JP2017075379A - 無電解白金めっき液 - Google Patents
無電解白金めっき液 Download PDFInfo
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- JP2017075379A JP2017075379A JP2015203809A JP2015203809A JP2017075379A JP 2017075379 A JP2017075379 A JP 2017075379A JP 2015203809 A JP2015203809 A JP 2015203809A JP 2015203809 A JP2015203809 A JP 2015203809A JP 2017075379 A JP2017075379 A JP 2017075379A
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 360
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 182
- 238000007747 plating Methods 0.000 title claims abstract description 141
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 34
- 150000003058 platinum compounds Chemical class 0.000 claims abstract description 27
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002253 acid Substances 0.000 claims abstract description 17
- -1 thiol compound Chemical class 0.000 claims abstract description 14
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims abstract description 13
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims abstract description 12
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims abstract description 12
- 239000008103 glucose Substances 0.000 claims abstract description 12
- 150000007524 organic acids Chemical class 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 20
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 claims description 19
- 239000008139 complexing agent Substances 0.000 claims description 13
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 10
- 235000019253 formic acid Nutrition 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 7
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 7
- 150000002500 ions Chemical class 0.000 abstract description 7
- 229940045985 antineoplastic platinum compound Drugs 0.000 abstract description 2
- 125000003963 dichloro group Chemical group Cl* 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 115
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 22
- 238000007772 electroless plating Methods 0.000 description 15
- 230000001603 reducing effect Effects 0.000 description 15
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- 239000012279 sodium borohydride Substances 0.000 description 11
- 229910000033 sodium borohydride Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910021529 ammonia Inorganic materials 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 239000004280 Sodium formate Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 6
- 235000019254 sodium formate Nutrition 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 3
- 150000003057 platinum Chemical class 0.000 description 3
- HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- IXSUHTFXKKBBJP-UHFFFAOYSA-L azanide;platinum(2+);dinitrite Chemical compound [NH2-].[NH2-].[Pt+2].[O-]N=O.[O-]N=O IXSUHTFXKKBBJP-UHFFFAOYSA-L 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- NDBYXKQCPYUOMI-UHFFFAOYSA-N platinum(4+) Chemical compound [Pt+4] NDBYXKQCPYUOMI-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- YZMHQCWXYHARLS-UHFFFAOYSA-N naphthalene-1,2-disulfonic acid Chemical compound C1=CC=CC2=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C21 YZMHQCWXYHARLS-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 235000019263 trisodium citrate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
