US20180305819A1 - Electroless platinum plating solution - Google Patents

Electroless platinum plating solution Download PDF

Info

Publication number
US20180305819A1
US20180305819A1 US15/767,817 US201615767817A US2018305819A1 US 20180305819 A1 US20180305819 A1 US 20180305819A1 US 201615767817 A US201615767817 A US 201615767817A US 2018305819 A1 US2018305819 A1 US 2018305819A1
Authority
US
United States
Prior art keywords
plating solution
electroless
platinum
electroless platinum
platinum plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/767,817
Other languages
English (en)
Inventor
Tomohito KATO
Hideto Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Chemicals Co Ltd
Original Assignee
Kojima Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=58518047&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20180305819(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Assigned to KOJIMA CHEMICALS, CO., LTD. reassignment KOJIMA CHEMICALS, CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATO, Tomohito, WATANABE, HIDETO
Publication of US20180305819A1 publication Critical patent/US20180305819A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Definitions

  • the present invention relates to an electroless platinum plating solution.
  • Some electroless platinum plating solutions conventionally known contain dinitrodiammineplatinum or dinitrotetraammineplatinum as a platinum salt, ethylenediamine or ammonia as a complexing agent, and hydrazine monohydrate or sodium borohydride as a reducing agent (See, for example, Patent Literatures 1 to 4).
  • Dinitrodiammineplatinum and dinitrotetraammineplatinum are poorly soluble in water. Therefore, they are dissolved in water by adding ethylenediamine or ammonia as a complexing agent to electroless platinum plating solutions containing them to form platinum complexes coordinated with ethylenediamine or ammonia.
  • reducing agents can reduce metal ions or metal complexes on the surface of a plating substrate to deposit metals thereon. Since the platinum complexes coordinated with ethylenediamine or ammonia are resistant to reduction, hydrazine monohydrate or sodium borohydride having a strong reducing action has been added as a reducing agent to the electroless platinum plating solutions. However, since hydrazine monohydrate and sodium borohydride have too strong reducing power, there are problems that platinum is deposited in the plating solutions due to reduction of the platinum complex and the reduction reaction is accompanied by generation of hydrogen.
  • the stability of the electroless platinum plating solutions has been improved by adding heavy metal ions such as lead and thallium or thiol compounds as a stabilizer.
  • Patent Literature 1 Japanese Patent Laid-Open No. 5-222543
  • Patent Literature 2 Japanese Patent Laid-Open No. 9-287078
  • Patent Literature 3 International Publication No. WO 2014/162935
  • Patent Literature 4 International Publication No. WO 2013/094544
  • the present inventors have made intensive studies, and as a result, have found that the conventional electroless platinum plating solutions decrease in solution stability for the following reasons.
  • ethylenediamine or ammonia used as a complexing agent is coordinated to platinum ions to form platinum complexes. Since ethylenediamine or ammonia is strongly complexed with platinum ions, a reducing agent having a strong reducing action is required in order to reduce the platinum complexes to deposit them on the surface of substrates to be plated.
  • the electroless platinum plating solutions are subjected to reduction and decomposition by the reducing power of the reducing agent having a strong reducing action.
  • the present inventors have achieved the above object by adopting the following electroless platinum plating solution.
  • the electroless platinum plating solution of the present invention is characterized by comprising a water-soluble platinum compound, and one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates.
  • the water-soluble platinum compound is preferably one or more water-soluble platinum compounds selected from the group consisting of platinous chloride (II), hydrogen tetrachloroplatinic acid (II), tetrachloroplatinate (II), platinic chloride (IV), hydrogen hexachloroplatinic acid (IV), hexachloroplatinate (IV), hydrogen hexahydroxoplatinic acid (IV), hexahydroxoplatinate (IV) and dichlorotetraammineplatinum (II).
  • the electroless platinum plating solution according to the present invention preferably comprises an organic acid as a complexing agent.
  • the organic acid is preferably one or more compounds selected from aliphatic hydroxy acids having a molecular weight of 90 to 500.
  • the platinum compound Since a water-soluble platinum compound is used in the electroless platinum plating solution according to the present invention, the platinum compound forms a platinum complex which in turn is easily dissolved in water, even if the electroless platinum plating solution contains no complexing agent such as ethylenediamine or ammonia that is strongly complexed with a platinum ion.
