TWI660239B - 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 - Google Patents

負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 Download PDF

Info

Publication number
TWI660239B
TWI660239B TW104123269A TW104123269A TWI660239B TW I660239 B TWI660239 B TW I660239B TW 104123269 A TW104123269 A TW 104123269A TW 104123269 A TW104123269 A TW 104123269A TW I660239 B TWI660239 B TW I660239B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
partition wall
acid
ink
Prior art date
Application number
TW104123269A
Other languages
English (en)
Chinese (zh)
Other versions
TW201619694A (zh
Inventor
Hideyuki Takahashi
高橋秀幸
Kotaro Yamada
山田光太郎
Original Assignee
AGC Inc.
日商Agc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Inc., 日商Agc股份有限公司 filed Critical AGC Inc.
Publication of TW201619694A publication Critical patent/TW201619694A/zh
Application granted granted Critical
Publication of TWI660239B publication Critical patent/TWI660239B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW104123269A 2014-07-18 2015-07-17 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件 TWI660239B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014148345 2014-07-18
JP2014-148345 2014-07-18

Publications (2)

Publication Number Publication Date
TW201619694A TW201619694A (zh) 2016-06-01
TWI660239B true TWI660239B (zh) 2019-05-21

Family

ID=55078564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104123269A TWI660239B (zh) 2014-07-18 2015-07-17 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件

Country Status (5)

Country Link
JP (1) JP6536578B2 (ko)
KR (1) KR102411740B1 (ko)
CN (1) CN106662815B (ko)
TW (1) TWI660239B (ko)
WO (1) WO2016010077A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102622857B1 (ko) * 2017-02-09 2024-01-10 동우 화인켐 주식회사 유기발광소자 및 양자점발광소자의 화소정의막 형성용 흑색 감광성 수지 조성물
KR20190116307A (ko) * 2017-02-21 2019-10-14 니폰 제온 가부시키가이샤 네거티브형 감광성 수지 조성물
KR102469945B1 (ko) * 2017-07-14 2022-11-23 삼성디스플레이 주식회사 표시 장치 및 그 제조방법
KR102146095B1 (ko) * 2017-09-15 2020-08-19 주식회사 엘지화학 화학증폭형 포토레지스트 조성물, 포토레지스트 패턴, 및 포토레지스트 패턴 제조방법
CN110412829A (zh) * 2018-04-26 2019-11-05 东友精细化工有限公司 负型感光性树脂组合物、光固化图案及图像显示装置
KR102311491B1 (ko) * 2019-02-13 2021-10-08 삼성에스디아이 주식회사 2중층 격벽 조성물, 이를 이용한 2중층 격벽 및 2중층 격벽을 포함하는 디스플레이 소자
CN111752097A (zh) * 2019-03-29 2020-10-09 常州强力电子新材料股份有限公司 自发光感光性树脂组合物、彩色滤光片和图像显示装置
KR20200135682A (ko) 2019-05-24 2020-12-03 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JPWO2021177253A1 (ko) * 2020-03-04 2021-09-10
KR20210121917A (ko) * 2020-03-31 2021-10-08 동우 화인켐 주식회사 광변환 잉크 조성물, 컬러필터 및 화상표시장치
KR20230096006A (ko) 2020-10-28 2023-06-29 샌트랄 글래스 컴퍼니 리미티드 함불소 수지, 발액제, 감광성 수지 조성물, 경화물 및 디스플레이
WO2022210797A1 (ja) * 2021-03-29 2022-10-06 株式会社カネカ ネガ型感光性組成物、光半導体装置、固体撮像装置、及び電子機器
CN114203748A (zh) * 2021-12-10 2022-03-18 Tcl华星光电技术有限公司 显示面板以及其制造方法
KR20240002709A (ko) 2022-06-29 2024-01-05 샌트랄 글래스 컴퍼니 리미티드 감광성 수지 조성물, 수지막, 경화물, 격벽, 유기 전계발광 소자, 파장 변환층, 디스플레이, 경화물의 제조 방법 및 격벽의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002194A (ja) * 2005-06-27 2007-01-11 Nippon Kayaku Co Ltd フッ素含有ポリシロキサン、それを用いる感光性樹脂組成物及びその硬化物
JP2009003442A (ja) * 2007-05-23 2009-01-08 Mitsubishi Chemicals Corp 感光性樹脂組成物、液晶配向制御突起、スペーサー、カラーフィルター及び画像表示装置
WO2012086610A1 (ja) * 2010-12-20 2012-06-28 旭硝子株式会社 感光性樹脂組成物、隔壁、カラーフィルタおよび有機el素子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609071B2 (ja) * 2002-11-06 2011-01-12 旭硝子株式会社 隔壁を製造する方法及び隔壁
JP2004277494A (ja) * 2003-03-13 2004-10-07 Asahi Glass Co Ltd 含フッ素樹脂および感光性樹脂組成物
JP4474991B2 (ja) * 2004-04-27 2010-06-09 旭硝子株式会社 レジスト組成物及びその塗膜
JP4809006B2 (ja) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 着色感光性樹脂組成物及びその硬化物
JP2009251392A (ja) * 2008-04-08 2009-10-29 Fujifilm Corp ネガ型レジスト組成物及びパターン形成方法
CN102105823A (zh) * 2008-07-30 2011-06-22 旭硝子株式会社 形成有间隔壁和像素的基板的制造方法
JP2011048064A (ja) * 2009-08-26 2011-03-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物及び積層体、並びにこれを用いた電磁波シールド及び透明導電性基板
JP2012014931A (ja) 2010-06-30 2012-01-19 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP5562739B2 (ja) * 2010-06-30 2014-07-30 三洋化成工業株式会社 感光性樹脂組成物
JP2012185430A (ja) * 2011-03-08 2012-09-27 Sumitomo Chemical Co Ltd 着色硬化性樹脂組成物
JP2013167687A (ja) * 2012-02-14 2013-08-29 Mitsubishi Chemicals Corp 感光性着色樹脂組成物、及びカラーフィルタ、及び液晶表示装置
KR102107962B1 (ko) * 2012-11-28 2020-05-07 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002194A (ja) * 2005-06-27 2007-01-11 Nippon Kayaku Co Ltd フッ素含有ポリシロキサン、それを用いる感光性樹脂組成物及びその硬化物
JP2009003442A (ja) * 2007-05-23 2009-01-08 Mitsubishi Chemicals Corp 感光性樹脂組成物、液晶配向制御突起、スペーサー、カラーフィルター及び画像表示装置
WO2012086610A1 (ja) * 2010-12-20 2012-06-28 旭硝子株式会社 感光性樹脂組成物、隔壁、カラーフィルタおよび有機el素子

Also Published As

Publication number Publication date
WO2016010077A1 (ja) 2016-01-21
KR20170032318A (ko) 2017-03-22
CN106662815B (zh) 2020-06-16
JP6536578B2 (ja) 2019-07-03
CN106662815A (zh) 2017-05-10
JPWO2016010077A1 (ja) 2017-04-27
KR102411740B1 (ko) 2022-06-21
TW201619694A (zh) 2016-06-01

Similar Documents

Publication Publication Date Title
TWI660239B (zh) 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件
TWI675070B (zh) 隔壁用硬化性組成物、隔壁、隔壁之製造方法、隔壁之修復方法、經修復之隔壁、及光學元件
TWI636331B (zh) Negative photosensitive resin composition, resin cured film, partition wall, and optical element
JP6350287B2 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁及び光学素子
TWI649339B (zh) 硬化性樹脂組成物、顯示元件用硬化膜、顯示元件用硬化膜的形成方法及顯示元件
TWI629566B (zh) 負型感光性樹脂組成物、樹脂硬化膜、隔壁及光學元件
KR102378162B1 (ko) 네거티브형 감광성 수지 조성물, 격벽 및 광학 소자
KR102115817B1 (ko) 경화막 형성용 열경화성 수지 조성물, 네가티브형 감방사선성 수지 조성물, 포지티브형 감방사선성 수지 조성물, 경화막, 그의 형성 방법, 반도체 소자 및 표시 소자
JP2018005231A (ja) ネガ型感光性樹脂組成物、スペーサの製造方法、保護膜の製造方法、および液晶表示素子
JP7010240B2 (ja) ネガ型感光性樹脂組成物
JP5682572B2 (ja) 感光性組成物、隔壁および有機el素子
TW201928523A (zh) 負型感光性樹脂組成物
JP2017040869A (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁ならびに光学素子およびその製造方法
CN104950570B (zh) 硬化膜形成用树脂组合物、硬化膜及其形成方法、以及显示元件
WO2017033835A1 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁ならびに光学素子およびその製造方法
WO2017033834A1 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁ならびに光学素子およびその製造方法
TW202305508A (zh) 化學增幅型正型感光性樹脂組成物、保護膜以及具有保護膜的元件