JP6983004B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP6983004B2 JP6983004B2 JP2017157067A JP2017157067A JP6983004B2 JP 6983004 B2 JP6983004 B2 JP 6983004B2 JP 2017157067 A JP2017157067 A JP 2017157067A JP 2017157067 A JP2017157067 A JP 2017157067A JP 6983004 B2 JP6983004 B2 JP 6983004B2
- Authority
- JP
- Japan
- Prior art keywords
- touch panel
- unit
- drive
- screen
- stop button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16P—SAFETY DEVICES IN GENERAL; SAFETY DEVICES FOR PRESSES
- F16P7/00—Emergency devices preventing damage to a machine or apparatus
- F16P7/02—Emergency devices preventing damage to a machine or apparatus by causing the machine to stop on the occurrence of dangerous conditions therein
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Description
14 チャックテーブル(ユニット)
24 プッシュプルアーム(ユニット)
31 搬入アーム(ユニット)
41 搬出アーム(ユニット)
70 切削手段(ユニット)
75 タッチパネル
81 駆動停止ボタン
82 クローズボタン
85 制御手段
86 駆動制御部
87 表示制御部
88 ユニット
Claims (2)
- 駆動可能なユニットと、該ユニットの操作画面を表示するタッチパネルと、該タッチパネルに対する操作に応じてユニットの駆動を制御する制御手段とを備える加工装置であって、
該制御手段は、
該タッチパネルの操作に応じて該ユニットの駆動及び停止を制御する駆動制御部と、
該タッチパネルの表示画面を制御する表示制御部と、を有し、
該駆動制御部は、該タッチパネルに表示された該操作画面上の駆動ボタンが押されると該ユニットを駆動し、
該表示制御部は、該ユニットが駆動を開始して所定のタイミングで該タッチパネルの表示画面を該操作画面から停止画面に切り替わると、該停止画面において、該タッチパネルの画面全体が操作を受け付け可能な検知領域となった駆動停止ボタンを表示し、
該駆動制御部は、該タッチパネルに表示された該停止画面上の該駆動停止ボタンが押されると該ユニットの駆動を停止すること、を特徴とする加工装置。 - 該表示制御部は、該ユニットが駆動を開始した後のタイミングで該タッチパネルの表示画面を該操作画面から該停止画面に切り替えること、を特徴とする請求項1に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157067A JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
KR1020180090763A KR102523322B1 (ko) | 2017-08-16 | 2018-08-03 | 가공 장치 |
CN201810895808.9A CN109404711B (zh) | 2017-08-16 | 2018-08-08 | 加工装置 |
TW107127909A TWI787319B (zh) | 2017-08-16 | 2018-08-10 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157067A JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019034370A JP2019034370A (ja) | 2019-03-07 |
JP6983004B2 true JP6983004B2 (ja) | 2021-12-17 |
Family
ID=65464243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017157067A Active JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6983004B2 (ja) |
KR (1) | KR102523322B1 (ja) |
CN (1) | CN109404711B (ja) |
TW (1) | TWI787319B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7226410B2 (ja) * | 2020-08-04 | 2023-02-21 | トヨタ自動車株式会社 | 車載インターフェース装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0341299A (ja) * | 1989-07-10 | 1991-02-21 | Fujitsu Ltd | 地震時に装置を停止させるための装置 |
JPH04189443A (ja) * | 1990-11-21 | 1992-07-07 | Hitachi Seiko Ltd | 工作機械の停止スイッチ装置 |
JP2002052443A (ja) * | 2000-08-08 | 2002-02-19 | Okamoto Machine Tool Works Ltd | 平面研削装置 |
KR20020075335A (ko) * | 2002-08-23 | 2002-10-04 | 정응규 | 원격제어패널을 갖는 cnc 밀링머신 |
JP4432472B2 (ja) * | 2002-11-29 | 2010-03-17 | 富士ゼロックス株式会社 | ユーザインタフェース装置 |
JP2005046979A (ja) * | 2003-07-31 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
US20050155043A1 (en) * | 2004-01-08 | 2005-07-14 | Schulz Kurt S. | Human-machine interface system and method for remotely monitoring and controlling a machine |
SE529122C2 (sv) * | 2004-09-24 | 2007-05-02 | Jokab Safety Ab | Skyddsanordning för områdesbegränsning och övervakning |
JP2007027167A (ja) * | 2005-07-12 | 2007-02-01 | Yamagata Casio Co Ltd | 部品搭載装置の非常停止方法 |
JP4257549B2 (ja) * | 2007-07-17 | 2009-04-22 | トヨタ自動車株式会社 | 操作装置 |
US8872775B2 (en) * | 2008-10-27 | 2014-10-28 | Nec Corporation | Information processing apparatus |
CA2707950A1 (en) * | 2009-06-15 | 2010-12-15 | Smart Technologies Ulc | Interactive input system and components therefor |
JP5505205B2 (ja) * | 2010-08-30 | 2014-05-28 | トヨタ自動車株式会社 | 脚動作支援装置 |
JP5714394B2 (ja) * | 2011-04-15 | 2015-05-07 | 富士機械製造株式会社 | 部品実装ライン |
WO2012153401A1 (ja) * | 2011-05-11 | 2012-11-15 | 三菱電機株式会社 | 数値制御装置 |
CN103224170A (zh) * | 2012-01-26 | 2013-07-31 | 钱嘉诚 | 电梯错按及无人即时清除装置 |
JP6013166B2 (ja) * | 2012-12-11 | 2016-10-25 | 株式会社ディスコ | 切削装置 |
JP6418763B2 (ja) * | 2014-03-19 | 2018-11-07 | Dmg森精機株式会社 | 工作機械の手動操作用シミュレーション装置 |
DE102014012186A1 (de) * | 2014-08-20 | 2016-02-25 | Sig Technology Ag | Verarbeitungsanlage, Verfahren zum Betreiben einer Verarbeitungsanlage und Verwendung einer Verarbeitungsanlage |
JP5926418B2 (ja) * | 2015-04-23 | 2016-05-25 | 京セラ株式会社 | 携帯端末装置 |
CN104964154A (zh) * | 2015-06-29 | 2015-10-07 | 安徽宝昱电子科技有限公司 | 机械设备的紧急停止装置 |
CN204868111U (zh) * | 2015-08-14 | 2015-12-16 | 天津津研机械设计有限公司 | 一种符合用户操作习惯的数控机床人机面板 |
JP6812306B2 (ja) * | 2017-06-05 | 2021-01-13 | 株式会社クボタ | 作業車両の停止システム及びそれを具備する作業車両 |
-
2017
- 2017-08-16 JP JP2017157067A patent/JP6983004B2/ja active Active
-
2018
- 2018-08-03 KR KR1020180090763A patent/KR102523322B1/ko active IP Right Grant
- 2018-08-08 CN CN201810895808.9A patent/CN109404711B/zh active Active
- 2018-08-10 TW TW107127909A patent/TWI787319B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102523322B1 (ko) | 2023-04-18 |
CN109404711B (zh) | 2023-06-02 |
CN109404711A (zh) | 2019-03-01 |
TWI787319B (zh) | 2022-12-21 |
JP2019034370A (ja) | 2019-03-07 |
KR20190019015A (ko) | 2019-02-26 |
TW201910948A (zh) | 2019-03-16 |
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