【解決手段】上記課題を解決するため、無電解白金めっき液は、水溶性白金化合物と、ホルマリン、グルコース、ギ酸塩からなる群から選択される1種以上の還元剤とを含むことを特徴とする。前記水溶性白金化合物は、塩化第一白金(II)、塩化白金(II)酸、塩化白金(II)酸塩、塩化第二白金(IV)、塩化白金(IV)酸、塩化白金(IV)酸塩、ヘキサヒドロキソ白金(IV)酸、ヘキサヒドロキソ白金(IV)酸塩、ジクロロテトラアンミン白金(II)からなる群から選択される1種以上の水溶性白金化合物であることが好ましい。無電解白金めっき液は、有機酸を含むことが好ましい。
【選択図】図1
Description
そこで、本件発明者等は、以下の無電解白金めっき液を採用することで上記課題を達成するに至った。
本件発明の無電解白金めっき液は、水溶性白金化合物と、ホルマリン、グルコース、ギ酸、ギ酸塩からなる群から選択される1種以上の還元剤とを含む水溶液である。
本実施形態の無電解白金めっき液によるめっき方法の一例を以下に説明する。ここでは、被めっき物であるめっき基材として、無電解めっき処理によって、絶縁基材の表面に銅皮膜及びニッケル皮膜を順に形成しためっき基材を用いる場合について説明する。めっき基材は、上記のものに限定されず、従来公知のめっき基材を用いることができる。
本実施形態の無電解白金めっき液は、金属等からなる電子部品、電極材料、ABS樹脂、ポリアミド樹脂、ポリカーボネート樹脂等の合成樹脂、アルミナ、ジルコニア等の導電性を持たないセラミックス等のめっきに好適である。特に、ジルコニア等のセラミックス等からなる酸素センサの電極や、種々の宝飾品等の用途に好適に使用することができる。
まず、電解めっき処理によって銅板上に厚さ3μmのニッケル皮膜を形成した。次に、電解めっき処理によってニッケル皮膜の表面に厚さ0.1μmの白金皮膜(白金電解皮膜)を形成することにより、めっき基材を作成した。
本実施例では、水に、水溶性白金化合物としてジクロロテトラアンミン白金(II)0.005mol/L(白金換算で1.0g/L)と、還元剤としてギ酸ナトリウム0.5mol/Lと、錯化剤としてリンゴ酸0.1mol/Lとを溶解して、無電解白金めっき液を調製した。続いて、pH調整剤として水酸化ナトリウム及び硫酸を用いて、無電解白金めっき液のpH(温度25℃)を7.0に調整した。
得られた無電解白金めっき液を温度70℃に加温し、白金電解皮膜が形成されためっき基材を当該無電解白金めっき液に浸漬して無電解めっき処理を行うことにより、白金電解皮膜の表面に白金皮膜(白金無電解皮膜)を形成した。
本比較例では、還元剤としてギ酸ナトリウムに代えてヒドラジン一水和物0.5mol/Lを用いたこと以外は、実施例2と全く同一にして、無電解白金めっき液を調製し、続いて、pH(温度25℃)を11.0に調製した。次に、得られた無電解白金めっき液を用いて、実施例1と全く同一にして、当該無電解白金めっき液の分解の有無を判定した。表1に結果を示す。
本比較例では、還元剤としてギ酸ナトリウムに代えて水酸化ホウ素ナトリウム0.5mol/Lを用いたこと以外は、実施例2と全く同一にして、無電解白金めっき液を調製し、続いて、pH(温度25℃)を11.0に調製した。次に、得られた無電解白金めっき液を用いて、実施例1と全く同一にして、当該無電解白金めっき液の分解の有無を判定した。表1に結果を示す。
本比較例では、白金化合物としてジクロロテトラアンミン白金(II)に代えてジニトロジアンミン白金(II)0.005mol/L(白金換算で1.0g/L)を用いたこと以外は、比較例1と全く同一にして、無電解白金めっき液を調製し、続いて、pH(温度25℃)を11.0に調製した。次に、得られた無電解白金めっき液を用いて、実施例1と全く同一にして、当該無電解白金めっき液の分解の有無を判定した。表1に結果を示す。
本比較例では、白金化合物としてジクロロテトラアンミン白金(II)に代えてジニトロジアンミン白金(II)0.005mol/L(白金換算で1.0g/L)を用いたこと以外は、比較例2と全く同一にして、無電解白金めっき液を調製し、続いて、pH(温度25℃)を11.0に調製した。次に、得られた無電解白金めっき液を用いて、実施例1と全く同一にして、当該無電解白金めっき液の分解の有無を判定した。表1に結果を示す。
Claims (4)
- 水溶性白金化合物と、ホルマリン、グルコース、ギ酸、ギ酸塩からなる群から選択される1種以上の還元剤とを含むことを特徴とする無電解白金めっき液。
- 前記水溶性白金化合物は、塩化第一白金(II)、塩化白金(II)酸、塩化白金(II)酸塩、塩化第二白金(IV)、塩化白金(IV)酸、塩化白金(IV)酸塩、ヘキサヒドロキソ白金(IV)酸、ヘキサヒドロキソ白金(IV)酸塩、ジクロロテトラアンミン白金(II)からなる群から選択される1種以上の水溶性白金化合物である請求項1記載の無電解白金めっき液。
- 錯化剤として有機酸を含む請求項1又は請求項2記載の無電解白金めっき液。
- 前記有機酸は、分子量が90〜500の脂肪族ヒドロキシ酸から選択される1種以上の化合物である請求項1から請求項3のいずれか一項に記載の無電解白金めっき液。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015203809A JP6352879B2 (ja) | 2015-10-15 | 2015-10-15 | 無電解白金めっき液 |
PCT/JP2016/056047 WO2017064874A1 (ja) | 2015-10-15 | 2016-02-29 | 無電解白金めっき液 |
US15/767,817 US20180305819A1 (en) | 2015-10-15 | 2016-02-29 | Electroless platinum plating solution |
EP16855128.1A EP3363928A4 (en) | 2015-10-15 | 2016-02-29 | AUTOCATALYTIC PLATE PLATING SOLUTION |
TW105106086A TWI586833B (zh) | 2015-10-15 | 2016-03-01 | 無電解白金電鍍液 |
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JP2015203809A JP6352879B2 (ja) | 2015-10-15 | 2015-10-15 | 無電解白金めっき液 |
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JP2017075379A true JP2017075379A (ja) | 2017-04-20 |
JP2017075379A5 JP2017075379A5 (ja) | 2018-05-17 |
JP6352879B2 JP6352879B2 (ja) | 2018-07-04 |
