TWI559365B - Coating device - Google Patents

Coating device Download PDF

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Publication number
TWI559365B
TWI559365B TW102100474A TW102100474A TWI559365B TW I559365 B TWI559365 B TW I559365B TW 102100474 A TW102100474 A TW 102100474A TW 102100474 A TW102100474 A TW 102100474A TW I559365 B TWI559365 B TW I559365B
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TW
Taiwan
Prior art keywords
base member
nozzle
substrate
sensor
guide rail
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TW102100474A
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Chinese (zh)
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TW201338017A (en
Inventor
Toshihiro Mori
Kenji Hamakawa
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Toray Eng Co Ltd
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Publication of TW201338017A publication Critical patent/TW201338017A/en
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Publication of TWI559365B publication Critical patent/TWI559365B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Description

塗佈裝置 Coating device

本發明是關於對運送的基板塗佈塗佈液之塗佈裝置。 The present invention relates to a coating apparatus for applying a coating liquid to a substrate to be transported.

在液晶顯示器(liquid crystal display)等的平面面板顯示器(flat panel display)、太陽電池板(solar cell panel)等,形成有像素(pixel)、電路圖案等的基板(substrate)被使用,這種基板是藉由使用塗佈例如光阻(resist)液(塗佈液)而進行的微影(photolithography)技術而被製作。 A substrate in which a pixel, a circuit pattern, or the like is formed, such as a flat panel display such as a liquid crystal display or a solar cell panel, is used. It is produced by a photolithography technique using coating, for example, a resist liquid (coating liquid).

再者,對基板塗佈塗佈液的裝置已知有具備如下構件之塗佈裝置:令基板成水平而固定的平台(stage);在橫向長的開縫(slit)形成於內部的噴嘴(nozzle),依照該塗佈裝置,可藉由一邊對平台上的基板使噴嘴移動於水平方向,一邊由開縫吐出塗佈液,在基板的表面形成由塗佈液構成的塗膜。而且,由開縫吐出塗佈液時,處於在基板與噴嘴(開縫)之間設置高度方向的間隙的狀態,為了調整該間隙的值,噴嘴可升降地構成。 Further, as a device for applying a coating liquid to a substrate, a coating device having a member in which a substrate is horizontally fixed and a nozzle which is formed in a horizontally long slit is known. According to the coating apparatus, the coating liquid can be discharged from the slit by moving the nozzle in the horizontal direction while the substrate on the stage is horizontal, and a coating film made of the coating liquid can be formed on the surface of the substrate. Further, when the coating liquid is discharged from the slit, a gap in the height direction is provided between the substrate and the nozzle (slit), and the nozzle is configured to be movable up and down in order to adjust the value of the gap.

藉由這種塗佈裝置進行塗佈作業,為了提高形成於基 板上的塗膜的品質(令膜厚成均勻),需令噴嘴對基板(水平面)平行,且使噴嘴與基板的間隙在橫向一定。因此,在平台的端部且對應噴嘴的橫向兩端部的各個位置配設有感測器(sensor)。然後使噴嘴移動於水平方向到該等感測器的上方,藉由透過該等感測器求噴嘴的橫向兩端部的高度的差,根據該差使噴嘴升降,調整其傾斜等的姿勢。據此,可令噴嘴成水平且使噴嘴與基板的間隙為一定。 Coating operation by such a coating device, in order to improve formation on the base The quality of the coating film on the plate (to make the film thickness uniform) is such that the nozzle is parallel to the substrate (horizontal plane) and the gap between the nozzle and the substrate is constant in the lateral direction. Therefore, a sensor is disposed at each end of the platform and at the respective lateral ends of the nozzle. Then, the nozzle is moved in the horizontal direction to the upper side of the sensors, and the difference between the heights of the lateral ends of the nozzle is obtained by the sensors, and the nozzle is moved up and down according to the difference, and the posture such as the inclination is adjusted. According to this, the nozzle can be made horizontal and the gap between the nozzle and the substrate can be made constant.

如此,噴嘴在平台上移動於水平方向的型式的塗佈裝置的情形,雖然不配設另一個機構而設置用以調整噴嘴的姿勢的感測器比較容易,但噴嘴僅上下升降且基板被運送於水平方向的型式的塗佈裝置(例如參照專利文獻1)的情形,仍舊無法採用前述感測器的構成。 In this way, in the case where the nozzle moves on the stage in the horizontal type of coating device, it is relatively easy to provide a sensor for adjusting the posture of the nozzle without providing another mechanism, but the nozzle is only raised and lowered and the substrate is transported to In the case of the coating device of the horizontal type (for example, refer to Patent Document 1), the configuration of the above-described sensor is still not available.

[專利文獻1]日本國特開2005-244155號公報(參照圖2) [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-244155 (refer to FIG. 2)

因此,基板被運送於水平方向的型式的塗佈裝置的情形如圖6所示被考慮如下之構成:配設由使安裝噴嘴91的升降體95升降之成為導件(guide)的支柱90朝噴嘴91的橫向的端部92延伸的臂(arm)93,在該臂93的頂端安裝感測器94。但是,此情形因臂93長,且在為了清掃(初始化)噴嘴91的單元(未圖示)接近移動至噴嘴91時,該單元的一部分與臂93干涉,故為了避開該干涉,需對臂93或單元的形狀下功夫,如此有構成變的複雜之問題點。 Therefore, in the case where the substrate is conveyed in the horizontal type of coating device, as shown in FIG. 6, a configuration is considered in which a post 90 which is a guide for raising and lowering the elevating body 95 to which the nozzle 91 is mounted is disposed. An arm 93 extending from the lateral end 92 of the nozzle 91 is mounted with a sensor 94 at the top end of the arm 93. However, in this case, since the arm 93 is long and a unit (not shown) for cleaning (initializing) the nozzle 91 is moved to the nozzle 91, a part of the unit interferes with the arm 93, so in order to avoid the interference, it is necessary to The shape of the arm 93 or the unit is worked hard, and there is a problem that the composition becomes complicated.

若對臂93或單元的形狀下功夫的話,則可將感測器94設置於噴嘴91的橫向的端部92的正下方,但為了確保由感測器94得到的高的測定精度,需剛性高的臂93。但若為了提高臂93的剛性而加大其剖面積的話,則與單元的干涉更進一步成為問題。與此相反,若為了防止單元與臂93的干涉而使臂93變細的話,則臂93的剛性降低,感測器94的支撐變的不穩定且正確的計測變的困難。 If the shape of the arm 93 or the unit is worked on, the sensor 94 can be disposed directly below the lateral end portion 92 of the nozzle 91, but rigidity is required to ensure high measurement accuracy obtained by the sensor 94. High arm 93. However, if the cross-sectional area is increased in order to increase the rigidity of the arm 93, interference with the unit becomes a further problem. On the contrary, if the arm 93 is made thinner in order to prevent interference between the unit and the arm 93, the rigidity of the arm 93 is lowered, the support of the sensor 94 becomes unstable, and accurate measurement becomes difficult.

因此,本發明的目的為提供一種在對被運送的基板進行塗佈的塗佈裝置中,藉由簡單的構成提高由感測器得到的噴嘴的橫向兩端部中的高度位置的檢測精度。 Accordingly, an object of the present invention is to provide a coating apparatus for coating a substrate to be conveyed, which improves the detection accuracy of the height position in the lateral end portions of the nozzle obtained by the sensor by a simple configuration.

(1)、本發明為一種塗佈裝置,其特徵包含:將基板運送於水平的運送方向之運送機構部;具有:在正交於前述運送方向的水平的橫向長,且對被運送的基板空出高度方向的間隙而對向的噴嘴,及使該噴嘴升降於高度方向的升降驅動部,對該基板由該噴嘴吐出塗佈液之塗佈機構部;為了調整前述噴嘴對水平面的姿勢而檢測該噴嘴的橫向兩端部中的高度位置之感測器,前述運送機構部包含:設置於運送的基板的橫向兩側,延伸於前述運送方向之導軌(rail);沿著前述導軌移動之底座構件;搭載於前述底座構件,在運送前述基板時保持該基板的橫向兩端部之保持部,前述感測器與前述保持部一起被搭載於前述底座構件,前述底座構件具有對前述導軌的頂面使前述底座構件浮起的浮起機構部,在前述底座構件透過前述浮起機構部而對前述導軌浮起的狀態下移動,在透過前述感測器進行 前述噴嘴的橫向兩端部中的高度位置的檢測時,在搭載於前述底座構件的前述感測器位於前述噴嘴的正下方的狀態下,解除利用前述浮起機構部進行的前述底座構件的浮起,使前述底座構件定位設置於前述導軌上。 (1) The present invention provides a coating apparatus comprising: a transport mechanism that transports a substrate in a horizontal transport direction; and has a horizontally long horizontal plane orthogonal to the transport direction and a substrate to be transported a nozzle that faces the gap in the height direction and an elevation drive unit that raises and lowers the nozzle in the height direction, and a coating mechanism that discharges the coating liquid from the nozzle to the substrate; and adjusts the posture of the nozzle to the horizontal plane a sensor for detecting a height position in the lateral end portions of the nozzle, the transport mechanism portion including: a rail disposed on two lateral sides of the transported substrate and extending in the transport direction; and moving along the guide rail a base member that is mounted on the base member and holds a holding portion of the lateral end portions of the substrate when the substrate is transported, wherein the sensor is mounted on the base member together with the holding portion, and the base member has a pair of the guide rails a floating mechanism portion on which the top surface floats the base member is moved downward in a state in which the base member is suspended by the floating mechanism portion , Carried out through the sensor In the detection of the height position in the lateral end portions of the nozzle, the floating of the base member by the floating mechanism portion is released in a state where the sensor mounted on the base member is located directly below the nozzle. The base member is positioned on the aforementioned rail.

依照本發明,為了透過運送機構部將基板運送於水平的運送方向,導軌對水平面尺寸精度佳地構成,而且搭載保持該基板的保持部的底座構件也被製作成對水平面尺寸精度佳地構成,且在保持水平的狀態下精度佳地沿著導軌移動之構成。因此,藉由在這種底座構件搭載有感測器,感測器對水平面的安裝位置也成為高精度,可透過該感測器精度佳地檢測噴嘴的橫向兩端部的高度位置。而且,因保持部為在基板的運送時保持該基板的橫向兩端部之構件,故保持部及搭載該保持部的底座構件存在於對應基板的橫向兩端部的位置。再者,藉由將感測器搭載於存在於這種位置的底座構件,無須如以往的長的臂,可在對應噴嘴的橫向兩端部的位置設置感測器,用以配設感測器的構成變的簡單。 According to the present invention, in order to transport the substrate in the horizontal transport direction through the transport mechanism portion, the guide rail has a high dimensional accuracy, and the base member on which the holding portion for holding the substrate is mounted is also formed to have a high dimensional accuracy. And it is configured to move along the guide rail with high precision while maintaining the horizontal state. Therefore, by mounting the sensor on the base member, the position at which the sensor is attached to the horizontal surface is also high-precision, and the height position of the lateral end portions of the nozzle can be accurately detected by the sensor. Further, since the holding portion is a member that holds both lateral end portions of the substrate during transportation of the substrate, the holding portion and the base member on which the holding portion is mounted exist at positions on both lateral ends of the corresponding substrate. Furthermore, by mounting the sensor on the base member existing at such a position, it is not necessary to have a long arm as in the prior art, and a sensor can be provided at a position corresponding to both lateral ends of the nozzle for providing sensing. The composition of the device becomes simple.

此情形如前述,因導軌對水平面尺寸精度佳地構成,且底座構件也對水平面尺寸精度佳地構成,故可藉由使這種底座構件定位設置於導軌上,在搭載於該底座構件的感測器對水平面尺寸精度高的狀態下,位於噴嘴的正下方。因此在該狀態下,可藉由感測器進行噴嘴的橫向兩端部中的高度位置的檢測而提高其檢測精度。 In this case, as described above, since the guide rail is excellent in the dimensional accuracy of the horizontal plane, and the base member is also excellent in the dimensional accuracy of the horizontal plane, the base member can be positioned on the guide rail to be mounted on the base member. The detector is located directly below the nozzle in a state where the horizontal plane accuracy is high. Therefore, in this state, the detection accuracy can be improved by detecting the height position in the lateral end portions of the nozzle by the sensor.

(2)、前述浮起機構部由藉由對前述導軌的頂面噴出氣 體使前述底座構件浮起的噴出部構成較佳。 (2) The floating mechanism portion is formed by ejecting gas from the top surface of the guide rail The ejection portion that floats the base member is preferable.

此情形,可藉由由噴出部進行氣體的噴出而使底座構件浮起,然後可藉由停止該噴出而解除該浮起,該等切換很容易。 In this case, the base member can be floated by the discharge of the gas by the discharge portion, and then the floating can be released by stopping the discharge, and the switching can be easily performed.

(3)、而且,在記載於前述(2)的塗佈裝置中,將在使前述底座構件定位設置於前述導軌上時殘留於前述噴出部的氣體放出到外部的流道被連接於該噴出部較佳。 (3) In the coating apparatus according to (2), the flow path in which the gas remaining in the discharge portion is released to the outside when the base member is positioned on the guide rail is connected to the discharge. The department is better.

即使想透過控制裝置使來自噴出部的氣體的噴出停止並使底座構件定位設置於導軌上,若在空氣噴出部內殘留空氣,則成為底座構件浮起的狀態,無法使底座構件定位設置於導軌上,惟依照該流道,可防止這種情況不佳。其結果,每次透過前述感測器進行前述噴嘴的橫向兩端部中的高度位置的檢測的作業,可使底座構件的高度位置成一定(再現性被確保)。 Even if it is desired to stop the discharge of the gas from the discharge portion by the control device and to position the base member on the guide rail, if the air is left in the air discharge portion, the base member floats and the base member cannot be positioned on the guide rail. However, according to the flow path, this situation can be prevented from being poor. As a result, each time the sensor detects the height position in the lateral end portions of the nozzle, the height position of the base member can be made constant (reproducibility is ensured).

依照本發明,因在對水平面尺寸精度佳地構成的底座構件搭載有感測器,故可透過該感測器精度佳地檢測噴嘴的橫向兩端部的高度位置。而且,藉由將感測器搭載於底座構件,無須如習知的長的臂,可在對應噴嘴的橫向兩端部的位置設置感測器,用以配設感測器的構成變的簡單。 According to the present invention, since the sensor is mounted on the base member which is excellent in the dimensional accuracy of the horizontal plane, the height position of the lateral end portions of the nozzle can be accurately detected by the sensor. Moreover, by mounting the sensor on the base member, it is not necessary to have a long arm as is conventional, and a sensor can be provided at a position corresponding to both lateral ends of the nozzle, and the configuration of the sensor can be simplified. .

1‧‧‧塗佈裝置 1‧‧‧ Coating device

2‧‧‧運送機構部 2‧‧‧Transportation Department

3‧‧‧塗佈機構部 3‧‧‧ Coating Agency

4‧‧‧控制裝置 4‧‧‧Control device

5‧‧‧檢查部 5‧‧‧Inspection Department

7、94‧‧‧感測器 7, 94‧‧‧ sensor

8‧‧‧接觸器 8‧‧‧Contactor

9‧‧‧計測器 9‧‧‧Measurer

11‧‧‧上側構件 11‧‧‧Upper components

15‧‧‧供給用空氣流道 15‧‧‧Supply air flow channel

16‧‧‧排氣用空氣流道 16‧‧‧Exhaust air flow passage

17‧‧‧閥 17‧‧‧ valve

20‧‧‧浮起平台 20‧‧‧Floating platform

20a‧‧‧頂面 20a‧‧‧ top

21‧‧‧導軌 21‧‧‧ rails

21a‧‧‧頂面 21a‧‧‧Top

22‧‧‧移動單元 22‧‧‧Mobile unit

23‧‧‧底座構件 23‧‧‧Base member

24‧‧‧線性馬達 24‧‧‧Linear motor

25‧‧‧吸附構件(保持部) 25‧‧‧Adsorption member (holding part)

26‧‧‧噴出部(浮起機構部) 26‧‧‧Spray part (floating mechanism part)

27‧‧‧氣墊 27‧‧‧ air cushion

30‧‧‧噴嘴 30‧‧‧Nozzles

31‧‧‧開縫 31‧‧‧ slitting

32‧‧‧升降驅動部 32‧‧‧ Lifting and Driving Department

33‧‧‧支柱 33‧‧‧ pillar

34‧‧‧升降體 34‧‧‧ Lifting body

35‧‧‧端部 35‧‧‧End

40‧‧‧基準構件 40‧‧‧ reference components

93‧‧‧臂 93‧‧‧ Arm

E‧‧‧基板的橫向端部 E‧‧‧ lateral end of the substrate

H0‧‧‧基準面 H0‧‧‧ datum

W‧‧‧基板 W‧‧‧Substrate

圖1是顯示本發明的塗佈裝置的概略構成之斜視圖。 Fig. 1 is a perspective view showing a schematic configuration of a coating apparatus of the present invention.

圖2是由運送方向看導軌、移動單元、浮起平台及噴嘴之圖。 2 is a view of the guide rail, the moving unit, the floating platform, and the nozzle viewed from the transport direction.

圖3是供給用空氣流道及排氣用空氣流道之說明圖。 3 is an explanatory view of a supply air flow path and an exhaust air flow path.

圖4是感測器之說明圖。 4 is an explanatory diagram of a sensor.

圖5是重置機構(reset mechanism)之說明圖。 Fig. 5 is an explanatory diagram of a reset mechanism.

圖6是習知的塗佈裝置之說明圖。 Fig. 6 is an explanatory view of a conventional coating device.

以下根據圖面說明本發明的實施的形態。 Hereinafter, embodiments of the present invention will be described based on the drawings.

圖1是顯示本發明的塗佈裝置1的概略構成之斜視圖。該塗佈裝置1為對運送的薄板狀的基板W塗佈藥液或光阻液等的液狀物之塗佈液的裝置,具備:將基板W運送於水平的運送方向之運送機構部2;具有對透過該運送機構部2運送的基板W吐出並塗佈塗佈液的噴嘴30之塗佈機構部3。進而該塗佈裝置1具備由控制運送機構部2及塗佈機構部3的動作的電腦構成之控制裝置4。該塗佈裝置1為對處於固定狀態的噴嘴30,基板W被運送於水平方向的型式的裝置。此外,在本實施形態中,設基板W的運送方向為X方向,稱正交於該X方向的水平方向(Y方向)為橫向。再者,稱正交於X方向與Y方向的Z方向為高度方向。 Fig. 1 is a perspective view showing a schematic configuration of a coating device 1 of the present invention. The coating device 1 is a device that applies a coating liquid of a liquid material such as a chemical liquid or a photoresist liquid to the transported thin plate-shaped substrate W, and includes a transport mechanism unit 2 that transports the substrate W in a horizontal transport direction. A coating mechanism unit 3 having a nozzle 30 that discharges and applies a coating liquid to the substrate W that is transported through the transport mechanism unit 2. Further, the coating device 1 includes a control device 4 composed of a computer that controls the operation of the transport mechanism unit 2 and the application mechanism unit 3. This coating apparatus 1 is a type of apparatus in which the nozzles 30 are in a fixed state and the substrate W is conveyed in the horizontal direction. Further, in the present embodiment, the transport direction of the substrate W is the X direction, and the horizontal direction (Y direction) orthogonal to the X direction is the horizontal direction. Furthermore, the Z direction orthogonal to the X direction and the Y direction is referred to as the height direction.

與本實施形態有關的運送機構部2具有:由頂面噴出氣體(空氣)並使基板W浮起之浮起平台20;設置於該浮起平台20的橫向兩側的導軌21;保持透過浮起平台20浮起的基板W的橫向的端部E並沿著導軌21水平移動的移動單 元22。此外,因導軌21被設置於橫向兩側,故移動單元22也被配設於橫向兩側。 The transport mechanism unit 2 according to the present embodiment has a floating platform 20 that ejects gas (air) from the top surface to float the substrate W, and guide rails 21 that are provided on both lateral sides of the floating platform 20; a moving sheet that moves from the lateral end E of the substrate W that the platform 20 floats and moves horizontally along the guide rail 21 Yuan 22. Further, since the guide rails 21 are provided on both lateral sides, the moving unit 22 is also disposed on both lateral sides.

浮起平台20被分割為複數個,具備排列於連送方向的複數個平台單元(stage unit)。浮起平台20的寬度尺寸比基板W的左右方向尺寸小,成為基板W的橫向的端部E由浮起平台20突出的狀態。噴出的空氣的流量(噴出強度)透過控制裝置4控制,藉由該控制,以水平狀的姿勢使基板W浮起。因該浮起平台20的頂面20a成為之後說明的調整作業的基準面H0(參照圖4),故使該頂面20a成為水平面並使浮起平台20精度佳地構成而被設置。 The floating platform 20 is divided into a plurality of stages, and has a plurality of stage units arranged in the continuous direction. The width of the floating platform 20 is smaller than the size of the substrate W in the left-right direction, and the end portion E of the substrate W is protruded from the floating platform 20. The flow rate (discharge intensity) of the ejected air is controlled by the control device 4, and by this control, the substrate W is floated in a horizontal posture. Since the top surface 20a of the floating platform 20 is the reference surface H0 (refer FIG. 4) of the adjustment operation demonstrated later, it is set as the top surface 20a as a horizontal surface, and the floating platform 20 is comprised precisely.

導軌21在運送方向延伸成直線狀,被設置於運送的基板W的橫向兩側。而且,導軌21的橫剖面(cross section)為矩形,其頂面為水平,導軌21精度佳地構成而被設置。 The guide rails 21 extend linearly in the transport direction and are provided on both lateral sides of the transported substrate W. Further, the cross section of the guide rail 21 is rectangular, the top surface thereof is horizontal, and the guide rail 21 is configured to be excellent in accuracy.

移動單元22具有:沿著導軌21移動之底座構件23;使該底座構件23移動之驅動裝置;被搭載於底座構件23,在基板W的運送時保持基板W的橫向端部E之保持部。此外,與本實施形態有關的驅動裝置由包含線性馬達(linear motor)24的構成組成,而且與本實施形態有關的保持部由吸附浮起的基板W的橫向端部E的底面之吸附機構25構成。 The moving unit 22 has a base member 23 that moves along the guide rail 21, a driving device that moves the base member 23, and a holding portion that is mounted on the base member 23 and holds the lateral end portion E of the substrate W during transport of the substrate W. Further, the drive device according to the present embodiment is composed of a configuration including a linear motor 24, and the holding portion according to the present embodiment is configured by the suction mechanism 25 that adsorbs the bottom surface of the lateral end portion E of the floating substrate W. Composition.

吸附機構25吸附被搬進浮起平台20的上游側,浮起的基板W的端部E的底面,在保持該吸附狀態下,搭載該吸附機構25的底座構件23根據控制裝置4的控制並透過線性馬達24移動到下游側。據此,基板W被直線運送於水 平方向。而且,吸附機構25配設於浮起平台20的左右兩側的各個,沿著基板W的單側的端部E在前後方向具有規定間隔配設有複數台(在本實施形態中為三台)。單側的複數台吸附機構25被搭載於共通的底座構件23,成一體而移動。 The adsorption mechanism 25 adsorbs the bottom surface of the end portion E of the substrate W that is moved into the upstream side of the floating platform 20, and holds the base member 23 of the suction mechanism 25 under the control of the control device 4 while maintaining the suction state. The linear motor 24 is moved to the downstream side. According to this, the substrate W is transported straight to the water Flat direction. Further, the suction mechanism 25 is disposed on each of the left and right sides of the floating platform 20, and a plurality of stages are provided at predetermined intervals along the one-side end portion E of the substrate W in the front-rear direction (three in the present embodiment). ). The plurality of single-stage adsorption mechanisms 25 on one side are mounted on the common base member 23 and move integrally.

圖2是由運送方向看導軌21、移動單元22、浮起平台20及噴嘴30之圖。如前述,導軌21為橫剖面矩形,而且底座構件23具有:與該導軌21的頂面21a平行的上側構件11;由該上側構件11的橫向兩側部朝下延伸的側壁構件12、13,且具有由上面與由橫向兩側包圍導軌21的上部之剖面形狀。 2 is a view of the guide rail 21, the moving unit 22, the floating platform 20, and the nozzle 30 as seen from the transport direction. As described above, the guide rail 21 has a rectangular cross section, and the base member 23 has an upper side member 11 parallel to the top surface 21a of the guide rail 21, and side wall members 12, 13 extending downward from both lateral sides of the upper side member 11, And having a cross-sectional shape of the upper portion of the guide rail 21 surrounded by the upper side and the lateral sides.

而且,底座構件23具有對導軌21的頂面21a以非接觸使該底座構件23浮起的浮起機構部,與本實施形態有關的浮起機構部為對導軌21的頂面21a噴出空氣(壓縮空氣)之空氣噴出部26。空氣噴出部26被安裝於上側構件11,在本實施形態中於橫向配設有兩個。而且針對運送方向,空氣噴出部26也並排設置有複數個。空氣噴出部26在其下部具有氣墊(airpad)27,由該氣墊27內對導軌21的頂面21a噴壓縮空氣,該氣墊27成為由頂面21a稍微浮起的狀態,亦即成為非接觸的狀態。此外,例如可由多孔碳(porous carbon)、陶瓷(ceramic)、燒結金屬(sintered metal)等構成氣墊27。針對該浮起量,亦即壓縮空氣的噴出量是依照控制裝置4的控制。透過該等空氣噴出部26,底座構件23可對導軌21在浮起的狀態下沿著導軌21移 動。 Further, the base member 23 has a floating mechanism portion that floats the base member 23 in contact with the top surface 21a of the guide rail 21, and the floating mechanism portion according to the present embodiment ejects air to the top surface 21a of the guide rail 21 ( The air ejection portion 26 of the compressed air). The air ejecting portion 26 is attached to the upper member 11, and in the present embodiment, two are disposed in the lateral direction. Further, in the transport direction, the air ejecting portions 26 are also provided in plural numbers in parallel. The air ejecting portion 26 has an air pad 27 at a lower portion thereof, and compressed air is blown from the top surface 21a of the guide rail 21 in the air cushion 27, and the air cushion 27 is slightly floated by the top surface 21a, that is, it is non-contact. status. Further, for example, the air cushion 27 may be composed of porous carbon, ceramic, sintered metal or the like. The amount of the discharge, that is, the discharge amount of the compressed air is controlled in accordance with the control device 4. Through the air ejecting portions 26, the base member 23 can move along the guide rail 21 in a state where the guide rail 21 is in a floating state. move.

而且如圖3所示,在空氣噴出部26連接有成為壓縮空氣的供給源的泵(pump)14,除了將壓縮空氣供給至氣墊27的供給用空氣流道15之外,還連接有使殘留於空氣噴出部26(氣墊27)中的空氣放出到外部(大氣開放)的排氣用空氣流道16。再者,在所有的空氣噴出部26的泵側(上游側)的流道配設有閥(valve)17,可透過該閥17,選擇供給用空氣流道15與排氣用空氣流道16的任一方於與空氣噴出部26連接的流道。該選擇(閥17的切換)是藉由控制裝置4對閥17傳送控制信號而執行。為了塗佈作業而運送基板W時為供給用空氣流道15被選擇。排氣用空氣流道16被選擇的情形於之後說明,為調整噴嘴30對水平面的姿勢之調整作業的時候。 Further, as shown in FIG. 3, a pump 14 that serves as a supply source of compressed air is connected to the air ejection portion 26, and the compressed air is supplied to the supply air flow path 15 of the air cushion 27, and is connected to the residual portion. The air in the air ejecting portion 26 (air cushion 27) is released to the exhaust air passage 16 outside (the atmosphere is open). Further, a valve 17 is disposed in the flow path on the pump side (upstream side) of all the air ejecting portions 26, and the valve 17 is permeable to the supply air flow path 15 and the exhaust air flow path 16 through the valve 17. Either of them is in the flow path connected to the air ejection portion 26. This selection (switching of the valve 17) is performed by the control device 4 transmitting a control signal to the valve 17. When the substrate W is transported for the coating operation, the supply air flow path 15 is selected. The case where the exhaust air flow path 16 is selected will be described later, in order to adjust the adjustment operation of the nozzle 30 to the horizontal plane.

藉由圖1針對塗佈機構部3進行說明。塗佈機構部3如前述在橫向具有長的噴嘴30。噴嘴30被安裝於在橫向長的升降體34。在噴嘴30內遍及其橫向的約略全長形成有開縫31,開縫31在噴嘴30的頂端(下端)開口。塗佈液被供給至噴嘴30,藉由一邊運送基板W,一邊由開縫31使塗佈液吐出,可對基板W的橫向的約略全長(全寬)塗佈塗佈液。再者,處於噴嘴30的頂端對被運送的基板W空出高度方向的間隙而對向的狀態。 The coating mechanism unit 3 will be described with reference to Fig. 1 . The coating mechanism unit 3 has a nozzle 30 having a long length in the lateral direction as described above. The nozzle 30 is attached to the elevating body 34 that is long in the lateral direction. A slit 31 is formed in the nozzle 30 over substantially the entire length of the lateral direction, and the slit 31 is opened at the tip end (lower end) of the nozzle 30. The coating liquid is supplied to the nozzle 30, and the coating liquid is discharged by the slit 31 while the substrate W is being conveyed, whereby the coating liquid can be applied to the approximate full length (full width) of the substrate W in the lateral direction. Further, the tip end of the nozzle 30 is in a state of being opposed to the transported substrate W by a gap in the height direction.

依照以上的運送機構部2及塗佈機構部3,成為基板W浮起於距浮起平台20的頂面規定高度的狀態,在該狀態下,基板W的橫向的端部E的底面透過吸附機構25吸附。 藉由搭載該吸附機構25的底座構件23沿著導軌21水平移動,使基板W被運送於水平方向,在該運送的途中,對基板W的頂面由噴嘴30吐出塗佈液形成塗膜。 According to the transport mechanism unit 2 and the application mechanism unit 3 described above, the substrate W is floated at a predetermined height from the top surface of the floating platform 20, and in this state, the bottom surface of the lateral end portion E of the substrate W is permeable. Mechanism 25 adsorbs. The base member 23 on which the suction mechanism 25 is mounted is horizontally moved along the guide rail 21, and the substrate W is transported in the horizontal direction. In the middle of the transport, the coating liquid is discharged from the nozzle 30 on the top surface of the substrate W to form a coating film.

而且,在橫向兩側配設有支柱33當作塗佈機構部3的一部分,安裝噴嘴30的升降體34跨於支柱33、33間而被配設。支柱33具有當作支撐升降體34的橫向兩端部,並且將升降體34導引於上下方向之導件的功能。再者,塗佈機構部3具有沿著支柱33使升降體34升降於高度方向之升降驅動部32。升降驅動部32配設於兩側的支柱33的各個,由使升降體34的橫向的端部獨立上下移動之致動器(actuator)構成。而且,升降驅動部32可根據來自控制裝置4的控制信號動作,橫向兩側的升降驅動部32一同步動作,就可使噴嘴30平行移動於高度方向,而且僅藉由一方的升降驅動部32動作,就能調整噴嘴30的姿勢(調整作業)。例如當噴嘴30對水平面傾斜時,調整作業可消除該傾斜。 Further, the pillar 33 is disposed as a part of the coating mechanism portion 3 on both sides in the lateral direction, and the lifting body 34 of the attachment nozzle 30 is disposed across the pillars 33 and 33. The stay 33 has a function as a guide for supporting the lateral ends of the elevating body 34 and guiding the elevating body 34 to the upper and lower directions. Further, the application mechanism unit 3 has an elevation drive unit 32 that elevates the elevation body 34 in the height direction along the support 33. Each of the lift driving units 32 is disposed on each of the pillars 33 on both sides, and is configured by an actuator that vertically moves the end portions of the lifter 34 in the lateral direction. Further, the elevation drive unit 32 can be operated in accordance with a control signal from the control device 4, and the elevation drive units 32 on the lateral sides can be operated in synchronization, so that the nozzles 30 can be moved in parallel in the height direction, and only one of the elevation drive units 32 can be used. By the action, the posture of the nozzle 30 can be adjusted (adjustment work). For example, when the nozzle 30 is tilted to the horizontal plane, the adjustment work can eliminate the tilt.

可藉由具備以上的構成的塗佈裝置1進行將塗佈液塗佈於基板W之上的塗佈作業,而為了提高由形成於該基板W上的塗佈液構成的塗膜的品質(令膜厚成均勻),噴嘴30對基板W的頂面(水平面)平行,且使噴嘴30與基板W的間隙在橫向一定較佳。 The coating operation of applying the coating liquid onto the substrate W can be performed by the coating device 1 having the above configuration, and the quality of the coating film formed of the coating liquid formed on the substrate W can be improved ( The film thickness is made uniform, and the nozzles 30 are parallel to the top surface (horizontal plane) of the substrate W, and the gap between the nozzles 30 and the substrate W is preferably in the lateral direction.

因此,當進行例如由升降體34更換噴嘴30的作業時,需進行令更換後的噴嘴30的姿勢成水平的調整作業。如此為了調整噴嘴30對水平面的姿勢,如圖2所示,塗佈裝置 1具備檢測噴嘴30的橫向兩端部35中的高度位置的感測器7。再者,該感測器7與吸附機構25一起被搭載於底座構件23。此外,因底座構件23被設置於橫向兩側,故感測器7也被設置於橫向兩側,該等兩側的感測器7、7被配置於延伸於橫向的同一直線(假想線)上。而且,在橫向兩側各自的底座構件23上,感測器7藉由與吸附機構25在運送方向排成直線狀的配置而被搭載。 Therefore, when the operation of replacing the nozzle 30 by the elevating body 34 is performed, for example, an adjustment operation for leveling the posture of the nozzle 30 after replacement is performed. Thus, in order to adjust the posture of the nozzle 30 to the horizontal plane, as shown in FIG. 2, the coating device 1 A sensor 7 for detecting a height position in the lateral end portions 35 of the nozzle 30 is provided. Further, the sensor 7 is mounted on the base member 23 together with the suction mechanism 25. Further, since the base member 23 is disposed on both lateral sides, the sensor 7 is also disposed on both lateral sides, and the sensors 7 and 7 on the both sides are disposed on the same straight line extending from the lateral direction (imaginary line) on. Further, on the respective base members 23 on the lateral sides, the sensor 7 is mounted by being arranged in a line in the transport direction with the suction mechanism 25.

藉由感測器7被搭載於底座構件23,藉由底座構件23移動到噴嘴30之下的位置,可使感測器7位於噴嘴30的正下方。此外,底座構件23的位置透過控制裝置4管理,可藉由控制裝置4的控制,使感測器7位於噴嘴30的正下方位置。 By the sensor 7 being mounted on the base member 23, the base member 23 is moved to a position below the nozzle 30, so that the sensor 7 can be positioned directly below the nozzle 30. Further, the position of the base member 23 is managed by the control device 4, and the sensor 7 can be positioned directly below the nozzle 30 by the control of the control device 4.

如圖4所示,與本實施形態有關的感測器7為接觸式的感測器,具有:可接觸噴嘴30的橫向的端部35的下端面之接觸器(contactor)8;計測距基準面H0的接觸器8的頂端的高度位置之計測器9,可藉由使接觸器8的頂端接觸噴嘴30的端部35的下端面,使計測器9計測基準面H0到噴嘴30的端部35的下端面的高度h。此外,在本實施形態中基準面H0為浮起平台20的頂面20a。 As shown in Fig. 4, the sensor 7 according to the present embodiment is a contact type sensor having a contactor 8 which can contact the lower end surface of the lateral end portion 35 of the nozzle 30; The height measuring device 9 of the tip end of the contactor 8 of the surface H0 can cause the measuring device 9 to measure the reference surface H0 to the end of the nozzle 30 by bringing the tip end of the contactor 8 into contact with the lower end surface of the end portion 35 of the nozzle 30. The height h of the lower end face of 35. Further, in the present embodiment, the reference surface H0 is the top surface 20a of the floating platform 20.

再者,由該感測器7得到的基準面H0到噴嘴30的端部35的下端面的高度的值h在橫向兩側中被計測,計測值被輸入到控制裝置4。控制裝置4可根據該計測值求高度h的差,可根據該差進行用以令噴嘴30成水平的調整作業。 Further, the value h of the height of the reference surface H0 obtained by the sensor 7 to the lower end surface of the end portion 35 of the nozzle 30 is measured on both sides in the lateral direction, and the measured value is input to the control device 4. The control device 4 can determine the difference in height h based on the measured value, and can perform an adjustment operation for leveling the nozzle 30 based on the difference.

而且,為了該調整作業,在透過感測器7進行噴嘴30 的橫向兩端部35中的高度位置的檢測時,即使是由底座構件23所具有的空氣噴出部26(參照圖2)進行壓縮空氣的噴出並對導軌21使底座構件23浮起的狀態也可以,惟在本實施形態中為了調整作業,控制裝置4進行在搭載於底座構件23的感測器7位於噴嘴30的正下方的狀態下,使來自所有的空氣噴出部26的壓縮空氣的噴出停止的控制。如前述,進行壓縮空氣的噴出的氣墊27處於由導軌21的頂面21a稍微浮起的狀態,而藉由停止該噴出,成為空氣噴出部26接觸導軌21的頂面21a的狀態(成為浮起被解除的狀態)。也就是說為了調整作業而令成使浮起的底座構件23定位設置於導軌21上的狀態。 Moreover, for the adjustment work, the nozzle 30 is performed through the sensor 7. In the detection of the height position in the lateral end portions 35, the state in which the compressed air is ejected by the air ejecting portion 26 (see FIG. 2) included in the base member 23 and the rail member 21 is caused to float the base member 23 In the present embodiment, the control device 4 performs the discharge of the compressed air from all the air ejection portions 26 in a state where the sensor 7 mounted on the base member 23 is located directly below the nozzle 30. Stop control. As described above, the air cushion 27 that ejects the compressed air is slightly floated by the top surface 21a of the guide rail 21, and by stopping the discharge, the air ejection portion 26 comes into contact with the top surface 21a of the guide rail 21 (becomes floating). The state that was released). That is, in order to adjust the work, the floating base member 23 is positioned and placed on the guide rail 21.

再者,隨著停止壓縮空氣之供給至所有的空氣噴出部26,控制裝置4對閥17(參照圖3)傳送控制信號進行流道的切換,進行控制以便所有的空氣噴出部26與排氣用空氣流道16連接。據此,在使底座構件23定位設置於導軌21上時,可使殘留於所有的空氣噴出部26的空氣放出到外部(大氣開放)。 Further, as the supply of the compressed air is stopped to all of the air ejection portions 26, the control device 4 transmits a control signal to the valve 17 (refer to FIG. 3) to switch the flow path, and performs control so that all the air ejection portions 26 and the exhaust gas are exhausted. Connected by air flow passage 16. According to this, when the base member 23 is positioned and positioned on the guide rail 21, the air remaining in all of the air ejection portions 26 can be released to the outside (air atmosphere).

即使想透過控制裝置4使來自空氣噴出部26的壓縮空氣的噴出停止並使底座構件23定位設置於導軌21上,若在空氣噴出部26(氣墊27)內殘留空氣,則成為底座構件23浮起的狀態,無法確實使底座構件23定位設置於導軌21上。此情形,每次進行前述調整作業,都無法使底座構件23的高度位置成一定,再現性不被確保,其結果計測值產生了誤差。 Even if the discharge of the compressed air from the air ejecting unit 26 is stopped by the control device 4 and the base member 23 is positioned and positioned on the guide rail 21, if the air is left in the air ejecting portion 26 (the air cushion 27), the base member 23 floats. In the up state, the base member 23 cannot be surely positioned on the guide rail 21. In this case, the height position of the base member 23 cannot be made constant every time the above-described adjustment work is performed, and the reproducibility is not ensured, and as a result, an error occurs in the measured value.

但是在本實施形態中,因可經由排氣用空氣流道16將殘留於空氣噴出部26中的壓縮空氣放出到外部,故可確實使底座構件23定位設置於導軌21上,並且每次進行前述調整作業可確實使該狀態再現。而且,可藉由經由排氣用空氣流道16將壓縮空氣放出到外部,迅速使底座構件23定位設置於導軌21上。據此,利用感測器7進行的計測被迅速地進行。 However, in the present embodiment, since the compressed air remaining in the air ejection portion 26 can be released to the outside via the exhaust air passage 16, the base member 23 can be surely positioned on the guide rail 21, and each time. The aforementioned adjustment operation can surely reproduce the state. Further, the base member 23 can be quickly positioned and disposed on the guide rail 21 by discharging the compressed air to the outside via the exhaust air passage 16. According to this, the measurement by the sensor 7 is quickly performed.

如以上,在與本實施形態有關的塗佈裝置中,為了將基板W運送於水平的運送方向,導軌21對水平面尺寸精度佳地構成且被設置,而且搭載保持該基板W的吸附機構25的底座構件23也處於對水平面尺寸精度佳地構成,且在保持水平的狀態下精度佳地沿著導軌21移動之構成。再者,藉由在這種底座構件23搭載有感測器7,感測器7對水平面的安裝位置也成為高精度,可透過該感測器7精度佳地檢測噴嘴30的橫向兩端部35的高度位置。例如每次進行調整作業,感測器7對水平面的位置被再現,可提高檢測精度。 As described above, in the coating apparatus according to the present embodiment, in order to convey the substrate W in the horizontal transport direction, the guide rail 21 is configured to be excellent in the horizontal plane size, and the adsorption mechanism 25 that holds the substrate W is mounted. The base member 23 is also configured to have a high dimensional accuracy and to move along the guide rail 21 with high precision while maintaining the horizontal state. Further, by mounting the sensor 7 on the base member 23, the mounting position of the sensor 7 to the horizontal plane is also highly accurate, and the lateral ends of the nozzle 30 can be accurately detected through the sensor 7. 35 height position. For example, the position of the sensor 7 on the horizontal plane is reproduced every time the adjustment work is performed, and the detection accuracy can be improved.

再者,因搭載於底座構件23的吸附機構25為在基板W的運送時保持該基板W的橫向兩端部E(參照圖1)之構件,故該吸附機構25及搭載該吸附機構25的底座構件23存在於對應基板W的橫向兩端部E的位置。再者,藉由將感測器7搭載於存在於這種位置的底座構件23,無須如圖6所示之以往的長的臂,可在對應噴嘴30的橫向兩端部35的位置設置感測器7,用以配設感測器7的構成變的簡單。 In addition, since the adsorption mechanism 25 mounted on the base member 23 is a member that holds the lateral end portions E (see FIG. 1) of the substrate W during transportation of the substrate W, the adsorption mechanism 25 and the adsorption mechanism 25 are mounted. The base member 23 is present at a position corresponding to the lateral end portions E of the substrate W. Further, by mounting the sensor 7 on the base member 23 existing at such a position, it is possible to provide a sense of position at the lateral end portions 35 of the corresponding nozzles 30 without the conventional long arms as shown in FIG. The detector 7 is used to configure the simplicity of the configuration of the sensor 7.

再者,在本實施形態中為了調整作業,在搭載於底座構件23的感測器7位於噴嘴30的正下方的狀態下,使來自空氣噴出部26的壓縮空氣的噴出停止,使底座構件23定位設置於導軌21上。因此如前述,因導軌21對水平面尺寸精度佳地構成,而且搭載保持基板W的吸附機構25的底座構件23也對水平面尺寸精度佳地構成,故可藉由使這種底座構件23在噴嘴30的正下方位置定位設置於導軌21上,在搭載於該底座構件23的感測器7對水平面尺寸精度高的狀態下,位於噴嘴30的正下方。因此,在該狀態下,可藉由感測器7進行噴嘴30的橫向兩端部35中的高度位置的檢測而提高其檢測精度。 In the present embodiment, in order to adjust the operation, the sensor 7 mounted on the base member 23 is positioned directly below the nozzle 30, and the discharge of the compressed air from the air ejection portion 26 is stopped to cause the base member 23 to be detached. The positioning is set on the guide rail 21. Therefore, as described above, since the guide rail 21 is configured to have excellent dimensional accuracy, and the base member 23 on which the suction mechanism 25 for holding the substrate W is mounted is also excellent in dimensional accuracy, the base member 23 can be placed in the nozzle 30. The position directly under the positioning position is provided on the guide rail 21, and the sensor 7 mounted on the base member 23 is located directly below the nozzle 30 in a state where the dimensional accuracy of the horizontal plane is high. Therefore, in this state, the detection accuracy can be improved by detecting the height position in the lateral end portions 35 of the nozzle 30 by the sensor 7.

而且,吸附機構25吸附保持基板W的橫向兩端部E,而在塗佈作業的時候,噴嘴30的橫向的端部35位於該基板W的端部E的上方。因此,若藉由與吸附機構25排列在運送方向的配置將感測器7搭載於底座構件23,使該底座構件23沿著導軌21移動並使感測器7位於噴嘴30的正下方,則感測器7可位於對應噴嘴30的橫向的端部35的位置。因此,可使用感測器7迅速地開始噴嘴30的高度位置的檢測。 Further, the adsorption mechanism 25 adsorbs and holds the lateral end portions E of the substrate W, and at the time of the coating operation, the lateral end portion 35 of the nozzle 30 is positioned above the end portion E of the substrate W. Therefore, when the sensor 7 is mounted on the base member 23 by the arrangement in which the adsorption mechanism 25 is arranged in the transport direction, the base member 23 is moved along the guide rail 21 and the sensor 7 is positioned directly below the nozzle 30. The sensor 7 can be located at a position corresponding to the lateral end 35 of the nozzle 30. Therefore, the detection of the height position of the nozzle 30 can be quickly started using the sensor 7.

而且在圖4中,設規定的水平面為基準面H0,感測器7的計測器9被設定,以便能精度佳地檢測噴嘴30的端部35的下端面的高度位置,惟為了發生需重新評價該設定的情形,本實施形態的塗佈裝置1具備重置機構。 Further, in Fig. 4, the predetermined horizontal plane is assumed to be the reference plane H0, and the measuring device 9 of the sensor 7 is set so that the height position of the lower end surface of the end portion 35 of the nozzle 30 can be accurately detected, but it is necessary to recreate In the case where the setting is evaluated, the coating device 1 of the present embodiment includes a reset mechanism.

該重置機構如圖5所示具有:設置於基準面H0上的基 準構件40;將該基準構件40運送至基準面H0上的規定位置之致動器(未圖示)。在本實施形態中基準面H0為浮起平台20的頂面20a。致動器為進行直線的伸縮動作的構成,該致動器一伸張,就使基準構件40承載於浮起平台20的頂面20a,該致動器一縮短,就使基準構件40退避至退避位置。該退避位置為在塗佈作業等的時候,基準構件40不造成妨礙的位置。 The reset mechanism has a base disposed on the reference plane H0 as shown in FIG. The quasi member 40; an actuator (not shown) that carries the reference member 40 to a predetermined position on the reference surface H0. In the present embodiment, the reference surface H0 is the top surface 20a of the floating platform 20. The actuator is configured to perform a linear telescopic movement. When the actuator is extended, the reference member 40 is carried on the top surface 20a of the floating platform 20. When the actuator is shortened, the reference member 40 is retracted to retreat. position. This retracted position is a position at which the reference member 40 does not interfere with it during a coating operation or the like.

基準構件40的底面41一放置在浮起平台20的頂面20a,其一部分就由浮起平台20的橫向端部突出,可使感測器7的接觸器8的頂端接觸該突出的部分的底面41。基準構件40的底面41以水平面構成,可使接觸器8的頂端與浮起平台20的頂面20a對齊於相同高度。再者,在對齊於該相同高度的狀態下,計測器9重新設定感測器7的原點。據此,在感測器7中浮起平台20的頂面20a成為基準面H0而被重新設定。其結果,當發生重新評價感測器7(計測器9)的設定的必要時,可透過重置機構迅速地進行該作業。 The bottom surface 41 of the reference member 40 is placed on the top surface 20a of the floating platform 20, a portion of which protrudes from the lateral end of the floating platform 20, so that the top end of the contactor 8 of the sensor 7 contacts the protruding portion. Bottom surface 41. The bottom surface 41 of the reference member 40 is formed in a horizontal plane, and the tip end of the contactor 8 can be aligned with the top surface 20a of the floating platform 20 at the same height. Furthermore, the meter 9 resets the origin of the sensor 7 in a state of being aligned at the same height. As a result, the top surface 20a of the floating platform 20 in the sensor 7 becomes the reference surface H0 and is reset. As a result, when it is necessary to re-evaluate the setting of the sensor 7 (meter 9), the operation can be quickly performed by the reset mechanism.

而且,本發明的塗佈裝置不限於圖示的形態,在本發明的範圍內其他的形態的塗佈裝置也可以。例如雖然說明了與本實施形態有關的浮起平台20為了使基板W浮起而使用空氣的情形,但不限於此,也可以使用超音波。而且,基板W的運送為浮起運送以外也可以。而且,雖然感測器7以接觸式,但也可以為非接觸式。再者,保持基板W的端部E的保持部雖然以基於空氣的吸引的吸附機構25進行 了說明,但基於空氣的吸引的吸附機構25以外也可以。 Further, the coating device of the present invention is not limited to the illustrated embodiment, and a coating device of another embodiment may be within the scope of the present invention. For example, although the floating platform 20 according to the present embodiment has been described in which air is used to float the substrate W, the present invention is not limited thereto, and ultrasonic waves may be used. Further, the conveyance of the substrate W may be carried out in addition to the floating conveyance. Moreover, although the sensor 7 is in a contact type, it may be a non-contact type. Further, the holding portion that holds the end portion E of the substrate W is carried out by the suction mechanism 25 that is attracted by air. Although it is described, it may be other than the adsorption mechanism 25 that attracts air.

再者在前述實施形態中,雖然浮起機構部以噴出空氣的空氣噴出部26,以透過空氣使底座構件23浮起的情形進行了說明,但除了空氣以外也可以為氮氣等的其他的氣體。 Further, in the above-described embodiment, the floating mechanism portion has been described in which the air ejecting portion 26 that ejects air is used to float the base member 23 through the air. However, other gases such as nitrogen may be used in addition to air. .

而且,以對導軌21底座構件23為非接觸的構成,亦即浮起機構部的構成除了基於氣體的噴出的構成以外,也可以為例如磁浮(magnetic levitation)、超音波浮起(ultrasonic levitation)、靜電浮起(electrostatic levitation)等。 Further, the configuration in which the base member 23 of the guide rail 21 is non-contact, that is, the configuration of the floating mechanism portion may be, for example, magnetic levitation or ultrasonic levitation, in addition to the configuration based on the discharge of gas. , electrostatic levitation, etc.

而且在前述實施形態中,雖然說明了在使底座構件23定位設置於導軌21上時,透過排氣用空氣流道16(參照圖3)使殘留於空氣噴出部26的空氣放出到外部(大氣開放)的情形,但為了更迅速地使底座構件23定位設置,未圖示,也可以設置強制地排出空氣噴出部26(氣墊27)內的空氣之吸引裝置。吸引裝置能以泵、鼓風機(blower)等,將該吸引裝置連接於排氣用空氣流道16也可以。此情形可藉由透過吸引裝置產生的負壓,使空氣噴出部26(氣墊27)吸附於導軌21上。 Further, in the above-described embodiment, when the base member 23 is positioned on the guide rail 21, the air remaining in the air discharge portion 26 is released to the outside through the exhaust air passage 16 (see FIG. 3). In the case of opening, in order to position the base member 23 more quickly, a suction device for forcibly discharging the air in the air ejection portion 26 (air cushion 27) may be provided, not shown. The suction device may be connected to the exhaust air flow passage 16 by a pump, a blower or the like. In this case, the air ejecting portion 26 (the air cushion 27) can be attracted to the guide rail 21 by the negative pressure generated by the suction means.

或者,為了迅速地使底座構件23定位設置,以底座構件23(至少其一部分)為磁性體(magnetic body),使電磁鐵(electromagnet)內裝於例如導軌21,透過該電磁鐵的磁力使底座構件23吸附於導軌21也可以。 Alternatively, in order to rapidly position the base member 23, the base member 23 (at least a part thereof) is a magnetic body, and an electromagnet is incorporated in, for example, the guide rail 21, and the magnetic force transmitted through the electromagnet causes the base The member 23 may be adsorbed to the guide rail 21.

再者,為了迅速地使底座構件23定位設置的另一手段 也可以為透過伸縮氣缸(cylinder)等的致動器,或透過馬達驅動的臂等的構件,對底座構件23給予朝導軌21的頂面21a的方向的外力,將底座構件23按壓於導軌21上之構成。 Furthermore, another means for positioning the base member 23 quickly The base member 23 may be biased toward the top surface 21a of the guide rail 21 by an actuator such as a telescopic cylinder or a member driven by a motor or the like, and the base member 23 may be pressed against the guide rail 21 . The composition of the above.

1‧‧‧塗佈裝置 1‧‧‧ Coating device

2‧‧‧運送機構部 2‧‧‧Transportation Department

3‧‧‧塗佈機構部 3‧‧‧ Coating Agency

7‧‧‧感測器 7‧‧‧Sensor

20‧‧‧浮起平台 20‧‧‧Floating platform

20a‧‧‧頂面 20a‧‧‧ top

21‧‧‧導軌 21‧‧‧ rails

22‧‧‧移動單元 22‧‧‧Mobile unit

23‧‧‧底座構件 23‧‧‧Base member

24‧‧‧線性馬達 24‧‧‧Linear motor

25‧‧‧吸附構件(保持部) 25‧‧‧Adsorption member (holding part)

30‧‧‧噴嘴 30‧‧‧Nozzles

31‧‧‧開縫 31‧‧‧ slitting

32‧‧‧升降驅動部 32‧‧‧ Lifting and Driving Department

33‧‧‧支柱 33‧‧‧ pillar

34‧‧‧升降體 34‧‧‧ Lifting body

E‧‧‧基板的橫向端部 E‧‧‧ lateral end of the substrate

W‧‧‧基板 W‧‧‧Substrate

Claims (3)

一種塗佈裝置,其特徵包含:將基板運送於水平的運送方向之運送機構部;具有:在正交於該運送方向的水平的橫向長,且對被運送的基板空出高度方向的間隙而對向的噴嘴,及使該噴嘴升降於高度方向的升降驅動部,對該基板由該噴嘴吐出塗佈液之塗佈機構部;以及為了調整該噴嘴對水平面的姿勢而檢測該噴嘴的橫向兩端部中的高度位置之感測器,該運送機構部包含:設置於運送的基板的橫向兩側,延伸於該運送方向之導軌;沿著該導軌移動之底座構件;以及搭載於該底座構件,在運送該基板時保持該基板的橫向兩端部之保持部,該感測器與該保持部一起被搭載於該底座構件,該底座構件具有對該導軌的頂面使該底座構件浮起的浮起機構部,在該底座構件透過該浮起機構部而對該導軌浮起的狀態下移動,在透過該感測器進行該噴嘴的橫向兩端部中的高度位置的檢測時,在搭載於該底座構件的該感測器位於該噴嘴的正下方的狀態下,解除利用該浮起機構部進行的該底座構件的浮起,使該底座構件定位設置於該導軌上。 A coating apparatus comprising: a transport mechanism that transports a substrate in a horizontal transport direction; and has a lateral length that is orthogonal to a horizontal direction of the transport direction, and a gap in a height direction is vacated with respect to the transported substrate. a counter nozzle, an elevating drive unit for elevating and lowering the nozzle in a height direction, an application mechanism unit for ejecting the coating liquid from the nozzle to the substrate, and two lateral directions of the nozzle for adjusting the posture of the nozzle to the horizontal plane a sensor for a height position in the end portion, the transport mechanism portion comprising: a guide rail disposed on two lateral sides of the transported substrate, extending in the transport direction; a base member moving along the guide rail; and being mounted on the base member Holding the holding portion of the lateral end portions of the substrate when the substrate is transported, the sensor is mounted on the base member together with the holding portion, the base member having the top surface of the rail to float the base member The floating mechanism portion moves in a state in which the base member is suspended by the floating mechanism portion, and the lateral ends of the nozzle are transmitted through the sensor. In the detection of the height position, in a state in which the sensor mounted on the base member is located directly below the nozzle, the floating of the base member by the floating mechanism portion is released, and the base member is positioned and set. On the rail. 如申請專利範圍第1項之塗佈裝置,其中該浮起機構部由藉由對該導軌的頂面噴出氣體使該底座構件浮起的噴出部構成。 The coating device according to claim 1, wherein the floating mechanism portion is constituted by a discharge portion that ejects a gas to the top surface of the guide rail to float the base member. 如申請專利範圍第2項之塗佈裝置,其中將在使該底座構件定位設置於該導軌上時殘留於該噴出部的氣體放出到外部的流道被連接於該噴出部。 A coating apparatus according to claim 2, wherein a flow path in which gas remaining in the discharge portion is discharged to the outside when the base member is positioned on the guide rail is connected to the discharge portion.
TW102100474A 2012-03-12 2013-01-07 Coating device TWI559365B (en)

Applications Claiming Priority (1)

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