KR20090026076A - A spreading device and a method for cleaning a spreading device - Google Patents

Abstract

A spreading device is provided to use a small space in comparison with an existing spreading device in no need of securing a work space for separating a stage. A spreading device comprises the following units. A substrate returning unit(2) returns a substrate(S) by lifting the substrate. A spreading unit(3) spreads a liquid on the substrate. A hole unit formed on the substrate returning unit spreads and sucks gases. A discharging unit discharges the gases from a plurality of hole units. A controlling unit converts a discharging mode to a sucking mode.

Description

{A SPREADING DEVICE AND A METHOD FOR CLEANING A SPREADING DEVICE}

The present invention relates to a coating apparatus and a cleaning method of the coating apparatus.

This application claims priority based on Japanese Patent Application No. 2007-231534 for which it applied to Japan on September 6, 2007, and uses the content here.

Fine patterns, such as a wiring pattern and an electrode pattern, are formed on the glass substrate which comprises display panels, such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film thereafter are performed.

As a coating apparatus which apply | coats a resist film on the board | substrate surface, the coating apparatus which fixes a slit nozzle, for example, and applys a resist to the glass substrate which moves below the said slit nozzle is known. Especially, the coating apparatus which floats and moves a board | substrate by blowing a gas on a stage is known (for example, refer patent document 1). In such a coating apparatus, a gas blowing hole and a suction hole are formed on the surface of the stage, so that the amount of floating of the substrate can be adjusted by blowing and sucking gas, and the substrate is floated while adjusting the height of the substrate. Application of the resist is carried out in the state of making it.

In this coating device, for example, a resist or the like remaining in the slit nozzle may accidentally flow on the stage. When the overflowed resist enters the gas ejection hole or the suction hole, it is difficult to maintain the normal gas ejection pressure and the suction pressure, and thus it is difficult to control the floating amount of the substrate. There is a need.

Patent Document 1: Japanese Unexamined Patent Publication No. 2005-236092

However, in the said coating apparatus, it is necessary to disassemble a stage in order to remove the resist which penetrated into the gas blowing hole or the suction hole, and there exists a problem that work efficiency is very bad. In addition, there is a need to secure a work space for disassembling the stage.

In view of the above circumstances, an object of the present invention is to provide a coating apparatus and a cleaning method of the coating apparatus which can improve the work efficiency and can save the space of the work space.

In order to achieve the said objective, the coating apparatus which concerns on the 1st aspect of this invention is a board | substrate conveyance part which floats a board | substrate and conveys, and the application | coating which apply | coats a liquid body to the said board | substrate, conveying by the said board | substrate conveyance part. An applicator having a portion, the substrate portion being formed in plural, a hole portion capable of ejecting and sucking gas, an ejection mode for ejecting gas from the plurality of hole portions, and a suction mode sucking from the plurality of hole portions It characterized in that it comprises a control means for switching to implement.

According to this aspect, a plurality of holes are formed in the substrate carrier to enable the ejection and suction of the gas, the ejection mode for ejecting the gas from the plurality of holes, and the suction mode for sucking from the plurality of holes. Since the control means is provided, when a liquid body flows into a board | substrate conveyance part, the liquid body which penetrated into the said hole part can be sucked by making a hole part into a suction mode. For this reason, it is not necessary to disassemble a board | substrate conveyance part and there is no need for space for disassembly. Thereby, work efficiency can be improved and space saving of a work space can be aimed at.

The coating device is one in which the hole portion preferably blows out and sucks gas in order to float the substrate.

In the configuration in which the hole portion blows out and sucks gas to float the substrate, it is difficult to precisely adjust the height of the floating portion of the substrate due to the liquid entering the hole portion. On the other hand, according to this embodiment, since the hole portion can be switched to the suction mode as described above, even when a liquid enters the hole portion, the floating height of the substrate can be stabilized and adjusted.

The coating device preferably has a means for causing the control means to switch between the ejection mode and the suction mode for the hole portion formed in a region corresponding to the application portion in the substrate transfer portion.

The area corresponding to the application portion in the substrate transfer portion is particularly adversely affected by the state of application of the liquid to be applied onto the substrate because the liquid flows easily and the liquid flows. In contrast, according to this embodiment, the control means switches the ejection mode and the suction mode to the hole formed in the region corresponding to the application portion of the substrate transfer portion, so that the region corresponding to the application portion is provided. The liquid overflowed in can be sucked. Thereby, the bad influence on the application | coating state of a liquid body can be avoided.

The coating device preferably further includes a first sensor that detects the suction sucked from the plurality of holes.

According to this embodiment, since the 1st sensor which detects the suction | suction thing attracted from the some hole part is further provided, it can be confirmed whether the liquid substance overflowed to the board | substrate conveyance part. Moreover, the structure which can confirm the quantity of the liquid body which the 1st sensor overflowed, etc. may be sufficient.

The said coating device, Preferably, the said control means has a means to stop conveyance of the said board | substrate and application | coating of the said liquid body based on the detection result by a said 1st sensor.

According to this embodiment, since the control means stops the conveyance of a board | substrate and application | coating of a liquid body based on the detection result by a 1st sensor, when a liquid body flows into a board | substrate conveyance part, the state of a board | substrate in that state is carried out. The conveyance and application of the liquid can be avoided.

The coating device preferably further includes a buffer tank for storing suction sucked from the plurality of holes.

According to this embodiment, since a buffer tank for storing the suction sucked from the plurality of holes is further provided, it is not necessary to discard the suction every time suction is performed. Thereby, work efficiency can be improved.

The coating device preferably has means for discharging the suctioned material when the control means is stored in the buffer tank for the predetermined amount or more.

According to this embodiment, since the suction is discharged when the suction is stored in the buffer tank by the control means for a predetermined amount or more, it is not necessary to confirm each time the suction of the suction is stored in the buffer tank. Thereby, work efficiency can be improved.

The coating device preferably further includes a flow passage connected to the plurality of hole portions and a washing liquid supply portion for supplying a washing liquid to the flow passage.

According to this embodiment, since the flow path connected to the some hole part and the cleaning liquid supply part which supplies a washing | cleaning liquid to the said flow path were further provided, the suction object attracted from a some hole part (containing a liquid body) Can be cleaned). As a result, the suction can be prevented from blocking the plurality of holes.