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US (1) | US20180305819A1 (ja) |
EP (1) | EP3363928A4 (ja) |
JP (1) | JP6352879B2 (ja) |
TW (1) | TWI586833B (ja) |
WO (1) | WO2017064874A1 (ja) |
Cited By (1)
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KR20210068875A (ko) * | 2019-12-02 | 2021-06-10 | (재)한국건설생활환경시험연구원 | 무전해 백금 도금액 조성물 및 이를 이용한 도금방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3626857A4 (en) | 2017-05-18 | 2021-07-14 | Japan Pure Chemical Co., Ltd. | SOLUTION FOR PLATING AUTOCATALYTIC PLATES AND PLATINUM FILM OBTAINED WITH THE SAID SOLUTION |
DE102018126804B4 (de) * | 2018-10-26 | 2020-09-24 | RF360 Europe GmbH | Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung |
JP6572376B1 (ja) | 2018-11-30 | 2019-09-11 | 上村工業株式会社 | 無電解めっき浴 |
Citations (3)
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JPS4856591A (ja) * | 1971-11-22 | 1973-08-08 | ||
JPS54117329A (en) * | 1978-03-06 | 1979-09-12 | Ngk Spark Plug Co | Electroless plating method |
JPH01319683A (ja) * | 1988-06-20 | 1989-12-25 | Electroplating Eng Of Japan Co | 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法 |
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US5041196A (en) * | 1989-12-26 | 1991-08-20 | Olin Corporation | Electrochemical method for producing chlorine dioxide solutions |
JP3101061B2 (ja) * | 1992-02-14 | 2000-10-23 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法 |
DE10048844A1 (de) * | 2000-10-02 | 2002-04-11 | Basf Ag | Verfahren zur Herstellung von Platinmetall-Katalysatoren |
JP4849930B2 (ja) * | 2006-03-28 | 2012-01-11 | 日本化学工業株式会社 | 導電性無電解めっき粉体およびその製造方法 |
US8317910B2 (en) * | 2010-03-22 | 2012-11-27 | Unity Semiconductor Corporation | Immersion platinum plating solution |
CN104126149B (zh) * | 2012-02-28 | 2017-03-22 | 旭硝子株式会社 | 电湿润装置、显示装置、透镜 |
DE102014006739B3 (de) * | 2014-05-12 | 2015-06-25 | Albert-Ludwigs-Universität Freiburg | Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils |
-
2015
- 2015-10-15 JP JP2015203809A patent/JP6352879B2/ja active Active
-
2016
- 2016-02-29 US US15/767,817 patent/US20180305819A1/en not_active Abandoned
- 2016-02-29 EP EP16855128.1A patent/EP3363928A4/en active Pending
- 2016-02-29 WO PCT/JP2016/056047 patent/WO2017064874A1/ja active Application Filing
- 2016-03-01 TW TW105106086A patent/TWI586833B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4856591A (ja) * | 1971-11-22 | 1973-08-08 | ||
JPS54117329A (en) * | 1978-03-06 | 1979-09-12 | Ngk Spark Plug Co | Electroless plating method |
JPH01319683A (ja) * | 1988-06-20 | 1989-12-25 | Electroplating Eng Of Japan Co | 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210068875A (ko) * | 2019-12-02 | 2021-06-10 | (재)한국건설생활환경시험연구원 | 무전해 백금 도금액 조성물 및 이를 이용한 도금방법 |
KR102293808B1 (ko) * | 2019-12-02 | 2021-08-24 | (재)한국건설생활환경시험연구원 | 무전해 백금 도금액 조성물 및 이를 이용한 도금방법 |
Also Published As
Publication number | Publication date |
---|---|
TWI586833B (zh) | 2017-06-11 |
EP3363928A1 (en) | 2018-08-22 |
US20180305819A1 (en) | 2018-10-25 |
TW201713798A (zh) | 2017-04-16 |
WO2017064874A1 (ja) | 2017-04-20 |
JP6352879B2 (ja) | 2018-07-04 |
EP3363928A4 (en) | 2019-06-19 |
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