TWI658069B - 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板 - Google Patents

聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板 Download PDF

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TWI658069B
TWI658069B TW103141241A TW103141241A TWI658069B TW I658069 B TWI658069 B TW I658069B TW 103141241 A TW103141241 A TW 103141241A TW 103141241 A TW103141241 A TW 103141241A TW I658069 B TWI658069 B TW I658069B
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polyimide
chemical formula
film
repeating unit
polyimide precursor
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TW103141241A
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TW201525026A (zh
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岡卓也
小濱幸德
久野信治
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日商宇部興產股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW103141241A 2013-11-27 2014-11-27 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板 TWI658069B (zh)

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JP2013-245486 2013-11-27
JP2013245486 2013-11-27

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TW201525026A TW201525026A (zh) 2015-07-01
TWI658069B true TWI658069B (zh) 2019-05-01

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JP (2) JP6485358B2 (ja)
KR (2) KR102281153B1 (ja)
CN (2) CN109535423B (ja)
TW (1) TWI658069B (ja)
WO (1) WO2015080158A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715260B (zh) * 2019-10-22 2021-01-01 臺灣塑膠工業股份有限公司 具有雜環芳香基之二胺化合物的合成方法、聚醯胺酸感測膜及聚醯亞胺膜
TWI771786B (zh) * 2019-11-07 2022-07-21 南韓商聚酰亞胺先端材料有限公司 低介電質之聚醯亞胺薄膜及其製造方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6314707B2 (ja) * 2014-07-09 2018-04-25 宇部興産株式会社 ポリイミド前駆体組成物、及びそれを用いた絶縁被覆層の製造方法
TWI682969B (zh) * 2014-10-23 2020-01-21 日商宇部興產股份有限公司 聚醯亞胺膜、聚醯亞胺前驅體及聚醯亞胺
JP6437095B2 (ja) 2015-03-27 2018-12-12 東京応化工業株式会社 感エネルギー性樹脂組成物
KR20180018667A (ko) * 2015-06-12 2018-02-21 우베 고산 가부시키가이샤 폴리이미드 전구체 조성물 및 폴리이미드 조성물
TWI706994B (zh) * 2015-07-16 2020-10-11 日商宇部興產股份有限公司 聚醯胺酸溶液組成物及聚醯亞胺膜
WO2017018290A1 (ja) * 2015-07-24 2017-02-02 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置
WO2017026448A1 (ja) * 2015-08-07 2017-02-16 東京応化工業株式会社 ポリイミド前駆体組成物
WO2017126409A1 (ja) * 2016-01-20 2017-07-27 Ｊｘエネルギー株式会社 ポリイミドフィルムの製造方法、ポリイミドフィルム、ポリアミド酸溶液及び感光性組成物
KR102249571B1 (ko) 2016-07-22 2021-05-07 미쓰이 가가쿠 가부시키가이샤 의료용 필름 및 그의 제조 방법, 의료용 코팅 조성물, 의료 용구 및 그의 제조 방법
JP7039166B2 (ja) * 2016-09-30 2022-03-22 東京応化工業株式会社 樹脂組成物、硬化物の製造方法、及び硬化物
KR20190077015A (ko) * 2016-10-27 2019-07-02 우베 고산 가부시키가이샤 폴리이미드 및 그것을 사용한 플렉시블 디바이스
JP6944784B2 (ja) * 2017-02-03 2021-10-06 東京応化工業株式会社 積層体、フレキシブルデバイスおよび積層体の製造方法
CN111465634B (zh) * 2017-12-15 2023-03-10 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜
CN109679095A (zh) * 2018-12-18 2019-04-26 苏州予信天材新材料应用技术有限公司 一种耐高温型聚酰胺-聚醚酰亚胺增韧聚合物及其制备方法
WO2021054475A1 (ja) * 2019-09-20 2021-03-25 宇部興産株式会社 ポリイミド前駆体組成物およびフレキシブル電子デバイスの製造方法
TWI775294B (zh) * 2020-01-31 2022-08-21 日商宇部興產股份有限公司 聚醯亞胺前驅體組合物及聚醯亞胺膜/基材積層體
JP6798633B1 (ja) * 2020-01-31 2020-12-09 宇部興産株式会社 ポリイミド前駆体組成物およびポリイミドフィルム／基材積層体
JP7226460B2 (ja) * 2020-01-31 2023-02-21 Ｕｂｅ株式会社 ポリイミド前駆体組成物およびポリイミドフィルム／基材積層体
KR102562545B1 (ko) 2020-01-31 2023-08-03 유비이 가부시키가이샤 폴리이미드 전구체 조성물 및 폴리이미드 필름/기재 적층체
JPWO2021261177A1 (ja) * 2020-06-23 2021-12-30
JPWO2022114136A1 (ja) * 2020-11-27 2022-06-02
WO2022196664A1 (ja) 2021-03-17 2022-09-22 三菱瓦斯化学株式会社 ポリイミド前駆体組成物
WO2023048121A1 (ja) * 2021-09-21 2023-03-30 Ｕｂｅ株式会社 ポリイミド前駆体組成物およびポリイミドフィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172127B1 (en) * 1997-09-12 2001-01-09 Korea Research Institute Of Chemical Technology Preparation of polyimide foam
