MY167509A - Film tyoe transfer material - Google Patents

Film tyoe transfer material

Info

Publication number
MY167509A
MY167509A MYPI2010001855A MYPI2010001855A MY167509A MY 167509 A MY167509 A MY 167509A MY PI2010001855 A MYPI2010001855 A MY PI2010001855A MY PI2010001855 A MYPI2010001855 A MY PI2010001855A MY 167509 A MY167509 A MY 167509A
Authority
MY
Malaysia
Prior art keywords
film
transfer material
exposure process
tyoe
type photosensitive
Prior art date
Application number
MYPI2010001855A
Inventor
Hee Wan Moon
Seung Je Jho
Byeong Il Lee
Original Assignee
Kolon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc filed Critical Kolon Inc
Publication of MY167509A publication Critical patent/MY167509A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0005—Enlarging or reduction of graphic information on a support by stretching or contracting the support, optionally in combination with the recording
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

DISCLOSED IS A FILM TYPE PHOTOSENSITIVE TRANSFER MATERIAL INCLUDING A BASE FILM (40), A RESIN PROTECTIVE LAYER (30), A PHOTOSENSITIVE RESIN LAYER (20) AND A COVER FILM (10), IN WHICH THE RESIN PROTECTIVE LAYER (30) HAS ADHESION OF 0.005 KGF/CM2 OR LESS. WHEN THE FILM TYPE PHOTOSENSITIVE TRANSFER MATERIAL IS APPLIED ON A PRINTED CIRCUIT BOARD, IT IS POSSIBLE TO PERFORM AN EXPOSURE PROCESS IN A STATE IN WHICH A BASE FILM (40) IS REMOVED, AND THUS AN INTERVAL BETWEEN A MASK (60) AND A PHOTOSENSITIVE RESIN LAYER (20) CAN BE NARROWED IN THE EXPOSURE PROCESS, THEREBY IMPROVING THE RESOLUTION OF A PATTERN. THE FILM TYPE PHOTOSENSITIVE TRANSFER MATERIAL ALLOWS THE BASE FILM (40) TO BE REMOVED BEFORE THE EXPOSURE PROCESS, AND CAN BE PROCESSED IN SHEETS OR CAN BE APPLIED TO A ROLL-TO-ROLL PROCESS.
MYPI2010001855A 2007-10-25 2008-10-24 Film tyoe transfer material MY167509A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070107798 2007-10-25
KR1020080104904A KR101115162B1 (en) 2007-10-25 2008-10-24 Film type transfer material

Publications (1)

Publication Number Publication Date
MY167509A true MY167509A (en) 2018-09-04

Family

ID=40765057

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010001855A MY167509A (en) 2007-10-25 2008-10-24 Film tyoe transfer material

Country Status (6)

Country Link
JP (1) JP5483734B2 (en)
KR (1) KR101115162B1 (en)
CN (1) CN101836162B (en)
HK (1) HK1146751A1 (en)
MY (1) MY167509A (en)
TW (1) TWI395058B (en)

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KR101258733B1 (en) * 2009-09-30 2013-04-30 코오롱인더스트리 주식회사 Dry film photoresist
CN103119663B (en) * 2010-09-28 2015-06-24 三菱制纸株式会社 Conductive material precursor and conductive material
KR102194713B1 (en) 2014-01-27 2020-12-23 삼성전기주식회사 Dry film photoresist
DE102014001688A1 (en) * 2014-02-07 2015-08-13 Giesecke & Devrient Gmbh Production of a security element with color change properties
KR102287289B1 (en) * 2014-07-08 2021-08-06 주식회사 동진쎄미켐 TRANSPARENT ElECTROD COMPLEX
KR102578975B1 (en) * 2015-03-20 2023-09-18 아지노모토 가부시키가이샤 Manufacturing method of sealant
TWI763631B (en) 2015-07-08 2022-05-11 日商昭和電工材料股份有限公司 Photosensitive element, method of forming resist pattern, and method of manufacturing printed wiring board
EP3424743B1 (en) * 2016-03-08 2020-08-19 Dai Nippon Printing Co., Ltd. Thermal transfer sheet and combination of transfer foil and thermal transfer sheet
WO2019008898A1 (en) * 2017-07-06 2019-01-10 リンテック株式会社 Resin film forming film and resin film forming composite sheet
CN107172804B (en) * 2017-07-11 2023-12-26 昆山倬跃蓝天电子科技有限公司 Photosensitive covering film and product
WO2019215848A1 (en) 2018-05-09 2019-11-14 日立化成株式会社 Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method
CN110534647B (en) * 2019-08-28 2023-12-26 云谷（固安）科技有限公司 Flexible substrate, display substrate and display panel
WO2024075158A1 (en) * 2022-10-03 2024-04-11 株式会社レゾナック Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS59137948A (en) * 1983-01-27 1984-08-08 Mitsubishi Chem Ind Ltd Photoresist material like dry film
IL84298A0 (en) * 1986-11-14 1988-03-31 Thiokol Morton Inc Improved photosensitive laminate
JP2992128B2 (en) * 1991-06-21 1999-12-20 日本合成化学工業株式会社 Photoresist film
JP3051252B2 (en) * 1992-02-28 2000-06-12 日本合成化学工業株式会社 Photoresist film laminating method
JPH06161098A (en) * 1992-11-20 1994-06-07 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition for sand blasting and photosensitive film formed by using the same
JP3241144B2 (en) * 1993-02-19 2001-12-25 日立化成工業株式会社 Photosensitive resin composition laminate, method for producing resist pattern, method for producing substrate, printed wiring board, printed wiring board and equipment
JP4129543B2 (en) * 2002-08-08 2008-08-06 三菱樹脂株式会社 Protective film for dry film resist
JP2005227398A (en) * 2004-02-10 2005-08-25 Fuji Photo Film Co Ltd Photosensitive transfer sheet
TWI318333B (en) * 2004-03-26 2009-12-11 Fujifilm Corp Photosensitive composition, photosensitive transfer material, light shielding layer for display device, color filter, liquid crystal display element, substrate having light shielding layer and process for producing the same
US20060037100A1 (en) * 2004-08-12 2006-02-16 Kim Young S Fungal resistant transgenic pepper plants and their production method
DE602005010378D1 (en) * 2004-12-22 2008-11-27 Rohm & Haas Elect Mat Process for producing optical devices with polymer layers
WO2007125992A1 (en) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation Photosensitive resin laminate
JP4979391B2 (en) * 2007-01-17 2012-07-18 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
JP2009083482A (en) * 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd Photosensitive resin laminate

Also Published As

Publication number Publication date
TW200937114A (en) 2009-09-01
JP2011501233A (en) 2011-01-06
TWI395058B (en) 2013-05-01
CN101836162A (en) 2010-09-15
JP5483734B2 (en) 2014-05-07
HK1146751A1 (en) 2011-07-08
KR101115162B1 (en) 2012-02-24
CN101836162B (en) 2012-11-14
KR20090042192A (en) 2009-04-29

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