  • the platinum complex formed from the water-soluble platinum compound is more easily reduced than platinum complexes coordinated with ethylenediamine or ammonia, which are formed in conventional electroless platinum plating solutions.
  • formalin, glucose, formic acid or formates having a weak reducing action is used as a reducing agent, the platinum complex can be made to an easily reduced state.
  • any of formalin, glucose, formic acid and formates as reducing agents also have a weaker reducing action than hydrazine monohydrate and sodium borohydride.
  • the electroless platinum plating solution of the present invention is not decomposed by any of the reducing agents. Therefore, the electroless platinum plating solution of the present invention can provide excellent solution stability even without the use of heavy metal ions or thiol compounds as compared with conventional electroless platinum plating solutions.
  • Any of formalin, glucose, formic acid and formates are also suitable in that they reduce the amount of hydrogen generated than the conventional reducing agents such as hydrazine monohydrate and sodium borohydride.
  • the electroless platinum plating solution of the present invention contains no compound capable of generating ammonia gas such as ethylenediamine or ammonia, it can prevent the generation of ammonia gas.
  • FIG. 1 is a graph showing the deposition property exhibited by the electroless platinum plating solution of an embodiment of the present invention.
  • FIG. 2 is an SEM image of the electroless platinum film obtained by electroless plating processing with the electroless platinum plating solution of Example 1.
  • FIG. 3 is an SEM image of the electroless platinum film obtained by electroless plating processing with the electroless platinum plating solution of Example 2.
  • the electroless platinum plating solution of the present invention is an aqueous solution comprising a water-soluble platinum compound and one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates.
  • water-soluble platinum compound examples include one or more water-soluble platinum compounds selected from the group consisting of platinous chloride (II), hydrogen tetrachloroplatinic acid (II), tetrachloroplatinate (II), platinic chloride (IV), hydrogen hexachloroplatinic acid (IV), hexachloroplatinate (IV), hydrogen hexahydroxoplatinic acid (IV), hexahydroxoplatinate (IV) and dichlorotetraammineplatinum (II).
  • the electroless platinum plating solution of the present invention preferably contains the water-soluble platinum compound in the range of not less than 0.0005 mol/L and not more than 0.05 mol/L and more preferably in the range of not less than 0.0025 mol/L and not more than 0.01 mol/L.
  • the content of the water-soluble platinum compound in the electroless platinum plating solution is less than 0.0005 mol/L, the electroless platinum film may be difficult to be formed and the plating rate may decrease.
  • plating itself can be performed well but economic efficiency decreases.
  • Platinum chloride (IV) is easily dissolved in the electroless platinum plating solution of the present invention to form a platinum complex represented by the following formula (1).
  • Dichlorotetraammineplatinum (II) is easily dissolved in the electroless platinum plating solution of the present invention to form a platinum complex represented by the following formula (2).
  • Both of the platinum complexes represented by the above formulae (1) and (2) are more easily reduced than platinum complexes coordinated with ethylenediamine, which are produced in conventional electroless platinum plating solutions.
  • the electroless platinum plating solution of the present invention requires no reducing agent having a strong reducing action, and even when a reducing agent having a weak reducing action is used, the platinum complex can be made to an easily reduced state.
  • any of one or more reducing agents selected from the group consisting of formalin, glucose, formic acid and formates have a weak reducing action.
  • the reducing agents can make the platinum complexes represented by the above formulae (1) and (2) to an easily reduced state.
  • Any of the above-mentioned reducing agents are advantageous in that they mainly produce carbon dioxide and water as decomposition products accompanying the reduction reaction and reduce the amount of hydrogen generated than hydrazine monohydrate or sodium borohydride.
  • the electroless platinum plating solution of the present invention is adjusted to a pH range of 6.5 to 12.0 as described below. The above-mentioned reducing agent can be used throughout this pH range.
  • the electroless platinum plating solution of the present invention preferably contains the reducing agent in the range of not less than 0.1 mol/L and not more than 1.0 mol/L and more preferably in the range of not less than 0.2 mol/L and not more than 0.8 mol/L.
  • the content of the reducing agent in the electroless platinum plating solution is less than 0.1 mol/L, undeposited areas may occur.
  • it exceeds 1.0 mol/L the reducing action of the reducing agent may become excessive and the solution stability of the electroless platinum plating solution may be thus impaired.
