TWI586833B - 無電解白金電鍍液 - Google Patents

無電解白金電鍍液 Download PDF

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Publication number
TWI586833B
TWI586833B TW105106086A TW105106086A TWI586833B TW I586833 B TWI586833 B TW I586833B TW 105106086 A TW105106086 A TW 105106086A TW 105106086 A TW105106086 A TW 105106086A TW I586833 B TWI586833 B TW I586833B
Authority
TW
Taiwan
Prior art keywords
platinum
electroless
plating solution
platinum plating
acid
Prior art date
Application number
TW105106086A
Other languages
English (en)
Chinese (zh)
Other versions
TW201713798A (zh
Inventor
Tomohito Kato
Hideto Watanabe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58518047&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI586833(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of TW201713798A publication Critical patent/TW201713798A/zh
Application granted granted Critical
Publication of TWI586833B publication Critical patent/TWI586833B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW105106086A 2015-10-15 2016-03-01 無電解白金電鍍液 TWI586833B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015203809A JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液

Publications (2)

Publication Number Publication Date
TW201713798A TW201713798A (zh) 2017-04-16
TWI586833B true TWI586833B (zh) 2017-06-11

Family

ID=58518047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106086A TWI586833B (zh) 2015-10-15 2016-03-01 無電解白金電鍍液

Country Status (5)

Country Link
US (1) US20180305819A1 (ja)
EP (1) EP3363928A4 (ja)
JP (1) JP6352879B2 (ja)
TW (1) TWI586833B (ja)
WO (1) WO2017064874A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3626857A4 (en) 2017-05-18 2021-07-14 Japan Pure Chemical Co., Ltd. SOLUTION FOR PLATING AUTOCATALYTIC PLATES AND PLATINUM FILM OBTAINED WITH THE SAID SOLUTION
DE102018126804B4 (de) * 2018-10-26 2020-09-24 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
JP6572376B1 (ja) 2018-11-30 2019-09-11 上村工業株式会社 無電解めっき浴
KR102293808B1 (ko) * 2019-12-02 2021-08-24 (재)한국건설생활환경시험연구원 무전해 백금 도금액 조성물 및 이를 이용한 도금방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200745377A (en) * 2006-03-28 2007-12-16 Nippon Chemical Ind Conductive powder plated by electroless plating and process for producing the same
TW201346326A (zh) * 2012-02-28 2013-11-16 Asahi Glass Co Ltd 電潤濕裝置、顯示裝置、透鏡（二）

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412435B2 (ja) * 1971-11-22 1979-05-23
JPS54117329A (en) * 1978-03-06 1979-09-12 Ngk Spark Plug Co Electroless plating method
JPH01319683A (ja) * 1988-06-20 1989-12-25 Electroplating Eng Of Japan Co 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法
US5041196A (en) * 1989-12-26 1991-08-20 Olin Corporation Electrochemical method for producing chlorine dioxide solutions
JP3101061B2 (ja) * 1992-02-14 2000-10-23 日本エレクトロプレイテイング・エンジニヤース株式会社 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
US8317910B2 (en) * 2010-03-22 2012-11-27 Unity Semiconductor Corporation Immersion platinum plating solution
DE102014006739B3 (de) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200745377A (en) * 2006-03-28 2007-12-16 Nippon Chemical Ind Conductive powder plated by electroless plating and process for producing the same
TW201346326A (zh) * 2012-02-28 2013-11-16 Asahi Glass Co Ltd 電潤濕裝置、顯示裝置、透鏡（二）

Also Published As

Publication number Publication date
EP3363928A1 (en) 2018-08-22
US20180305819A1 (en) 2018-10-25
TW201713798A (zh) 2017-04-16
WO2017064874A1 (ja) 2017-04-20
JP6352879B2 (ja) 2018-07-04
EP3363928A4 (en) 2019-06-19
JP2017075379A (ja) 2017-04-20

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