WO2005101532A1 - 窒化ガリウム系発光装置 - Google Patents
窒化ガリウム系発光装置 Download PDFInfo
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- WO2005101532A1 WO2005101532A1 PCT/JP2004/005475 JP2004005475W WO2005101532A1 WO 2005101532 A1 WO2005101532 A1 WO 2005101532A1 JP 2004005475 W JP2004005475 W JP 2004005475W WO 2005101532 A1 WO2005101532 A1 WO 2005101532A1
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- barrier layer
- emitting device
- gallium nitride
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 37
- 229910002601 GaN Inorganic materials 0.000 title claims description 36
- 230000004888 barrier function Effects 0.000 claims abstract description 89
- 238000005253 cladding Methods 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 5
- 239000000969 carrier Substances 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 14
- 239000000872 buffer Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 11
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
- H01S5/222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties having a refractive index lower than that of the cladding layers or outer guiding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
- H01S5/3216—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities quantum well or superlattice cladding layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
Definitions
- Gallium nitride based light emitting device Gallium nitride based light emitting device
- the present invention relates to a gallium nitride-based light emitting device, particularly to a light emitting device such as a light emitting diode (LED) or a semiconductor laser (LD) that emits light in a short wavelength region of 380 nm or less.
- a light emitting device such as a light emitting diode (LED) or a semiconductor laser (LD) that emits light in a short wavelength region of 380 nm or less.
- FIGS. 9 and 10 show the configuration of a light emitting device (semiconductor laser) disclosed in the following Patent Document.
- a light emitting device semiconductor laser
- FIG. 9 shows the cross-sectional configuration of the light emitting device
- (b) shows the composition ratio of A1 in this cross-sectional configuration.
- This light emitting device has a structure in which a first conductivity type layer 11, an active layer 12, and a second conductivity type layer 13 are laminated on a substrate 21 and a buffer layer 22.
- the first conductivity type layer 11 has a contact layer 23, a cladding layer 25, and a first light guide layer 26, the active layer 12 has an active layer 27, and the second conductivity type layer 13 has a carrier confinement layer. 28, a second light guide layer 29, a clad layer 30, and a contact layer 31.
- the active layer 12 (or the active layer 27) is sandwiched between the first and second light guide layers 26 and 29, and a light guide path is formed by the first and second light guide layers and the active layer therebetween.
- FIG. 10 shows the layer structure near the active layer 12 (or the active layer 27) and its band gap.
- the active layer 12 (27) has a structure in which a plurality of well layers la, lb and a plurality of barrier layers 2a, 2b, 2c are alternately stacked, A carrier confinement layer 28 is formed inside the layer 27 or near the active layer.
- the carrier confinement layer 28 confines carriers from the first conductivity type layer in the active layer or the well layer.
- the carrier confinement layer 28 confines electrons in the active layer.
- the reason why the carrier confinement layer 28 is provided on the p-layer side is that electrons easily overflow the active layer because the diffusion length of electrons in the nitride semiconductor is longer than the diffusion length of holes. I have.
- n-side barrier layer 2a disposed on the side can function as a hole confinement layer with the n-side barrier layer 2a being thicker than other barrier layers. It is described that the function of confining the carrier can be suitably extracted.
- Patent Document Japanese Patent Application Laid-Open Publication No. 2003-111536 Disclosure of the Invention
- the active layer is a multiple quantum well (MQW) structure composed of a barrier layer and a well layer, and a carrier confinement layer that confines electrons on the p-layer side and a carrier confinement layer that confines holes on the n-layer side.
- MQW multiple quantum well
- light-emitting devices using GaN-based compound semiconductors have been increasingly used in recent years, and further improvement in light emission intensity is particularly desired as a light source for illumination.
- An object of the present invention is to provide a light-emitting device using a GaN-based compound semiconductor that emits ultraviolet light and having a higher emission intensity.
- the present invention provides a substrate, a first conductivity type cladding layer formed on the substrate, an active layer formed on the cladding layer, and a second conductivity type cladding formed on the active layer.
