 60 and camera 62 are feed fed.

The positions of the chuck table 30 and the like in the X-axis direction with respect to the processing unit 60 and the camera 62 are measured by the above-described X-axis measurement unit. Further, the positions of the processing unit 60 and the camera 62 in the Y-axis direction with respect to the chuck table 30 and the like are measured by the Y-axis measurement unit described above. Furthermore, the Z-axis direction positions of the processing unit 60 and the camera 62 with respect to the chuck table 30 and the like are measured by the Z-axis measurement unit described above.

As shown in FIG. 4, the machining unit 60 is a cutting unit in which a cutting blade 66 having an annular cutting edge on its outer peripheral edge is mounted on a spindle 64 with a rotating shaft substantially parallel to the holding surface 33 of the chuck table 30. , cuts the workpiece 100 held on the chuck table 30 . The axis of rotation of spindle 64 is generally perpendicular to the X-axis and Z-axis directions and generally parallel to the Y-axis direction. A cutting blade 66 is attached to one end of the spindle 64 . A rotational drive source (not shown) such as a motor is connected to the other end of the spindle 64 , and the cutting blade 66 is rotated by the torque of the rotational drive source transmitted via the spindle 64 . By rotating the cutting blade 66 , cutting grooves are formed in the workpiece 100 along the division lines 103 to singulate the devices 104 .

In the vicinity of the cutting blade 66, as shown in FIGS. 1 and 4, a cutting fluid supply nozzle 68 is provided for supplying cutting fluid such as pure water to the workpiece 100, the cutting blade 66, and the like. A blade position detection unit 69 is arranged below the cutting blade 66 to detect the height of the lower end of the cutting blade 66, that is, the position in the Z-axis direction. Each component of the machining unit 60 is controlled by the above-described control unit 39 in accordance with the cutting conditions of the workpiece 100 and the like.

As shown in FIGS. 1, 2, 3 and 4, the processing device 2 includes a control unit 39 that controls the constituent elements of the processing device 2 according to the processing conditions of the workpiece 100. . The control unit 39 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. and a computer capable of executing a computer program.

The arithmetic processing device of the control unit 39 executes a computer program stored in the storage device on the RAM, generates a control signal for controlling the processing device 2, and transmits the generated control signal to the input/output interface device. output to each component of the processing device 2 via The control unit 39 also includes a display unit (not shown) configured by a liquid crystal display device or the like for displaying cutting operation states and images, and a display unit (not shown) for inputting operation instructions and processing content information for the processing device 2 by the operator. is connected to an input unit (not shown) used for

In the control unit 39, the size and type of the chuck table 30 input by the operator via the input unit are registered. For example, when the chuck table 30-1 shown in FIG. 2 having a relatively small size in the radial direction is used as the chuck table 30, the operator registers the size and type of the chuck table 30-1 in the control unit 39. . Along with registering the size and type of chuck table 30-1 in control unit 39, the operator sets the position of clamp 22 relative to main body 21 to the center axis side, which is a position corresponding to the size and type of chuck table 30-1. move to In the control unit 39, when the chuck table 30-2 shown in FIG. 2 having a relatively large radial size is used as the chuck table 30, the operator registers the size and type of the chuck table 30-2. . Along with registering the size and type of chuck table 30-2 in control unit 39, the operator moves the position of clamp 22 relative to main body 21 to the outer peripheral side corresponding to the size and type of chuck table 30-2. move.

The control unit 39 controls opening and closing of the first open/close valve 26 to switch whether or not to suction the chuck table suction path 24 , thereby determining whether or not the chuck table 30 is fixed on the mounting surface 23 of the chuck table base 20 . switch between Further, the control unit 39 controls opening and closing of the second open/close valve 27 to switch whether or not to suck the workpiece suction path 25 , thereby holding the workpiece 100 on the holding surface 33 of the chuck table 30 . Toggle on or off.

The control unit 39 is connected to the AE sensor 29 and acquires the voltage signal of the elastic wave detected by the AE sensor 29 . Based on the elastic wave detected by the AE sensor 29, the control unit 39 detects trouble caused by the action of the processing unit 60, for example, chipping or cracking of the workpiece 100 due to clogging or crushing of the grindstone. If it is determined that these troubles have been detected, the operation of each component constituting the processing unit 60 is stopped.