  • sodium formate, potassium formate and ammonium formate can be used as the formates.
  • Sodium formate is suitable due to being readily soluble in water and ease of handling.
  • the water-soluble platinum compound is used in the electroless platinum plating solution of the present invention, no complexing agent is necessarily required to dissolve the platinum compound in water. However, adding the complexing agent can further stabilize the electroless platinum plating solution.
  • the organic acid is preferably one or more compounds selected from aliphatic hydroxy acids having a molecular weight of 90 to 500.
  • the complexing agent also acts as a pH buffering material.
  • the electroless platinum plating solution of the present invention preferably contains the organic acid in the range of not less than 0.01 mol/L and not more than 0.5 mol/L and more preferably in the range of not less than 0.02 mol/L and not more than 0.3 mol/L.
  • the content of the organic acid in the electroless platinum plating solution is less than 0.01 mol/L, it may not act as a complexing agent. When it exceeds 0.5 mol/L, plating itself can be performed well but economic efficiency decreases.
  • the electroless platinum plating solution of the present invention may further contain various components such as a surfactant, a stress relaxant and a pH adjusting agent.
  • surfactant examples include polyethylene glycol and any other various surfactants conventionally known.
  • polyethylene glycol the surfactant
  • the wettability of the surface of a plating substrate can be improved, and bubbles can be made easier to separate from the surface of the plating substrate when the bubbles are generated on the surface of the plating substrate.
  • stress relaxant examples include saccharin, 1,4-butynediol, benzenesulfonic acid and naphthalenedisulfonic acid, and any other various stress relaxants conventionally known.
  • the electroless platinum plating solution can be preferably adjusted in the pH range of 6.5 to 13.0 by adding the adjusting agent.
  • the pH of the electroless platinum plating solution is less than 6.5, the reducing action of the reducing agent may decrease.
  • pH is preferably not more than 13.0 from the viewpoint of workability such as pH adjustment as well as controlling bath.
  • adjusting the pH of the electroless platinum plating solution in the above-mentioned range can vary the appearance of the resulting electroless platinum film. For example, when the pH of the electroless platinum plating solution is 7, a gray-colored electroless platinum film can be obtained. When the pH is 12, a white-colored electroless platinum film can be obtained.
  • the electroless platinum plating solution of an embodiment according to the present invention since a water-soluble platinum compound such as platinous chloride (II), platinic chloride (IV), hexahydroxoplatinate (IV) or dichlorotetraammineplatinum (II) is used, this platinum compound can form a platinum complex even without the use of complexing agents to easily dissolve it in water.
  • the platinum complex formed from the water-soluble platinum compound is more easily reduced than platinum complexes coordinated with ethylenediamine, which are produced in conventional electroless platinum plating solutions.
  • formalin, glucose, formic acid or formates having a weak reducing action is used as a reducing agent, the platinum complex can be made to an easily reduced state.
  • any of formalin, glucose, formic acid and formates as reducing agents also have a weaker reducing action than hydrazine monohydrate and sodium borohydride.
  • the electroless platinum plating solution of the present invention is not decomposed by any of the reducing agents. Therefore, the electroless platinum plating solution of the present invention can provide excellent solution stability even without the use of heavy metal ions or thiol compounds as compared with conventional electroless platinum plating solutions.
  • Any of formalin, glucose, formic acid and formates are also suitable in that they reduce the amount of hydrogen generated than the conventional reducing agents such as hydrazine monohydrate and sodium borohydride.
  • the electroless platinum plating solution of the present invention contains no compound capable of generating ammonia gas such as ethylenediamine, it can prevent the generation of ammonia gas.
  • the example described here uses, as a plating substrate which is an object to be plated, a plating substrate that have a copper film and a nickel film sequentially formed on the surface of an insulating base by electroless plating processing.
  • the plating substrate is not limited to the above-mentioned plating substrate but any conventionally known plating substrate can be used.
  • the plating substrate is subjected to electrolytic plating processing to form a platinum film (electrolytic platinum film) on the surface of the nickel film.
  • the plating substrate having the electrolytic platinum film on the surface of the nickel film is subjected to electroless plating processing by immersing it in an electroless platinum plating solution of the present embodiment.
