TWI494260B - Substrate processing device - Google Patents

Substrate processing device Download PDF

Info

Publication number
TWI494260B
TWI494260B TW102129802A TW102129802A TWI494260B TW I494260 B TWI494260 B TW I494260B TW 102129802 A TW102129802 A TW 102129802A TW 102129802 A TW102129802 A TW 102129802A TW I494260 B TWI494260 B TW I494260B
Authority
TW
Taiwan
Prior art keywords
substrate
rocking
rocking member
detecting
roller
Prior art date
Application number
TW102129802A
Other languages
English (en)
Chinese (zh)
Other versions
TW201414653A (zh
Inventor
末吉秀樹
宮迫久顕
荻原潔
濱田崇広
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201414653A publication Critical patent/TW201414653A/zh
Application granted granted Critical
Publication of TWI494260B publication Critical patent/TWI494260B/zh

Links

Classifications

    • H10P72/0612—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H10P72/3202—
    • H10P74/20—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW102129802A 2012-08-22 2013-08-20 Substrate processing device TWI494260B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012182964A JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置

Publications (2)

Publication Number Publication Date
TW201414653A TW201414653A (zh) 2014-04-16
TWI494260B true TWI494260B (zh) 2015-08-01

Family

ID=50213886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102129802A TWI494260B (zh) 2012-08-22 2013-08-20 Substrate processing device

Country Status (4)

Country Link
JP (1) JP6000019B2 (enExample)
KR (1) KR101473107B1 (enExample)
CN (1) CN103633000B (enExample)
TW (1) TWI494260B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI841852B (zh) * 2020-06-30 2024-05-11 日商芝浦機械電子裝置股份有限公司 安裝裝置及安裝方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD800083S1 (en) 2015-02-23 2017-10-17 Samsung Electronics Co., Ltd. Electronic device
CN105107776B (zh) * 2015-08-24 2017-06-27 京东方科技集团股份有限公司 检测装置及工件清洗设备
CN105865495B (zh) * 2016-06-20 2017-12-01 武汉华星光电技术有限公司 位置检知装置
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
CN109142388B (zh) * 2018-08-01 2021-04-13 京东方科技集团股份有限公司 基板检测器、驱动装置以及基板清洁设备
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
USD959424S1 (en) 2020-02-26 2022-08-02 Samsung Electronics Co., Ltd. Mobile telephone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06247530A (ja) * 1993-02-22 1994-09-06 Yoshida Sharyo Kiki Kk 荷検出装置
JPH1111640A (ja) * 1997-06-30 1999-01-19 Okamura Corp ローラコンベヤにおける搬送物検出装置
JP2001057355A (ja) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
TWM259245U (en) * 2004-05-28 2005-03-11 Jing Bo Technology Co Ltd Magnetically swinging counting controller and resetting structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10265026A (ja) * 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd ワーク通過検出装置
JP2002110004A (ja) * 2000-09-29 2002-04-12 Nippon Kentetsu Co Ltd 通過検出スイッチ
JP2003128244A (ja) * 2001-10-30 2003-05-08 Sumitomo Precision Prod Co Ltd 基板検出装置及び基板処理設備
TW200420480A (en) * 2003-04-04 2004-10-16 Mosel Vitelic Inc Wafer transmission system with sensor
JP2007066985A (ja) * 2005-08-29 2007-03-15 Shibaura Mechatronics Corp 基板の検出装置及び処理装置
KR20070048483A (ko) * 2005-11-04 2007-05-09 세메스 주식회사 기판을 처리하는 장치 및 기판을 처리하는 방법
KR101071174B1 (ko) * 2008-11-26 2011-10-10 에프엔에스테크 주식회사 기판 감지장치
JP2010133884A (ja) * 2008-12-08 2010-06-17 Sharp Corp 振り子センサ
CN102253505B (zh) * 2010-05-20 2013-04-03 北京京东方光电科技有限公司 基板位置检测方法及装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06247530A (ja) * 1993-02-22 1994-09-06 Yoshida Sharyo Kiki Kk 荷検出装置
JPH1111640A (ja) * 1997-06-30 1999-01-19 Okamura Corp ローラコンベヤにおける搬送物検出装置
JP2001057355A (ja) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
TWM259245U (en) * 2004-05-28 2005-03-11 Jing Bo Technology Co Ltd Magnetically swinging counting controller and resetting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI841852B (zh) * 2020-06-30 2024-05-11 日商芝浦機械電子裝置股份有限公司 安裝裝置及安裝方法

Also Published As

Publication number Publication date
CN103633000A (zh) 2014-03-12
TW201414653A (zh) 2014-04-16
JP6000019B2 (ja) 2016-09-28
CN103633000B (zh) 2016-05-04
JP2014041897A (ja) 2014-03-06
KR20140026256A (ko) 2014-03-05
KR101473107B1 (ko) 2014-12-16

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