TWI559365B - Coating device - Google Patents

Coating device Download PDF

Info

Publication number
TWI559365B
TWI559365B TW102100474A TW102100474A TWI559365B TW I559365 B TWI559365 B TW I559365B TW 102100474 A TW102100474 A TW 102100474A TW 102100474 A TW102100474 A TW 102100474A TW I559365 B TWI559365 B TW I559365B
Authority
TW
Taiwan
Prior art keywords
base member
nozzle
substrate
sensor
guide rail
Prior art date
Application number
TW102100474A
Other languages
English (en)
Chinese (zh)
Other versions
TW201338017A (zh
Inventor
Toshihiro Mori
Kenji Hamakawa
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201338017A publication Critical patent/TW201338017A/zh
Application granted granted Critical
Publication of TWI559365B publication Critical patent/TWI559365B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW102100474A 2012-03-12 2013-01-07 Coating device TWI559365B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012054677A JP6023440B2 (ja) 2012-03-12 2012-03-12 塗布装置

Publications (2)

Publication Number Publication Date
TW201338017A TW201338017A (zh) 2013-09-16
TWI559365B true TWI559365B (zh) 2016-11-21

Family

ID=49127968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102100474A TWI559365B (zh) 2012-03-12 2013-01-07 Coating device

Country Status (4)

Country Link
JP (1) JP6023440B2 (ja)
KR (1) KR102018506B1 (ja)
CN (1) CN103301998B (ja)
TW (1) TWI559365B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103736631B (zh) * 2013-12-10 2016-08-24 京东方科技集团股份有限公司 一种狭缝式涂布机
CN105964454A (zh) * 2016-07-15 2016-09-28 张凤平 一种多功能增压可水平移动喷漆工作台
CN106076734B (zh) * 2016-07-20 2019-07-26 联德精密材料（中国）股份有限公司 自动点胶装置及其点胶方法
CN106444110B (zh) * 2016-11-17 2023-08-29 合肥京东方光电科技有限公司 基板支撑杆以及涂覆防静电液的方法
JP6803120B2 (ja) * 2016-11-28 2020-12-23 東レエンジニアリング株式会社 原点検出器及び塗布装置
JP2018113327A (ja) * 2017-01-11 2018-07-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102641446B1 (ko) * 2017-07-19 2024-02-28 주식회사 탑 엔지니어링 디스펜싱 장치
CN107649975B (zh) * 2017-10-11 2024-02-27 泉州市宏铭机械开发有限公司 一种碑石自动磨光机
JP6817986B2 (ja) * 2018-08-30 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス ステージ測定治具、塗布装置およびステージ測定方法
KR102154492B1 (ko) * 2020-04-03 2020-09-10 박옥경 인테리어 자재 시공방법
CN112742630B (zh) * 2020-12-23 2021-09-14 深圳市言九电子科技有限公司 聚合物电池的生产方法及流水线设备
CN113877772A (zh) * 2021-11-09 2022-01-04 怀化华晨电子科技有限公司 一种用于电子元件电路板生产的点胶装置
CN115846112B (zh) * 2022-12-23 2023-08-01 佛山市南海区佳朗卫生用品有限公司 一种用于纸尿裤的喷胶机构、喷胶复合装置及使用方法
CN117548289B (zh) * 2024-01-09 2024-04-02 宁波欧达光电有限公司 一种用于电磁屏蔽光伏组件的制备装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101192008A (zh) * 2006-11-28 2008-06-04 东京毅力科创株式会社 涂敷方法和涂敷装置
JP2011246213A (ja) * 2010-05-24 2011-12-08 Olympus Corp 基板搬送装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116965A (ja) * 1984-11-09 1986-06-04 Mitsubishi Electric Corp エア浮上式リニア搬送装置
JP3278714B2 (ja) * 1996-08-30 2002-04-30 東京エレクトロン株式会社 塗布膜形成装置
JP2002200450A (ja) * 2000-12-28 2002-07-16 Chugai Ro Co Ltd 非接触移動式テーブルコータ
JP4091378B2 (ja) * 2002-08-28 2008-05-28 大日本スクリーン製造株式会社 基板処理装置
JP4305918B2 (ja) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
JP4570545B2 (ja) 2005-09-22 2010-10-27 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4662466B2 (ja) * 2005-10-06 2011-03-30 東京エレクトロン株式会社 塗布膜形成装置及びその制御方法
JP4673180B2 (ja) * 2005-10-13 2011-04-20 東京エレクトロン株式会社 塗布装置及び塗布方法
KR100919407B1 (ko) * 2008-01-28 2009-09-29 주식회사 탑 엔지니어링 액정 적하 장치
JP5608469B2 (ja) * 2010-08-20 2014-10-15 東京応化工業株式会社 塗布装置
CN102000652B (zh) * 2010-09-10 2013-03-13 深圳市华星光电技术有限公司 液晶涂布装置及液晶涂布方法
JP2012071268A (ja) * 2010-09-29 2012-04-12 Dainippon Screen Mfg Co Ltd 塗布装置、および塗布方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101192008A (zh) * 2006-11-28 2008-06-04 东京毅力科创株式会社 涂敷方法和涂敷装置
JP2011246213A (ja) * 2010-05-24 2011-12-08 Olympus Corp 基板搬送装置

Also Published As

Publication number Publication date
KR20130105332A (ko) 2013-09-25
JP6023440B2 (ja) 2016-11-09
KR102018506B1 (ko) 2019-09-05
CN103301998B (zh) 2017-06-06
JP2013191604A (ja) 2013-09-26
TW201338017A (zh) 2013-09-16
CN103301998A (zh) 2013-09-18

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