  • the platinum complex in the electroless platinum plating solution can be reduced and deposited on the surface of the electrolytic platinum film to form another platinum film (electroless platinum film) on the electrolytic platinum film.
  • the deposition rate is 1 to 2 m/hour, which can be approximately the same deposition rate as that of conventional electroless platinum plating solutions containing dinitrodiammineplatinum or dinitrotetraammineplatinum.
  • the working temperature of the electroless platinum plating solution is preferably in the range of 40 to 90° C.
  • the temperature is less than 40° C., the plating rate may be slow.
  • the temperature exceeds 90° C., the water evaporation amount may increase and the composition variation may thus increase.
  • the time of plating with the electroless platinum plating solution depends on the thickness of the electroless platinum film to be formed. For example, in the case of using an electroless platinum plating solution containing 0.005 mol/L of dichlorotetraammineplatinum (II) (1.0 g/L in terms of platinum) as a water-soluble platinum compound, the plating time of 30 minutes allows an electroless platinum film having a thickness of 0.5 ⁇ m to be formed.
  • II dichlorotetraammineplatinum
  • the above-mentioned reducing agent mainly produces carbon dioxide and water with reduction reaction. Since carbon dioxide and water do not accumulate in the electroless platinum plating solution, the electroless platinum plating solution does not deteriorate and can thus be used for a long time.
  • the electroless platinum plating solution of the present embodiment is suitable for plating electronic components made of metals or the like, electrode materials, synthetic resins such as ABS resins, polyamide resins and polycarbonate resins, ceramics having no conductivity such as alumina and zirconia, and the like.
  • it can be suitably used for electrodes of oxygen sensors made of ceramics such as zirconia, and the like, as well as various jewelry goods, and the like.
  • a nickel film having a thickness of 3 ⁇ m was formed on a copper plate by electrolytic plating processing.
  • a plating substrate was prepared by forming a platinum film (electrolytic platinum film) having a thickness of 0.1 ⁇ m on the surface of the nickel film by electrolytic plating processing.
  • the resulting electroless platinum plating solution was warmed to a temperature of 70° C., the plating substrate having the electrolytic platinum film thereon was subjected to electroless plating processing by immersing it in the electroless platinum plating solution to form another platinum film (electroless platinum film) on the electrolytic platinum film.
  • the thickness of the electroless platinum film was measured every 10 minutes until the immersion time reached 60 minutes. The results are shown in FIG. 1 . From FIG. 1 , the deposition rate during the electroless plating processing was determined to be 1.0 ⁇ m/hour.
  • electroless plating processing was performed for 60 minutes to form an electroless platinum film having a thickness of 0.5 ⁇ m.
  • the resulting electroless platinum film was visually observed to be gray-colored.
  • the surface of the resulting electroless platinum film was observed with a scanning electron microscope (SEM) at a magnification of 30,000 times. As shown in FIG. 2 , the particle size of the platinum particles was large, and the electroless platinum film has a rough surface shape.
  • the temperature of the electroless platinum plating solution was changed to 50° C., 60° C., 70° C. or 80° C., and the plating substrate having the electrolytic platinum film formed thereon was subjected to electroless plating processing by immersing it in the electroless platinum plating solution for two hours. At this time, whether platinum deposits were formed in the electroless platinum plating solution or not was observed to determine whether the electroless platinum plating solution was decomposed or not.
  • Table 1 In Table 1, X indicates that the electroless platinum plating solution was decomposed within one hour, ⁇ indicates that it was decomposed within two hours, and ⁇ indicates that it was not decomposed at all even after two hours.
  • the electroless platinum plating solution kept at a temperature of 50 to 80° C. for two hours was allowed to cool naturally, and on the following day, was warmed again to the same temperature.
  • the plating substrate was subjected to electroless plating processing by immersing it in the electroless platinum plating solution for two hours. Even in the electroless platinum plating solution warmed to any of the above temperatures, electroless plating processing was able to be performed normally. This clearly indicates that the electroless platinum plating solution can be used continuously.
  • the electroless platinum plating solution was prepared in exactly the same manner as in Example 1 except that the pH (at a temperature of 25° C.) was adjusted to 11.0.
  • the resulting electroless platinum plating solution was warmed to a temperature of 70° C., the plating substrate having the electrolytic platinum film thereon was subjected to electroless plating processing by immersing it in the electroless platinum plating solution for 60 minutes to form an electroless platinum film having a thickness of 0.5 ⁇ m on the electrolytic platinum film.
