TWI738641B - 封裝體之製造方法 - Google Patents
封裝體之製造方法 Download PDFInfo
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- TWI738641B TWI738641B TW105108549A TW105108549A TWI738641B TW I738641 B TWI738641 B TW I738641B TW 105108549 A TW105108549 A TW 105108549A TW 105108549 A TW105108549 A TW 105108549A TW I738641 B TWI738641 B TW I738641B
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- manufacturing
- resin composition
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 82
- 239000010408 film Substances 0.000 claims abstract description 117
- 239000011342 resin composition Substances 0.000 claims abstract description 101
- 238000005538 encapsulation Methods 0.000 claims abstract description 93
- 230000001681 protective effect Effects 0.000 claims abstract description 70
- 238000001035 drying Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000013039 cover film Substances 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims description 117
- 238000000034 method Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000012360 testing method Methods 0.000 description 22
- 239000011575 calcium Substances 0.000 description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 description 20
- 239000005020 polyethylene terephthalate Substances 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 19
- 239000011521 glass Substances 0.000 description 19
- -1 polyethylene terephthalate Polymers 0.000 description 19
- 239000002985 plastic film Substances 0.000 description 18
- 229920006255 plastic film Polymers 0.000 description 18
- 229920001187 thermosetting polymer Polymers 0.000 description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 14
- 239000011261 inert gas Substances 0.000 description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 238000003475 lamination Methods 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000004711 α-olefin Substances 0.000 description 8
- 230000002411 adverse Effects 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000006082 mold release agent Substances 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000953 kanthal Inorganic materials 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229920002367 Polyisobutene Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
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- 229920000180 alkyd Polymers 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- XCMXCHCLUYBPEF-UHFFFAOYSA-N 2-(2-hydroxyphenyl)propanedinitrile Chemical compound OC1=C(C=CC=C1)C(C#N)C#N XCMXCHCLUYBPEF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- AKSROGHADDORBX-UHFFFAOYSA-M 2-acetamidoacetate;tetrabutylphosphanium Chemical compound CC(=O)NCC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC AKSROGHADDORBX-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229920002402 Oppanol® B 100 Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 241000705989 Tetrax Species 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000005443 coulometric titration Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical group CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Wrappers (AREA)
- Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-058486 | 2015-03-20 | ||
| JP2015058486 | 2015-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201705580A TW201705580A (zh) | 2017-02-01 |
| TWI738641B true TWI738641B (zh) | 2021-09-11 |
Family
ID=56979209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105108549A TWI738641B (zh) | 2015-03-20 | 2016-03-18 | 封裝體之製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6724900B2 (ja) |
| KR (1) | KR102578975B1 (ja) |
| CN (1) | CN107409447A (ja) |
| TW (1) | TWI738641B (ja) |
| WO (1) | WO2016152756A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016158770A1 (ja) * | 2015-03-27 | 2016-10-06 | 味の素株式会社 | 封止用樹脂組成物 |
