JP2019034370A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2019034370A JP2019034370A JP2017157067A JP2017157067A JP2019034370A JP 2019034370 A JP2019034370 A JP 2019034370A JP 2017157067 A JP2017157067 A JP 2017157067A JP 2017157067 A JP2017157067 A JP 2017157067A JP 2019034370 A JP2019034370 A JP 2019034370A
- Authority
- JP
- Japan
- Prior art keywords
- touch panel
- unit
- stop button
- drive
- drive stop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims description 29
- 238000005520 cutting process Methods 0.000 abstract description 43
- 230000007246 mechanism Effects 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 238000012423 maintenance Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16P—SAFETY DEVICES IN GENERAL; SAFETY DEVICES FOR PRESSES
- F16P7/00—Emergency devices preventing damage to a machine or apparatus
- F16P7/02—Emergency devices preventing damage to a machine or apparatus by causing the machine to stop on the occurrence of dangerous conditions therein
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
Description
14 チャックテーブル(ユニット)
24 プッシュプルアーム(ユニット)
31 搬入アーム(ユニット)
41 搬出アーム(ユニット)
70 切削手段(ユニット)
75 タッチパネル
81 駆動停止ボタン
82 クローズボタン
85 制御手段
86 駆動制御部
87 表示制御部
88 ユニット
Claims (1)
- 駆動可能なユニットと、該ユニットの操作画面を表示するタッチパネルと、該タッチパネルに対する操作に応じてユニットの駆動を制御する制御手段とを備える加工装置であって、
該タッチパネルには、該ユニットが駆動を開始して所定のタイミングで、該ユニットの駆動を停止する駆動停止ボタンが全面に表示されること、を特徴とする加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157067A JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
KR1020180090763A KR102523322B1 (ko) | 2017-08-16 | 2018-08-03 | 가공 장치 |
CN201810895808.9A CN109404711B (zh) | 2017-08-16 | 2018-08-08 | 加工装置 |
TW107127909A TWI787319B (zh) | 2017-08-16 | 2018-08-10 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157067A JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019034370A true JP2019034370A (ja) | 2019-03-07 |
JP6983004B2 JP6983004B2 (ja) | 2021-12-17 |
Family
ID=65464243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017157067A Active JP6983004B2 (ja) | 2017-08-16 | 2017-08-16 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6983004B2 (ja) |
KR (1) | KR102523322B1 (ja) |
CN (1) | CN109404711B (ja) |
TW (1) | TWI787319B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022029065A (ja) * | 2020-08-04 | 2022-02-17 | トヨタ自動車株式会社 | 車載インターフェース装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04189443A (ja) * | 1990-11-21 | 1992-07-07 | Hitachi Seiko Ltd | 工作機械の停止スイッチ装置 |
JP2002052443A (ja) * | 2000-08-08 | 2002-02-19 | Okamoto Machine Tool Works Ltd | 平面研削装置 |
WO2004018149A1 (en) * | 2002-08-23 | 2004-03-04 | Eung Gyu Jung | Cnc milling machine provided with remote control panel |
JP2012045251A (ja) * | 2010-08-30 | 2012-03-08 | Toyota Motor Corp | 脚動作支援装置 |
JP2012227205A (ja) * | 2011-04-15 | 2012-11-15 | Fuji Mach Mfg Co Ltd | 部品実装ライン |
JP2014113669A (ja) * | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | 切削装置 |
WO2016026602A1 (de) * | 2014-08-20 | 2016-02-25 | Sig Technology Ag | Verarbeitungsanlage, verfahren zum betreiben einer verarbeitungsanlage und verwendung einer verarbeitungsanlage |
JP2018201419A (ja) * | 2017-06-05 | 2018-12-27 | 株式会社クボタ | 作業車両の停止システム及びそれを具備する作業車両 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0341299A (ja) * | 1989-07-10 | 1991-02-21 | Fujitsu Ltd | 地震時に装置を停止させるための装置 |
JP4432472B2 (ja) * | 2002-11-29 | 2010-03-17 | 富士ゼロックス株式会社 | ユーザインタフェース装置 |
JP2005046979A (ja) * | 2003-07-31 | 2005-02-24 | Disco Abrasive Syst Ltd | 切削装置 |
US20050155043A1 (en) * | 2004-01-08 | 2005-07-14 | Schulz Kurt S. | Human-machine interface system and method for remotely monitoring and controlling a machine |
SE529122C2 (sv) * | 2004-09-24 | 2007-05-02 | Jokab Safety Ab | Skyddsanordning för områdesbegränsning och övervakning |