The coating device is preferably a pipe connected to a gas supply means for supplying gas to the plurality of hole portions and a suction means for sucking from the plurality of hole portions. And a valve formed in the flow passage so that any one of the suction means is connected to the plurality of hole portions.

According to this embodiment, the flow passage is a pipe connected to a gas supply means for supplying gas to the plurality of holes and a suction means for sucking from the plurality of holes, wherein any of the gas supply means and the suction means is provided. Since a valve is formed in the flow path so that one is connected to the plurality of holes, the ejection mode and the suction mode can be easily switched by the valve.

The coating device preferably further includes a second sensor that detects the ejection of the gas and the suction state in the hole.

According to this embodiment, since it is further provided with the 2nd sensor which detects the blowing and suction state of the gas in a hole part, the presence or absence of abnormality of the blowing and suction state of a gas can be detected.

The coating device preferably has means for causing the control means to perform the return operation of the plurality of holes based on the detection result of the second sensor.

According to this embodiment, based on the detection result of the second sensor, the control means causes the return operation of the plurality of holes, so that the return operation is detected when it is detected if there is no abnormality in the gas ejection and suction state. It can be done. For this reason, gas can be stably ejected from a hole part, and stable suction can be performed. This return operation includes, for example, switching between the blowing mode and the suction mode, adjusting the blowing amount of the gas in the blowing mode, adjusting the suction amount in the suction mode, and the like.

The coating device preferably has a means for the control unit to stop the conveyance of the substrate and the coating of the liquid body based on the detection result of the second sensor.

According to this embodiment, based on the detection result of the 2nd sensor, since a control means stops conveyance of a board | substrate and application | coating of a liquid body, conveyance of a board | substrate when there exists an abnormality in gas ejection and aspiration state. And application of the liquid can be stopped. For this reason, it can avoid that conveyance of a board | substrate and application | coating of a liquid body are performed when gas cannot be stably blown out from a hole part, or when stable suction cannot be performed.

The cleaning method of the coating apparatus which concerns on the 2nd aspect of this invention is the cleaning of the coating apparatus provided with the board | substrate conveyance part which floats and conveys a board | substrate, and the coating part which apply | coats a liquid body to the said board | substrate, conveying by the said board | substrate conveyance part. As a method, the said board | substrate conveyance part is provided with the some hole part which can blow out and attract | suck a gas, and it suctions in the said some hole part according to the state of the said board | substrate conveyance part, It is characterized by the above-mentioned.

According to this aspect, since the board | substrate conveyance part is provided with the some hole part which can blow out and attract | suck a gas, and it is supposed that suction is performed in the said some hole part according to the state of a board | substrate conveyance part, When it overflows, the liquid body which entered the hole part can be suctioned. For this reason, it is not necessary to disassemble a board | substrate conveyance part and there is no need for space for disassembly. Thereby, work efficiency can be improved and space saving of a work space can be aimed at.

The cleaning method of the coating device preferably includes detecting a suction sucked from the plurality of holes.

According to this embodiment, since it is supposed to detect the suction sucked from the plurality of holes, it is possible to confirm whether or not the liquid flows in the substrate transfer portion. Moreover, you may make it possible to confirm the quantity etc. of the liquid which overflowed.

The cleaning method of the coating device preferably includes performing the suction based on the detection result.

According to this embodiment, since suction is performed based on the detection result, suction can be efficiently performed when it is judged that the liquid body has overflowed.

The cleaning method of the coating device preferably includes stopping the conveyance of the substrate and the coating of the liquid body based on the detection result.

According to this embodiment, since the conveyance of a board | substrate and application | coating of a liquid body are stopped based on a detection result, when a liquid body overflows to a board | substrate conveyance part, it is carried out that conveyance of a board | substrate and liquid body application are performed in that state. Can be avoided.

The cleaning method of the coating device preferably includes performing the detection every startup of the coating device, every predetermined time, each time the predetermined number of substrates are processed, or every application operation of the liquid body. .

According to this embodiment, since the detection is performed every start of the coating device, every predetermined time, every time the substrate is processed for a predetermined number of times, or every application operation of the liquid body, suction can be performed at an appropriate timing. .

The cleaning method of the coating device preferably includes the coating device having a flow path connected to the plurality of hole portions, and supplying a cleaning liquid into the flow path after the suction or at the same time as the suction.

According to this embodiment, since the cleaning liquid is supplied into the flow path connected to the plurality of hole portions after the suction or at the same time as the suction, the suction material (including the liquid body) sucked from the plurality of hole portions can be washed. have. Thereby, it can avoid that a suction object becomes clogged in a some hole part.

When supplying a washing | cleaning liquid simultaneously with suction, since a suction material and the said washing | cleaning liquid can be sucked together, work efficiency improves.

The cleaning method of the coating device preferably includes drying the inside of the flow path after supply of the cleaning liquid.

According to this embodiment, since the inside of a flow path is dried after supply of a washing | cleaning liquid, it can prevent that a high humidity gas is supplied to a board | substrate conveyance part. Moreover, since the gas of high humidity can be prevented from being supplied to a board | substrate conveyance part, contamination of a board | substrate can be prevented.

The cleaning method of the coating device preferably includes detecting a gas ejection state and the suction state in the hole.

According to this embodiment, since the gas blowing state and the suction state in a hole part are detected, this can be detected when there is an abnormality in the gas blowing and suction state.

The cleaning method of the coating device preferably includes a return operation of the plurality of holes based on the detection result.

According to this embodiment, since the return operation of the plurality of holes is performed on the basis of the detection result, the return operation can be performed when it is detected if there is no abnormality in the gas ejection and suction state. For this reason, gas can be stably ejected from a hole part, and stable suction can be performed. This return operation includes, for example, switching between the blowing mode and the suction mode, adjusting the blowing amount of the gas in the blowing mode, adjusting the suction amount in the suction mode, and the like.

The cleaning method of the coating device preferably includes stopping the conveyance of the substrate and the application of the liquid body based on the detection result.

According to this embodiment, since the conveyance of a board | substrate and application | coating of a liquid body are stopped based on a detection result, when there exists an abnormality in gas ejection and aspiration state, conveyance of a board | substrate and application | coating of a liquid body can be stopped. have. For this reason, it can avoid that conveyance of a board | substrate and application | coating of a liquid body are performed when gas cannot be stably blown out from a hole part, or when stable suction cannot be performed.

According to the present invention, the work efficiency of the coating device can be improved, and the space of the work space can be reduced.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a perspective view of the coating device 1 according to the present embodiment.

As shown in FIG. 1, the coating apparatus 1 which concerns on this embodiment is a coating apparatus which apply | coats a resist on the glass substrate used for a liquid crystal panel etc., for example, The board | substrate conveyance part 2 and an application part (3) and the management part 4 are main components. In the coating device 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transfer unit 2, and the application unit 3 is applied by the management unit 4. State is managed.

2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. With reference to these drawings, the detailed structure of the coating device 1 is demonstrated.

(Substrate conveying part)

First, the structure of the board | substrate conveyance part 2 is demonstrated.

The board | substrate conveyance part 2 has the board | substrate loading area | region 20, the coating process area | region 21, the board | substrate carrying out area | region 22, the conveyance mechanism 23, and the frame part 24 which supports these. . In this board | substrate conveyance part 2, the board | substrate S is conveyed by the conveyance mechanism 23 to the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22 in order. The board | substrate loading area | region 20, the coating process area | region 21, and the board | substrate carrying out area | region 22 are arrange | positioned in this order from the upstream to the downstream side of a board | substrate conveyance direction. The conveyance mechanism 23 is formed in one side of each said part so that it may apply to each part of the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22. As shown in FIG.

Hereinafter, in explaining the structure of the coating device 1, in order to simplify notation, the direction in drawing is demonstrated using an XYZ coordinate system. As a longitudinal direction of the board | substrate conveyance part 2, the conveyance direction of a board | substrate is described with an X direction. In the plan view, the direction orthogonal to the X direction (substrate conveyance direction) is described as the Y direction. The direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as the Z direction. In each of the X, Y and Z directions, the direction of the arrow in the figure is the + direction and the direction opposite to the direction of the arrow is the-direction.

The board | substrate loading area | region 20 is a site | part which carries in the board | substrate S conveyed from the exterior of the apparatus, and has the carry-in side stage 25 and the lift mechanism 26. As shown in FIG.

The carrying-in side stage 25 is formed in the upper part of the frame part 24, and is a rectangular plate-shaped member when it sees from the plane which consists of SUS etc., for example. As for the carry-in side stage 25, X direction is length. In the carry-in side stage 25, the air blowing hole 25a and the lift pin reeling hole 25b are each formed in multiple numbers. These air blowing holes 25a and the lifting pin dropping-out holes 25b are formed to penetrate the carrying-in side stage 25.

The air blowing hole 25a is a hole for blowing air onto the stage surface 25c of the carry-in stage 25. For example, the air blowing hole 25a is a plane in the region where the substrate S passes in the carry-in stage 25. When viewed, they are arranged in a matrix. An air supply source (not shown) is connected to this air blowing hole 25a. In this carry-in side stage 25, the board | substrate S can be made to float to + Z direction by the air which blows out from the air blowing hole 25a.

The lifting pin projection holes 25b are formed in a region into which the substrate S is loaded in the carry-in stage 25. The lifting pin projection hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

The alignment apparatus 25d is formed in each of the both ends of the Y direction among these loading side stages 25 one by one. The alignment device 25d is a device for aligning the position of the substrate S carried in the carry-in side stage 25. Each alignment device 25d has a long hole and a positioning member formed in the long hole, and mechanically sandwiches the substrate carried in the loading stage 25 from both sides.

The lift mechanism 26 is formed in the back surface side of the board | substrate carrying in position of the carry-in side stage 25. As shown in FIG. This lift mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The lifting member 26a is connected to a drive mechanism (not shown), and the lifting member 26a moves in the Z direction by the drive of the drive mechanism. The plurality of lifting pins 26b are vertically formed from the upper surface of the lifting member 26a toward the carrying-in side stage 25. Each elevating pin 26b is arrange | positioned in the position which overlaps with said elevating pin outgoing hole 25b in planar view, respectively. As the elevating member 26a moves in the Z direction, each elevating pin 26b is projected from the elevating pin recessed holes 25b onto the stage surface 25c. The + Z direction edge part of each lifting pin 26b is formed so that the position on a Z direction may respectively correspond, and the board | substrate S conveyed from the exterior of an apparatus can be hold | maintained in the horizontal state.

In the application | coating process area | region 21, the process stage 27 which floats and supports the board | substrate S as a site | part to which application | coating of a resist is given is formed.

The processing stage 27 is a rectangular plate-shaped member when the stage surface 27c is covered with, for example, a light absorbing material containing hard alumite as a main component, and is formed in the + X direction with respect to the carry-in stage 25. It is. In the part covered with the light absorbing material in the processing stage 27, reflection of light such as laser light is suppressed. In the processing stage 27, the Y direction is a length. The dimension of the Y direction of the processing stage 27 is made substantially the same as the dimension of the Y direction of the carry-in side stage 25. The process stage 27 is provided with the some air blowing hole 27a which blows out air on the stage surface 27c, and the some air suction hole 27b which sucks air on the stage surface 27c. These air blowing holes 27a and air suction holes 27b are formed to penetrate the processing stage 27. Moreover, the inside of the process stage 27 is provided with the some groove which abbreviate | omitted illustration for giving resistance to the pressure of the gas which passes through the air blowing hole 27a and the air suction hole 27b. These grooves are connected to the air blowing hole 27a and the air suction hole 27b inside the stage.

In the processing stage 27, the pitch of the air jet holes 27a is narrower than the pitch of the air jet holes 25a formed in the carry-in stage 25, and the air jet holes 27a are smaller than the carry-in stage 25. It is densely formed. For this reason, in this processing stage 27, the floating amount of a board | substrate can be adjusted with high precision compared with another stage, and it can control so that the floating amount of a board | substrate may be 100 micrometers or less, for example, 50 micrometers or less. have.

The board | substrate carrying out area | region 22 is a site | part which carries out the board | substrate S to which the resist was apply | coated to the exterior of the apparatus, and has the carrying-out stage 28 and the lift mechanism 29. As shown in FIG. This carrying-out stage 28 is formed in the + X direction side with respect to the process stage 27, and is comprised by the material and dimension substantially the same as the carrying-in side stage 25 formed in the board | substrate carrying-in area 20. FIG. In the carrying out side stage 28, the air blowing hole 28a and the lifting pin falling-out hole 28b are formed similarly to the carrying in side stage 25. As shown in FIG. The lift mechanism 29 is formed in the back surface side of the board | substrate carrying out position of the carrying-out stage 28, and is supported by the frame part 24, for example. The elevating member 29a and the elevating pin 29b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 formed in the substrate loading area 20. When carrying out the board | substrate S on the carrying-out stage 28 to an external apparatus, this lift mechanism 29 can lift the board | substrate S by the lifting pin 29b for sending and receiving board | substrate S. It is supposed to be.

The conveyance mechanism 23 has the conveyer 23a, the vacuum pad 23b, and the rail 23c. The conveyer 23a has a structure in which a linear motor is formed, for example, and the conveyer 23a can move on the rail 23c by driving the linear motor.

This conveyer 23a is arrange | positioned so that the predetermined part 23d may overlap with the edge part of the board | substrate S at the -Y direction when it sees in plan view. The part 23d which overlaps with this board | substrate S is formed in the position lower than the height position of the back surface of the board | substrate at the time of making the board | substrate S float.

The vacuum pad 23b is arranged in multiple numbers in the part 23d which overlaps with the said board | substrate S in the conveyer 23a. This vacuum pad 23b has the adsorption surface which vacuum-adsorbs the board | substrate S, and is arrange | positioned so that the said adsorption surface may face upward. The vacuum pad 23b can hold | maintain the said board | substrate S by the adsorption surface attracting the back surface edge part of the board | substrate S. As shown in FIG. Each vacuum pad 23b can adjust the height position from the upper surface of the conveyer 23a, and can move the height position of the vacuum pad 23b up and down according to the floating amount of the board | substrate S, for example. It is supposed to be. The rail 23c extends over each stage to the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyer 23a is made by sliding the said rail 23c. It is possible to move along each said stage. In addition, the operation | movement of each part of the conveyance mechanism 23 is controlled by the control part not shown.

(Application department)

Next, the structure of the application part 3 is demonstrated.

The application part 3 is a part which apply | coats a resist on the board | substrate S, and has the sentence frame 31 and the nozzle 32. As shown in FIG.

The sentence frame 31 has the support column member 31a and the bridge | crosslinking member 31b, and is formed so that the process stage 27 may be hung in the Y direction. One support column member 31a is formed on the Y-direction side of the processing stage 27, and each support column member 31a is supported on both side surfaces of the frame portion 24 on the Y-direction side, respectively. Each support pillar member 31a is formed so that the height position of an upper end part may correspond. The bridge | crosslinking member 31b is bridge | crosslinked between the upper end parts of each support pillar member 31a, and it is possible to raise / lower the said support pillar member 31a.

This door-shaped frame 31 is connected to the moving mechanism 31c, and can move to an X direction. This moving mechanism 31c allows the door frame 31 to move between the management part 4. That is, the nozzle 32 formed in the door frame 31 is able to move between the management part 4. Moreover, this door-shaped frame 31 can move also in a Z direction by the movement mechanism not shown.

The nozzle 32 is comprised in the elongate shape of one long direction, and is formed in the surface of the cross-sectional member 31b of the sentence frame 31 at the side of the -Z direction. At the tip of the nozzle 32 in the -Z direction, a slit-like opening 32a is formed along its longitudinal direction, and a resist is discharged from the opening 32a. The nozzle 32 is arrange | positioned so that the longitudinal direction of the opening part 32a may become parallel to a Y direction, and the said opening part 32a opposes the processing stage 27. As shown in FIG. The dimension of the longitudinal direction of the opening part 32a is smaller than the dimension of the Y direction of the board | substrate S to be conveyed, and the resist is not apply | coated to the peripheral area of the board | substrate S. FIG. A flow passage (not shown) for circulating the resist in the opening 32a is formed inside the nozzle 32, and a resist supply source (not shown) is connected to the flow path. This resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist into the opening 32a with the pump. A moving mechanism (not shown) is formed in the supporting member 31a, and the nozzle 32 held by the crosslinking member 31b can move in the Z direction by the moving mechanism. A moving mechanism (not shown) is formed in the nozzle 32, and the moving mechanism enables the nozzle 32 to move in the Z direction with respect to the crosslinking member 31b. On the lower surface of the crosslinked member 31b of the door-shaped frame 31, the distance in the Z direction between the opening 32a of the nozzle 32, that is, the front end of the nozzle 32 and the opposing surface opposite to the front end of the nozzle is measured. The sensor 33 is attached.

(Management)

The structure of the management part 4 is demonstrated.

The management part 4 is a site | part which manages the nozzle 32 so that the discharge amount of the resist (liquid body) discharged to the board | substrate S may become constant, and -X with respect to the application | coating part 3 in the board | substrate conveyance part 2 is -X. It is formed in the direction side (upstream side of a board | substrate conveyance direction). This management part 4 has the preliminary discharge mechanism 41, the nozzle cleaning apparatus 43, the accommodating part 44 which accommodates these, and the holding member 45 which hold | maintains this accommodating part. The holding member 45 is connected to the moving mechanism 45a. By the said movement mechanism 45a, the accommodating part 44 is able to move to a X direction.

The preliminary ejection mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order on the -X direction side. Each dimension of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the support column members 31a of the sentence frame 31, and the sentence frame (31) It is possible to access over each site | part.

The preliminary ejection mechanism 41 is a part which ejects a resist preliminarily. The preliminary ejection mechanism 41 is formed nearest to the nozzle 32. The dip tank 42 is a liquid tank in which solvent, such as thinner, was stored inside. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32. The nozzle cleaning device 43 includes a cleaning mechanism not shown to move in the Y direction, and a moving mechanism not shown to move the cleaning mechanism. Have This movement mechanism is formed in the -X direction side rather than the washing | cleaning mechanism. The nozzle cleaning device 43 has a larger X-direction dimension than the preliminary discharge mechanism 41 and the dip tank 42 as long as the moving mechanism is formed. In addition, the arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning apparatus 43 is not limited to the arrangement | positioning of this embodiment, and other arrangement | positioning may be sufficient.

(Processing stage)

FIG. 5: is a figure which shows the structure of the air blowing mechanism and the suction mechanism of the processing stage 27 of the board | substrate processing part 2. FIG. Based on the same figure, the structure regarding the air blowing and air suction of the said stage is demonstrated.

In the processing stage 27, an air blowing mechanism 60, a suction mechanism 70, and a control unit (control means) 100 are formed.

The air blowing mechanism 60 has a blower 61, a buffer tank 62, an auto pressure controller (APC) 63, a manifold 64, and a blowing pressure monitoring port 65.

The blower 61 is an air supply source for supplying air to the air blowing mechanism, and is connected to the buffer tank 62 by a pipe 60a. As an air supply source, an air supply line such as a factory may be connected instead of the blower 61. The buffer tank 62 is comprised so that the temperature of the air supplied may be kept constant, for example, and is connected to the APC 63 by the piping 60b.

The APC 63 is provided with the butterfly valve 63a and the controller 63b which adjust the supply amount of air. The manifold 64 is connected to the processing stage 27 by the piping 60c. In the piping 60c, the process stage 27 side is branched, and the said branch part is respectively connected to each of the said some groove | channel. Therefore, the air from the APC 63 is blown out of the air blowing holes 27a through the pipe 60c and the plurality of grooves.

In addition, the manifold 64 is connected to the APC 63 by a pipe 60f. Moreover, the structure which this manifold 64 is not formed may be sufficient.

The jet pressure monitoring port 65 is connected to the processing stage 27 by the piping 60e. Specifically, the pipe 60e is connected to the plurality of grooves, and the blowing pressure monitoring port 65 is connected to the air blowing hole 27a of the processing stage 27 through the pipe 60e and the groove. have. In this configuration, the pipe 60e is connected to the pipe 60c via the plurality of grooves. The ejection pressure monitoring port 65 has a configuration in which a pressure detecting port is formed in the groove, and the pressure detecting port can detect the gas pressure directly under the stage. A pressure gauge 66 is formed in the jet pressure monitoring port 65, and the jet pressure of the air blown out from the air jet hole 27a can be measured, and the measurement result is APC through the wire 60d. It is supposed to be transmitted to the controller 63b in 63. In addition, various valves are formed in each of the pipes 60a to 60c and the pipe 60e. In addition, a pressure gauge may be provided between the APC 63 and the air blowing hole 27a to transmit the measurement result to the controller 63b in the APC 63.

The suction mechanism 70 has a blower 71, an auto pressure controller (APC) 72, a drain 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the drain portion 73, and the manifold 74 are connected to each other by pipes 70a to 70d, and various valves are attached to each pipe 70a to 70d. . Instead of the blower 71, an air suction line such as a factory may be used. Moreover, the structure in which the manifold 74 is not formed may be sufficient. The APC 72 is provided with the butterfly valve 72a and the controller 72b which adjust the supply amount of air.

The drain portion 73 has a buffer tank 73a, a discharge pipe 73b, a discharge valve 73c, and a sensor (first sensor) 73d. The buffer tank 73a is a tank for storing suction sucked from the processing stage 27. The discharge pipe 73b is a discharge path at the time of discharging the stored matter stored in the buffer tank 73a from the buffer tank 73a. The discharge valve 73c is attached to the discharge pipe 73b and is a valve for switching on and off of the discharge of the stored matter stored in the buffer tank 73a. The sensor 73d is attached to the buffer tank 73a, and is a sensor that detects whether or not suction is supplied into the buffer tank 73a. The sensor 73d can also detect the amount of debris in the buffer tank 73a. The detection result of the sensor 73d (the presence or absence of the aspirate and the amount of the stored matter) is transmitted to the controller 100.

The suction pressure monitoring port 75 is connected to the processing stage 27 by the piping 70e. Specifically, the pipe 70e is connected to the plurality of grooves, and the suction pressure monitoring port 75 is connected to the air suction hole 27b of the processing stage 27 through the pipe 70e and the groove. have. In addition, the pipe 70e is connected to the pipe 70d via the plurality of grooves. The suction pressure monitoring port 75 is configured such that a pressure detecting port is connected to the plurality of grooves, and the pressure detecting port can detect the gas pressure immediately below the processing stage 27. have. A pressure gauge 76 is attached to the suction pressure monitoring port 75, and the suction pressure of the air sucked by the air suction hole 27b can be measured, and the measurement result is the controller in the APC 72. It is supposed to be transmitted to 72b. A pressure gauge may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be transmitted to the controller 72b in the APC 72 via a wire (shown by broken lines in the figure) or the like.

The switching valve 80 is formed between the pipe 60f and the pipe 70c. The switching valve 80 is able to switch between the air blowing mechanism 60 and the air suction mechanism 70. Further, the processing stage 27 includes a sensor 27d which detects the amount of air ejected from the air ejection hole 27a and the air suction hole 27b and the amount of suction, and the air ejection hole 27a and the air suction. The cleaning liquid supply part 81 for supplying a cleaning liquid inside the hole 27b is formed.

The control part 100 controls the operation | movement of the said air blowing mechanism 60 and the suction mechanism 70 collectively. For example, the blower 61 and the blower 71 can be switched on and off. Moreover, the opening degree of the valve 73c is adjusted based on the quantity of the storage material transmitted from the sensor 73d of the drain part 73. FIG. Moreover, the control part 100 may perform an air blowing operation | movement and a suction operation | movement or stop based on the detection result regarding the presence or absence of the suction object transmitted from the sensor 73d.

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.

6-9 is a top view which shows the operation process of the coating device 1. With reference to each drawing, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the board | substrate S is carried in the board | substrate carrying-in area | region 20, the resist is apply | coated in the coating process area | region 21, floating and conveying the said board | substrate S, and the board | substrate S which apply | coated this resist was applied. Is carried out from the substrate carrying-out area 22. 6-9, only the outline of the sentence frame 31 was shown with the broken line, and it was easy to distinguish the structure of the nozzle 32 and the processing stage 27. As shown in FIG. The detailed operation in each part is described below.

Before carrying in a board | substrate to the board | substrate carrying-in area 20, the coating device 1 is standby. Specifically, the conveyer 23a is arrange | positioned at the -Y direction side of the board | substrate carrying-in position of the carry-in side stage 25, carrying the height position of the vacuum pad 23b to the floating height position of a board | substrate, and carrying in Air is blown out from the air blowing hole 25a of the side stage 25, the air blowing hole 27a of the processing stage 27, the air suction hole 27b, and the air blowing hole 28a of the carrying out side stage 28, respectively. It blows off or aspirates, and it is made to supply the air so that a board | substrate may float on the surface of each stage.

In this state, when the board | substrate S is conveyed to the board | substrate carrying-in position shown in FIG. 6 from the exterior by the conveyance arm etc. which omit illustration, for example, the lifting member 26a is moved to + Z direction, and the lifting pin 26b ) Is projected from the lift pin projection hole 25b to the stage surface 25c. And the board | substrate S is lifted by the lifting pin 26b, and the said board | substrate S is received.

After receiving the board | substrate S, the lifting member 26a is lowered and the lifting pin 26b is accommodated in the lifting pin projection hole 25b. At this time, since the layer of air is formed in the stage surface 25c, the board | substrate S is hold | maintained in the state which floated with respect to the stage surface 25c by the said air. When the board | substrate S reaches the surface of an air layer, the carrier of the board | substrate S is aligned by the positioning member of the alignment apparatus 25d, and the conveyance machine arrange | positioned at the -Y direction side of a board | substrate loading position ( The vacuum pad 23b of 23a) is vacuum-suctioned to the edge part at the side of -Y direction of the board | substrate S. FIG. The state to which the edge part at the side of -Y direction of the board | substrate S was adsorb | sucked is shown in FIG.

After the -Y direction side edge part of the board | substrate S is adsorbed by the vacuum pad 23b, the conveyer 23a is moved to the process stage 27 along the rail 23c. Since the board | substrate S has floated, even if the drive force of the conveyer 23a is made relatively small, the board | substrate S will move smoothly along the rail 23c. In the processing stage 27, the air suction by the air suction hole 27b is performed in addition to the air blowing by the air blowing hole 27a, and the floating amount is adjusted more accurately.

When the conveyance direction front end of the board | substrate S reaches the position of the opening part 32a of the nozzle 32, as shown in FIG. 7, the resist is discharged toward the board | substrate S from the opening part 32a of the nozzle 32. As shown in FIG. do. Discharge of a resist is performed, fixing the position of the nozzle 32, and conveying the board | substrate S by the conveyer 23a.

With the movement of the board | substrate S, the resist film R is apply | coated on the board | substrate S as shown in FIG. The resistive film R is formed in the predetermined area | region of the board | substrate S by the board | substrate S passing under the opening part 32a which discharges a resist.

Before applying the resist R to the substrate S, the distance on the Z direction of the front end of the substrate S and the nozzle 32 by two laser sensors 33 attached to the crosslinking member 31b (coating gap) Calculate Based on this calculation result, an application | coating gap is adjusted with the moving mechanism provided in the support member 31a so that the said application | coating gap may become predetermined value preset. At the time of calculating the coating gap, laser light is emitted from the laser emitting part toward the substrate S, and the laser light is reflected from the surface of the substrate S to enter the laser receiving part. Since the stage surface 27c of the processing stage 27 is covered with hard alumite, which is a light absorbing material, the laser light is not reflected at the stage surface 27c, and only the light reflected at the surface of the substrate S is the laser light receiving portion. Will be incident on. While the resist is applied to the substrate S, the floating amounts of both ends of the substrate S in the Y direction are measured by the two laser sensors 33 attached to the crosslinking member 31b, respectively. The laser light is emitted from the laser emitting part toward the substrate S, and the laser light is reflected on the surface of the substrate S to enter the laser receiving part. Since the stage surface 27c of the processing stage 27 is covered with hard alumite, which is a light absorbing material, the laser light is not reflected at the stage surface 27c, and only the light reflected at the surface of the substrate S is applied to the laser receiver. Will be incident.

The board | substrate S in which the resist film R was formed is conveyed to the carrying out side stage 28 by the conveyer 23a. In the carrying out side stage 28, the board | substrate S is conveyed to the board | substrate carrying out position shown in FIG. 9 in the state floated with respect to the stage surface 28c.

When the board | substrate S reaches | attains the board | substrate carrying out position, suction of the vacuum pad 23b is canceled | released and the lifting member 29a of the lift mechanism 29 is moved to + Z direction. Then, the lifting pin 29b protrudes from the lifting pin projection hole 28b to the back surface of the substrate S, and the substrate S is lifted by the lifting pin 29b. In this state, the external conveyance arm formed in the + X direction side of the carrying out stage 28, for example, accesses the carrying out stage 28, and receives the board | substrate S. FIG. After passing the board | substrate S to a conveyance arm, the conveyer 23a is returned to the board | substrate carrying-in position of the loading side stage 25 again, and it waits until the next board | substrate S is conveyed.

The preliminary ejection for maintaining the ejection state of the nozzle 32 is performed in the application part 3 until the next board | substrate S is conveyed. As shown in FIG. 10, the moving mechanism 31 moves the sentence frame 31 to the position of the management part 4 in the -X direction.

After moving the sentence frame 31 to the position of the management part 4, the position of the sentence frame 31 is adjusted, and the nozzle 32 is made to access the nozzle cleaning apparatus 43. FIG. In the nozzle cleaning device 43, a cleaning liquid such as thinner is discharged toward the opening 32a of the nozzle 32, and nitrogen gas is discharged to the opening 32a of the nozzle 32 simultaneously with the thinner as necessary. While cleaning, the nozzle 32 is cleaned by scanning the washing mechanism not shown in the longitudinal direction of the nozzle 32.

After the nozzle 32 is cleaned, the nozzle 32 is accessed by the preliminary ejection mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary ejection surface, and the nozzle 32 is moved in the -X direction. The resist R is preliminarily ejected from the opening 32a while being moved.

After the preliminary ejection, the sentence frame 31 is returned to its original position as shown in FIG. 11. When the next board | substrate S is conveyed, as shown in FIG. 11, the nozzle 32 is moved to the predetermined position on a Z direction by the moving mechanism which has not shown the figure formed in the support member 31a. In this manner, by repeatedly performing the coating operation and the preliminary ejecting operation of applying the resist film R to the substrate S, a high quality resist film R is formed on the substrate S. FIG.

As needed, for example, the nozzle 32 may be accessed in the dip tank 42 every time the manager 4 is accessed a predetermined number of times. In the dip tank 42, the drying of the nozzle 32 is prevented by exposing the opening 32a of the nozzle 32 to the vapor atmosphere of the thinner or resist stored in the dip tank 42.

In the course of the series of ejection operations and preliminary ejection operations, for example, it can be assumed that the resist R flows onto the processing stage 27 from the nozzle 32. The resist R which overflowed on the processing stage 27 is attracted to the suction mechanism 70 from the air suction hole 27b. The sucked resist R is supplied to the buffer tank 73a of the suction mechanism 70 and detected by the sensor 73d attached to the buffer tank 73a. The detection result indicating that the resist R is supplied into the buffer tank 73a by the sensor 73d is transmitted to the control unit 100. Moreover, it can also detect by the pressure change by the pressure gauge attached to the jet pressure monitoring port 65, the suction pressure monitoring port 75, the suction pipe, and the jet pipe as a detection means when the resist R overflowed.

Based on these detection results, the control part 100 recognizes the message that the resist R has overflowed on the processing stage 27, and stops the discharge operation of the resist R. FIG. Moreover, the control part 100 stops the suction operation | movement by shutting down the blower 71 of the suction mechanism 70, or making the valve | bulb provided in the suction mechanism 70 closed. After stopping the suction operation, the control unit 100 stops the conveyance of the substrate S in that state when the substrate S is located upstream of the nozzle 32. When the board | substrate S is located just under the nozzle 32, the conveyance apparatus (a state which stopped the conveyance of the board | substrate apply | coated next to the said board | substrate S, and blows air to the board | substrate S) ( 23 is evacuated to the outside of the processing stage 27 (for example, the carry-in stage 25 or the carry-out stage 28). After evacuating the board | substrate S to the outer side of the process stage 27, the control part 100 stops the operation | movement of the conveying apparatus 23, and shuts off the blower 61 of the blowing mechanism 60. As shown in FIG. In addition, as for the shutdown of the blower 61 and the blower 71, and the operation stop timing of the conveying apparatus 23, every time the application | coating device 1 is started, every predetermined time, every time the predetermined number of board | substrates are processed, You may carry out between every application | coating operation | movement of a resist. Moreover, whenever a detection result is transmitted from the sensor 73d or a change is detected by the jet pressure monitoring port 65 etc., you may make it shut down and conveyance stop operation.

Next, the control part 100 switches the switching valve 80 so that suction may be performed by both the air blowing hole 27a and the air suction hole 27b (suction mode), and the blower of the air suction mechanism 70 71) Start it. At this time, the cleaning liquid is supplied from the cleaning liquid supply part 81 into the air blowing hole 27a and the air suction hole 27b, and the suction operation is performed together with the cleaning liquid. At this time, when the amount of the storage material in the buffer tank 73a becomes larger than the predetermined amount, the opening degree of the valve 73c is enlarged to discharge the storage material in the buffer tank 73a.

Next, the control part 100 dries the air blowing hole 27a and the air suction hole 27b. Specifically, the blower 61 of the air blowing mechanism 60 is started, and the switching valve 80 is alternately switched to the air blowing mechanism 60 side and the air suction mechanism 70 side. When the switching valve 80 is switched to the air ejection mechanism 60 side, air is ejected from both the air ejection hole 27a and the air suction hole 27b (injection mode). When the switching valve 80 is switched to the air suction mechanism 70 side, suction is performed in both the air blowing hole 27a and the air suction hole 27b in the same manner as the suction mode of the suction operation. By alternately switching the blowing mode and the suction mode, air is sufficiently flowed through the air blowing hole 27a and the air suction hole 27b, and the inside of the hole is dried. In this drying operation, it is preferable to perform the suction mode first and then switch to the jetting mode.

When the air blowing hole 27a and the air suction hole 27b are dried, after adjusting the air blowing amount and the suction amount in the said blowing mode and the suction mode, after being able to adjust to a predetermined blowing amount and the suction amount, The conveyance operation | movement of the board | substrate S and the application | coating operation | movement of the resist R are made to perform. The air blowing amount and the suction amount in the blowing mode and the suction mode are adjusted based on the detection result of the sensor 27d formed in the processing stage 27, for example.

Thus, according to this embodiment, the blowing mode which blows gas from the air blowing hole 27a and the air suction hole 27b, and the suction mode which sucks in from the air blowing hole 27a and the air suction hole 27b are made. Since the control part 100 which switches and implements is provided, when the resist R flows in the process stage 27, the resist R which penetrated into the air suction hole 27b is switched to the suction mode. It can be aspirated. For this reason, it is not necessary to disassemble the board | substrate conveyance part 2, and there is also no need for space for disassembly. Thereby, work efficiency can be improved and space saving of a work space can be aimed at.

The technical scope of this invention is not limited to the said embodiment, A change can be added suitably in the range which does not deviate from the meaning of this invention.

About the whole structure of the coating device 1, although the conveyance mechanism 23 was arrange | positioned in the -Y direction side of each stage in the said embodiment, it is not limited to this. For example, the structure which arrange | positions the conveyance mechanism 23 to the + Y direction side of each stage may be sufficient. Moreover, as shown in FIG. 12, said conveyance mechanism 23 (transfer machine 23a, vacuum pad 23b, rail 23c) is arrange | positioned at the -Y direction side of each stage, and the said conveyance is located on the + Y direction side. The conveyance mechanism 53 (conveyor 53a, vacuum pad 53b, rail 53c) of the same structure as the mechanism 23 is arrange | positioned, and the board | substrate different from the conveyance mechanism 23 and the conveyance mechanism 53 is arranged. You may comprise so that conveyance may be carried out. For example, as shown to the same figure, the conveyance mechanism 23 is made to convey the board | substrate S1, and the conveyance mechanism 53 is made to convey the board | substrate S2. In this case, since the board | substrate can be conveyed alternately by the conveyance mechanism 23 and the conveyance mechanism 53, throughput will improve. Moreover, when conveying the board | substrate which has an area about half of said board | substrate S, S1, S2, it hold | maintains one by one in the conveyance mechanism 23 and the conveyance mechanism 53, for example, Two board | substrates can be simultaneously conveyed by advancing 23 and the conveyance mechanism 53 side by side in the + X direction. By such a configuration, the throughput can be improved.

In addition, in the said embodiment, although it was set as the structure which can switch a jet mode and a suction mode in the process stage 27, it is not limited to this, For example, the carry-in stage 25 and the carry-out stage 28 Also in the case, the jet mode and the suction mode may be configured to be switched.

Moreover, in the said embodiment, although it was the structure which detects whether the resist R overflowed on the process stage 27 by the sensor 73d, it is not limited to this, For example, a resist ( You may detect whether R) overflowed.

Moreover, in the said embodiment, although the method which makes the coating device 1 into the suction mode when the resist R overflowed on the process stage 27 was demonstrated, it is not limited to this. For example, when the resist R which overflowed on the process stage 27 is a small amount, you may make the coating apparatus 1 into a blowing mode, and let the resist R fly off.

The present invention is very useful industrially because the work efficiency of the coating device can be improved and the space saving of the work space can be achieved.

1 is a perspective view showing the configuration of a coating apparatus according to the present embodiment.

2 is a front view illustrating the configuration of the coating apparatus according to the present embodiment.

3 is a plan view showing the configuration of a coating apparatus according to the present embodiment.

4 is a side view illustrating the configuration of the coating apparatus according to the present embodiment.

FIG. 5 is a diagram illustrating the configuration of the air blowing mechanism and the suction mechanism according to the present embodiment. FIG.

6 is a view showing the operation of the coating apparatus according to the present embodiment.

7 is an operation diagram.

8 is an operation diagram.

9 is the same operation diagram.

10 is the same operation diagram.

11 is an operation diagram.

12 is a plan view showing the configuration of another coating apparatus according to the present embodiment.

※ Explanation of code for main part of drawing ※

1: coating device

2: board | substrate conveyance part

3: coating part

4: management

27a: air blowing hole

27b: air suction hole

27d: sensor (second sensor)

60: air blowing mechanism

70: air suction mechanism

73d: sensor (first sensor)

80: switching valve

100: control unit

S: Substrate

R: resist film

Claims (24)

As a coating apparatus provided with the board | substrate conveyance part which floats a board | substrate and conveys, and the application | coating part which apply | coats a liquid body to the said board | substrate, conveyed by the said board | substrate conveyance part, A plurality of holes formed in the substrate carrier and capable of ejecting and sucking gas; And a control means for switching the blowing mode for blowing gas from the plurality of holes and the suction mode for sucking in the holes. The method of claim 1, And the hole portion ejects and sucks gas to float the substrate. The method according to claim 1 or 2, And said control means has a means for switching between said ejection mode and said suction mode for said hole portion formed in a region corresponding to said application portion of said substrate transfer portion. The method according to claim 1 or 2, And a first sensor for detecting a suction sucked from the plurality of holes. The method of claim 4, wherein And said control means has means for stopping conveyance of said substrate and application of said liquid body on the basis of a detection result by said first sensor. The method according to claim 1 or 2, And a buffer tank for storing the suction sucked from the plurality of holes. The method of claim 6, And the control means has a means for discharging the suctioned material when the suctioned water is stored in the buffer tank for a predetermined amount or more. The method according to claim 1 or 2, A flow passage connected to the plurality of holes, A coating apparatus further comprising a cleaning liquid supply part for supplying a cleaning liquid to the flow passage. The method according to claim 1 or 2, The flow passage is a pipe connected to gas supply means for supplying gas to the plurality of holes and suction means for sucking from the plurality of holes, And a valve formed in the flow passage so that any one of the gas supply means and the suction means is connected to the plurality of hole portions. The method according to claim 1 or 2, And a second sensor for detecting the ejection of the gas and the suction state in the hole. The method of claim 10, And the control means has means for causing a return operation of the plurality of holes based on the detection result of the second sensor. The method of claim 11, And the return operation includes switching between the blowing mode and the suction mode, adjusting the blowing amount of the gas in the blowing mode, and adjusting the suction amount in the suction mode. The method of claim 10, And said control means has means for stopping conveyance of said substrate and application of said liquid body based on a detection result of said second sensor. As a cleaning method of the coating device provided with the board | substrate conveyance part which floats a board | substrate and conveys, and the application | coating part which apply | coats a liquid body to the said board | substrate, conveyed by the said board | substrate conveyance part, The board | substrate conveyance part is provided with the some hole part which can blow out and aspirate gas, The cleaning method of the coating apparatus characterized by sucking in the said some hole part according to the said board | substrate conveyance part state. The method of claim 14, The cleaning method of the coating apparatus which detects the suction material attracted from the said some hole part. The method of claim 15, The cleaning method of the coating device which performs the said suction based on the said detection result. The method of claim 15, The cleaning method of the coating device which stops conveyance of the said board | substrate and application | coating of the said liquid body based on the said detection result. The method according to any one of claims 15 to 17, The cleaning method of the coating device which performs the said detection every time the said coating device starts, every predetermined time, every time the said board | substrate of a predetermined number of times is processed, or every application | coating operation | movement of the said liquid body. The method according to any one of claims 14 to 17, The coating device includes a flow path connected to the plurality of hole portions, The cleaning method of the coating apparatus which supplies a washing | cleaning liquid in the said flow path after the said suction or simultaneously with the said suction. The method of claim 19, The cleaning method of the coating apparatus which dries the inside of the said flow path after supply of the said washing | cleaning liquid. The method according to any one of claims 14 to 17, The cleaning method of the coating device which detects the gas blowing state and the said suction state in the said hole part. The method of claim 21, The cleaning method of the coating device which performs the return operation | movement of the said some hole part based on the said detection result. The method of claim 22, And the return operation includes switching of the blowing of the gas and the suction, adjusting the blowing amount of the gas, and adjusting the suction amount of the suction. The method of claim 21, The cleaning method of the coating device which stops conveyance of the said board | substrate and application | coating of the said liquid body based on the said detection result.

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