As described above, the processing apparatus 2 according to the first embodiment includes the chuck table base 20 having the mounting surface 23 on the upper surface, and the lower surface 34 that is detachably fixed to the mounting surface 23 of the chuck table base 20 in close contact with the upper surface. and a machining unit 60 for machining the workpiece 100 held by the chuck table 30 . An AE sensor 29 for detecting the generated elastic wave is arranged on the chuck table base 20, and the chuck table 30 is exchanged according to the change in size of the workpiece 100. FIG. For this reason, in the processing apparatus 2 according to the first embodiment, the AE sensor 29 for detecting elastic waves generated in the chuck table 30 by the action of the processing unit 60 is arranged on the chuck table base 20. Since the chuck table 30 mounted on the mounting surface 23 of the upper surface is exchanged according to the change of the size of the workpiece 100, the chuck table 30 does not need to incorporate the AE sensor 29, and the chuck An effect is obtained that the elastic waves generated in the workpiece 100 held on the table 30 can be captured with high accuracy.

In addition, in the processing apparatus 2 according to the first embodiment, the chuck table 30 includes a holding surface suction path 36 that allows the lower surface 34 and the holding surface 33 to communicate with each other, and the mounting surface 23 of the chuck table base 20 has a chuck. A chuck table suction path 24 for detachably fixing the chuck table 30 to the chuck table base 20 by applying a negative pressure to the lower surface 34 of the table 30, and a holding surface suction path 36 for the chuck table 30 mounted on the mounting surface 23. and a workpiece suction path 25 communicating with and applying a negative pressure to the workpiece are opened. Therefore, the processing apparatus 2 according to the first embodiment can easily detachably fix the chuck table 30 to the chuck table base 20 by applying a negative pressure through the chuck table suction path 24, The workpiece 100 can be easily detachably fixed to the chuck table 30 by applying negative pressure through the workpiece suction path 25 and the holding surface suction path 36 .

Further, the processing apparatus 2 according to the first embodiment is a cutting unit in which a cutting blade 66 having an annular cutting edge on the outer peripheral edge is mounted on a spindle 64 with a rotating shaft parallel to the holding surface 33 . For this reason, the processing apparatus 2 according to the first embodiment incorporates the AE sensor 29 in the chuck table 30 when specifically cutting the workpiece 100 by rotating the cutting blade 66 of the processing unit 60. There is an effect that the elastic wave generated in the workpiece 100 held by the chuck table 30 can be captured with high accuracy.

Further, in the processing apparatus 2 according to the first embodiment, the workpiece suction path 25 is provided along the rotation axis of the chuck table base 20, and the holding surface suction path 36 is provided along the rotation axis of the chuck table 30. Therefore, regardless of the size of the chuck table 30 in the radial direction, the workpiece suction path 25 and the holding surface suction path 36 can be easily communicated with each other. Further, the processing apparatus 2 according to the first embodiment is provided with the seal member fitting portion 25a for fitting the seal member 38 in the opening portion of the workpiece suction path 25 on the mounting surface 23 side, and furthermore, the holding surface Since the seal member fitting portion 36a into which the seal member 38 is fitted is provided in the opening portion on the lower surface 34 side of the suction path 36, regardless of the size of the chuck table 30 in the radial direction, through the seal member 38, The workpiece suction path 25 and the holding surface suction path 36 can be more preferably communicated with each other.

Further, in the processing apparatus 2 according to the first embodiment, the chuck table suction path 24 is provided parallel to the rotation axis of the chuck table base 20 and at a position radially away from the outer circumference of the chuck table base 20. Regardless of the size of the table 30 in the radial direction, the lower surface 34 of the chuck table 30 can be suitably brought into close contact and detachably fixed.

[Embodiment 2]
FIG. 5 is a partial side cross-sectional view showing a main part of a processing apparatus according to Embodiment 2. FIG. A processing device 2-2 according to Embodiment 2 of the present invention will be described with reference to the drawings. In addition, FIG. 5 attaches|subjects the same code|symbol to the same part as Embodiment 1, and abbreviate|omits description.

As shown in FIG. 5, a processing apparatus 2-2 according to the second embodiment includes a chuck table base 20- that is configured similarly to the processing apparatus 2 according to the first embodiment except for the clamps 22 in the chuck table base 20. 2, a chuck table 30 having the same configuration as the processing apparatus 2 according to the first embodiment, and a processing unit 60 for cutting the workpiece 100 in the processing apparatus 2 according to the first embodiment. and a processing unit 70 for grinding the workpiece 100 .

As shown in FIG. 5, the workpiece 100 to be processed by the processing apparatus 2-2 according to the second embodiment has a protective tape 109 adhered to the front surface 102, and the protective tape 109 is attached with the back surface 105 facing upward. The surface 102 side is held by the holding surface 33 of the chuck table 30 via and ground by the processing unit 70 .

In the processing unit 70 provided in the processing apparatus 2-2 according to the second embodiment, a grinding wheel 71 having grinding wheels 72 arranged in an annular shape on its lower surface is attached to a spindle 81 having a rotation axis substantially orthogonal to the holding surface 33 of the chuck table 30. and grinds the back surface 105 side of the workpiece 100 held on the holding surface 33 of the chuck table 30 .