JP2007027167A (ja) * | 2005-07-12 | 2007-02-01 | Yamagata Casio Co Ltd | 部品搭載装置の非常停止方法 |
JP4257549B2 (ja) * | 2007-07-17 | 2009-04-22 | トヨタ自動車株式会社 | 操作装置 |
CN102204224B (zh) * | 2008-10-27 | 2014-07-09 | 日本电气株式会社 | 信息处理装置 |
US20110032215A1 (en) * | 2009-06-15 | 2011-02-10 | Smart Technologies Ulc | Interactive input system and components therefor |
JPWO2012153401A1 (ja) * | 2011-05-11 | 2014-07-28 | 三菱電機株式会社 | 数値制御装置 |
CN103224170A (zh) * | 2012-01-26 | 2013-07-31 | 钱嘉诚 | 电梯错按及无人即时清除装置 |
JP6418763B2 (ja) * | 2014-03-19 | 2018-11-07 | Dmg森精機株式会社 | 工作機械の手動操作用シミュレーション装置 |
JP5926418B2 (ja) * | 2015-04-23 | 2016-05-25 | 京セラ株式会社 | 携帯端末装置 |
CN104964154A (zh) * | 2015-06-29 | 2015-10-07 | 安徽宝昱电子科技有限公司 | 机械设备的紧急停止装置 |
CN204868111U (zh) * | 2015-08-14 | 2015-12-16 | 天津津研机械设计有限公司 | 一种符合用户操作习惯的数控机床人机面板 |
-
2017
- 2017-08-16 JP JP2017157067A patent/JP6983004B2/ja active Active
-
2018
- 2018-08-03 KR KR1020180090763A patent/KR102523322B1/ko active IP Right Grant
- 2018-08-08 CN CN201810895808.9A patent/CN109404711B/zh active Active
- 2018-08-10 TW TW107127909A patent/TWI787319B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04189443A (ja) * | 1990-11-21 | 1992-07-07 | Hitachi Seiko Ltd | 工作機械の停止スイッチ装置 |
JP2002052443A (ja) * | 2000-08-08 | 2002-02-19 | Okamoto Machine Tool Works Ltd | 平面研削装置 |
WO2004018149A1 (en) * | 2002-08-23 | 2004-03-04 | Eung Gyu Jung | Cnc milling machine provided with remote control panel |
JP2012045251A (ja) * | 2010-08-30 | 2012-03-08 | Toyota Motor Corp | 脚動作支援装置 |
JP2012227205A (ja) * | 2011-04-15 | 2012-11-15 | Fuji Mach Mfg Co Ltd | 部品実装ライン |
JP2014113669A (ja) * | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | 切削装置 |
WO2016026602A1 (de) * | 2014-08-20 | 2016-02-25 | Sig Technology Ag | Verarbeitungsanlage, verfahren zum betreiben einer verarbeitungsanlage und verwendung einer verarbeitungsanlage |
JP2018201419A (ja) * | 2017-06-05 | 2018-12-27 | 株式会社クボタ | 作業車両の停止システム及びそれを具備する作業車両 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022029065A (ja) * | 2020-08-04 | 2022-02-17 | トヨタ自動車株式会社 | 車載インターフェース装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20190019015A (ko) | 2019-02-26 |
TWI787319B (zh) | 2022-12-21 |
KR102523322B1 (ko) | 2023-04-18 |
JP6983004B2 (ja) | 2021-12-17 |
CN109404711A (zh) | 2019-03-01 |
TW201910948A (zh) | 2019-03-16 |
CN109404711B (zh) | 2023-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7017949B2 (ja) | 加工装置 | |
TWI746815B (zh) | 加工裝置 | |
JP2018008286A (ja) | 静電チャックテーブル、レーザー加工装置及び被加工物の加工方法 | |
US10935957B2 (en) | Processing apparatus | |
KR102523322B1 (ko) | 가공 장치 | |
JP6433178B2 (ja) | 加工装置 | |
JP6844900B2 (ja) | 加工装置及び入力方法 | |
TW201913775A (zh) | 加工裝置 | |
JP2020077668A (ja) | 加工装置 | |
JP2015138808A (ja) | 切削装置 | |
JP7154910B2 (ja) | 加工装置 | |
JP7229640B2 (ja) | 切削装置 | |
JP5386276B2 (ja) | 切削装置 | |
US20210034228A1 (en) | Processing apparatus | |
JP2018074101A (ja) | 加工装置のチャックテーブル | |
TW202407780A (zh) | 加工裝置 | |
JP6071466B2 (ja) | 加工装置 | |
JP2022021006A (ja) | 加工装置 | |
JP2018192583A (ja) | 加工装置 | |
JP2021170598A (ja) | 加工装置 | |
JP2020136489A (ja) | 搬送装置 | |
JP2020049564A (ja) | 切削装置 | |
KR20180115223A (ko) | 프레임 유닛 및 피가공물의 레이저 가공 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200602 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210303 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210316 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210514 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20211102 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20211122 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6983004 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |