EP3363928A4 - AUTOCATALYTIC PLATE PLATING SOLUTION - Google Patents

AUTOCATALYTIC PLATE PLATING SOLUTION Download PDF

Info

Publication number
EP3363928A4
EP3363928A4 EP16855128.1A EP16855128A EP3363928A4 EP 3363928 A4 EP3363928 A4 EP 3363928A4 EP 16855128 A EP16855128 A EP 16855128A EP 3363928 A4 EP3363928 A4 EP 3363928A4
Authority
EP
European Patent Office
Prior art keywords
plating solution
platinum plating
electroless platinum
electroless
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16855128.1A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3363928A1 (en
Inventor
Tomohito KATO
Hideto Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Chemicals Co Ltd
Original Assignee
Kojima Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58518047&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP3363928(A4) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Publication of EP3363928A1 publication Critical patent/EP3363928A1/en
Publication of EP3363928A4 publication Critical patent/EP3363928A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
EP16855128.1A 2015-10-15 2016-02-29 AUTOCATALYTIC PLATE PLATING SOLUTION Pending EP3363928A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015203809A JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液
PCT/JP2016/056047 WO2017064874A1 (ja) 2015-10-15 2016-02-29 無電解白金めっき液

Publications (2)

Publication Number Publication Date
EP3363928A1 EP3363928A1 (en) 2018-08-22
EP3363928A4 true EP3363928A4 (en) 2019-06-19

Family

ID=58518047

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16855128.1A Pending EP3363928A4 (en) 2015-10-15 2016-02-29 AUTOCATALYTIC PLATE PLATING SOLUTION

Country Status (5)

Country Link
US (1) US20180305819A1 (ja)
EP (1) EP3363928A4 (ja)
JP (1) JP6352879B2 (ja)
TW (1) TWI586833B (ja)
WO (1) WO2017064874A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3626857A4 (en) 2017-05-18 2021-07-14 Japan Pure Chemical Co., Ltd. SOLUTION FOR PLATING AUTOCATALYTIC PLATES AND PLATINUM FILM OBTAINED WITH THE SAID SOLUTION
DE102018126804B4 (de) * 2018-10-26 2020-09-24 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
JP6572376B1 (ja) 2018-11-30 2019-09-11 上村工業株式会社 無電解めっき浴
KR102293808B1 (ko) * 2019-12-02 2021-08-24 (재)한국건설생활환경시험연구원 무전해 백금 도금액 조성물 및 이를 이용한 도금방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3101061B2 (ja) * 1992-02-14 2000-10-23 日本エレクトロプレイテイング・エンジニヤース株式会社 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
US6936564B2 (en) * 2000-10-02 2005-08-30 Basf Aktiengesellschaft Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition
DE102014006739B3 (de) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412435B2 (ja) * 1971-11-22 1979-05-23
JPS54117329A (en) * 1978-03-06 1979-09-12 Ngk Spark Plug Co Electroless plating method
JPH01319683A (ja) * 1988-06-20 1989-12-25 Electroplating Eng Of Japan Co 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法
US5041196A (en) * 1989-12-26 1991-08-20 Olin Corporation Electrochemical method for producing chlorine dioxide solutions
JP4849930B2 (ja) * 2006-03-28 2012-01-11 日本化学工業株式会社 導電性無電解めっき粉体およびその製造方法
US8317910B2 (en) * 2010-03-22 2012-11-27 Unity Semiconductor Corporation Immersion platinum plating solution
CN104126149B (zh) * 2012-02-28 2017-03-22 旭硝子株式会社 电湿润装置、显示装置、透镜

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3101061B2 (ja) * 1992-02-14 2000-10-23 日本エレクトロプレイテイング・エンジニヤース株式会社 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
US6936564B2 (en) * 2000-10-02 2005-08-30 Basf Aktiengesellschaft Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition
DE102014006739B3 (de) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017064874A1 *

Also Published As

Publication number Publication date
TWI586833B (zh) 2017-06-11
EP3363928A1 (en) 2018-08-22
US20180305819A1 (en) 2018-10-25
TW201713798A (zh) 2017-04-16
WO2017064874A1 (ja) 2017-04-20
JP6352879B2 (ja) 2018-07-04
JP2017075379A (ja) 2017-04-20

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