KR102578975B1 - 밀봉체의 제조 방법 - Google Patents
밀봉체의 제조 방법 Download PDFInfo
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- KR102578975B1 KR102578975B1 KR1020177030063A KR20177030063A KR102578975B1 KR 102578975 B1 KR102578975 B1 KR 102578975B1 KR 1020177030063 A KR1020177030063 A KR 1020177030063A KR 20177030063 A KR20177030063 A KR 20177030063A KR 102578975 B1 KR102578975 B1 KR 102578975B1
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- KR
- South Korea
- Prior art keywords
- sealing sheet
- infrared
- resin composition
- sealing
- weight
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 83
- 239000000565 sealant Substances 0.000 title 1
- 238000007789 sealing Methods 0.000 claims abstract description 232
- 239000011342 resin composition Substances 0.000 claims abstract description 105
- 239000013039 cover film Substances 0.000 claims abstract description 70
- 238000001035 drying Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 46
- 239000011575 calcium Substances 0.000 description 20
- -1 polyethylene terephthalate Polymers 0.000 description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 description 20
- 239000005020 polyethylene terephthalate Substances 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 19
- 239000011521 glass Substances 0.000 description 19
- 239000002985 plastic film Substances 0.000 description 17
- 229920006255 plastic film Polymers 0.000 description 17
- 229920001187 thermosetting polymer Polymers 0.000 description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 14
- 239000011261 inert gas Substances 0.000 description 14
- 238000003475 lamination Methods 0.000 description 14
- 238000001723 curing Methods 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000004711 α-olefin Substances 0.000 description 8
- 230000002411 adverse Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000006082 mold release agent Substances 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229910000953 kanthal Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920001083 polybutene Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- GMVPRGQOIOIIMI-DODZYUBVSA-N 7-[(1R,2R,3R)-3-hydroxy-2-[(3S)-3-hydroxyoct-1-enyl]-5-oxocyclopentyl]heptanoic acid Chemical compound CCCCC[C@H](O)C=C[C@H]1[C@H](O)CC(=O)[C@@H]1CCCCCCC(O)=O GMVPRGQOIOIIMI-DODZYUBVSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- DZCMEPAMVOSKNY-UHFFFAOYSA-N 2,3,4-tris(diaminomethyl)phenol Chemical compound NC(N)C1=CC=C(O)C(C(N)N)=C1C(N)N DZCMEPAMVOSKNY-UHFFFAOYSA-N 0.000 description 1
- XUZIWKKCMYHORT-UHFFFAOYSA-N 2,4,6-tris(diaminomethyl)phenol Chemical compound NC(N)C1=CC(C(N)N)=C(O)C(C(N)N)=C1 XUZIWKKCMYHORT-UHFFFAOYSA-N 0.000 description 1
- AKSROGHADDORBX-UHFFFAOYSA-M 2-acetamidoacetate;tetrabutylphosphanium Chemical compound CC(=O)NCC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC AKSROGHADDORBX-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229920002402 Oppanol® B 100 Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Wrappers (AREA)
- Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2015-058486 | 2015-03-20 | ||
| JP2015058486 | 2015-03-20 | ||
| PCT/JP2016/058641 WO2016152756A1 (ja) | 2015-03-20 | 2016-03-18 | 封止体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170128578A KR20170128578A (ko) | 2017-11-22 |
| KR102578975B1 true KR102578975B1 (ko) | 2023-09-18 |
Family
ID=56979209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177030063A KR102578975B1 (ko) | 2015-03-20 | 2016-03-18 | 밀봉체의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6724900B2 (ja) |
| KR (1) | KR102578975B1 (ja) |
| CN (1) | CN107409447A (ja) |
| TW (1) | TWI738641B (ja) |
| WO (1) | WO2016152756A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI769977B (zh) * | 2015-03-27 | 2022-07-11 | 日商味之素股份有限公司 | 密封用樹脂組成物 |
| US10964920B2 (en) | 2017-05-17 | 2021-03-30 | Sumitomo Chemical Company, Limited | Method for producing organic electronic device |
| JP6461271B1 (ja) | 2017-09-28 | 2019-01-30 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
| JP6501856B1 (ja) * | 2017-12-07 | 2019-04-17 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
| CN111757910B (zh) | 2018-02-27 | 2022-06-24 | 味之素株式会社 | 密封用树脂组合物 |
| JP2019177645A (ja) * | 2018-03-30 | 2019-10-17 | 東洋製罐グループホールディングス株式会社 | 電子デバイス用バリアフィルム |
| JP2020158739A (ja) * | 2019-03-28 | 2020-10-01 | 味の素株式会社 | 樹脂組成物および樹脂シート |
| JP7318462B2 (ja) * | 2019-09-30 | 2023-08-01 | 味の素株式会社 | 封止用樹脂組成物 |
| KR20220078639A (ko) * | 2019-09-30 | 2022-06-10 | 아지노모토 가부시키가이샤 | 수지 조성물 및 수지 시트 |
| JP2021075009A (ja) * | 2019-11-12 | 2021-05-20 | 味の素株式会社 | 封止用シートの製造方法 |
| JP2021154627A (ja) * | 2020-03-27 | 2021-10-07 | 味の素株式会社 | 封止用シート |
| JP7528605B2 (ja) * | 2020-07-22 | 2024-08-06 | 味の素株式会社 | 封止用シートおよびポリマー組成物層 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108077A (ja) | 2004-09-10 | 2006-04-20 | Semiconductor Energy Lab Co Ltd | 表示装置およびその作製方法並びにその製造装置 |
| JP2006269247A (ja) | 2005-03-24 | 2006-10-05 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
| WO2011062167A1 (ja) | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
| WO2013031656A1 (ja) | 2011-08-26 | 2013-03-07 | 三菱化学株式会社 | 接着性封止フィルム、接着性封止フィルムの製造方法および接着性封止フィルム用塗布液 |
| WO2015005165A1 (ja) | 2013-07-09 | 2015-01-15 | コニカミノルタ株式会社 | ガスバリア性フィルム、有機エレクトロルミネッセンス素子の製造方法、および、有機エレクトロルミネッセンス素子 |
| JP2015125875A (ja) | 2013-12-26 | 2015-07-06 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08300549A (ja) * | 1995-04-28 | 1996-11-19 | Ajinomoto Co Inc | ガスバリアフィルム及びその製造方法 |
| JP4555942B2 (ja) * | 2004-08-02 | 2010-10-06 | 日立化成工業株式会社 | 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線基板 |
| US8040469B2 (en) * | 2004-09-10 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same and apparatus for manufacturing the same |
| KR101115162B1 (ko) * | 2007-10-25 | 2012-02-24 | 코오롱인더스트리 주식회사 | 필름형 감광성 전사재료 |
| JP2010084939A (ja) | 2008-09-08 | 2010-04-15 | Fuji Koki Corp | 四方切換弁 |
| JP2010084938A (ja) | 2008-09-30 | 2010-04-15 | Kazuo Isobe | 自転車用に適したクラッチ機構 |
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| Publication number | Publication date |
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| JP6724900B2 (ja) | 2020-07-15 |
| TW201705580A (zh) | 2017-02-01 |
| TWI738641B (zh) | 2021-09-11 |
| KR20170128578A (ko) | 2017-11-22 |
| JPWO2016152756A1 (ja) | 2017-12-28 |
| WO2016152756A1 (ja) | 2016-09-29 |
| CN107409447A (zh) | 2017-11-28 |
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