- the active layer is a gallium nitride based light emitting device having a barrier layer made of a gallium nitride based compound semiconductor layer and a well layer, wherein the barrier layer of the active layer is of the first conductivity type A first barrier layer formed on the cladding layer side; and a second barrier layer sandwiched between the well layers, wherein a first barrier layer is provided between the active layer and the second conductivity type cladding layer.
- a carrier blocking layer of the second conductivity type a band gap E gb of the carrier blocking layer, a band gap E g2 of the second barrier layer, a band gap E gl of the first barrier layer, and a band gap E of the cladding layer.
- gc is characterized by satisfying E gb> E g 2> E g 1 ⁇ E gc.
- the carrier from the first conductivity type layer is blocked by the carrier block layer, and the carrier from the second conductivity type layer is blocked by the first barrier layer.
- the first conductivity type can be set to n-type and the second conductivity type can be set to p-type.
- the first barrier layer functions as a hole confinement layer, and the carrier block layer functions as an electron confinement layer.
- FIG. 1 is a configuration diagram of a light emitting device according to the embodiment.
- FIG. 2 is an explanatory diagram of the size of the band gap of the embodiment.
- FIG. 3 is a diagram showing the relationship between the band gap of the first barrier layer with respect to the second barrier layer and the emission intensity.
- FIG. 4 is an explanatory diagram showing the relationship between the band gap of the first barrier layer with respect to the cladding layer and the emission intensity.
- FIG. 5 is a diagram showing the relationship between the band gap of the p-type block layer and the emission intensity with respect to the second barrier layer.
- FIG. 6 is a diagram showing the relationship between the thickness of the first barrier layer and the light emission intensity.
- FIG. 7 is a diagram showing the relationship between the presence or absence of a well layer and the emission intensity.
- FIG. 8 is a diagram showing the relationship between the thickness of the well layer and the light emission intensity.
- FIG. 9 is a configuration diagram of a conventional device.
- FIG. 9A is a cross-sectional configuration diagram of a light emitting device, and FIG.
- FIG. 10 is an explanatory diagram showing the magnitude of the band gap energy of the conventional device.
- FIG. 10 (a) is a diagram showing the layer structure
- FIG. 10 (b) is a diagram showing the magnitude of the band gap energy in the layer structure of FIG. 10 (a).
- FIG. 1 shows a cross-sectional configuration diagram of a light emitting device using the GaN-based compound semiconductor device according to the present embodiment.
- the light-emitting devices are sequentially formed on a sapphire substrate 110 at a low temperature (LT) SiN buffer layer 112, a low-temperature (Shingu) GaN buffer layer 114, an undoped GaN buffer layer 116, a high temperature
- An SiN buffer layer 118 and an AND GaN buffer layer 120 are formed as an underlayer, and an n-type contact layer 122 and an n-type superlattice cladding layer 124 are formed on the underlayer.
- An active layer 129 including an n-type first barrier layer 126, a p-type block layer 132, a p-type superlattice cladding layer 134, and a p-type contact layer 136 are stacked.
- the optical guide layer is not particularly set, but when the optical guide layer is inserted, an n-side optical guide layer is provided between the n-type superlattice cladding layer 124 and the n-type first barrier layer 126.
- a p-side optical guide layer may be inserted between the p-type block layer 132 and the p-type superlattice cladding layer 134.
- the active layer 129 includes an n-type first barrier layer 126 and a multiple quantum well (MQW) structure in which an n-type well layer 128 and an n-type second barrier layer 130 are alternately stacked.
- the n-type first barrier layer 126 and the p-type block layer 132 each function as a carrier confinement layer. That is, the n-type first barrier layer 126 has a function of confining holes from the p-type layer, and the p-type block layer 132 has a function of confining electrons from the n-type layer.
- the material and thickness of each layer are as follows.
- n-type contact layer 1 22 Si dope G aN (2 ⁇ m)
- n-type superlattice cladding layer 1 24 A 10. 2 Ga. . 8 N barrier layer (2 nm) 50 layers of ZGaN well layer (2 nm)
- n-type first barrier layer 1 26 A 10. isGao. srN (26 nm)
- Active layer 1 29 I no. OsG ao. 95 N well layer 1 28 (2 nm) / 1 o. 19 Gao. 81 N 2nd barrier layer 130 (13 nm) 3 layers p-type blocking layer 132: Mg doping A 1 o. 27 G a o. 73 N (25 nm)
- P-type superlattice cladding layer 1 34 Mg de one-flop A 10. 2 G a 0 8 N barrier layer (2 nm) ZMg de one flop GaN well layer (2 nm) to 30 layers
- an n-type contact layer 122 with an n-electrode and a p-type contact layer 136 with a p-electrode function as a light emitting device.
- the low-temperature SIN buffer layer 112 and the high-temperature SIN buffer layer 118 are not essential and need not be formed.
- the light emitting device shown in FIG. 1 is manufactured by the following process. That is,
- a sapphire C-plane substrate 110 is placed on a susceptor in a MOCVD apparatus, and the substrate 110 is heat-treated at 110 ° C. for 10 minutes in a hydrogen atmosphere.
- TMG trimethylgallium
- ammonia gas are supplied as source gases into the apparatus to grow a low-temperature GaN buffer layer 114.
- TMG trimethylgallium
- ammonia gas are supplied into the apparatus as a source gas to grow an undoped n-type GaN buffer layer 116.
- TMG trimethylgallium
- ammonia gas are supplied as source gases, and the undoped n-type GaN layer 120 is grown.
- a puffer layer as an underlayer is formed.
- a silicon-containing gas is supplied at 1075 ° C. to grow a Si-doped n-type GaN contact layer 122.
- TMA trimethylaluminum
- trimethylgallium trimethylgallium
- ammonia gas and silane gas are supplied as source gases, and a total of 50 n-type A 1 GaN barrier layers and n-type GaN well layers are alternately grown.
- n-type superlattice cladding layer 124 To grow an n-type superlattice cladding layer 124.
- the temperature is lowered to 850 ° C., and TMG, TMA, and ammonia gas are supplied as source gases to grow the n-type A 1 GaN first barrier layer 126.
- an active layer 129 is grown at 850 ° C. by growing a total of three n-type InGaN well layers 128 and an n-type A 1 GaN second barrier layer 130 alternately.
- the p-type superlattice cladding layer 134 is grown by alternately growing a total of 30 layers of Mg doped p-type A 1 GaN barrier layers and Mg-doped p-type GaN well layers.
- the wafer is taken out of the M ⁇ C VD apparatus and electrodes are formed. Specifically, Ni (10 nm) and Au (10 nm) are sequentially vacuum-deposited on the wafer surface and heat-treated at 520 ° C in an oxygen atmosphere containing 5% oxygen to form a P-type transparent electrode. I do. Next, a photoresist is applied to the entire surface, and is etched using an etching mask until a part of the n-type contact layer 122 is exposed on the surface. Then, an n-electrode is formed on the exposed n-type contact layer 122.
- Ti 5 nm
- a 1 5 nm
- Ti 5 nm
- a 1 5 nm
- a gold pad for wire bonding is formed on a part of the p-type transparent electrode and the n-type electrode, the backside of the substrate is polished, and an LED chip is cut out by scribing and mounted to obtain an LED.
- each layer described above is merely examples, and specifically, an LED can be manufactured under the following conditions.
- n-type first barrier layer 126 A 1 G a in N without A 1 x I n y G a x -. be constructed from y N, the range of composition ratios x and y are 0 ⁇ X ⁇ 0 3 0 ⁇ y ⁇ 0.05. In the table, these conditions are indicated as A 1 ⁇ 0.3 In ⁇ 0.05.
- the n-type well layer 128 and the n-type second barrier layer 130 of the active layer 129 can also be composed of A 1 X I nyGai- x -y N, respectively. 0.01 0 ⁇ y ⁇ 0.1 1
- the n-type second barrier layer 130 satisfies 0 ⁇ x ⁇ 0.3 0 ⁇ y ⁇ 0.05.
- the n-type well layer 128 is shown as A 1 ⁇ 0.01 In 1 ⁇ 0.1 1
- the n-type second barrier layer 130 is shown as A 1 ⁇ 0.3 In ⁇ 0.05.
- n-type first barrier layer 126 and n-type second barrier layer 130 A 1 x I n y G a! -x-yN (However, 0 ⁇ x ⁇ 0.3 3 0 ⁇ y ⁇ 0.05.)
- n-type well layer 128 A 1 I n b G a a - b N (However, 0 ⁇ a ⁇ 0.01 0 ⁇ b ⁇ 0.1.)
- p-type carrier block layer A 1 p I nqG a P- qN ( ⁇ , 0 ⁇ p ⁇ 0.5.5 0 ⁇ q ⁇ 0.1)
- Superlattice cladding layer (barrier layer): A 1 ⁇ I nrGai- r N (however, 0 ⁇ 0.2 0 ⁇ r ⁇ 0.1)
- Superlattice cladding layer (well layer): AI r G ai -eiN (However, 0 ⁇ j6 ⁇ 0. 05 0 ⁇ 77 ⁇ 0. 1)
- the configuration shown in FIG. 1 differs from the conventional device shown in FIGS. 9 and 10 in that the n-type superlattice cladding layer 124 p-type superlattice cladding layer 134 p-type block layer 132 n-type second barrier layer 130, and The point is that these band gap energies are set so as to satisfy a predetermined relationship by controlling the composition ratio of the n-type first barrier layer 126.
- the bandgap energy of the p-type block layer 132 is Egb
- the bandgap energy of the n-type second barrier layer 130 in the active layer 129 is Eg2
- the bandgap energy of the n-type first barrier layer 126 is Eg1.
- n-type cladding layer 124 When the bandgap energy of the P-type cladding layer 134 is E gc, E g b> E g 2> E g 1 ⁇ E gc is satisfied.
- FIG. 2 shows the magnitude relation of the band gap energy of each layer.
- the n-type cladding layer 124 and the p-type cladding layer 134 have a superlattice structure, and if their effective band gap energy is E gc, the bandgap Egb of the p-type blocking layer 132 confines electrons as carriers. c, greater than Eg 2. That is, Egb> Eg2.
- FIG. 3 shows a change in emission intensity when the bandgap energy Eg2 of the n-type second barrier layer 130 is set to 1 and the bandgap energy Eg1 of the n-type first barrier layer 126 is changed.
- Luminous intensity is measured by placing the fabricated LED device in an integrating sphere, injecting current, and measuring the total light output from the device. The emission wavelength is around 370 nm.
- the horizontal axis is E g 1 ZE g 2 and the vertical axis is the electoluminescence intensity (relative intensity).
- Eg 1 of the first barrier layer 12 6 by changing the changing the supply amount A 1 X G a have X N of A 1 composition ratio x of trimethylaluminum (TMA) Has been realized.
- the bandgap energy increases as the supply amount of TMA is increased and the A1 composition ratio X is increased.
- Band gap energies other than E g 1, for example, E gc and E gb are set to constant values.
- FIG. 4 shows the case where the effective band gap E gc of the n-type cladding layer 126 and the p-type cladding layer 134 is 1, and the band gap E g 1 of the n-type first barrier layer 126 is changed. The change in emission intensity is shown.
- the bandgap energy of the n-type first barrier layer 126 is changed by changing the A1 composition ratio x in A1xGanN constituting the first barrier layer, as in the case of FIG.
- FIG. 5 shows the change in emission intensity when the bandgap energy E g2 of the n-type second barrier layer 130 is set to 1 and the bandgap energy E gb of the p-type block layer 132 is changed. Have been.
- the emission intensity monotonously increases as the band gap energy E gb of the P-type block layer 132 increases. This is because the electron confinement effect increases as E gb increases.
- the n-type first barrier layer 126 is formed to be thicker than other barrier layers.
- the n-type first barrier layer 126 is made of undoped A 1 GaN or undoped A 1 In n GaN, if this layer functions as a resistive layer, if it is formed too thick, the luminescence intensity will be reduced. Will be.
- FIG. 6 shows a change in emission intensity when the thickness of the n-type second barrier layer 130 is fixed to 13 nm and the thickness of the n-type first barrier layer 126 is changed. ing.
- the luminescence intensity increases as the thickness of the n-type first barrier layer 126 increases, and a luminescence intensity of 0.18 is obtained when the thickness is around 25 nm.
- the thickness of the n-type first barrier layer 1 26 is d 1 and the thickness of the ri-type
- the thickness of the barrier layer 130 it is necessary that dl> d 2.
- the upper limit of d 1 needs to be suppressed to about 50 nm or less.
- the n-type well layer 1 28 and the n-type second barrier layer 130 are stacked on the n-type first barrier layer 126, and the n-type first barrier layer 1 26 and An n-type well layer 128 is also formed between the n-type second barrier layer 130 and the n-type second barrier layer 130.
- the presence of the well layer is also preferable from the viewpoint of improving the light emission intensity.
- FIG. 7 shows a change in light emission intensity when a well layer is formed between the n-type first barrier layer 126 and the n-type second barrier layer 130 and when no well layer is formed. The light emission intensity when the well layer is formed is increased to 0.2 in contrast to the light emission intensity when the well layer is not formed.
- the active layer 12 9 is constituted by the MQW of the n-type first barrier layer 126, the n-type well layer 128, and the n-type second barrier layer 130. It is preferable to form the n-type well layer 128 as thin as possible to make the quantum effect remarkable.
- FIG. 8 shows a change in light emission intensity when the thickness of the n-type second barrier layer 130 is kept constant and the thickness of the n-type well layer 128 is changed. The emission intensity increases as the n-type well layer 128 becomes thinner. Therefore, the well layer 128 should preferably have a thickness of 5 nm or less, more preferably 4 nm or less.
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Abstract
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CNB2004800004844A CN100359707C (zh) | 2004-04-16 | 2004-04-16 | 氮化镓系发光器件 |
PCT/JP2004/005475 WO2005101532A1 (ja) | 2004-04-16 | 2004-04-16 | 窒化ガリウム系発光装置 |
EP04728005A EP1619729B1 (en) | 2004-04-16 | 2004-04-16 | Gallium nitride based light-emitting device |
US10/518,148 US7067838B1 (en) | 2004-04-16 | 2004-04-16 | Gallium-nitride-based light-emitting apparatus |
JP2006516826A JP3863177B2 (ja) | 2004-04-16 | 2004-04-16 | 窒化ガリウム系発光装置 |
DE602004025461T DE602004025461D1 (de) | 2004-04-16 | 2004-04-16 | Lichtemittierendes bauelement auf galliumnitridbasis |
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PCT/JP2004/005475 WO2005101532A1 (ja) | 2004-04-16 | 2004-04-16 | 窒化ガリウム系発光装置 |
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US (1) | US7067838B1 (ja) |
EP (1) | EP1619729B1 (ja) |
JP (1) | JP3863177B2 (ja) |
CN (1) | CN100359707C (ja) |
DE (1) | DE602004025461D1 (ja) |
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US11824137B2 (en) | 2017-03-08 | 2023-11-21 | Nikkiso Co., Ltd. | Semiconductor light-emitting element and method for manufacturing semiconductor light-emitting element |
US10593838B2 (en) | 2017-08-14 | 2020-03-17 | Lg Innotek Co., Ltd. | Semiconductor device |
JP2019033284A (ja) * | 2018-11-01 | 2019-02-28 | 日機装株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
WO2023243518A1 (ja) * | 2022-06-13 | 2023-12-21 | ヌヴォトンテクノロジージャパン株式会社 | 窒化物系半導体発光素子 |
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CN100359707C (zh) | 2008-01-02 |
US7067838B1 (en) | 2006-06-27 |
JPWO2005101532A1 (ja) | 2007-08-16 |
EP1619729A4 (en) | 2006-09-27 |
DE602004025461D1 (de) | 2010-03-25 |
JP3863177B2 (ja) | 2006-12-27 |
CN1698215A (zh) | 2005-11-16 |
US20060131558A1 (en) | 2006-06-22 |
EP1619729B1 (en) | 2010-02-10 |
EP1619729A1 (en) | 2006-01-25 |
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