The grinding wheel 71 includes a plurality of grinding wheels 72 and a wheel base 74 fixing the plurality of grinding wheels 72 on a lower surface 76 . Grinding wheel 71 is mounted on upper surface 75 of wheel base 74 by a plurality of bolts 84 to lower end 82 of spindle 81 via wheel mount 83 .

A cutting feed unit (not shown) is provided above the spindle 81 in the processing unit 70 . The cutting feed unit moves the processing unit 70 in the vertical direction, which is the cutting feed direction orthogonal to the holding surface 33, that is, in the Z-axis direction shown in FIG. The cutting feed unit lowers the processing unit 70 to bring the grinding wheel 71 of the processing unit 70 closer to the workpiece 100 held on the holding surface 33 of the chuck table 30, and raises the processing unit 70 to chuck the grinding wheel 71. Move away from the workpiece 100 held on the holding surface 33 of the table 30 . By pressing the grinding wheel 71 close to the workpiece 100 and rotating it, the back surface 105 side of the workpiece 100 is ground and flattened, and the thickness of the workpiece 100 is reduced. Each component of the processing unit 70 is controlled by the above-described control unit 39 in accordance with the conditions for grinding the workpiece 100 and the like.

As described above, the processing apparatus 2-2 according to the second embodiment includes the chuck table base 20 and the chuck table 30 having substantially the same configuration as the processing apparatus 2 according to the first embodiment. 2, the processing unit 70 for processing the workpiece 100 held on the chuck table 30 is provided instead of the processing unit 60 of the second embodiment. It has the same function and effect as the effect.

Further, in the processing apparatus 2-2 according to the second embodiment, the processing unit 70 has a grinding wheel 71 having grinding wheels 72 arranged in an annular shape on the bottom surface, which is mounted on a spindle 81 having a rotating shaft perpendicular to the holding surface 33. Grinding unit. For this reason, the processing apparatus 2-2 according to the second embodiment specifically grinds the workpiece 100 by pressing the grinding wheel 71 of the processing unit 70 close to the workpiece 100 and rotating it. Also, the chuck table 30 does not need to incorporate the AE sensor 29, and the elastic waves generated in the workpiece 100 held by the chuck table 30 can be captured with high accuracy.

It should be noted that the present invention is not limited to the description of the above embodiment and the like, and can be implemented with various modifications. For example, in the processing device 2 according to the first embodiment, the processing unit 60 may be changed to one having a different shape and material of the cutting blade 66, and in the processing device 2-2 according to the second embodiment, the processing unit 70 may be changed to a grinding wheel 71 having a different shape, material, or the like, or the processing unit 60 or the processing unit 70 may be replaced by a processing unit of a different type that performs other processing on the workpiece 100. may

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

2, 2-2 processing device 20 chuck table base 23 mounting surface 24 chuck table suction path 25 workpiece suction path 25a, 36a sealing member fitting portion 29 AE sensor 30, 30-1, 30-2 chuck table 33 holding Surface 34 Lower surface 36 Holding surface suction path 38 Sealing member 39 Control unit 60, 70 Processing unit 64, 81 Spindle 66 Cutting blade 71 Grinding wheel 100 Workpiece

Claims (4)

a chuck table base having a mounting surface on its upper surface; a chuck table whose lower surface is in close contact with the mounting surface of the chuck table base so as to be detachably fixed; A processing apparatus comprising a processing unit that processes a workpiece held on a table,
an AE sensor for detecting an elastic wave generated in the chuck table by the action of the processing unit is arranged on the chuck table base;
The chuck table is exchanged according to a change in size of the workpiece , and
The flat lower surface of the chuck table is placed on the flat mounting surface of the chuck table base, and a negative pressure is applied to the mounting surface of the chuck table base so that the lower surface is brought into close contact with the mounting surface. and a processing device fixed to the chuck table base. The chuck table has a holding surface suction path for communicating the lower surface and the holding surface inside,
The mounting surface of the chuck table base includes a chuck table suction path for applying a negative pressure to the lower surface of the chuck table to detachably fix the chuck table to the chuck table base, and a suction path mounted on the mounting surface. 2. The processing apparatus according to claim 1, wherein a workpiece suction path communicating with said holding surface suction path of said chuck table to apply a negative pressure thereto is open. 3. The processing apparatus according to claim 1, wherein said processing unit is a cutting unit in which a cutting blade having an annular cutting edge on its outer peripheral edge is mounted on a spindle with a rotating shaft parallel to said holding surface. 3. The processing apparatus according to claim 1, wherein said processing unit is a grinding unit in which a grinding wheel having grinding wheels arranged in a ring on its lower surface is mounted on a spindle of a rotating shaft orthogonal to said holding surface.

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