  • the resulting electroless platinum film was visually observed to have a white glossy appearance.
  • the surface of the resulting electroless platinum film was observed with a SEM at a magnification of 30,000 times. As shown in FIG. 3 , the particle size of the platinum particles was small, and the electroless platinum film has a smooth surface shape.
  • Example 2 the electroless platinum plating solution kept at a temperature of 50 to 80° C. for two hours was processed, and on the following day, electroless plating processing was performed. Even in the electroless platinum plating solution warmed to any of the above temperatures, electroless plating processing was able to be performed normally. This clearly indicates that the electroless platinum plating solution can be used continuously.
  • the electroless platinum plating solution was prepared in exactly the same manner as in Example 2 except that 0.5 mol/L of hydrazine monohydrate was used instead of sodium formate as a reducing agent.
  • the pH (at a temperature of 25° C.) of the electroless platinum plating solution was adjusted to 11.0.
  • the resulting electroless platinum plating solution was used to determine whether it was decomposed or not, in exactly the same manner as in Example 1. The results are shown in Table 1.
  • the electroless platinum plating solution was prepared in exactly the same manner as in Example 2 except that 0.5 mol/L of sodium borohydride was used instead of sodium formate as a reducing agent.
  • the pH (at a temperature of 25° C.) of the electroless platinum plating solution was adjusted to 11.0.
  • the resulting electroless platinum plating solution was used to determine whether it was decomposed or not, in exactly the same manner as in Example 1. The results are shown in Table 1.
  • the electroless platinum plating solution was prepared in exactly the same manner as in Comparative Example 1 except that 0.005 mol/L of dinitrodiammineplatinum (II) (1.0 g/L in terms of platinum) was used instead of dichlorotetraammineplatinum (II) as a platinum compound.
  • the pH (at a temperature of 25° C.) of the electroless platinum plating solution was adjusted to 11.0.
  • the resulting electroless platinum plating solution was used to determine whether it was decomposed or not, in exactly the same manner as in Example 1. The results are shown in Table 1.
  • the electroless platinum plating solution was prepared in exactly the same manner as in Comparative Example 2 except that 0.005 mol/L of dinitrotetraammineplatinum (II) (1.0 g/L in terms of platinum) was used instead of dichlorotetraammineplatinum (II) as a platinum compound.
  • the pH (at a temperature of 25° C.) of the electroless platinum plating solution was adjusted to 11.0.
  • the resulting electroless platinum plating solution was used to determine whether it was decomposed or not, in exactly the same manner as in Example 1. The results are shown in Table 1.
  • Table 1 clearly indicates that the electroless platinum plating solutions of both of Examples 1 and 2 in which the platinum compound is dichlorotetraammineplatinum (II) and the reducing agent is sodium formate are not decomposed even after two hours at a temperature ranging from 50 to 80° C. and thus have excellent solution stability.
  • the reducing agent is hydrazine monohydrate or sodium borohydride are decomposed within one hour at a temperature ranging from 70 to 80° C., and within two hours even at a temperature ranging from 50 to 60° C. and thus has poor solution stability.
  • the electroless platinum plating solution of the present invention since the electroless platinum plating solution of the present invention has excellent solution stability, it can thus withstand long use.
  • the electroless platinum plating solution of the present invention contains no compound capable of generating ammonia gas such as ethylenediamine or ammonia, it can prevent the generation of ammonia gas. Thus, it can prevent the working environment from deteriorating due to odor associated with the generation of ammonia gas.
  • reducing agents such as formalin, glucose, formic acid and formates that have a weak reducing action can be used. In addition, these reducing agents can reduce the amount of hydrogen gas generated as compared with hydrazine monohydrate and sodium borohydride.
  • the electroless platinum plating solution of the embodiments of the present invention is suitable for plating electronic components made of metals or the like, electrode materials, various synthetic resins, ceramics, and the like.
  • it can be suitably used for electrodes of oxygen sensors made of ceramics such as zirconia, and the like, as well as various jewelry goods, and the like.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
US15/767,817 2015-10-15 2016-02-29 Electroless platinum plating solution Abandoned US20180305819A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-203809 2015-10-15
JP2015203809A JP6352879B2 (ja) 2015-10-15 2015-10-15 無電解白金めっき液
PCT/JP2016/056047 WO2017064874A1 (ja) 2015-10-15 2016-02-29 無電解白金めっき液

