200922697 九、發明說明 【發明所屬之技術領域】 本發明是關於塗佈裝置及塗佈裝置的清潔方法。 本案是根據於2〇〇7年9月6日在日本所申請的曰本 特願2007 — 23 1 534號案來主張優先權，在此引用其內容 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上，形成 有配線圖案或電極圖案等的細微圖案。一般來說這種圖案 ’是用例如光微影技術等的方法所形成。在光微影技術中 ，分別進行：在玻璃基板上形成光阻膜的步驟、將該光阻 膜進行圖案曝光的步驟、及之後將該光阻膜予以顯像的步 驟。 已知的作爲在基板上塗佈光阻膜的塗佈裝置，是例如 將狹縫噴嘴固定，對於移動於該狹縫噴嘴下的玻璃基板塗 佈光阻劑。在這其中習知的塗佈裝置，是藉由將氣體噴出 到台部上，來使基板浮起移動（例如參考專例文獻1 )。 在這種塗佈裝置，在台部表面設置有氣體噴出孔及吸引孔 ，藉由進行氣體的噴出及吸引，而能調節基板的浮起量， 在一邊調節基板的浮起高度一邊使基板浮起的狀態，進行 光阻劑的塗佈。 在該塗佈裝置，有時例如殘留於狹縫噴嘴內的光阻劑 等會不小心地掉落在台部上。當掉落的光阻劑進入氣體噴 -5 - 200922697 出孔或吸引孔的內部時’就很難保持正常的氣體噴出壓力 及吸引壓力’而可能會很難調節基板的浮起量，所以必須 將該光阻劑除去。 〔專利文獻1〕 日本特開2005 — 236092號公報 【發明內容】 〔發明欲解決的課題〕 可是，在上述塗佈裝置’要將進入到氣體噴出孔或吸 引孔的內部的光阻劑除去’則需要將台部分解，會有作業 效率非常差的問題。而又產生了確保用來分解台部的作業 空間的必要性。 鑑於以上的情形，本發明的目的，要提供一種塗佈裝 置及塗佈裝置的清潔方法’能使作業效率提升，且可使作 業空間達到節省空間化。 〔用以解決課題的手段〕 爲了達成上述目的，本發明的第一型態的塗佈裝置， 是具備有：使基板浮起來進行搬運的基板搬運部、及在藉 由該基板搬運部搬運基板的同時對上述基板塗佈液狀體的 塗佈部’的塗佈裝置，是具備有··在上述基板搬運部設置 有複數個’可進行氣體的噴出及吸引的孔部；以及將從上 述複數的孔部噴出氣體的噴出模式、與從上述複數的孔部 吸引氣體的吸引模式進行切換的控制手段。 -6- 200922697 藉由該型態，具備有：在基板搬運部設置有複數個， 可進行氣體的噴出及吸引的孔部；以及將從複數的孔部噴 出氣體的噴出模式、與從複數的孔部吸引氣體的吸引模式 進行切換的控制手段；所以當液狀體掉落在基板搬運部時 ，藉由將孔部調整成吸引模式，則能將進入到孔部的液狀 體予以吸引。因此，就不需要分解基板搬運部，也不需要 分解用的空間。藉此，可使作業效率提升，也能使作業空 間達到節省空間化。 上述塗佈裝置，上述孔部，是爲了使上述基板浮起而 進行氣體的噴出及吸引。 在孔部爲了使基板浮起而進行氣體的噴出及吸引的構 造，會因爲液狀體進入到孔部而很難正確地調節基板的浮 起高度。相對地，藉由該實施方式，如上述能將孔部切換 爲吸引模式，所以即使當液狀體進入孔部時，也能調節基 板的浮起高度使其穩定化。 上述塗佈裝置，上述控制手段具有：針對在上述基板 搬運部之中在對應於上述塗佈部的區域處設置的上述孔部 ，來進行切換上述噴出模式及上述吸引模式的手段。 液狀體特別容易掉落在，基板搬運部之中對應於塗佈 部的區域’而容易因爲液狀體的掉落，而對於塗佈在基板 上的液狀體的塗佈狀態造成不好的影響。相對地，藉由該 實施方式，控制手段針對在基板搬運部之中在對應於塗佈 部的區域處設置的孔部’來進行切換噴出模式及吸引模式 ，所以能將掉落在對應於該塗佈部的區域的液狀體予以吸 200922697 引。藉此，則能避免對於液狀體的塗佈狀態造成不好的影 響° 上述塗佈裝置，又具備有：檢測從上述複數的孔部所 吸引的吸引物的第一感應器。 藉由該實施方式，又具備有：檢測從複數的孔部所吸 引的吸引物的第一感應器，所以能確認是否有液狀體掉落 在基板搬運部。第一感應器也可作成能將所掉落的液狀體 的量等加以確認的構造。 上述塗佈裝置，上述控制手段具有：根據上述第一感 應器的檢測結果，來使上述基板的搬運動作及上述液狀體 的塗佈動作停止的手段。 藉由該實施方式，控制手段根據第一感應器的檢測結 果’來使基板的搬運動作及上述液狀體的塗佈動作停止， 所以當液狀體掉落於基板搬運部時，能避免繼續進行基板 的搬運動作及液狀體的塗佈動作。 上述塗佈裝置，又具備有：將從上述複數的孔部所吸 引的吸引物予以儲存的暫存槽。 藉由該實施方式，又具備有：將從複數的孔部所吸引 的吸引物予以儲存的暫存槽，所以當進行吸引時不需要將 吸引物廢棄。藉此可提升作業效率。 上述的塗佈裝置’上述控制手段，具有：當在上述暫 存槽儲存預定量以上的上述吸引物時，則將上述吸引物排 出的手段。 藉由該實施方式，藉由控制手段，當在暫存槽儲存預 -8 - 200922697 定量以上的吸引物時，則將吸引物排出，所以不需要確認 要將儲存於暫存槽的吸引物的量進行吸引的時機。藉此， 可以提升作業效率。 上述塗佈裝置，又具備有：與上述複數的孔部連接的 流通路、及將洗淨液供給到上述流通路的洗淨液供給部。 藉由該實施方式，又具備有：與複數的孔部連接的流 通路、及將洗淨液供給到該流通路的洗淨液供給部；所以 能將從複數的孔部所吸引的吸引物（包含液狀體）予以洗 淨。藉此，能防止吸引物堵塞於複數的孔部。 上述塗佈裝置，上述流通路是配管’而該配管是連接 於：用來將氣體供給到上述複數的孔部的氣體供給手段、 及用來從上述複數的孔部進行吸引的吸引手段；又具備有 :於上述流通路設置以讓上述氣體供給手段及上述吸引手 段的其中任一方連接於上述複數的孔部的閥部。 藉由該實施方式，流通路是配管’而該配管是連接於 :用來將氣體供給到複數的孔部的氣體供給手段、及用來 從複數的孔部進行吸引的吸引手段；將閥部於上述流通路 設置成：讓該氣體供給手段及吸引手段的其中任一方連接 於複數的孔部，所以能容易藉由該閥部來切換噴出模式及 吸引模式。 上述塗佈裝置，又具備有：將上述孔部的上述氣體噴 出及上述吸引的狀態予以檢測的第二感應器° 藉由該實施方式，又具備有：將孔部的氣體噴出及吸 引的狀態予以檢測的第二感應器，所以能夠檢測在氣體的 -9- 200922697 噴出及吸引的狀態是否有異常情形。 上述塗佈裝置’上述控制手段’具有：根據上述第二 感應器的檢測結果，來進行上述複數的孔部的回復動作的 手段。 藉由該實施方式’控制手段會根據第二感應器的檢測 結果，來進行複數的孔部的回復動作’所以當檢測出在氣 體的噴出及吸引狀態沒有異常時則可進行回復動作。因此 ，可從孔部穩定噴出氣體，而能進行穩定的吸引動作。作 爲該回復動作，例如包含有：噴出模式及吸引模式的切換 、噴出模式的氣體噴出量的調節及吸引模式的吸引量的調 節等。 上述塗佈裝置，上述控制手段，具有：根據上述第二 感應器的檢測結果’使上述基板的搬運動作及上述液狀體 的塗佈動作停止的手段。 藉由該實施方式’控制手段會根據第二感應器的檢測 結果’使基板的搬運動作及液狀體的塗佈動作停止，所以 當氣體的噴出及吸引的狀態有異常時，則能使基板的搬運 動作及液狀體的塗佈動作停止。因此，在無法穩定從孔部 噴出氣體的情況，或無法穩定進行吸引的情況，則能避免 進行基板的搬運及液狀體的塗佈動作。 本發明的第二型態的塗佈裝置的清潔方法，是具備有 :使基板浮起來進行搬運的基板搬運部、及在藉由該基板 搬運部搬運基板的同時對上述基㈤塗佈液狀體的塗佈部， 的塗佈裝關清潔方法，在上述基板搬_，㈣有複數 -10- 200922697 個可進行氣體的噴出及吸引的孔部’因應於上述基板搬運 部的狀態，在上述複數的孔部進行吸引。 藉由該型態’在基板搬運部’設置有複數個可進行氣 體的噴出及吸引的孔部’因應於基板搬運部的狀態’在該 複數的孔部進行吸引，所以當液狀體掉落在基板搬運部時 ，則能將進入到孔部的液狀體予以吸引。因此’就不需要 分解基板搬運部，也不需要分解用的空間。藉此’可使作 業效率提升，也能使作業空間達到節省空間化。 上述塗佈裝置的清潔方法’包含有：將從上述複數的 孔部所吸引的吸引物予以檢測的方式。 藉由該實施方式，由於將從複數的孔部所吸引的吸引 物予以檢測，所以能確認液狀體是否掉落於基板搬運部。 而也可作成能確認所掉落的液狀體的量等。 上述塗佈裝置的清潔方法’包含有：根據上述檢測的 結果來進行上述吸引的方式。 藉由該實施方式，是根據檢測結果來進行吸引，所以 當判斷液狀體掉落時能有效率地進行吸引。 上述塗佈裝置的清潔方法，包含有：根據上述檢測結 果來使上述基板的搬運動作及上述液狀體的塗佈動作停止 的方式。 藉由該貫施方式’根據檢測結果來使基板的搬運動作 及液狀體的塗佈動作停止，所以當液狀體掉落於基板搬運 部時，能避免繼續進行基板的搬運動作及液狀體的塗佈動 作。 -11 - 200922697 上述塗佈裝置的清潔方法，包含有：在每次上述塗佈 裝置的啓動、每經過預定時間、每處理過預定片數的上述 基板、或每次上述液狀體的塗佈動作之間，進行上述檢測 動作的方式。 藉由該實施方式，在每次塗佈裝置的啓動、每經過預 定時間、每處理過預定片數的基板、或每次液狀體的塗佈 動作之間，進行檢測動作，所以能以適當的時機進行吸引 〇 上述塗佈裝置的清潔方法，包含有：上述塗佈裝置具 備有與上述複數的孔部連接的流通路，在上述吸引動作之 後或與上述吸引動作同時，將洗淨液供給到上述流通路內 的方式。 藉由該實施方式，在吸引動作之後或與吸引動作同時 ’將洗淨液供給到與複數的孔部連接的流通路內，所以能 將從複數的孔部所吸引的吸引物（包含液狀體）予以洗淨 。藉此，則能防止吸引物堵塞於複數的孔部。 在與吸引動作同時供給洗淨液的情況，能將吸引物與 該洗淨液一起予以吸引，所以能提升作業效率。 上述塗佈裝置的清潔方法，包含有：在上述洗淨液供 給後，使上述流通路內乾燥的方式。 藉由該實施方式’在洗淨液供給後’使流通路內乾燥 ，所以能防止將溼度較高的氣體供給到基板搬運部。而藉 由防止將溼度較高的氣體供給到基板搬運部’而能防止污 染基板。 -12- 200922697 上述塗佈裝置的清潔方法’包含有：將上述孔部的氣 體的噴出狀態及上述吸引狀態予以檢測的方式。 藉由該實施方式，將孔部的氣體的噴出狀態及吸引狀 態予以檢測，所以一旦在氣體的噴出及吸引狀態有異常情 形，就能夠檢測到。 上述塗佈裝置的清潔方法，包含有：根據上述檢測結 果，進行上述複數的孔部的回復動作。 藉由該實施方式，根據檢測結果，進行複數的孔部的 回復動作，所以在氣體的噴出及吸引的狀態檢測出沒有異 常的情況，可以進行回復動作。因此，可從孔部穩定噴出 氣體，而能進行穩定的吸引動作。作爲該回復動作，例如 包含有：噴出模式及吸引模式的切換、噴出模式的氣體噴 出量的調節及吸引模式的吸引量的調節等。 上述塗佈裝置的清潔方法’包含有：根據上述檢測結 果，使上述基板的搬運動作及上述液狀體的塗佈動作停止 的方式。 藉由該實施方式’根據檢測結果，使基板的搬運動作 及液狀體的塗佈動作停止’所以當氣體的噴出及吸引的狀 態有異吊時’則能使基板的搬運動作及液狀體的塗佈動作 诤止。因此，在無法穩定從孔部噴出氣體的情況，或無法 穩定進行吸引的情況，則能避免進行基板的搬運及液狀體 的塗佈動作。 〔發明效果〕 -13- 200922697 藉由本發明，可使塗佈裝置的作業效率提升，可使作 業空間達到節省空間化。 【實施方式】 以下根據圖面來說明本發明的實施方式。 第1圖是本實施方式的塗佈裝置1的立體圖。 如第1圖所示，本實施方式的塗佈裝置1，是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置，是 以：基板搬運部2、塗佈部3、管理部4，爲主要構成元 件。該塗佈裝置1，是藉由基板搬運部2使基板浮起來進 行搬運，且藉由塗佈部3將光阻劑塗佈於該基板上，藉由 管理部4來管理塗佈部3的狀態。 第2圖是塗佈裝置1的正視圖，第3圖是塗佈裝置1 的俯視圖，第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。 (基板搬運部） 首先來說明基板搬運部2的構造。 基板搬運部2具有：基板搬入區域20、塗佈處理區 域21、基板搬出區域22、搬運機構23、以及支承這些構 造的框架部24。在該基板搬運部2，是藉由搬運機構23 將基板S依序搬運到基板搬入區域2 0、塗佈處理區域2 1 、及基板搬出區域2 2。基板搬入區域2 0、塗佈處理區域 2 1、及基板搬出區域22，是以該順序從基板搬運方向的 -14 - 200922697 上游側排列到下游側。搬運機構23，爲了要涵蓋基板搬 入區域20、塗佈處理區域21、及基板搬出區域22的各部 分，而設置在該各部分的其中一側。 以下在說明塗佈裝置1的構造時，爲了容易表示，使 用XYZ座標來說明圖中的方向。將基板搬運部2的長軸 方向也就是基板的搬運方向記爲X方向。將從俯視方向 觀察與X方向（基板搬運方向）垂直相交的方向記爲Y 方向。將與包含X方向軸及γ方向軸的平面垂直的方向 記爲Z方向。分別在X方向、Y方向及Z方向，圖中箭 頭的方向爲+方向，與箭頭的方向相反的方向爲-方向。 基板搬入區域20，是將從裝置外部搬運過來的基板s 予以搬入的部位，具有：搬入側台25、與升降機構26。 搬入側台25，設置在框架部24的上部，是例如由 SU S等所構成的從俯視方向觀察爲矩形的板狀構件。該搬 入側台25，其X方向爲長軸。在搬入側台25，分別設有 複數的空氣噴出孔25a、與複數的升降銷出沒孔25b。該 空氣噴出孔25a及升降銷出沒孔25b，是設置成貫穿搬入 側台25。 空氣噴出孔25a，是將空氣噴出到搬入側台25的台 表面2 5 c上的孔，例如在搬入側台2 5之中基板S通過的 區域配置成從俯視方向觀察爲矩陣狀。該空氣噴出孔2 5 a 連接著沒有圖示的空氣供給源。在該搬入側台25 ’藉由 從空氣噴出孔2 5 a所噴出的空氣而能使基板S朝+ Z方向 浮起。 -15- 200922697 升降銷出沒孔2 5 b ’是設置在搬入側台2 5之中基 搬入的區域。該升降銷出沒孔25b，讓供給到台表面 的空氣不會漏出。 在該搬入側台25之中的Y方向的兩端部，各設 一個校準裝置25d。校準裝置25d，是將搬入到搬入 25的基板S予以定位的裝置。各校準裝置25d具有 孔部、與設在該長孔部內的定位構件，將搬入到搬入 2 5的基板從兩側機械性地予以夾持。 升降機構2 6，是設置在搬入側台2 5的基板搬入 的背面側。該升降機構2 6具有：升降構件2 6 a、與 的升降銷26b。升降構件26a，連接於沒有圖示的驅 構，藉由該驅動機構的驅動而讓升降構件2 6 a朝Z方 動。複數的升降銷26b，從升降構件26a的上面部朝 入側台25豎立設置。各升降銷26b，是配置在：從 方向觀察分別與上述升降銷出沒孔25b重疊的位置。 讓升降構件26a朝Z方向移動，則各升降銷26b會從 銷出沒孔25b出沒於台表面25c上。各升降銷26b白 方向的端部是設置成分別與Z方向上的位置一致，而 從裝置外部搬運過來的基板S保持爲水平的狀態。 塗佈處理區域2 1，是進行光阻劑的塗佈處理的 ，設置有：將基板S浮起支承的處理台27。 處理台2 7，是以例如硬質氧化鋁膜爲主成分的 收材料來覆蓋台表面2：7C的從俯視方向觀察爲矩形的 構件，是設置在相對於搬入側台25的+ X方向側。 板S 25c 置有 側台 :長 側台 位置 複數 動機 向移 向搬 俯視 藉由 升降 J + Z 能將 部位 光吸 板狀 在處 -16- 200922697 理台27之中以光吸收材料覆蓋的部位，會抑制雷射光等 的光線反射。該處理台27，γ方向爲長軸。處理台27的 Y方向的尺寸，與搬入側台25的Y方向尺寸大致相同。 在處理台27設置有：將空氣噴出到台表面27c上的複數 的空氣噴出孔27a、與將台表面27c上的空氣予以吸引的 複數的空氣吸引孔27b。這些空氣噴出孔27a及空氣吸引 孔27b，設置成貫穿處理台27。在處理台27的內部，設 置有沒有圖示的複數個溝部，該溝部用來對通過空氣噴出 孔27a及空氣吸引孔27b的氣體的壓力施予阻力。該複數 的溝部，在台部內部連接於空氣噴出孔27a及空氣吸引孔 27b ° 在處理台27，空氣噴出孔27a的間距，是相較於設 置在搬入側台2 5的空氣噴出孔2 5 a的間距更狹窄，與搬 入側台25相比，將空氣噴出孔27a設置得較緊密。因此 ，與其他的台部相比，在該處理台27能以較高精確度來 調節基板的浮起量，基板的浮起量例如可控制爲1 00 // m 以下，而5 0 // m以下較佳。 基板搬出區域2 2，是用來將塗佈有光阻劑的基板S 搬出到裝置外部的部位，具有：搬出側台2 8、與升降機 構2 9。該搬出側台2 8，設置在相對於處理台2 7的+ X方 向側’由與設置在基板搬入區域2 0的搬入側台2 5約相同 的材質、尺寸所構成。與搬入側台2 5同樣地，在搬出側 台28設置有：空氣噴出孔28a及升降銷出沒孔28b。升 降機構2 9，設置在搬出側台2 8的基板搬出位置的背面側 =17 - 200922697 ’例如以框架部24來支承。升降機構29的升降構件29a 及升降銷29b，與設置在基板搬入區域20的升降機構26 的各部位爲相同的構造。該升降機構29，當將搬出側台 28上的基板s搬出到外部裝置時，能藉由基板S交接用 的升降銷2 9b來將基板S抬起。 搬運機構23，具有：搬運機23a、真空襯墊23b、軌 道23c。搬運機23a的構造是在內部設置有例如線性馬達 ’藉由驅動該線性馬達，讓搬運機23a可於軌道23c上移 動。 該搬運機23a是配置成：在俯視方向觀察讓預定的部 分2 3 d重疊於基板S的- Y方向端部。與該基板S重疊的 部分23 d，是設置在：較當使基板S浮起時的基板背面的 高度位置更低的位置。 真空襯墊23b，是有複數個排列在搬運機23a之中與 上述基板S重疊的部分23d。該真空襯墊23b，具有用來 真空吸附基板S的吸附面，配置成讓該吸附面朝向上方。 真空襯墊23b，藉由讓吸附面吸附住基板S的背面端部， 則可保持住該基板S。各真空襯墊23b，其從搬運機23a 的上面部起算的高度位置是可調節的，例如可因應基板S 的浮起量而將真空襯墊23b的高度位置上下調整。軌道 2 3 c是在：搬入側台2 5、處理台2 7、及搬出側台2 8的側 方涵蓋各台部地延伸著，藉由滑動於該軌道23c而能讓搬 運機23a沿著該各台部移動。搬運機構23的各部位的動 作，是藉由沒有圖示的控制部所控制。 -18- 200922697 (塗佈部） 接著來說明塗佈部3的構造。 塗佈部3，是用來在基板S上塗佈光阻劑的部分，具 有：門型框架31、與噴嘴32。 門型框架3 1，具有：支柱構件3 1 a、與架橋構件3 1 b ，是設置成在Y方向跨越處理台27。支柱構件31a’在處 理台27的Y方向側各設置有一個’各支柱構件3 1 a分別 支承於框架部2 4的Y方向側的兩側面。各支柱構件3 1 a ，是設置成讓其上端部的高度位置一致。架橋構件3 1 b， 是架橋於各支柱構件3 1 a的上端部之間’相對於該支柱構 件3 1 a可進行升降。 該門型框架3 1是連接於移動機構3 1 c，可朝X方向 移動。藉由該移動機構3 1 c讓門型框架3 1可在其與管理 部4之間移動。也就是說，設置於門型框架31的噴嘴3 2 可在其與管理部4之間移動。而該門型框架31，藉由沒 有圖示的移動機構讓其也可朝Z方向移動。 噴嘴32 ’是作成其中一方向爲長軸的長條狀，是設 置在門型框架3 1的架橋構件3 1 b的- Z方向側的面部。 在該噴嘴32之中的- Z方向的前端，沿著本身的長軸方 向設置有狹縫狀的開口部3 2 a，從該開口部3 2 a將光阻劑 吐出。噴嘴32’其開口部32a的長軸方向與γ方向平行 ’並且該開口部32a配置成與處理台27相對向。開口部 32a的長軸方向的尺寸是較所搬運的基板s的γ方向的尺 -19- 200922697 寸更小’而不會將光阻劑塗佈到基板S的周邊區域。在噴 嘴3 2的內部設置有使光阻劑流通到開口部3 2 a的沒有圖 示的流通路’該流通路連接著沒有圖示的光阻劑供給源。 該光阻劑供給源例如具有沒有圖示的泵浦，藉由以該泵浦 將光阻劑推擠到開口部3 2 a ’而從開口部3 2 a將光阻劑吐 出。在支柱構件3 1 a設置有沒有圖示的移動機構，藉由該 移動機構，讓在架橋構件3 1 b所保持的噴嘴3 2可朝Z方 向移動。在噴嘴32設置有沒有圖示的移動機構，藉由該 移動機構讓噴嘴32可相對於架橋構件3 i b朝z方向移動 。在門型框架3 1的架橋構件3 1 b的下面部安裝：用來將 噴嘴3 2的開口部3 2 a，也就是噴嘴3 2的前端以及與該噴 嘴前端相對向的相對向面之間的Z方向上的距離予以測定 的感應器3 3。 (管理部） 來說明管理部4的構造。 管理部4，是爲了讓吐出到基板S的光阻劑（液狀體 )的吐出量爲定量而將噴嘴3 2進行管理的部位，是設置 在：基板搬運部2之中的相對於塗佈部3的- X方向側（ 基板搬運方向的上游側）。該管理部4，具有：預備吐出 機構4 1、浸漬槽42、噴嘴洗淨裝置43、將這些構造予以 收容的收容部44、以及用來保持該收容部的保持構件4 5 。保持構件4 5與移動機構4 5 a連接。藉由該移動機構 45a讓收容部44可朝X方向移動。 -20- 200922697 預備吐出機構4 1、浸漬槽42、及噴嘴洗淨裝置43 是以該順序朝- X方向側排列。