TW201315756A (zh) * 2011-09-09 2013-04-16 Ube Industries 聚醯亞胺前驅體水溶液組成物及聚醯亞胺前驅體水溶液組成物之製造方法
WO2013105610A1 (ja) * 2012-01-13 2013-07-18 宇部興産株式会社 ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59223726A (ja) * 1983-06-02 1984-12-15 Mitsubishi Chem Ind Ltd ポリアミド酸の化学閉環法
JPS6015426A (ja) * 1983-07-08 1985-01-26 Mitsubishi Chem Ind Ltd ポリアミド酸の化学閉環法
JPS61267030A (ja) 1985-05-22 1986-11-26 Toray Ind Inc 液晶表示素子
JPH09302225A (ja) * 1996-03-14 1997-11-25 Toshiba Corp ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子
JP2004115813A (ja) * 1996-03-14 2004-04-15 Toshiba Corp ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子
JP2002069179A (ja) 2000-08-29 2002-03-08 Ube Ind Ltd 可溶性、透明なポリイミドおよびその製造法
JP4281241B2 (ja) * 2000-10-31 2009-06-17 宇部興産株式会社 ポリイミド粉末の製造法、ポリイミド粉末、ポリイミド粉末成形体およびその製造法
JP4461606B2 (ja) * 2000-10-31 2010-05-12 宇部興産株式会社 ポリイミド粉末の製法、ポリイミド粉末、ポリイミド粉末成形体およびその製法
JP2002146021A (ja) 2000-11-10 2002-05-22 Ube Ind Ltd 可溶性、透明なポリイミドおよびその製造法
US20020151234A1 (en) * 2001-02-05 2002-10-17 Ube Industries, Ltd. Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate
JP2003168800A (ja) 2001-11-30 2003-06-13 Mitsubishi Gas Chem Co Inc 薄膜トランジスタ基板
JP3824533B2 (ja) 2001-12-28 2006-09-20 三井化学株式会社 無色透明ポリイミド
JP2004083814A (ja) 2002-08-29 2004-03-18 Mitsui Chemicals Inc 新規なポリアミド酸およびポリイミド
KR101252875B1 (ko) * 2005-01-21 2013-04-09 미츠비시 가스 가가쿠 가부시키가이샤 폴리이미드 수지, 폴리이미드 필름 및 폴리이미드 적층체
JP5417595B2 (ja) 2006-10-10 2014-02-19 新日鉄住金化学株式会社 ポリイミド樹脂層の形成方法
KR101423361B1 (ko) 2007-05-24 2014-07-24 미츠비시 가스 가가쿠 가부시키가이샤 무색 투명 수지 필름의 제조 방법 및 제조 장치
JP5270865B2 (ja) 2007-06-13 2013-08-21 三井化学株式会社 接着剤並びにその用途
CN102906097B (zh) 2010-02-09 2015-03-04 吉坤日矿日石能源株式会社 降冰片烷-2-螺-α-环烷酮-α’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸二酐类、降冰片烷-2-螺-α-环烷酮-α’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸及其酯类、降冰片烷-2-螺-α-环烷酮-α’-螺-2”-降冰片烷-5,5”,6,6”-四羧酸二酐类的制造
CN102405259B (zh) * 2010-05-31 2013-03-13 株式会社有泽制作所 聚酰亚胺树脂用组合物及由其形成的聚酰亚胺树脂
EP2594609B1 (en) * 2010-07-14 2017-01-11 Ube Industries, Ltd. Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition
WO2013018904A1 (ja) * 2011-08-04 2013-02-07 日産化学工業株式会社 光配向処理法用の液晶配向剤、及びそれを用いた液晶配向膜
JP6156363B2 (ja) * 2012-03-28 2017-07-05 宇部興産株式会社 微細カーボン分散組成物およびこれを用いたポリイミド−微細カーボン複合体
CN103242657B (zh) * 2013-05-23 2015-11-25 江苏亚宝绝缘材料股份有限公司 一种聚酰亚胺薄膜制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172127B1 (en) * 1997-09-12 2001-01-09 Korea Research Institute Of Chemical Technology Preparation of polyimide foam
TW201315756A (zh) * 2011-09-09 2013-04-16 Ube Industries 聚醯亞胺前驅體水溶液組成物及聚醯亞胺前驅體水溶液組成物之製造方法
WO2013105610A1 (ja) * 2012-01-13 2013-07-18 宇部興産株式会社 ポリイミド前駆体水溶液組成物、及びポリイミド前駆体水溶液組成物の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715260B (zh) * 2019-10-22 2021-01-01 臺灣塑膠工業股份有限公司 具有雜環芳香基之二胺化合物的合成方法、聚醯胺酸感測膜及聚醯亞胺膜
TWI771786B (zh) * 2019-11-07 2022-07-21 南韓商聚酰亞胺先端材料有限公司 低介電質之聚醯亞胺薄膜及其製造方法

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CN109535423A (zh) 2019-03-29
TW201525026A (zh) 2015-07-01
KR20160091936A (ko) 2016-08-03
JP2019108552A (ja) 2019-07-04
KR20210063447A (ko) 2021-06-01
KR102281153B1 (ko) 2021-07-22
CN109535423B (zh) 2021-06-01
JPWO2015080158A1 (ja) 2017-03-16
KR102257869B1 (ko) 2021-05-27
CN105764991A (zh) 2016-07-13
WO2015080158A1 (ja) 2015-06-04
CN105764991B (zh) 2018-10-26
JP6485358B2 (ja) 2019-03-20
JP6721070B2 (ja) 2020-07-08

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