Publications (1)

Publication Number Publication Date
US20180305819A1 true US20180305819A1 (en) 2018-10-25

Family

ID=58518047

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/767,817 Abandoned US20180305819A1 (en) 2015-10-15 2016-02-29 Electroless platinum plating solution

Country Status (5)

Country Link
US (1) US20180305819A1 (ja)
EP (1) EP3363928A4 (ja)
JP (1) JP6352879B2 (ja)
TW (1) TWI586833B (ja)
WO (1) WO2017064874A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018126804A1 (de) * 2018-10-26 2020-04-30 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
US10941494B2 (en) * 2017-05-18 2021-03-09 Japan Pure Chemical Co., Ltd. Electroless platinum plating solution and platinum film obtained using same
US10947623B2 (en) 2018-11-30 2021-03-16 C. Uyemura & Co., Ltd. Electroless plating bath

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102293808B1 (ko) * 2019-12-02 2021-08-24 (재)한국건설생활환경시험연구원 무전해 백금 도금액 조성물 및 이를 이용한 도금방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298280A (en) * 1989-12-26 1994-03-29 Olin Corporation Process for producing an electrode by electroless deposition
US20110229734A1 (en) * 2010-03-22 2011-09-22 Unity Semiconductor Corporation Immersion platinum plating solution