該預備吐出機構4 1、 漬槽42、及噴嘴洗淨裝置43的Y方向的各尺寸，是較 述門型框架3 1的支柱構件3 1 a之間的距離更小，上述 型框架3 1是跨越各部分來接達。 預備吐出機構4 1，是預備性地將光阻劑吐出的部 。該預備吐出機構4 1設置成最接近噴嘴32。浸漬槽42 是在內部儲存有稀釋劑等的溶劑的液體槽。噴嘴洗淨裝 4 3 ’是用來將噴嘴3 2的開口部3 2 a附近予以沖洗的裝 ’是具有：朝γ方向移動的沒有圖示的洗淨機構、以 使該洗淨機構移動的沒有圖示的移動機構。該移動機構 設置在較洗淨機構更靠- X方向側。噴嘴洗淨裝置4 3 藉由設置有移動機構的部分，與預備吐出機構41及浸 槽42相比’其X方向的尺寸較大。而當然針對預備吐 機構41、浸漬槽42、噴嘴洗淨裝置43的配置方式，並 限於本實施方式的配置方式，也可以用其他的配置方式 (處理台） 第5圖是基板處理部2的處理台27的空氣噴出機 、吸引機構的構造的顯示圖。根據該圖，來說明有關上 處理台的空氣噴出及空氣吸引的構造。 在處理台27設置有：空氣噴出機構6〇、吸引機構 、控制部（控制手段）1〇〇。 空氣噴出機構60具有：鼓風機61、暫存槽62、壓 浸 上 門 分 置 置 及 漬 出 不 構 述 7 0 力 -21 - 200922697 65 供 供 61 與 台 連 空 〇 可 理 經 台 的 溝 檢 有 噴 內 自動控制器（APC ) 63、歧管64、及噴出壓力監視口 〇 鼓風機0 1 ’是將空氣供給到空氣噴出機構的空氣 給源，是藉由配管60a而連接於暫存槽62。作爲空氣 給源’也可連接工廠等的空氣供給管線而取代鼓風機 。暫存槽62 ’例如作成將所供給的空氣的溫度保持爲 定，藉由配管60b而連接於APC63。 APC63 ’設置有：調節空氣的供給量的蝶形閥63a 控制器63b。歧管64，是藉由配管60c而連接於處理 2 7。配管6 0 c，從處理台2 7側分歧，該分歧部分分別 接於上述複數溝部的各個溝部。於是，來自APC 63的 氣會經由配管6 0 c及複數的溝部從空氣噴出孔2 7 a噴出 歧管64’是藉由配管60f而連接於APC63。而也 作成不設置該歧管64。 噴出壓力監視口 65，是藉由配管60e而連接於處 台27。具體來說，配管60e連接於上述複數的溝部， 由該配管60e及溝部將噴出壓力監視口 65連接於處理 27的空氣噴出孔27a。在該構造，配管60e經由該複數 溝部而連接於配管60c。噴出壓力監視口 65 ’是在上述 部設置有壓力檢測用口的構造，藉由該壓力檢測用口可 測台部正下方的氣體壓力。在噴出壓力監視口 6 5設置 壓力計66，而可測定從空氣噴出孔27a噴出的空氣的 出壓力，並且將測定結果經由電線60d發送到APC 63 的控制器63b。而在各配管60a〜配管60c及配管60e -22 - 200922697 設置有各種閥部。而也可在APC63與空氣噴出孔 間設置壓力計，將測定結果發送到APC63內的控制 〇 吸引機構70’具有：鼓風機71、壓力自動控 APC ) 72、排放部73、歧管74、及吸引壓力監視[ 鼓風機71、APC72、排放部73、歧管74，是互相 管70a〜7〇d分別連接，在各配管70a〜70d安裝有 部。而也可使用工廠等的空氣吸引管線來取代鼓頂 。而也可作成不設置歧管74的構造。APC 72，設 調節空氣的供給量的蝶形閥72a與控制器72b。 排放部73，具有：暫存槽73a、排出管73b、 73c、及感應器（第一感應器）73d。暫存槽73a， 處理台2 7所吸引的吸引物予以儲存的槽部。排出 ，是將儲存於暫存槽73a的儲存物從該暫存槽73a 的排出通路。排出閥73c，是安裝於排出管73b， 於暫存槽73 a內的儲存物的排出的導通、斷開予以 閥部。感應器73d，安裝於暫存槽73a，是用來檢 有將吸引物供給到暫存槽7 3 a內的感應器。該感應 ，可將暫存槽7 3 a內的儲存物的量予以檢測。感應 的檢測結果（有無吸引物、儲存物的量），是發送 部 100。 吸引壓力監視口 75，是藉由配管70e而連接 台2 7。具體來說.，配管7 0 e連接於上述複數的溝 由該配管70e及溝部將吸引壓力監視口 75連接於 27a之 丨器63b 制器（ 1 75 ° 藉由配 各種閥 I機7 1 置有： 排出閥 是將從 管 73b 排出時 將儲存 切換的 測是否 器73d 器73d 到控制 於處理 部，經 處理台 -23- 200922697 27的空氣噴出孔27b。配管70e經由該複數的溝部而連接 於配管70d。吸引壓力監視口 75，是在上述溝部設置有壓 力檢測用口的構造，藉由該壓力檢測用口可檢測處理台 27正下方的氣體壓力。在吸引壓力監視口 75安裝有壓力 計76，而可測定藉由空氣吸引孔27b所吸引的空氣的吸 引壓力，並且將測定結果發送到APC 72內的控制器72b。 而也可在APC72與空氣吸引孔27b之間設置壓力計’經 由電線（圖中以虛線顯示）等將測定結果發送到APC 72 內的控制器72b。 在配管60f與配管70c之間設置有切換閥80。切換閥 80，可將空氣噴出機構60與空氣吸引機構70切換。在處 理台27設置有：將來自空氣噴出孔27a及空氣吸引孔 27b的空氣的噴出量、吸引量予以檢測的感應器27d ;以 及用來將洗淨液供給到該空氣噴出孔27a及空氣吸引孔 2 7b的內部的洗淨液供給部8 1。 控制部1 〇〇，是總括性地將上述該空氣噴出機構60 及吸引機構的動作予以控制。例如，可將鼓風機6 1及 鼓風機7 1的開啓、關閉予以切換。而根據從排放部7 3的 感應器73d所發送的儲存物的量，來調節閥部73c的開度 。而控制部1〇〇，是根據關於從感應器73d發送的吸引物 的有無的檢測結果，來進行空氣噴出動作及吸引動作或使 其停止。 接著來說明如上述構造的塗佈裝置1的動作。 第6圖〜第9圖，是顯示塗佈裝置1的動作過程的俯 -24- 200922697 視圖。參考各圖來說明將光阻劑塗佈在基板s的動作。在 k動作’知基板S搬入到基板搬入區域2 0，使該基板S 浮起而進行搬運’且在塗佈處理區域2 1塗佈光阻劑，將 已塗佈好該光阻劑的基板S從基板搬出區域22搬出。第 6圖〜第9圖僅以虛線顯示門型框架31的輪廓，而容易 判斷噴嘴3 2及處理台2 7的構造。以下來說明各部分的詳 細動作。 在將基板搬入到基板搬入區域20之前，使塗佈裝置 1待機。具體來說’在搬入側台25的基板搬入位置的一 Y 方向側配置搬運機23a ’將真空襯墊23b的高度位置定位 在基板的浮起高度位置’並且從搬入側台2 5的空氣噴出 孔25a、處理台27的空氣噴出孔27a、空氣吸引孔27b及 搬出側台2 8的空氣噴出孔2 8 a分別將空氣噴出或吸引， 成爲將空氣供給到讓基板浮起於各台部表面的程度的狀態 〇 在該狀態’例如藉由沒有圖示的搬運臂等，如第6圖 所示’若從外部將基板S搬運到基板搬入位置，則使升降 構件2 6 a朝+ Z方向移動’將升降銷2 6 b從升降銷出沒孔 25b突出到台表面25c。而藉由升降銷26b將基板S抬起 ，進行該基板S的交接動作。 在接收基板S之後，使升降構件2 6 a下降將升降銷 2 6 b收容於升降銷出沒孔2 5 b內。此時，由於在台表面 2 5 c形成有空氣層’所以基板S藉由該空氣而保持爲相對 於台表面2 5 c浮起的狀態。當基板s到達空氣層的表面時 -25- 200922697 ，藉由校準裝置25d的定位構件來進行基板S的定位，將 在基板搬入位置的- Y方向側處配置的搬運機2 3 a的真空 襯墊2 3 b真空吸附於基板S的- Y方向側端部。在第6圖 顯示了吸附住基板S的- Y方向側端部的狀態。 在藉由真空襯墊2 3 b吸附住基板S的一Y方向側端部 之後，使搬運機23a沿著軌道23c朝處理台27移動。由 於基板S爲浮起的狀態，所以即使搬運機2 3 a的驅動力較 小，基板S也能沿著軌道2 3 c順利移動。在處理台2 7， 除了空氣噴出孔27a所進行的空氣噴出之外，還以空氣吸 引孔27b進行空氣吸引，而能以更高的精確度來調整浮起 量。 一旦基板 S的搬運方向前端到達噴嘴3 2的開口部 3 2a的位置，如第7圖所示，則從噴嘴32的開口部32a 朝向基板S吐出光阻劑。光阻劑的吐出動作，是使噴嘴 32的位置固定，藉由搬運機23a —邊搬運基板S —邊來 進行。 伴隨著基板S的移動，則如第8圖所示在基板S上塗 佈光阻膜R。藉由讓基板S通過，吐出光阻劑的開口部 3 2a下面，而在基板S的預定區域形成光阻膜R。 在對基板S進行光阻劑R的塗佈之前，藉由安裝於 架橋構件3 1 b的兩個雷射感應器3 3，來計算出基板S與 噴嘴32的前端部的Z方向上的距離（塗佈間隙）。根據 該計算結果，藉由設置於支承構件3 1 a的移動機構來調整 塗佈間隙，讓該塗佈間隙成爲預設的預定値。當計算塗佈 -26 - 200922697 間隙時，從雷射射出部朝向基板S射出雷射光，雷射光被 基板S的表面反射而入射到雷射受光部。處理台27的台 表面27c是以光吸收材料也就是硬質氧化鋁膜所覆蓋，雷 射光不會在台表面27c反射，只有在基板S的表面反射的 光會入射到雷射受光部。在對基板S塗佈光阻劑期間，藉 由安裝於架橋構件3 1 b的兩個雷射感應器3 3來分別測定 基板S的 Y方向的兩端部的浮起量。從雷射射出部朝向 基板S射出雷射光，以基板S的表面反射雷射光，而入射 到雷射受光部。處理台2 7的台表面2 7c是以光吸收材料 也就是硬質氧化鋁膜所覆蓋，雷射光不會在台表面2 7c反 射，只有在基板S的表面反射的光會入射到雷射受光部。 形成了光阻膜R的基板S，是藉由搬運機23a將其朝 向搬出側台2 8搬運。在搬出側台2 8，在相對於台表面 2 8c浮起的狀態，如第9圖所示將基板S搬運到基板搬出 位置。 —旦基板S到達基板搬出位置，則解除真空襯墊23b 的吸附，使升降機構29的升降構件29a朝向+ Z方向移 動。然後，升降銷2 9b從升降銷出沒孔2 8 b朝向基板S的 背面突出，藉由升降銷29b將基板S抬起。在該狀態，例 如在搬出側台2 8的+ X方向側處設置的外部的搬運臂， 會接達於搬出側台2 8，而接收基板S。在將基板S交接到 搬運臂之後，將搬運機23a再回到搬入側台25的基板搬 入位置’待機直到要搬運下個基板S。 在尙未要搬運下個基板S的期間，在塗佈部3，進行 -27- 200922697 用來保持噴嘴3 2的吐出狀態的預備吐出動作。如第1 0圖 所示，藉由移動機構31c使門型框架31朝- X方向移動 到管理部4的位置。 在使門型框架3 1移動到管理部4的位置之後’調整 門型框架3 1的位置將噴嘴32接達到噴嘴洗淨裝置43。 在噴嘴洗淨裝置43，朝向噴嘴32的開口部32a附近而吐 出稀釋液等的洗淨液，並且因應需要將氮氣與稀釋劑同時 吐出到噴嘴3 2的開口部3 2a，且同時藉由將沒有圖示的 洗淨機構朝向噴嘴3 2的長軸方向掃描，將噴嘴3 2洗淨。 在洗淨好噴嘴3 2之後，將該噴嘴3 2接達到預備吐出 機構41。在預備吐出機構41，會一邊將開口部32a與預 備吐出面之間的距離予以測定，一邊將噴嘴3 2的開口部 32a移動到Z方向上的預定位置，一邊使噴嘴32朝一 X 方向移動，一邊從開口部3 2 a預備吐出光阻劑R。 在預備吐出動作之後，如第1 1圖所示將門型框架3 i 回到原來位置。當要搬運下個基板S時，如第1 1圖所示 ’藉由設置在支承構件3 1 a的沒有圖示的移動機構，使噴 嘴32移動到Z方向上的預定位置。藉由對基板s反覆進 行塗佈光阻膜R的塗佈動作與預備吐出動作，則在基板S 形成良質的光阻膜R。 而也可因應需要’例如每預定次數接達到管理部4後 ’則將該噴嘴3 2接達到浸漬槽4 2內。在浸漬槽4 2，是 耢由將噴π角3 2的開口部3 2 a暴露於’儲存於浸漬槽4 2的 稀釋劑或光阻劑的蒸氣環境，來防止噴嘴3 2乾燥。 -28- 200922697 在上述一連串的吐出動作及預備吐出動作的過程，可 設想例如光阻劑R從噴嘴32掉落到處理台27上。掉落於 處理台27上的光阻劑R，從空氣吸引孔27b被朝向吸引 機構7 0吸引。所吸引的光阻劑R，被供給到吸引機構7 0 的暫存槽73a，藉由安裝於暫存槽73a的感應器73d所檢 測。藉由該感應器73d將已把光阻劑R供給到暫存槽73a 內的內容的檢測結果發送到控制部1 0 〇。而作爲光阻劑R 掉落時的檢測手段，也可藉由在噴出壓力監視口 6 5、吸 引壓力監視口 75、吸引配管、及噴出配管所具備的壓力 計所測得的壓力變化來檢測。 控制部1 〇〇，根據該檢測結果，辨識出光阻劑R掉落 在處理台2 7上的內容，使光阻劑R的吐出動作停止。控 制部1 〇 〇，將吸引機構7 0的鼓風機71關閉，或使設置於 吸引機構70的閥部成爲關閉狀態，使吸引動作停止。在 吸引動作停止之後，控制部1 〇 〇，當基板S位於噴嘴3 2 的上游側時，停止繼續搬運基板S。當基板S位於噴嘴3 2 的正下方時，則使該基板S的下個要塗佈的基板的搬運動 作停止，並且在將空氣噴出到基板S的狀態藉由搬運裝置 23使基板S退避到處理台27的外側（例如搬入側台25 或搬出側台28 )。在使基板S退避到處理台27的外側之 後，控制部1 〇 〇使搬運裝置2 3的動作停止，將噴出機構 60的鼓風機61關閉。而鼓風機61及鼓風機71的關閉、 搬運裝置2 3的動作停止的時機，也可在每次啓動塗佈裝 置1、每經過預定時間、每處理過預定片數的基板、每次 -29- 200922697 光阻劑的塗佈動作之間來進行。也可在每次從感應器73 d 發送檢測結果、或每次藉由噴出壓力監視口 65等測至 變化，來進行關閉、停止搬運動作。 接著’控制部100，在空氣噴出孔27a及空氣吸引孔 2 7b兩方，將切換閥80切換來進行吸引（吸引模式）， 使空氣吸引機構7 〇的鼓風機7 1啓動。此時，從洗淨液供 給部8 1將洗淨液供給到空氣噴出孔2 7 a及空氣吸弓丨孑匕 2 7 b內，連同該洗淨液來進行吸引動作。此時，當暫存槽 73a內的儲存物的量超過預定量時，則將閥部73c的開度 增大而將暫存槽73 a內的儲存物排出。 接著，控制部1 〇〇，使空氣噴出孔27a及空氣吸引孔 2 7b乾燥。具體來說，將空氣噴出機構60的鼓風機61啓 動，將切換閥8 0交互地切換到空氣噴出機構6 0側及空氣 吸引機構70側。當切換閥80切換到空氣噴出機構60側 時，從空氣噴出孔27a及空氣吸引孔27b兩方噴出空氣（ 噴出模式）。當將切換閥80切換到空氣吸引機構70側時 ，與上述吸引動作的吸引模式同樣地，在空氣噴出孔27a 及空氣吸引孔27b兩方進行吸引。藉由交互地切換噴出模 式與吸引模式，則能使空氣充分地流通於空氣噴出孔27a 及空氣吸引孔2 7b內，讓該孔部的內部乾燥。在該乾燥動 作，最好先進行吸引模式，然後切換成噴出模式。 一旦空氣噴出孔27a及空氣吸引孔27b乾燥了，則將 上述噴出模式及吸引模式的空氣的噴出量、吸引量進行調 節，在可調節成預定的噴出量及吸引量之後’則進行基板 -30- 200922697 S的搬運動作及光阻劑R的塗佈動作。噴出模式及吸 式的空氣的噴出量、吸引量，是根據例如設置於處 27的感應器27d的檢測結果來進行調節。 藉由本實施方式，由於具備有控制部100，該控 1〇〇會進行切換爲：從空氣噴出孔27a及空氣吸引孔 噴出氣體的噴出模式、與從空氣噴出孔27a及空氣吸 2 7b進行吸引的吸引模式，所以當光阻劑r掉落在處 2 7時則切換爲吸引模式，藉此則能將進入到空氣吸 2 7b的光阻劑R予以吸引。因此，則不需要將基板搬 2分解，也不需要分解用的空間。藉此，可使作業效 升’且能使作業空間達到節省空間化。 本發明的技術範圍並不限於上述實施方式，在不 本發明主旨的範圍可以作適當變更。 針對塗佈裝置1的全體構造，在上述實施方式， 是將搬運機構23配置在各台部的- Y方向側，而並 於此。例如，也可將搬運機構23配置在各台部的+ 向側。而如第1 2圖所示，也可在各台部的一 γ方向 置上述搬運機構23 (搬運機23a、真空襯墊23b、 23c )’在+ Y方向側配置與該搬運機構23爲相同構 搬運機構53 (搬運機53a、真空襯墊53b、軌道53c 而能以搬運機構23與搬運機構53來搬運不同的基板 如’如該圖所示，在搬運機構2 3搬運基板S 1，在搬 構53搬運基板S2。在該情況，則能以搬運機構23 運機構53來交互搬運基板，讓生產能力提升。而在 引模 理台 制部 27b 引孔 理台 引孔 運部 率提 脫離 雖然 不限 γ方 側配 軌道 造的 )， 。例 運機 與搬 要將 -31 - 200922697 具有上述基板S、si、S2的一半程度的面積的基板進行搬 運的情況’例如以搬運機構23與搬運機構53各保持一片 ，藉由使搬運機構23與搬運機構53朝+ X方向一同行進 ’則能同時搬運兩片基板。藉由這種構造，則能讓生產能 力提升。 在上述實施方式，在處理台27可切換噴出模式與吸 引模式’而並不限於此，例如在搬入側台2 5及搬出側台 也可作成可切換噴出模式與吸引模式。 在上述實施方式，是藉由感應器73 d來檢測光阻劑R 是否掉落於處理台2 7上，而並不限於此，也可藉由目視 方式來檢視是否有光阻劑R掉落。 在上述實施方式，雖然說明了當光阻劑R掉落於處理 台2 7上時將塗佈裝置丨調整成吸引模式的方法，而並不 限於此。例如’在掉落於處理台2 7上的光阻劑R爲少量 的情況，則也可將塗佈裝置1調整成噴出模式將光阻劑R 吹飛也可以。 〔產業上的可利用性〕 本發明能使塗佈裝置的作業效率提升，且可使作業空 間達到節省空間化，在產業上非常有用》 【圖式簡單說明】 第]圖是顯示本實施方式的塗佈裝置的構造的立體圖 -32- 200922697 第2圖是顯示本實施方式的塗佈裝置的構造的正視圖 第3圖是顯不本貫施方式的塗佈裝置的構造的俯視圖 第4圖是顯不本實施方式的塗佈裝置的構造的側視圖 第5圖是本實施方式的空氣噴出機構及吸引機構的構 造的顯示圖。 第6圖是本實施方式的塗你驻罢M & i & 抑裝置的動作的顯示圖。 第7圖是該圖的作動圖。 第8圖是該圖的作動圖。 第9圖是該圖的作動圖。 弟10圖是該圖的作動圖。 第Η圖是該圖的作動圖。 他塗佈裝置的構造的俯視 第12圖是本實施方式的等 圖 【主要元件符號說明】 1 :塗佈裝置 2 :基板搬運部 3 ·_塗佈部 4 :管理部 2 7 a :空氣噴出孔 27b :空氣吸引孔 33- 200922697 27d :感應器（第二感應器） 60 :空氣噴出機構 70 :空氣吸引機構 73d:感應器（第一感應器） 8 0 :切換閥 1 〇 〇 :控制部 S :基板 R :光阻膜 -34200922697 IX. Description of the Invention [Technical Field] The present invention relates to a coating apparatus and a cleaning method of the coating apparatus. This case is based on the case of the Japanese Patent Application No. 2007-23 1 534, which was filed in Japan on September 6, 2007. The content is referred to here. [Prior Art] The composition of the liquid crystal display is displayed. A fine pattern such as a wiring pattern or an electrode pattern is formed on the glass substrate of the panel. Generally, such a pattern 'is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed. A known coating device for applying a photoresist film on a substrate is, for example, a slit nozzle fixed to apply a photoresist to a glass substrate which is moved under the slit nozzle. In the conventional coating apparatus, the substrate is floated and moved by ejecting a gas onto the stage (for example, refer to the specific document 1). In such a coating apparatus, a gas discharge hole and a suction hole are provided on the surface of the table portion, and by ejecting and sucking the gas, the amount of floating of the substrate can be adjusted, and the substrate can be floated while adjusting the floating height of the substrate. In the state of the photoresist, the photoresist is applied. In this coating apparatus, for example, a photoresist or the like remaining in the slit nozzle may be accidentally dropped on the land portion. When the dropped photoresist enters the inside of the gas jet-5 - 200922697 hole or the suction hole, it is difficult to maintain the normal gas discharge pressure and suction pressure. It may be difficult to adjust the floating amount of the substrate, so it is necessary to The photoresist is removed. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-236092. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] However, in the above-described coating device, the photoresist is removed from the gas ejection hole or the suction hole. If you need to solve the partial part of the station, there will be a problem that the work efficiency is very poor. However, the necessity of ensuring the working space for decomposing the table is created. In view of the above circumstances, it is an object of the present invention to provide a coating apparatus and a cleaning method for a coating apparatus which can improve work efficiency and save space in a work space. [Means for Solving the Problem] In the first aspect of the present invention, the coating apparatus of the first aspect of the present invention includes a substrate conveying unit that floats the substrate and transports the substrate, and conveys the substrate by the substrate conveying unit. The coating device for applying the coating portion of the liquid crystal substrate to the substrate is provided with a plurality of holes for discharging and sucking gas at the substrate conveying portion; and A discharge mode of a plurality of holes for ejecting gas and a control means for switching between suction modes for attracting gas from the plurality of holes. -6-200922697 In this configuration, a plurality of holes are provided in the substrate transporting portion to allow gas to be ejected and sucked, and a discharge mode in which gas is ejected from a plurality of holes and a plurality of discharges are provided. The control means for switching the suction mode of the hole suction gas; therefore, when the liquid body is dropped on the substrate conveyance portion, the liquid portion entering the hole portion can be sucked by adjusting the hole portion to the suction mode. Therefore, it is not necessary to disassemble the substrate conveying portion, and a space for decomposition is not required. Thereby, the work efficiency can be improved, and the work space can be saved. In the above coating apparatus, the hole portion is for ejecting and sucking gas in order to float the substrate. In the structure in which the gas is ejected and sucked in the hole portion to float the substrate, it is difficult to accurately adjust the floating height of the substrate because the liquid material enters the hole portion. On the other hand, according to this embodiment, since the hole portion can be switched to the suction mode as described above, the floating height of the substrate can be adjusted to stabilize even when the liquid body enters the hole portion. In the above-described coating apparatus, the control means includes means for switching the discharge mode and the suction mode with respect to the hole portion provided in a region corresponding to the application portion among the substrate conveyance portions. The liquid material is particularly likely to fall on the region corresponding to the coating portion in the substrate conveying portion, and it is easy to cause the liquid to be applied on the substrate due to the falling of the liquid material. Impact. In contrast, according to the embodiment, the control means switches the discharge mode and the suction mode with respect to the hole portion provided in the region corresponding to the application portion among the substrate conveyance portions, so that it can be dropped in correspondence with the hole portion The liquid in the area of the coating portion is sucked into 200922697. Thereby, it is possible to avoid a bad influence on the application state of the liquid. The coating apparatus further includes a first inductor that detects the attraction attracted from the plurality of holes. According to this embodiment, the first sensor for detecting the suction material sucked from the plurality of holes is provided, so that it is possible to confirm whether or not the liquid material has fallen on the substrate conveyance portion. The first inductor can also be constructed to confirm the amount of the liquid to be dropped or the like. In the above coating apparatus, the control means includes means for stopping the conveyance operation of the substrate and the application operation of the liquid material based on the detection result of the first sensor. According to this embodiment, the control means stops the conveyance operation of the substrate and the application operation of the liquid material based on the detection result of the first sensor. Therefore, when the liquid body is dropped on the substrate conveyance portion, it is possible to avoid continuing. The substrate transfer operation and the liquid application operation are performed. Further, the coating apparatus further includes a temporary storage tank for storing the suction material sucked from the plurality of holes. According to this embodiment, the temporary storage tank for storing the suction attracted from the plurality of holes is provided, so that it is not necessary to discard the suction when the suction is performed. This can improve work efficiency. In the above-described coating device, the control means includes means for discharging the attracting matter when the suction amount is stored in the temporary storage tank by a predetermined amount or more. According to this embodiment, when the suction of the predetermined amount of -8 - 200922697 is stored in the temporary storage tank by the control means, the attraction is discharged, so that it is not necessary to confirm the attraction to be stored in the temporary storage tank. The timing of the amount of attraction. Thereby, work efficiency can be improved. Further, the coating apparatus further includes a flow path connected to the plurality of holes, and a cleaning liquid supply unit that supplies the cleaning liquid to the flow path. According to this embodiment, the flow path that is connected to the plurality of holes and the cleaning liquid supply unit that supplies the cleaning liquid to the flow path are provided, so that the suction that is attracted from the plurality of holes can be provided. (including liquid) should be washed. Thereby, it is possible to prevent the attraction from being clogged in the plurality of holes. In the above coating apparatus, the flow path is a pipe, and the pipe is connected to a gas supply means for supplying a gas to the plurality of holes, and a suction means for sucking from the plurality of holes; The valve portion is provided in the flow passage so that one of the gas supply means and the suction means is connected to the plurality of holes. According to this embodiment, the flow path is a pipe, and the pipe is connected to a gas supply means for supplying gas to the plurality of holes, and a suction means for sucking from the plurality of holes; The flow path is provided such that one of the gas supply means and the suction means is connected to the plurality of holes, so that the discharge mode and the suction mode can be easily switched by the valve portion. The coating device further includes a second inductor that detects the state in which the gas is ejected from the hole and the state of the suction. According to the embodiment, the gas is ejected and sucked from the hole. Since the second sensor is detected, it is possible to detect whether there is an abnormality in the state of the gas -9-200922697 ejected and attracted. The coating device 'the control means' has means for performing a return operation of the plurality of holes according to the detection result of the second inductor. According to the embodiment, the control means performs the return operation of the plurality of holes based on the detection result of the second sensor. Therefore, when it is detected that there is no abnormality in the discharge and suction state of the gas, the return operation can be performed. Therefore, the gas can be stably ejected from the hole portion, and a stable suction operation can be performed. The return operation includes, for example, switching between the discharge mode and the suction mode, adjustment of the gas discharge amount in the discharge mode, and adjustment of the suction amount in the suction mode. In the above coating apparatus, the control means includes means for stopping the conveyance operation of the substrate and the application operation of the liquid material based on the detection result of the second inductor. According to the embodiment, the control means stops the transport operation of the substrate and the application operation of the liquid material based on the detection result of the second sensor. Therefore, when the state of the gas being ejected and sucked is abnormal, the substrate can be made. The conveyance operation and the application operation of the liquid body are stopped. Therefore, when the gas cannot be stably ejected from the hole portion or the suction cannot be stably performed, the substrate can be transported and the liquid application operation can be avoided. In the cleaning method of the coating apparatus of the second aspect of the present invention, the substrate transporting unit that floats the substrate and transports the substrate, and the substrate (f) is coated with the liquid while the substrate is transported by the substrate transporting unit. In the coating and cleaning method of the coating portion of the body, in the substrate transfer method, (4) a plurality of -10 200922697 holes capable of ejecting and sucking the gas are in response to the state of the substrate transport unit, A plurality of holes are attracted. In this type of 'in the substrate transporting portion', a plurality of holes that can be used for the discharge and suction of the gas are sucked in the plurality of holes in the state of the substrate transporting portion, so that the liquid is dropped. At the time of the substrate conveyance portion, the liquid that has entered the hole portion can be sucked. Therefore, it is not necessary to disassemble the substrate conveying portion, and there is no need for a space for decomposition. This can increase the efficiency of the work and also save space in the work space. The cleaning method of the above coating apparatus includes a method of detecting an attraction sucked from the plurality of holes. According to this embodiment, since the suction attracted from the plurality of holes is detected, it is possible to confirm whether or not the liquid body has fallen on the substrate conveyance portion. Further, it is also possible to confirm the amount of the liquid to be dropped and the like. The cleaning method of the above coating apparatus ' includes a method of performing the above-described suction based on the result of the above detection. According to this embodiment, since the suction is performed based on the detection result, the suction can be efficiently performed when it is judged that the liquid is dropped. The cleaning method of the coating apparatus includes a method of stopping the conveyance operation of the substrate and the application operation of the liquid material based on the detection result. According to the above-described method, the substrate conveyance operation and the liquid application operation are stopped according to the detection result. Therefore, when the liquid material is dropped on the substrate conveyance portion, the substrate conveyance operation and the liquid state can be prevented from being continued. Body coating action. -11 - 200922697 The cleaning method of the above coating apparatus includes: the substrate, or the coating of the liquid each time a predetermined number of times per a predetermined time elapsed after the start of the coating device The manner in which the above detection operation is performed between the operations. According to this embodiment, the detection operation can be performed every time the application of the coating device, the predetermined time elapses, the predetermined number of substrates per process, or the application operation of the liquid each time, so that appropriate In the cleaning method of the coating apparatus, the coating apparatus includes a flow path connected to the plurality of holes, and the cleaning liquid is supplied after the suction operation or simultaneously with the suction operation. The way to the above flow path. According to this embodiment, after the suction operation or the suction operation, the cleaning liquid is supplied into the flow path connected to the plurality of holes, so that the suction material (including the liquid) that is attracted from the plurality of holes can be formed. Wash). Thereby, it is possible to prevent the attraction from being clogged in the plurality of holes. When the cleaning liquid is supplied simultaneously with the suction operation, the attraction can be sucked together with the cleaning liquid, so that work efficiency can be improved. The cleaning method of the coating apparatus includes a method of drying the inside of the flow path after the supply of the cleaning liquid. According to this embodiment, the inside of the flow path is dried after the supply of the cleaning liquid, so that it is possible to prevent the gas having a high humidity from being supplied to the substrate conveying portion. On the other hand, it is possible to prevent contamination of the substrate by preventing the gas having a high humidity from being supplied to the substrate carrying portion. -12-200922697 The cleaning method of the coating apparatus described above includes a method of detecting a state in which the gas in the hole portion is ejected and the suction state. According to this embodiment, since the gas discharge state and the suction state of the hole portion are detected, it is possible to detect the gas in the discharge state and the suction state. The cleaning method of the coating apparatus includes performing a recovery operation of the plurality of holes according to the detection result. According to this embodiment, since the recovery operation of the plurality of holes is performed based on the detection result, it is possible to detect that there is no abnormality in the state in which the gas is ejected and sucked, and the recovery operation can be performed. Therefore, the gas can be stably ejected from the hole portion, and a stable suction operation can be performed. The return operation includes, for example, switching between the discharge mode and the suction mode, adjustment of the gas discharge amount in the discharge mode, and adjustment of the suction amount in the suction mode. The cleaning method of the above coating apparatus includes a method of stopping the conveyance operation of the substrate and the application operation of the liquid material based on the detection result. According to the embodiment, the substrate conveyance operation and the liquid application operation are stopped based on the detection result. Therefore, when the gas is ejected and sucked in a different state, the substrate can be transported and the liquid can be moved. The coating action is stopped. Therefore, when the gas cannot be stably ejected from the hole portion or the suction cannot be stably performed, the substrate can be transported and the liquid application operation can be avoided. [Effect of the Invention] -13- 200922697 By the present invention, the work efficiency of the coating apparatus can be improved, and the work space can be made space-saving. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a perspective view of the coating device 1 of the present embodiment. As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate conveying unit 2 and a coating unit 3 . The management unit 4 is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. (Substrate conveyance unit) First, the structure of the board conveyance unit 2 will be described. The substrate transporting unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate carry-in area 20, the coating processing area 2 1 , and the substrate carry-out area 2 2 by the transport mechanism 23 . The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side of the -14 - 200922697 in the substrate conveyance direction to the downstream side. The transport mechanism 23 is provided on one of the respective portions in order to cover the respective portions of the substrate carrying region 20, the coating processing region 21, and the substrate carrying-out region 22. Hereinafter, in explaining the structure of the coating apparatus 1, the directions in the drawings will be described using XYZ coordinates for ease of display. The direction of the long axis of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the γ-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction. The substrate loading area 20 is a portion into which the substrate s conveyed from the outside of the apparatus is carried, and has a loading side table 25 and an elevating mechanism 26. The loading side table 25 is provided in the upper portion of the frame portion 24, and is, for example, a plate-like member which is formed of SU S or the like and has a rectangular shape when viewed from a plan view. The loading side table 25 has a long axis in the X direction. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of lift pin exit holes 25b. The air ejection hole 25a and the lift pin exit hole 25b are provided so as to penetrate through the loading side table 25. The air ejection hole 25a is a hole for ejecting air onto the table surface 25c of the loading side table 25. For example, the area where the substrate S passes through the loading side table 25 is arranged in a matrix shape as seen from a plan view. The air ejection hole 2 5 a is connected to an air supply source (not shown). The loading side table 25' can float the substrate S in the +Z direction by the air ejected from the air ejection holes 25a. -15- 200922697 The lift pin exit hole 2 5 b ' is the area that is placed in the loading side table 25 and moved in. The lift pin has a hole 25b so that air supplied to the surface of the table does not leak. One calibration device 25d is provided at each of the both ends of the loading side table 25 in the Y direction. The calibration device 25d is a device for positioning the substrate S carried into the loading unit 25. Each of the aligning devices 25d has a hole portion and a positioning member provided in the long hole portion, and mechanically holds the substrate carried into the loading member 25 from both sides. The elevating mechanism 26 is a rear side on which the substrate placed on the loading side table 25 is carried. The elevating mechanism 26 has a lifting member 26a and a lifting pin 26b. The elevating member 26a is connected to a drive (not shown), and the elevating member 26a is moved toward the Z by the driving of the drive mechanism. A plurality of lift pins 26b are erected from the upper surface of the elevating member 26a toward the side table 25. Each of the lift pins 26b is disposed at a position overlapping the lift pin exit hole 25b as viewed in the direction. When the elevating member 26a is moved in the Z direction, the elevating pins 26b are ejected from the pin-out holes 25b on the table surface 25c. The end portions of the respective lift pins 26b in the white direction are provided so as to coincide with the positions in the Z direction, and the substrate S conveyed from the outside of the apparatus is kept horizontal. The coating treatment region 21 is a coating treatment for the photoresist, and a processing table 27 for supporting and supporting the substrate S is provided. The processing table 27 is a member that covers the table surface 2: 7C and has a rectangular shape as viewed in a plan view from a material such as a hard aluminum oxide film as a main component, and is provided on the +X direction side with respect to the loading side table 25. The plate S 25c is provided with a side table: the long side table position is a plurality of motives, and the moving portion is moved upwardly by the lifting and lowering J + Z, and the portion of the light-absorbing plate is covered by the light absorbing material in the area -16-200922697 It suppresses reflection of light such as laser light. In the processing table 27, the γ direction is the long axis. The size of the processing table 27 in the Y direction is substantially the same as the size of the loading side table 25 in the Y direction. The processing table 27 is provided with a plurality of air ejection holes 27a for discharging air onto the table surface 27c, and a plurality of air suction holes 27b for sucking air on the table surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. Inside the processing table 27, a plurality of groove portions (not shown) for applying a resistance to the pressure of the gas passing through the air ejection hole 27a and the air suction hole 27b are provided. The plurality of groove portions are connected to the air ejection hole 27a and the air suction hole 27b in the table portion. The pitch of the air ejection hole 27a in the processing table 27 is compared with the air ejection hole 25 provided in the loading side table 25. The pitch of a is narrower, and the air ejection hole 27a is set closer than the loading side table 25. Therefore, compared with the other stages, the processing table 27 can adjust the floating amount of the substrate with higher precision, and the floating amount of the substrate can be controlled, for example, to be less than 100 // m, and 5 0 // The following is preferred. The substrate carry-out area 22 is a portion for carrying out the substrate S coated with the photoresist to the outside of the apparatus, and has a carry-out side table 28 and an elevator mechanism 29. The carry-out side table 2, 8 is disposed on the +X direction side with respect to the processing table 27, and is composed of the same material and size as the loading side table 25 provided in the substrate loading area 20. Similarly to the loading side table 2 5, the unloading side 28 is provided with an air ejection hole 28a and a lift pin exit hole 28b. The lift mechanism 29 is provided on the back side of the substrate carry-out position of the carry-out side table 28 = 17 - 200922697 ', for example, supported by the frame portion 24. The elevating member 29a and the elevating pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided in the substrate loading area 20. When the substrate s on the carry-out side table 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate S. The transport mechanism 23 has a transporter 23a, a vacuum cushion 23b, and a rail 23c. The structure of the transporter 23a is internally provided with, for example, a linear motor. By driving the linear motor, the transporter 23a can be moved on the rail 23c. The transporter 23a is disposed so that a predetermined portion 23d is superposed on the end portion in the -Y direction of the substrate S as viewed in a plan view. The portion 23d overlapping the substrate S is disposed at a position lower than the height position of the back surface of the substrate when the substrate S is floated. The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23b can hold the substrate S by allowing the adsorption surface to adsorb the rear end portion of the substrate S. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 2 3 c is extended on the side of the loading side table 25, the processing table 27, and the unloading side table 28, and the carrier 23a can be moved along the rail 23c by sliding on the side of each of the stages. The stations are moved. The operation of each part of the transport mechanism 23 is controlled by a control unit (not shown). -18- 200922697 (Coating part) Next, the structure of the application part 3 is demonstrated. The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 31 and a nozzle 32. The portal frame 3 1 has a strut member 3 1 a and a bridging member 3 1 b that are disposed to span the processing table 27 in the Y direction. Each of the pillar members 31a' is provided on the Y-direction side of the processing table 27, and each of the pillar members 3 1 a is supported by both side faces of the frame portion 24 in the Y-direction side. Each of the strut members 3 1 a is disposed such that the height positions of the upper end portions thereof coincide. The bridging members 3 1 b are bridged between the upper end portions of the respective strut members 3 1 a and are movable up and down with respect to the strut members 31 1 a. The portal frame 31 is connected to the moving mechanism 3 1 c and is movable in the X direction. The door frame 3 1 is movable between it and the management unit 4 by the moving mechanism 3 1 c. That is, the nozzle 3 2 provided to the portal frame 31 is movable between it and the management portion 4. The door frame 31 can also be moved in the Z direction by a moving mechanism not shown. The nozzle 32' is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridging member 3 1 b of the portal frame 3 1 . In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 3 2 a is provided along the longitudinal axis of the nozzle 32, and the photoresist is discharged from the opening portion 3 2 a. The nozzle 32' has a longitudinal direction parallel to the γ direction of the opening 32a, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the long-axis direction is smaller than the dimension -19 - 200922697 inches in the γ direction of the substrate s to be transported, and the photoresist is applied to the peripheral region of the substrate S. Inside the nozzle 32, a flow path (not shown) for allowing the photoresist to flow to the opening portion 3a is provided. This flow path is connected to a photoresist supply source (not shown). The photoresist supply source has, for example, a pump (not shown), and the photoresist is ejected from the opening 3 2 a by pushing the photoresist to the opening 3 2 a ' by the pump. The strut member 3 1 a is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 3 2 held by the bridging member 3 1 b to move in the Z direction. The nozzle 32 is provided with a moving mechanism (not shown) by which the nozzle 32 is movable in the z direction with respect to the bridging member 3 i b. Mounted on the lower surface of the bridging member 3 1 b of the portal frame 3 1 for connecting the opening portion 3 2 a of the nozzle 32, that is, the front end of the nozzle 32 and the opposing surface opposite to the nozzle front end The distance in the Z direction is measured by the sensor 33. (Management Unit) The structure of the management unit 4 will be described. The management unit 4 is a portion for managing the nozzle 3 2 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is provided in the substrate transport unit 2 with respect to coating. - X direction side of the part 3 (upstream side in the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 4 1 , a dipping tank 42 , a nozzle cleaning device 43 , an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45 5 a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a. -20- 200922697 The preliminary discharge mechanism 4 1 , the immersion tank 42 , and the nozzle cleaning device 43 are arranged in the -X direction side in this order. The size of the preliminary discharge mechanism 4 1 , the stain groove 42 , and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the pillar members 31 1 a of the portal frame 3 1 , and the frame 3 1 is formed. It is to reach across all parts. The preliminary discharge mechanism 41 is a portion that preliminarily discharges the photoresist. The preliminary discharge mechanism 4 1 is disposed closest to the nozzle 32. The immersion tank 42 is a liquid tank in which a solvent such as a diluent is stored inside. The nozzle cleaning device 4 3 ' is a device for rinsing the vicinity of the opening portion 3 2 a of the nozzle 3 2 and has a cleaning mechanism (not shown) that moves in the γ direction to move the cleaning mechanism. A moving mechanism not shown. The moving mechanism is disposed on the -X direction side of the cleaner mechanism. The nozzle cleaning device 4 3 has a larger size in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 by the portion in which the moving mechanism is provided. Of course, the arrangement of the preliminary spouting mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is limited to the arrangement of the present embodiment, and other arrangements (processing stations) may be used. FIG. 5 is the substrate processing unit 2. A display view of the structure of the air ejecting machine and the suction mechanism of the processing table 27. The structure of the air discharge and the air suction of the upper processing stage will be described based on the figure. The processing table 27 is provided with an air ejection mechanism 6A, a suction mechanism, and a control unit (control means) 1A. The air ejecting mechanism 60 has a blower 61, a temporary storage tank 62, a pressure immersion door, and a non-construction of the waterlogging. 7 0 Force-21 - 200922697 65 Supply 61 and the docking station of the Taiwanese vacancy The automatic injection controller (APC) 63, the manifold 64, and the discharge pressure monitoring port blower 0 1 ' are air supply sources for supplying air to the air discharge mechanism, and are connected to the temporary storage tank 62 by the pipe 60a. As the air supply source, an air supply line such as a factory may be connected instead of the air blower. The temporary storage tank 62' is made, for example, to maintain the temperature of the supplied air, and is connected to the APC 63 by the pipe 60b. The APC 63 ' is provided with a butterfly valve 63a controller 63b that adjusts the amount of supply of air. The manifold 64 is connected to the process 27 by a pipe 60c. The pipes 60c are branched from the processing table 27 side, and the diverging portions are respectively connected to the respective groove portions of the plurality of groove portions. Then, the gas from the APC 63 is discharged from the air ejection hole 27a through the pipe 60c and the plurality of grooves. The manifold 64' is connected to the APC 63 via the pipe 60f. It is also assumed that the manifold 64 is not provided. The discharge pressure monitoring port 65 is connected to the stage 27 by a pipe 60e. Specifically, the pipe 60e is connected to the plurality of grooves, and the discharge pressure monitoring port 65 is connected to the air discharge hole 27a of the process 27 by the pipe 60e and the groove. In this configuration, the pipe 60e is connected to the pipe 60c via the plurality of grooves. The discharge pressure monitoring port 65' is a structure in which a pressure detecting port is provided in the above portion, and the pressure detecting port can measure the gas pressure immediately below the table portion. The pressure gauge 66 is provided at the discharge pressure monitoring port 65, and the pressure of the air ejected from the air ejection hole 27a can be measured, and the measurement result is transmitted to the controller 63b of the APC 63 via the electric wire 60d. Each of the pipes 60a to 60c and the pipes 60e-22 to 200922697 are provided with various valve portions. Alternatively, a pressure gauge may be provided between the APC 63 and the air ejection hole, and the control result of the measurement result sent to the APC 63 may include: a blower 71, an automatic pressure control APC 72, a discharge portion 73, a manifold 74, and an attraction. The pressure monitoring [the blower 71, the APC 72, the discharge unit 73, and the manifold 74 are connected to the respective tubes 70a to 7〇d, and the respective tubes 70a to 70d are attached to each other. Instead, the air suction line of a factory or the like can be used instead of the drum top. Alternatively, a configuration in which the manifold 74 is not provided may be employed. The APC 72 is provided with a butterfly valve 72a that regulates the supply amount of air and a controller 72b. The discharge portion 73 has a temporary storage tank 73a, discharge pipes 73b and 73c, and an inductor (first inductor) 73d. The temporary storage tank 73a is a groove portion in which the suction attracted by the processing table 27 is stored. The discharge is a discharge passage for storing the stored matter stored in the temporary storage tank 73a from the temporary storage tank 73a. The discharge valve 73c is a valve portion that is attached to the discharge pipe 73b to turn on and off the discharge of the stored matter in the temporary storage tank 73a. The inductor 73d is attached to the temporary storage tank 73a for detecting an inductor that supplies the suction into the temporary storage tank 73a. The induction can detect the amount of storage in the temporary storage tank 73a. The detection result of the induction (the presence or absence of the attractant or the amount of the stored matter) is the transmitting unit 100. The suction pressure monitoring port 75 is connected to the table 27 by the pipe 70e. Specifically. The pipe 70 0 e is connected to the plurality of grooves. The pipe 70e and the groove portion connect the suction pressure monitoring port 75 to the device 63b of the 27a (1 75 ° is provided by various valves I 7 1 : discharge valve When the tube 73b is discharged from the tube 73b, the sensor 73d 73d for storing the switching is controlled to the processing unit, and passes through the air ejection hole 27b of the processing table -23-200922697. The pipe 70e is connected to the pipe 70d via the plurality of grooves. The suction pressure monitoring port 75 has a structure in which a pressure detecting port is provided in the groove portion, and the pressure detecting port can detect the gas pressure immediately below the processing table 27. The pressure gauge 76 is attached to the suction pressure monitoring port 75, and The suction pressure of the air sucked by the air suction hole 27b can be measured, and the measurement result can be transmitted to the controller 72b in the APC 72. Alternatively, a pressure gauge can be provided between the APC 72 and the air suction hole 27b via the electric wire (Fig. The measurement result is transmitted to the controller 72b in the APC 72. A switching valve 80 is provided between the pipe 60f and the pipe 70c. The switching valve 80 can be used to vent the air to the air 60. The suction unit 70 is switched. The processing unit 27 is provided with an inductor 27d for detecting the amount of discharge of air from the air ejection hole 27a and the air suction hole 27b, and for supplying the cleaning liquid to the air ejection. The cleaning liquid supply unit 81 inside the hole 27a and the air suction hole 27b. The control unit 1 is configured to collectively control the operation of the air ejection mechanism 60 and the suction mechanism. For example, the air blower 6 can be used. 1 and the opening and closing of the blower 7 1 are switched. The opening degree of the valve portion 73c is adjusted according to the amount of the stored matter sent from the inductor 73d of the discharge portion 73. The control portion 1 is based on The air ejection operation and the suction operation are stopped or stopped from the detection result of the presence or absence of the attraction transmitted from the sensor 73d. Next, the operation of the coating device 1 having the above-described structure will be described. Fig. 6 to Fig. 9 are The view of the operation of the coating apparatus 1 is shown in the view of the lower-24-200922697. The operation of applying the photoresist to the substrate s will be described with reference to the respective drawings. In the k operation, the substrate S is carried into the substrate carrying-in area 20, and the Substrate S The carrier is applied and coated with a photoresist, and the substrate S to which the photoresist has been applied is carried out from the substrate carry-out region 22. Figures 6 to 9 show the gate only in broken lines. The outline of the frame 31 is easy to determine the structure of the nozzle 3 2 and the processing table 27. The detailed operation of each part will be described below. Before the substrate is carried into the substrate loading area 20, the coating device 1 is placed on standby. The transporter 23a is placed on the Y-direction side of the substrate loading position of the loading-side table 25, and the height position of the vacuum pad 23b is positioned at the floating height position ' of the substrate, and the air ejection hole 25a from the loading-side table 25 is The air ejection hole 27a of the processing table 27, the air suction hole 27b, and the air ejection hole 280a of the carry-out side table 28 respectively eject or suck air, and supply air to the extent that the substrate floats on the surface of each table. In this state, for example, by a transport arm or the like (not shown), as shown in Fig. 6, when the substrate S is transported to the substrate carrying position from the outside, the elevating member 26 a is moved in the + Z direction. Lift pin 2 6 b from lift pin No hole 25b projecting to the stage surface 25c. On the other hand, the substrate S is lifted by the lift pins 26b, and the substrate S is transferred. After receiving the substrate S, the elevating member 26 6a is lowered to accommodate the lift pin 2 6 b in the lift pin exit hole 2 5 b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is maintained in a state of being floated relative to the table surface 25c by the air. When the substrate s reaches the surface of the air layer -25-200922697, the positioning of the substrate S is performed by the positioning member of the calibration device 25d, and the vacuum lining of the carrier 2 3 a disposed at the -Y direction side of the substrate loading position The pad 2 3 b is vacuum-adsorbed to the - Y-direction side end portion of the substrate S. Fig. 6 shows a state in which the - Y-direction side end portion of the substrate S is sucked. After the Y-direction side end portion of the substrate S is sucked by the vacuum pad 2 3 b, the carrier 23a is moved toward the processing table 27 along the rail 23c. Since the substrate S is in a floating state, even if the driving force of the transporter 2 3 a is small, the substrate S can smoothly move along the rail 2 3 c. At the processing table 2 7, in addition to the air ejection by the air ejection hole 27a, the air suction is performed by the air suction hole 27b, and the floating amount can be adjusted with higher accuracy. When the leading end of the substrate S in the conveyance direction reaches the position of the opening portion 3 2a of the nozzle 32, as shown in Fig. 7, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 while transporting the substrate S by the transporter 23a. As the substrate S moves, the photoresist film R is coated on the substrate S as shown in Fig. 8. By passing the substrate S, the lower surface of the opening portion 3 2a of the photoresist is discharged, and the photoresist film R is formed in a predetermined region of the substrate S. Before the application of the photoresist R to the substrate S, the distance between the substrate S and the front end portion of the nozzle 32 in the Z direction is calculated by the two laser sensors 3 3 attached to the bridging member 3 1 b. (coating gap). According to the calculation result, the coating gap is adjusted by the moving mechanism provided to the supporting member 31a, so that the coating gap becomes a predetermined predetermined enthalpy. When the gap of the coating -26 - 200922697 is calculated, the laser beam is emitted from the laser emitting portion toward the substrate S, and the laser beam is reflected by the surface of the substrate S and enters the laser light receiving portion. The stage surface 27c of the processing table 27 is covered with a light absorbing material, that is, a hard aluminum oxide film, and the laser light is not reflected on the stage surface 27c, and only the light reflected on the surface of the substrate S is incident on the laser light receiving portion. During the application of the photoresist to the substrate S, the amount of floating of both ends of the substrate S in the Y direction is measured by the two laser sensors 3 3 attached to the bridging member 3 1 b. The laser light is emitted from the laser emitting portion toward the substrate S, and the laser light is reflected from the surface of the substrate S to be incident on the laser light receiving portion. The stage surface 27c of the processing table 27 is covered with a light absorbing material, that is, a hard aluminum oxide film, and the laser light is not reflected on the stage surface 27c, and only the light reflected on the surface of the substrate S is incident on the laser light receiving portion. . The substrate S on which the photoresist film R is formed is transported toward the carry-out side table 28 by the transporter 23a. The substrate S is transported to the substrate carry-out position as shown in Fig. 9 in a state where the carry-out side table 2, 8 is floated with respect to the table surface 28c. When the substrate S reaches the substrate carrying-out position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. Then, the lift pins 29b protrude from the lift pin exit holes 28b toward the back surface of the substrate S, and the substrate S is lifted by the lift pins 29b. In this state, for example, an external transfer arm provided at the +X direction side of the carry-out side table 28 is received by the carry-out side stand 2, and the substrate S is received. After the substrate S is transferred to the transport arm, the transporter 23a is returned to the substrate loading position of the loading side table 25 to stand by until the next substrate S is to be transported. While the next substrate S is not being transported, the application unit 3 performs a preliminary discharge operation for maintaining the discharge state of the nozzles 3 in -27-200922697. As shown in Fig. 10, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the moving mechanism 31c. After the door frame 3 1 is moved to the position of the management unit 4, the position of the door frame 3 1 is adjusted to connect the nozzle 32 to the nozzle cleaning device 43. In the nozzle cleaning device 43, the cleaning liquid such as the diluent is discharged toward the vicinity of the opening 32a of the nozzle 32, and if necessary, the nitrogen gas and the diluent are simultaneously discharged to the opening portion 3 2a of the nozzle 32, and at the same time The cleaning mechanism (not shown) scans in the longitudinal direction of the nozzle 3 2, and washes the nozzle 32. After the nozzle 3 2 is cleaned, the nozzle 3 2 is connected to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is moved in the X direction. The photoresist R is preliminarily discharged from the opening 3 2 a. After the preliminary discharge operation, the door frame 3 i is returned to the original position as shown in Fig. 11. When the next substrate S is to be transported, as shown in Fig. 1, the nozzle 32 is moved to a predetermined position in the Z direction by a moving mechanism (not shown) provided on the support member 31a. When the coating operation of the coating resist film R and the preliminary discharge operation are repeated on the substrate s, a favorable photoresist film R is formed on the substrate S. Alternatively, the nozzle 3 2 may be connected to the dipping tank 4 2 as needed, for example, after reaching the management unit 4 every predetermined number of times. In the immersion tank 4 2, the nozzle 3 2 is prevented from drying by exposing the opening portion 3 2 a of the π angle 3 2 to the vapor atmosphere of the diluent or the photoresist stored in the immersion tank 4 2 . -28- 200922697 In the above-described series of discharge operation and preliminary discharge operation, it is conceivable that, for example, the photoresist R falls from the nozzle 32 onto the processing table 27. The photoresist R dropped on the processing table 27 is sucked toward the suction mechanism 70 from the air suction hole 27b. The attracted photoresist R is supplied to the temporary storage tank 73a of the suction mechanism 70, and is detected by the inductor 73d attached to the temporary storage tank 73a. The detection result of the content of the photoresist R supplied to the temporary storage tank 73a is transmitted to the control unit 10 〇 by the inductor 73d. Further, as a means for detecting when the photoresist R is dropped, it can be detected by a pressure change measured by a discharge pressure monitoring port 65, a suction pressure monitoring port 75, a suction pipe, and a pressure gauge provided in the discharge pipe. . Based on the detection result, the control unit 1 recognizes the content of the photoresist R dropped on the processing table 27, and stops the discharge operation of the photoresist R. The control unit 1 〇 关闭 closes the blower 71 of the suction mechanism 70 or closes the valve unit provided in the suction mechanism 70 to stop the suction operation. After the suction operation is stopped, the control unit 1 〇 〇 stops the conveyance of the substrate S when the substrate S is positioned on the upstream side of the nozzle 3 2 . When the substrate S is located immediately below the nozzle 3 2, the conveyance operation of the next substrate to be coated on the substrate S is stopped, and the substrate S is retracted by the conveyance device 23 in a state where the air is ejected to the substrate S. The outside of the processing table 27 (for example, the loading side table 25 or the loading side table 28). After the substrate S is retracted to the outside of the processing table 27, the control unit 1 stops the operation of the transport device 23, and closes the blower 61 of the discharge mechanism 60. The timing at which the blower 61 and the blower 71 are turned off and the operation of the transport device 23 is stopped may be performed every time the coating device 1 is started, and a predetermined number of substrates are processed per predetermined time, each time -29-200922697 The coating operation of the photoresist is performed between. The detection operation may be turned off or stopped each time the detection result is transmitted from the sensor 73 d or every time the change is detected by the discharge pressure monitoring port 65 or the like. Then, the control unit 100 switches the switching valve 80 to perform suction (suction mode) on both the air ejection hole 27a and the air suction hole 27b, and activates the air blower 7 1 of the air suction mechanism 7A. At this time, the cleaning liquid is supplied from the cleaning liquid supply unit 81 to the air ejection hole 27a and the air suction port 27b, and the suction operation is performed together with the cleaning liquid. At this time, when the amount of the stored matter in the temporary storage tank 73a exceeds the predetermined amount, the opening degree of the valve portion 73c is increased to discharge the stored matter in the temporary storage tank 73a. Next, the control unit 1 干燥 dries the air ejection hole 27a and the air suction hole 27b. Specifically, the blower 61 of the air ejection mechanism 60 is activated, and the switching valve 80 is alternately switched to the air ejection mechanism 60 side and the air suction mechanism 70 side. When the switching valve 80 is switched to the air ejection mechanism 60 side, air is ejected from both the air ejection hole 27a and the air suction hole 27b (discharge mode). When the switching valve 80 is switched to the air suction mechanism 70 side, suction is performed in both the air ejection hole 27a and the air suction hole 27b in the same manner as the suction mode of the suction operation described above. By alternately switching the discharge mode and the suction mode, air can be sufficiently circulated into the air ejection hole 27a and the air suction hole 27b, and the inside of the hole portion can be dried. In this drying operation, it is preferable to perform the suction mode first and then switch to the ejection mode. When the air ejection hole 27a and the air suction hole 27b are dried, the discharge amount and the suction amount of the air in the discharge mode and the suction mode are adjusted, and after the predetermined discharge amount and the suction amount can be adjusted, the substrate -30 is performed. - 200922697 S handling operation and coating action of photoresist R. The discharge mode and the amount of suction of the suction air and the amount of suction are adjusted based on, for example, the detection result of the inductor 27d provided at the place 27. According to the present embodiment, since the control unit 100 is provided, the control unit 100 switches between the discharge mode in which the gas is ejected from the air ejection hole 27a and the air suction hole, and the suction from the air ejection hole 27a and the air suction 27b. The attraction mode is such that when the photoresist r is dropped at 2, the mode is switched to the attraction mode, whereby the photoresist R that has entered the air absorption 27b can be attracted. Therefore, it is not necessary to disassemble the substrate 2 and there is no need for a space for decomposition. Thereby, the work efficiency can be increased and the work space can be made space-saving. The technical scope of the present invention is not limited to the above-described embodiments, and may be modified as appropriate without departing from the scope of the present invention. In the above-described embodiment, the entire structure of the coating device 1 is such that the transport mechanism 23 is disposed on the -Y direction side of each of the table portions. For example, the transport mechanism 23 may be disposed on the + direction side of each of the stages. Further, as shown in Fig. 12, the transport mechanism 23 (the transporter 23a, the vacuum pads 23b, 23c) can be placed in the gamma direction of each of the stages in the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum cushion 53b, and the rail 53c can transport different substrates by the transport mechanism 23 and the transport mechanism 53. As shown in the figure, the transport mechanism 23 transports the substrate S1. In this case, the substrate S2 is transported by the transport mechanism 53. In this case, the substrate can be transported by the transport mechanism 23 to transport the substrate alternately, and the production capacity can be improved. The lead-in mechanism unit 27b can be used to remove the lead-in hole. Although not limited to the γ square side with the track made). In the case of carrying out the transport of the substrate having the area of the substrate S, si, and S2 of the above-mentioned substrates S, Si, and S2, for example, the transport mechanism 23 and the transport mechanism 53 are held one by one, and the transport mechanism 23 is held by the transport mechanism 23 With the transport mechanism 53 moving in the +X direction, it is possible to carry two substrates at the same time. With this configuration, production capacity can be improved. In the above-described embodiment, the processing table 27 can switch between the discharge mode and the suction mode, and the present invention is not limited thereto. For example, the transfer side table 25 and the carry-out side table can be switched between the discharge mode and the suction mode. In the above embodiment, whether the photoresist R is dropped on the processing table 27 by the sensor 73 d is not limited thereto, and it is also possible to visually check whether or not the photoresist R is dropped. . In the above embodiment, the method of adjusting the coating device 成 to the suction mode when the photoresist R is dropped on the processing table 27 has been described, and is not limited thereto. For example, when the photoresist R dropped on the processing table 27 is a small amount, the coating device 1 may be adjusted to the discharge mode to blow the photoresist R. [Industrial Applicability] The present invention can improve the work efficiency of the coating device, and can save space in the work space, and is very useful in the industry. [Simplified description of the drawings] The figure shows the present embodiment. FIG. 2 is a front view showing the structure of the coating device of the present embodiment. FIG. 3 is a plan view showing the structure of the coating device of the present embodiment. FIG. FIG. 5 is a side view showing the structure of the air ejecting mechanism and the suction mechanism of the present embodiment. FIG. Fig. 6 is a view showing the operation of the apparatus for applying the M & i & Figure 7 is an actuation diagram of the figure. Figure 8 is an actuation diagram of the figure. Figure 9 is an actuation diagram of the figure. Figure 10 is an actuating diagram of the figure. The figure is the actuating diagram of the figure. Fig. 12 is a plan view of the structure of the coating apparatus. Fig. 12 is a diagram of the main embodiment. [Main component symbol description] 1 : Coating device 2: substrate conveying portion 3 - Coating portion 4 : Management portion 2 7 a : Air ejection Hole 27b: air suction hole 33- 200922697 27d: sensor (second sensor) 60: air ejection mechanism 70: air suction mechanism 73d: sensor (first sensor) 8 0: switching valve 1 〇〇: control unit S: substrate R: photoresist film - 34