| KR20200006545A (ko) | 2017-05-17 | 2020-01-20 | 스미또모 가가꾸 가부시키가이샤 | 유기 전자 디바이스의 제조 방법 |
| JP6461271B1 (ja) * | 2017-09-28 | 2019-01-30 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
| JP6501856B1 (ja) * | 2017-12-07 | 2019-04-17 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
| JP7276312B2 (ja) | 2018-02-27 | 2023-05-18 | 味の素株式会社 | 封止用樹脂組成物 |
| JP2019177645A (ja) * | 2018-03-30 | 2019-10-17 | 東洋製罐グループホールディングス株式会社 | 電子デバイス用バリアフィルム |
| JP2020158739A (ja) * | 2019-03-28 | 2020-10-01 | 味の素株式会社 | 樹脂組成物および樹脂シート |
| JP7318462B2 (ja) * | 2019-09-30 | 2023-08-01 | 味の素株式会社 | 封止用樹脂組成物 |
| KR20220078639A (ko) * | 2019-09-30 | 2022-06-10 | 아지노모토 가부시키가이샤 | 수지 조성물 및 수지 시트 |
| JP2021075009A (ja) * | 2019-11-12 | 2021-05-20 | 味の素株式会社 | 封止用シートの製造方法 |
| JP2021154627A (ja) * | 2020-03-27 | 2021-10-07 | 味の素株式会社 | 封止用シート |
| JP7528605B2 (ja) * | 2020-07-22 | 2024-08-06 | 味の素株式会社 | 封止用シートおよびポリマー組成物層 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060055314A1 (en) * | 2004-09-10 | 2006-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same and apparatus for manufacturing the same |
| JP2006269247A (ja) * | 2005-03-24 | 2006-10-05 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
| TW201311755A (zh) * | 2011-08-22 | 2013-03-16 | Mitsui Chemicals Inc | 片狀環氧樹脂組成物及含有其的密封用片 |
| TW201313866A (zh) * | 2011-08-26 | 2013-04-01 | Mitsubishi Chem Corp | 接著性密封薄膜、接著性密封薄膜之製造方法及接著性密封薄膜用塗佈液 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08300549A (ja) * | 1995-04-28 | 1996-11-19 | Ajinomoto Co Inc | ガスバリアフィルム及びその製造方法 |
| JP4555942B2 (ja) * | 2004-08-02 | 2010-10-06 | 日立化成工業株式会社 | 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線基板 |
| JP4954515B2 (ja) * | 2004-09-10 | 2012-06-20 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| MY167509A (en) * | 2007-10-25 | 2018-09-04 | Kolon Inc | Film tyoe transfer material |
| JP2010084939A (ja) | 2008-09-08 | 2010-04-15 | Fuji Koki Corp | 四方切換弁 |
| JP2010084938A (ja) | 2008-09-30 | 2010-04-15 | Kazuo Isobe | 自転車用に適したクラッチ機構 |
| JP4983864B2 (ja) | 2009-07-08 | 2012-07-25 | マツダ株式会社 | 車両用フレーム構造 |
| KR101677077B1 (ko) * | 2009-11-18 | 2016-11-17 | 아지노모토 가부시키가이샤 | 수지 조성물 |
| SG193637A1 (en) * | 2011-03-30 | 2013-11-29 | Kuraray Co | Method for producing ethylene-vinyl alcohol copolymer resin, ethylene-vinyl alcohol copolymer resin, and laminate |
| CN202668965U (zh) * | 2012-06-21 | 2013-01-16 | 怀集县集美新材料有限公司 | Pvb薄膜生产线的冷却与干燥系统 |
| JPWO2015005165A1 (ja) * | 2013-07-09 | 2017-03-02 | コニカミノルタ株式会社 | ガスバリア性フィルム、有機エレクトロルミネッセンス素子の製造方法、および、有機エレクトロルミネッセンス素子 |
| JP2015125875A (ja) * | 2013-12-26 | 2015-07-06 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
-
2016
- 2016-03-18 CN CN201680016779.3A patent/CN107409447A/zh active Pending
- 2016-03-18 TW TW105108549A patent/TWI738641B/zh active
- 2016-03-18 KR KR1020177030063A patent/KR102578975B1/ko active IP Right Grant
- 2016-03-18 JP JP2017508305A patent/JP6724900B2/ja active Active
- 2016-03-18 WO PCT/JP2016/058641 patent/WO2016152756A1/ja active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060055314A1 (en) * | 2004-09-10 | 2006-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same and apparatus for manufacturing the same |
| JP2006269247A (ja) * | 2005-03-24 | 2006-10-05 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
| TW201311755A (zh) * | 2011-08-22 | 2013-03-16 | Mitsui Chemicals Inc | 片狀環氧樹脂組成物及含有其的密封用片 |
| TW201313866A (zh) * | 2011-08-26 | 2013-04-01 | Mitsubishi Chem Corp | 接著性密封薄膜、接著性密封薄膜之製造方法及接著性密封薄膜用塗佈液 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016152756A1 (ja) | 2016-09-29 |
| KR20170128578A (ko) | 2017-11-22 |
| KR102578975B1 (ko) | 2023-09-18 |
| JPWO2016152756A1 (ja) | 2017-12-28 |
| TW201705580A (zh) | 2017-02-01 |
| JP6724900B2 (ja) | 2020-07-15 |
| CN107409447A (zh) | 2017-11-28 |
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