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412435B2 (ja) * 1971-11-22 1979-05-23
JPS54117329A (en) * 1978-03-06 1979-09-12 Ngk Spark Plug Co Electroless plating method
JPH01319683A (ja) * 1988-06-20 1989-12-25 Electroplating Eng Of Japan Co 白金コロイド溶液及びそれを用いた無電解白金メッキ方法ならびに白金担持体の製法
JP3101061B2 (ja) * 1992-02-14 2000-10-23 日本エレクトロプレイテイング・エンジニヤース株式会社 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
JP4849930B2 (ja) * 2006-03-28 2012-01-11 日本化学工業株式会社 導電性無電解めっき粉体およびその製造方法
CN104126149B (zh) * 2012-02-28 2017-03-22 旭硝子株式会社 电湿润装置、显示装置、透镜
DE102014006739B3 (de) * 2014-05-12 2015-06-25 Albert-Ludwigs-Universität Freiburg Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298280A (en) * 1989-12-26 1994-03-29 Olin Corporation Process for producing an electrode by electroless deposition
US20110229734A1 (en) * 2010-03-22 2011-09-22 Unity Semiconductor Corporation Immersion platinum plating solution

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941494B2 (en) * 2017-05-18 2021-03-09 Japan Pure Chemical Co., Ltd. Electroless platinum plating solution and platinum film obtained using same
DE102018126804A1 (de) * 2018-10-26 2020-04-30 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
DE102018126804B4 (de) * 2018-10-26 2020-09-24 RF360 Europe GmbH Verfahren zur Herstellung eines elektroakustischen Resonators und elektroakustische Resonatorvorrichtung
US10947623B2 (en) 2018-11-30 2021-03-16 C. Uyemura & Co., Ltd. Electroless plating bath

Also Published As

Publication number Publication date
TWI586833B (zh) 2017-06-11
EP3363928A1 (en) 2018-08-22
TW201713798A (zh) 2017-04-16
WO2017064874A1 (ja) 2017-04-20
JP6352879B2 (ja) 2018-07-04
EP3363928A4 (en) 2019-06-19
JP2017075379A (ja) 2017-04-20

Similar Documents

Publication Publication Date Title
US6183545B1 (en) Aqueous solutions for obtaining metals by reductive deposition
TWI409367B (zh) Electrolytic gold plating and the use of its gold film
US20180305819A1 (en) Electroless platinum plating solution
JP5586587B2 (ja) Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴
US20150167191A1 (en) Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath
EP3023520B1 (en) Environmentally friendly gold electroplating compositions and corresponding method
EP3725920A1 (en) Trivalent chromium plating solution and method for chromium-plating using same
JP2017075379A5 (ja)
KR20230095905A (ko) 백금 전해 도금욕 및 백금 도금 제품
CN101289756A (zh) 用于金铜合金电解沉积的电解组合物及方法
US8961670B2 (en) Alkaline plating bath for electroless deposition of cobalt alloys
US6858122B2 (en) Nickel electroplating solution
EP3334853A1 (en) Electroless silver plating bath and method of using the same
EP2730682B1 (en) Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy
JP4992434B2 (ja) 金メッキ液および金メッキ方法
JP5312842B2 (ja) 電解合金めっき液及びそれを用いるめっき方法
US6852211B2 (en) Nickel electroplating solution
CN105579620A (zh) 电镀浴
EP3842572A1 (en) Tin alloy electroplating bath and plating method using same
EP3725919A1 (en) Trivalent chromium plating solution and trivalent chromium plating method using same
JP2010150606A (ja) 電解再生式の無電解スズメッキ方法
JP2013189715A (ja) Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴

Legal Events

Date Code Title Description
AS Assignment

Owner name: KOJIMA CHEMICALS, CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KATO, TOMOHITO;WATANABE, HIDETO;REEL/FRAME:046305/0456

Effective date: 20180514

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCV Information on status: appeal procedure

Free format text: NOTICE OF APPEAL FILED

STCV Information on status: appeal procedure

Free format text: APPEAL BRIEF (OR SUPPLEMENTAL BRIEF) ENTERED AND FORWARDED TO EXAMINER

STCV Information on status: appeal procedure

Free format text: EXAMINER'S ANSWER TO APPEAL BRIEF MAILED

STCV Information on status: appeal procedure

Free format text: ON APPEAL -- AWAITING DECISION BY THE BOARD OF APPEALS

STCV Information on status: appeal procedure

Free format text: BOARD OF APPEALS DECISION RENDERED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION