JP6536578B2 - ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁、光学素子および光学素子の製造方法 - Google Patents

ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁、光学素子および光学素子の製造方法 Download PDF

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JP6536578B2
JP6536578B2 JP2016534467A JP2016534467A JP6536578B2 JP 6536578 B2 JP6536578 B2 JP 6536578B2 JP 2016534467 A JP2016534467 A JP 2016534467A JP 2016534467 A JP2016534467 A JP 2016534467A JP 6536578 B2 JP6536578 B2 JP 6536578B2
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resin composition
photosensitive resin
negative photosensitive
compound
ink repellent
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JPWO2016010077A1 (ja
Inventor
高橋　秀幸
秀幸 高橋
光太郎 山田
光太郎 山田
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AGC Inc
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Asahi Glass Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
JP2016534467A 2014-07-18 2015-07-15 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁、光学素子および光学素子の製造方法 Active JP6536578B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014148345 2014-07-18
JP2014148345 2014-07-18
PCT/JP2015/070289 WO2016010077A1 (ja) 2014-07-18 2015-07-15 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子

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JPWO2016010077A1 JPWO2016010077A1 (ja) 2017-04-27
JP6536578B2 true JP6536578B2 (ja) 2019-07-03

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JP (1) JP6536578B2 (ko)
KR (1) KR102411740B1 (ko)
CN (1) CN106662815B (ko)
TW (1) TWI660239B (ko)
WO (1) WO2016010077A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230096006A (ko) 2020-10-28 2023-06-29 샌트랄 글래스 컴퍼니 리미티드 함불소 수지, 발액제, 감광성 수지 조성물, 경화물 및 디스플레이
KR20240002709A (ko) 2022-06-29 2024-01-05 샌트랄 글래스 컴퍼니 리미티드 감광성 수지 조성물, 수지막, 경화물, 격벽, 유기 전계발광 소자, 파장 변환층, 디스플레이, 경화물의 제조 방법 및 격벽의 제조 방법

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KR102622857B1 (ko) * 2017-02-09 2024-01-10 동우 화인켐 주식회사 유기발광소자 및 양자점발광소자의 화소정의막 형성용 흑색 감광성 수지 조성물
CN110249264A (zh) * 2017-02-21 2019-09-17 日本瑞翁株式会社 负型感光性树脂组合物
KR102469945B1 (ko) 2017-07-14 2022-11-23 삼성디스플레이 주식회사 표시 장치 및 그 제조방법
KR102146095B1 (ko) * 2017-09-15 2020-08-19 주식회사 엘지화학 화학증폭형 포토레지스트 조성물, 포토레지스트 패턴, 및 포토레지스트 패턴 제조방법
CN110412829A (zh) * 2018-04-26 2019-11-05 东友精细化工有限公司 负型感光性树脂组合物、光固化图案及图像显示装置
KR102311491B1 (ko) * 2019-02-13 2021-10-08 삼성에스디아이 주식회사 2중층 격벽 조성물, 이를 이용한 2중층 격벽 및 2중층 격벽을 포함하는 디스플레이 소자
CN111752097A (zh) * 2019-03-29 2020-10-09 常州强力电子新材料股份有限公司 自发光感光性树脂组合物、彩色滤光片和图像显示装置
KR20200135682A (ko) 2019-05-24 2020-12-03 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
KR20220149673A (ko) * 2020-03-04 2022-11-08 에이지씨 가부시키가이샤 포지티브형 감광성 수지 조성물
KR20210121917A (ko) * 2020-03-31 2021-10-08 동우 화인켐 주식회사 광변환 잉크 조성물, 컬러필터 및 화상표시장치
WO2022210797A1 (ja) * 2021-03-29 2022-10-06 株式会社カネカ ネガ型感光性組成物、光半導体装置、固体撮像装置、及び電子機器
CN114203748A (zh) * 2021-12-10 2022-03-18 Tcl华星光电技术有限公司 显示面板以及其制造方法

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EP1560068B1 (en) * 2002-11-06 2008-01-23 Asahi Glass Company Ltd. Barrier rib and its method of preparation
JP2004277494A (ja) 2003-03-13 2004-10-07 Asahi Glass Co Ltd 含フッ素樹脂および感光性樹脂組成物
JP4474991B2 (ja) * 2004-04-27 2010-06-09 旭硝子株式会社 レジスト組成物及びその塗膜
JP4671338B2 (ja) * 2005-06-27 2011-04-13 日本化薬株式会社 フッ素含有ポリシロキサン、それを用いる感光性樹脂組成物及びその硬化物
JP4809006B2 (ja) * 2005-07-05 2011-11-02 太陽ホールディングス株式会社 着色感光性樹脂組成物及びその硬化物
JP2009003442A (ja) * 2007-05-23 2009-01-08 Mitsubishi Chemicals Corp 感光性樹脂組成物、液晶配向制御突起、スペーサー、カラーフィルター及び画像表示装置
JP2009251392A (ja) * 2008-04-08 2009-10-29 Fujifilm Corp ネガ型レジスト組成物及びパターン形成方法
WO2010013654A1 (ja) * 2008-07-30 2010-02-04 旭硝子株式会社 隔壁と画素が形成された基板を製造する方法
JP2011048064A (ja) * 2009-08-26 2011-03-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物及び積層体、並びにこれを用いた電磁波シールド及び透明導電性基板
JP2012014931A (ja) 2010-06-30 2012-01-19 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP5562739B2 (ja) * 2010-06-30 2014-07-30 三洋化成工業株式会社 感光性樹脂組成物
JP5880445B2 (ja) * 2010-12-20 2016-03-09 旭硝子株式会社 感光性樹脂組成物、隔壁、カラーフィルタおよび有機ｅｌ素子
JP2012185430A (ja) * 2011-03-08 2012-09-27 Sumitomo Chemical Co Ltd 着色硬化性樹脂組成物
JP2013167687A (ja) * 2012-02-14 2013-08-29 Mitsubishi Chemicals Corp 感光性着色樹脂組成物、及びカラーフィルタ、及び液晶表示装置
JP6350287B2 (ja) * 2012-11-28 2018-07-04 旭硝子株式会社 ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁及び光学素子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230096006A (ko) 2020-10-28 2023-06-29 샌트랄 글래스 컴퍼니 리미티드 함불소 수지, 발액제, 감광성 수지 조성물, 경화물 및 디스플레이
KR20240002709A (ko) 2022-06-29 2024-01-05 샌트랄 글래스 컴퍼니 리미티드 감광성 수지 조성물, 수지막, 경화물, 격벽, 유기 전계발광 소자, 파장 변환층, 디스플레이, 경화물의 제조 방법 및 격벽의 제조 방법

Also Published As

Publication number Publication date
TWI660239B (zh) 2019-05-21
TW201619694A (zh) 2016-06-01
CN106662815B (zh) 2020-06-16
JPWO2016010077A1 (ja) 2017-04-27
CN106662815A (zh) 2017-05-10
WO2016010077A1 (ja) 2016-01-21
KR102411740B1 (ko) 2022-06-21
KR20170032318A (ko) 2017-03-22

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