TWI778116B - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
- Publication number
- TWI778116B TWI778116B TW107128333A TW107128333A TWI778116B TW I778116 B TWI778116 B TW I778116B TW 107128333 A TW107128333 A TW 107128333A TW 107128333 A TW107128333 A TW 107128333A TW I778116 B TWI778116 B TW I778116B
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- Prior art keywords
- electrode
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- semiconductor device
- conductive semiconductor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1248—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
Landscapes
- Led Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Bipolar Transistors (AREA)
- Noodles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0103159 | 2017-08-14 | ||
| KR1020170103159A KR102390828B1 (ko) | 2017-08-14 | 2017-08-14 | 반도체 소자 |
| ??10-2017-0103159 | 2017-08-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201921723A TW201921723A (zh) | 2019-06-01 |
| TWI778116B true TWI778116B (zh) | 2022-09-21 |
Family
ID=63254530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107128333A TWI778116B (zh) | 2017-08-14 | 2018-08-14 | 半導體裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10593838B2 (enExample) |
| EP (1) | EP3444855B1 (enExample) |
| JP (1) | JP2019036729A (enExample) |
| KR (1) | KR102390828B1 (enExample) |
| CN (1) | CN109390446B (enExample) |
| TW (1) | TWI778116B (enExample) |
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| US20190189850A1 (en) * | 2017-12-19 | 2019-06-20 | Epistar Corporation | Light-emitting device |
| JP7541813B2 (ja) * | 2018-05-30 | 2024-08-29 | ソウル バイオシス カンパニー リミテッド | 発光ダイオード及びそれを有する発光素子 |
| DE102019112949A1 (de) * | 2019-05-16 | 2020-11-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender Halbleiterchip und strahlungsemittierendes Bauteil |
| US10971650B2 (en) * | 2019-07-29 | 2021-04-06 | Lextar Electronics Corporation | Light emitting device |
| KR20210019804A (ko) * | 2019-08-13 | 2021-02-23 | 삼성전자주식회사 | Led 소자 및 이를 포함하는 led 디스플레이 모듈 |
| US11038088B2 (en) | 2019-10-14 | 2021-06-15 | Lextar Electronics Corporation | Light emitting diode package |
| US20220393073A1 (en) * | 2019-11-08 | 2022-12-08 | Idemitsu Kosan Co.,Ltd. | Laminate and semiconductor device |
| US11569415B2 (en) * | 2020-03-11 | 2023-01-31 | Lumileds Llc | Light emitting diode devices with defined hard mask opening |
| US11735695B2 (en) * | 2020-03-11 | 2023-08-22 | Lumileds Llc | Light emitting diode devices with current spreading layer |
| DE102020114772A1 (de) * | 2020-06-03 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip |
| TWI855134B (zh) * | 2020-08-19 | 2024-09-11 | 晶元光電股份有限公司 | 化合物半導體元件及化合物半導體裝置 |
| WO2022050510A1 (ko) * | 2020-09-04 | 2022-03-10 | 주식회사 포톤웨이브 | 자외선 발광소자 및 이를 포함하는 발광소자 패키지 |
| KR102385672B1 (ko) * | 2020-09-04 | 2022-04-13 | 주식회사 포톤웨이브 | 자외선 발광소자 및 이를 포함하는 발광소자 패키지 |
| CN112750925B (zh) * | 2020-12-31 | 2022-04-08 | 广东省科学院半导体研究所 | 深紫外led器件结构及其制备方法 |
| JP6995227B1 (ja) * | 2021-01-07 | 2022-01-14 | 日機装株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
| WO2022158679A1 (ko) * | 2021-01-21 | 2022-07-28 | 주식회사 포톤웨이브 | 자외선 발광소자 |
| KR102539566B1 (ko) * | 2021-01-21 | 2023-06-05 | 주식회사 포톤웨이브 | 자외선 발광소자 |
| JP7504054B2 (ja) * | 2021-04-20 | 2024-06-21 | 日機装株式会社 | 半導体発光素子 |
| US12408493B2 (en) * | 2021-05-26 | 2025-09-02 | Nichia Corporation | Light-emitting element including first semiconductor layer having exposed portion with first region and second regions |
| JP7329742B2 (ja) * | 2021-05-26 | 2023-08-21 | 日亜化学工業株式会社 | 発光素子 |
| CN115172556A (zh) * | 2021-06-17 | 2022-10-11 | 厦门三安光电有限公司 | 一种发光二极管芯片、发光装置及显示装置 |
| CN115663086A (zh) * | 2021-08-10 | 2023-01-31 | 厦门三安光电有限公司 | 发光二极管及发光装置 |
| CN113921672B (zh) * | 2021-09-14 | 2023-06-20 | 厦门三安光电有限公司 | 发光二极管及发光模块 |
| CN115832143A (zh) * | 2021-09-24 | 2023-03-21 | 厦门三安光电有限公司 | 倒装发光二极管和发光装置 |
| WO2023060753A1 (zh) * | 2021-10-14 | 2023-04-20 | 淮安澳洋顺昌光电技术有限公司 | Led芯片及其制备方法 |
| CN113851566B (zh) * | 2021-12-01 | 2022-02-11 | 山西中科潞安紫外光电科技有限公司 | 一种深紫外led倒装芯片及其制作方法 |
| US20250167515A1 (en) * | 2022-02-25 | 2025-05-22 | Ireach Corporation | Semiconductor laser and packaging structure thereof |
| US20240379910A1 (en) * | 2023-05-12 | 2024-11-14 | Seoul Viosys Co., Ltd. | Light emitting device and display device having the same |
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| CN109390446A (zh) | 2019-02-26 |
| KR20190018325A (ko) | 2019-02-22 |
| KR102390828B1 (ko) | 2022-04-26 |
| EP3444855B1 (en) | 2020-09-30 |
| CN109390446B (zh) | 2023-04-07 |
| EP3444855A1 (en) | 2019-02-20 |
| TW201921723A (zh) | 2019-06-01 |
| JP2019036729A (ja) | 2019-03-07 |
| US20190051797A1 (en) | 2019-02-14 |
| US10593838B2 (en) | 2020-03-17 |
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